3SK143O [PANASONIC]

RF Small Signal Field-Effect Transistor, 1-Element, Ultra High Frequency Band, Silicon, N-Channel, Metal-oxide Semiconductor FET, MINI PACKAGE-4;
3SK143O
型号: 3SK143O
厂家: PANASONIC    PANASONIC
描述:

RF Small Signal Field-Effect Transistor, 1-Element, Ultra High Frequency Band, Silicon, N-Channel, Metal-oxide Semiconductor FET, MINI PACKAGE-4

放大器 光电二极管 晶体管
文件: 总3页 (文件大小:165K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
High Frequency FETs  
3SK143  
Silicon N-Channel 4-pin MOS FET  
For UHF high-gain and low-noise amplification  
unit: mm  
2.8+00..32  
1.5+00..32  
Features  
0.6±0.15  
0.65±0.15  
Low noise-figure (NF)  
Large power gain PG  
0.5R  
Mini-type package, allowing downsizing of the sets and autoatic  
insertion through the tape/magazine packing.  
3
1
2
Absolute Maximum Ratings (Ta = 5°C)  
Parameter  
Drain to Source voltage  
Gate 1 to Source voltage  
Gate 2 to Source voltage  
Drain current  
Symbol  
VDS  
VG1S  
S  
ID  
Ra
Unit  
V
15  
±8  
0.4±
V
1: Source  
2: Drain  
3: Gate2  
4: Gate1  
±8  
±30  
mA  
mW  
°C  
°C  
Allowable power dissipatio
Channel temperatre  
Storage temperate  
PD  
2
Mini Type Package (4-pin)  
Tch  
150  
Marking Symbl: 3D  
Tstg  
5to +150  
ElecCharactertics (T= 25°C)  
Parameter  
Symbol  
Conditions  
mi
typ  
max  
13  
Unit  
mA  
nA  
nA  
V
2
*
rain to Source cut-orrent  
Gate 1 curre
IDSS  
IG1SS  
IG2SS  
VS = 10V, VGS = 0, VG2S = 4V  
VDS = VG2S = 0, VG1S = ±8V  
VDS = VG1S = 0, VG2S ±8V  
ID = 100µA, VG1S = 5V, VG2S = 0  
VDS = 10V, VG2S = 4V, ID = 100µA  
0.2  
±20  
±20  
Gaent  
1
*
Draiage  
VDSX  
15  
3  
1  
12  
Gate 1 to cut-off voltage VG1SC  
Gate 2 to Source cut-off vage VG2SC  
0
V
V
DS = 10V, VG2S = 0, ID = 100µA  
2
V
Forward transfer admittance  
| Yfs |  
VDS = 10V, ID = 10mA, VG= 4V, f = 1kHz  
20  
1.9  
0.9  
0.02  
15  
28  
2.4  
1.2  
mS  
pF  
pF  
pF  
dB  
dB  
Input capacitance (Common Source) Ciss  
Output capacitance (Common Source) Coss  
Reverse transfer capacitance (Common Source) Crss  
1.4  
0.6  
VDS = 10V, VG1S = VG2S = 5V  
f = 1MHz  
Power gain  
Noise figure  
PG  
NF  
VDS = 8V, ID = 8mA, VG2S = 3V  
= 800MHz  
13  
5
1 RD = 56and RS = 270Ω  
*
2 IDSS rank classification  
*
Rank  
O
P
Q
IDSS (mA)  
0.2 to 1.5  
3DO  
0.5 to 4  
3DP  
3 to 13  
3DQ  
Marking Symbol  
1
High Frequency FETs  
3SK143  
PD  
Ta  
ID VDS  
ID  
VG1S  
320  
280  
240  
200  
160  
120  
80  
24  
20  
16  
12  
8
36  
30  
24  
18  
12  
6
VG2S=4V 3V  
VG2S=4V  
Ta=25˚C  
VDS=10V  
Ta=25˚C  
2V  
VG1S=0.6V  
0.4V  
1V  
0V  
0.2V  
0V  
– 0.2V  
– 0.4V  
4
40  
0
0
0
–2  
0
20 40 60 80 100 120 140 160  
0
2
4
6
8
10  
12  
–1  
0
1
2
3
4
(
)
( )  
V
( )  
Gate 1 to source voltage VG1S V  
Ambient temperature Ta ˚C  
Drain to source voltage VDS  
| Yfs | VG1S  
Ciss, Coss  
VDS  
PG  
VG1S  
36  
30  
24  
18  
12  
6
2.4  
2.0  
1.6  
1.2  
0.8  
0.4  
0
24  
20  
16  
12  
8
V
DS=10V  
VG1S=VG2S=–5V  
f=1MHz  
Ta=25˚C  
VDS=8V  
f=800MHz  
Ta=25˚C  
f=1kHz  
Ta=25˚C  
Ciss  
VG2S=4V  
VG2S=5V  
4V  
3V  
Coss  
3V  
2V  
1V  
1V  
4
2V  
2
0V  
0
–2  
0
–2  
–1  
0
1
2
3
0.1  
0.3  
1
3
10  
30  
100  
–1  
0
1
3
(
V
)
( )  
V
( )  
Gate 1 to source voltage VG1S V  
Gate 1 to source voltage VG1S  
Drain to source voltage VDS  
NF  
VG1S  
PG  
VG2S  
ID  
VG1S  
24  
20  
16  
12  
8
30  
20  
12  
10  
8
VDS=8V  
f=800MHz  
Ta=25˚C  
VDS=8V  
f=800MHz  
Ta=25˚C  
VDS=10V  
VG2S=4V  
10  
0
6
VG2S=1V  
2V  
3V  
4V  
–10  
–20  
–30  
4
Ta=75˚C  
25˚C  
4
2
–25˚C  
0
–2  
0
–2.0  
–1  
0
1
2
3
–2  
0
2
4
6
8
–1.6  
–1.2  
– 0.8 – 0.4  
0
( )  
V
( )  
V
( )  
Gate 1 to source voltage VG1S V  
Gate 1 to source voltage VG1S  
Gate 2 to source voltage VG2S  
2
Request for your special attention and precautions in using the technical information and  
semiconductors described in this book  
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and  
regulations of the exporting country, especially, those with regard to security export control, must be observed.  
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples  
of the products, and no license is granted under any intellectual property right or other right owned by our company or any other  
company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other  
company which may arise as a result of the use of technical information described in this book.  
(3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office  
equipment, communications equipment, measuring instruments and household appliances).  
Consult our sales staff in advance for information on the following applications:  
Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support  
systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the prod-  
ucts may directly jeopardize life or harm the human body.  
Any applications other than the standard applications intended.  
(4) The products and product specifications described in this book are subject to change without notice for modification and/or im-  
provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product  
Standards in advance to make sure that the latest specifications satisfy your requirements.  
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions  
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute  
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any  
defect which may arise later in your equipment.  
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure  
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire  
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.  
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,  
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which  
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.  
(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita  
Electric Industrial Co., Ltd.  

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