AN6591BFJM [PANASONIC]

Support Circuit, PQCC44, QFP-44;
AN6591BFJM
型号: AN6591BFJM
厂家: PANASONIC    PANASONIC
描述:

Support Circuit, PQCC44, QFP-44

无绳技术 电信 电信集成电路
文件: 总9页 (文件大小:852K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
DATA SHEET  
Part No.  
AN6591BFJM  
Package Code No.  
*QFP044-P-0606A  
SEMICONDUCTOR COMPANY  
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.  
Publication date: August 2005  
SDE00013AEB  
1
AN6591BFJM  
Contents  
„ Function ……………………………………………………………………………………………………………..  
„ Applications …………………………………………………………………………………………………………  
„ Package …………………………………………………………………………………………………………….  
„ Test Circuit Diagram ………...…………………………………………………………………………………….  
„ Block Diagram ………………...…………………………………………………………………………………….  
3
3
3
4
6
„ Pin Descriptions ………………...…………………………………………………………………………………… 7  
„ Absolute Maximum Ratings ……………………………………………………………………………………….  
„ Operating Supply Voltage Range ……………..………………………………………………………………….  
8
8
SDE00013AEB  
2
AN6591BFJM  
AN6591BFJM  
Sending and receiving PLL single-chip IC for PHS  
„ Function  
y PLL: Prescaler, Counter, Phase comparator, Charge pump (for two systems)  
y Reception: 2nd-MIX, LIM-AMP, RSSI  
y Transmission: Quadrature modulator, Phase shifter, UP-MIX, APC  
„ Applications  
y PHS  
„ Package  
y 4Directions - 44Pin Plastic Quad Flat Non-leaded Package (QFP Type)  
SDE00013AEB  
3
AN6591BFJM  
„ Test Circuit Diagram  
SDE00013AEB  
4
AN6591BFJM  
„ Test Circuit Diagram (continued)  
SDE00013AEB  
5
AN6591BFJM  
„ Block Diagram  
SDE00013AEB  
6
AN6591BFJM  
„Pin Descriptions  
Pin  
Pin  
No.  
Symbol  
No.  
Function  
Symbol  
N.C.  
Function  
1
2
RXMXIN  
RXLOIN  
VCC2  
RX-MIX-IN  
23  
24  
25  
26  
27  
28  
29  
30  
31  
32  
33  
34  
35  
36  
37  
38  
39  
40  
41  
42  
43  
44  
RX-LOCAL-IN  
VCC-MIX  
N.C.  
3
N.C.  
4
MXO  
LMDEC1  
LMIN  
LMDEC2  
VCC2  
MIX-OUT  
VCC  
VCC-2nd CMOS  
5
LIM-DECOUPLE1  
LIM-IN  
CP2  
2nd-CHARGEPUMP-OUT  
2nd-POWERSAVE-IN  
1st-POWERSAVE-IN  
REFERENCE-IN  
6
PSIF  
7
LIM-DECOUPLE2  
PSRF  
REF  
8
VCC-LIN  
9
LMO  
LIM-OUT  
TX-LOCAL2-IN  
RSSI-OUT  
GND  
LD  
LOCK-DETECT-OUT  
CLOCK-IN  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
TXLO2  
RSO  
CLOCK  
DATA  
STROBE  
GND  
CP1  
SERIAL-DATA-IN  
STROBE-IN  
GND  
Q_IN  
Q_INPUT  
GND-1st / 2nd CMOS  
1st-PRESCALER-IN  
_
Q_IN  
Q_INPUT  
I_IN  
I_INPUT  
VCC  
VCC-1st CMOS  
_
I_IN  
I_INPUT  
RFIN  
TXLO1  
TXLO1R  
APC/BS  
VCC1  
1st-PRESCALER-IN  
TX-LOCAL1  
VCC1  
VCC-TX-MOD  
GNDM  
IFIN  
GND-TX-MOD  
2nd-PRESCALER-IN  
TX-LOCAL 1REF  
APC / BS  
N.C.  
VCC-TX-OUT  
GND2  
VCC  
GND-2nd CMOS  
VCC-1st / 2nd BIP  
TXO  
TX-OUTPUT  
GNDO  
GND-TX-OUT  
SDE00013AEB  
7
AN6591BFJM  
„ Absolute Maximum Ratings  
No.  
Parameter  
Storage temperature  
Symbol  
Rating  
–55 to +125  
Unit  
1
2
3
4
5
6
7
8
Tstg  
°C  
°C  
*1  
*1  
Operating ambient temperature  
Operating ambient atmospheric pressure  
Operating constant gravity  
Operating shock  
Topr  
–20 to +70  
Popr  
1.013 × 105 0.61 × 105  
Pa  
Gopr  
9 810  
4 900  
3.5  
m/s2  
m/s2  
V
Sopr  
Supply voltage  
V
CC , VCC1 , VCC2  
*2  
*2  
Supply current  
ICC  
PD  
54  
mA  
mW  
Power dissipation  
194  
Note) *1: Expect for the operating ambient temperature and storage temperature , all ratings are for Ta = 25°C  
*2: The range under absolute maximum ratings, power dissipation.  
„ Operating Supply Voltage Range  
Operating supply voltage range  
VCC , VCC1 , VCC2  
2.7 to 3.3  
V
SDE00013AEB  
8
Request for your special attention and precautions in using the technical information and  
semiconductors described in this book  
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and  
regulations of the exporting country, especially, those with regard to security export control, must be observed.  
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples  
of the products, and no license is granted under any intellectual property right or other right owned by our company or any other  
company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other  
company which may arise as a result of the use of technical information described in this book.  
(3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office  
equipment, communications equipment, measuring instruments and household appliances).  
Consult our sales staff in advance for information on the following applications:  
Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support  
systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the prod-  
ucts may directly jeopardize life or harm the human body.  
Any applications other than the standard applications intended.  
(4) The products and product specifications described in this book are subject to change without notice for modification and/or im-  
provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product  
Standards in advance to make sure that the latest specifications satisfy your requirements.  
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions  
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute  
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any  
defect which may arise later in your equipment.  
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure  
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire  
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.  
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,  
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which  
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.  
(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita  
Electric Industrial Co., Ltd. Industrial Co., Ltd.  

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