3SK143O [PANASONIC]
RF Small Signal Field-Effect Transistor, 1-Element, Ultra High Frequency Band, Silicon, N-Channel, Metal-oxide Semiconductor FET, MINI PACKAGE-4;型号: | 3SK143O |
厂家: | PANASONIC |
描述: | RF Small Signal Field-Effect Transistor, 1-Element, Ultra High Frequency Band, Silicon, N-Channel, Metal-oxide Semiconductor FET, MINI PACKAGE-4 放大器 光电二极管 晶体管 |
文件: | 总3页 (文件大小:165K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
High Frequency FETs
3SK143
Silicon N-Channel 4-pin MOS FET
For UHF high-gain and low-noise amplification
unit: mm
2.8–+00..32
1.5–+00..32
■ Features
0.6±0.15
0.65±0.15
● Low noise-figure (NF)
● Large power gain PG
0.5R
● Mini-type package, allowing downsizing of the sets and autoatic
insertion through the tape/magazine packing.
3
1
2
■ Absolute Maximum Ratings (Ta = 5°C)
Parameter
Drain to Source voltage
Gate 1 to Source voltage
Gate 2 to Source voltage
Drain current
Symbol
VDS
VG1S
S
ID
Ra
Unit
V
15
±8
0.4±
V
1: Source
2: Drain
3: Gate2
4: Gate1
±8
±30
mA
mW
°C
°C
Allowable power dissipatio
Channel temperatre
Storage temperate
PD
2
Mini Type Package (4-pin)
Tch
150
Marking Symbl: 3D
Tstg
−5to +150
■ ElecCharactertics (T= 25°C)
Parameter
Symbol
Conditions
mi
typ
max
13
Unit
mA
nA
nA
V
2
*
rain to Source cut-orrent
Gate 1 curre
IDSS
IG1SS
IG2SS
VS = 10V, VGS = 0, VG2S = 4V
VDS = VG2S = 0, VG1S = ±8V
VDS = VG1S = 0, VG2S ±8V
ID = 100µA, VG1S = −5V, VG2S = 0
VDS = 10V, VG2S = 4V, ID = 100µA
0.2
±20
±20
Gaent
1
*
Draiage
VDSX
15
−3
−1
12
Gate 1 to cut-off voltage VG1SC
Gate 2 to Source cut-off vage VG2SC
0
V
V
DS = 10V, VG2S = 0, ID = 100µA
2
V
Forward transfer admittance
| Yfs |
VDS = 10V, ID = 10mA, VG= 4V, f = 1kHz
20
1.9
0.9
0.02
15
28
2.4
1.2
mS
pF
pF
pF
dB
dB
Input capacitance (Common Source) Ciss
Output capacitance (Common Source) Coss
Reverse transfer capacitance (Common Source) Crss
1.4
0.6
VDS = 10V, VG1S = VG2S = −5V
f = 1MHz
Power gain
Noise figure
PG
NF
VDS = 8V, ID = 8mA, VG2S = 3V
= 800MHz
13
5
1 RD = 56Ω and RS = 270Ω
*
2 IDSS rank classification
*
Rank
O
P
Q
IDSS (mA)
0.2 to 1.5
3DO
0.5 to 4
3DP
3 to 13
3DQ
Marking Symbol
1
High Frequency FETs
3SK143
PD
Ta
ID VDS
ID
VG1S
320
280
240
200
160
120
80
24
20
16
12
8
36
30
24
18
12
6
VG2S=4V 3V
VG2S=4V
Ta=25˚C
VDS=10V
Ta=25˚C
2V
VG1S=0.6V
0.4V
1V
0V
0.2V
0V
– 0.2V
– 0.4V
4
40
0
0
0
–2
0
20 40 60 80 100 120 140 160
0
2
4
6
8
10
12
–1
0
1
2
3
4
(
)
( )
V
( )
Gate 1 to source voltage VG1S V
Ambient temperature Ta ˚C
Drain to source voltage VDS
| Yfs | VG1S
Ciss, Coss
VDS
PG
VG1S
36
30
24
18
12
6
2.4
2.0
1.6
1.2
0.8
0.4
0
24
20
16
12
8
V
DS=10V
VG1S=VG2S=–5V
f=1MHz
Ta=25˚C
VDS=8V
f=800MHz
Ta=25˚C
f=1kHz
Ta=25˚C
Ciss
VG2S=4V
VG2S=5V
4V
3V
Coss
3V
2V
1V
1V
4
2V
2
0V
0
–2
0
–2
–1
0
1
2
3
0.1
0.3
1
3
10
30
100
–1
0
1
3
(
V
)
( )
V
( )
Gate 1 to source voltage VG1S V
Gate 1 to source voltage VG1S
Drain to source voltage VDS
NF
VG1S
PG
VG2S
ID
VG1S
24
20
16
12
8
30
20
12
10
8
VDS=8V
f=800MHz
Ta=25˚C
VDS=8V
f=800MHz
Ta=25˚C
VDS=10V
VG2S=4V
10
0
6
VG2S=1V
2V
3V
4V
–10
–20
–30
4
Ta=75˚C
25˚C
4
2
–25˚C
0
–2
0
–2.0
–1
0
1
2
3
–2
0
2
4
6
8
–1.6
–1.2
– 0.8 – 0.4
0
( )
V
( )
V
( )
Gate 1 to source voltage VG1S V
Gate 1 to source voltage VG1S
Gate 2 to source voltage VG2S
2
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products, and no license is granted under any intellectual property right or other right owned by our company or any other
company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other
company which may arise as a result of the use of technical information described in this book.
(3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office
equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
– Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support
systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the prod-
ucts may directly jeopardize life or harm the human body.
– Any applications other than the standard applications intended.
(4) The products and product specifications described in this book are subject to change without notice for modification and/or im-
provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.
(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita
Electric Industrial Co., Ltd.
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