2SD2345G [PANASONIC]

Small Signal Bipolar Transistor, 0.05A I(C), 40V V(BR)CEO, 1-Element, NPN, Silicon, ROHS COMPLIANT, SSMINI3-F3, 3 PIN;
2SD2345G
型号: 2SD2345G
厂家: PANASONIC    PANASONIC
描述:

Small Signal Bipolar Transistor, 0.05A I(C), 40V V(BR)CEO, 1-Element, NPN, Silicon, ROHS COMPLIANT, SSMINI3-F3, 3 PIN

放大器 光电二极管 晶体管
文件: 总4页 (文件大小:222K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
This product complies with the RoHS Directive (EU 2002/95/EC).  
Transistors  
2SD2345G  
Silicon NPN epitaxial planar type  
For low-frequency amplification  
Features  
Package  
High forward current transfer ratio hFE  
Low collector-emitter saturation voltage VCE(sat)  
High emitter-base voltage (Collector open) VEBO  
Low noise voltage NV  
Code  
SSMini3-F3  
MarkinSymbol: 1Z  
Pin
1: B
mitt
Colector  
Absolute Maximum Ratings Ta = 25°C  
Parameter  
Symbol  
V
VCEO  
VBO  
IC  
Rng  
Unit  
V
Collector-base voltage (Emitter open)  
Collector-emitter voltage (Base open)  
Emitter-base voltage (Collector open)  
Collector current  
40  
15  
V
V
50  
mA  
mA  
mW  
°C  
Peak collector current  
ICP  
10
Collector power dissipaton  
Junction temperate  
PC  
25  
Tj  
125  
Storage temperaure  
5to +125  
°C  
Electrical Characteristics Ta = 25°C 3°C  
ter  
Symbol  
VCBO  
VCEO  
VEBO  
ICBO  
Conditions  
Min  
50  
Typ  
Max  
Unit  
V
CollectorEmitter open)  
Collector-emiage (Base opn)  
Emitter-base voltage (Collector open)  
Collector-base cutoff current (Emitter open)  
Collector-emitter cutoff current (Base open)  
Forward current transfer ratio *  
Collector-emitter saturation voltage  
Transition frequency  
IC = 10 µA, IE = 0  
IC = 1 mA, IB = 0  
40  
V
IE = 10 µA, IC = 0  
VCB = 20 V, IE = 0  
VCE = 20 V, IB = 0  
VCE = 10 V, IC = 2 mA  
15  
V
100  
1
nA  
µA  
ICEO  
hFE  
400  
2000  
0.20  
VCE(sat) IC = 10 mA, IB = 1 mA  
fT VB = 10 V, IE = −2 mA, f = 200 MHz  
0.05  
120  
V
MHz  
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.  
2. : Rank classification  
*
Rank  
R
S
T
hFE  
400 to 800  
600 to 1 200 1000 to 2000  
Publication date: June 2007  
SJC00408AED  
1
This product complies with the RoHS Directive (EU 2002/95/EC).  
2SD2345G  
PC Ta  
IC VCE  
IC VBE  
150  
125  
100  
75  
160  
140  
120  
100  
80  
120  
100  
80  
60  
40  
0  
VCE = 10 V  
Ta = 25°C  
25°C  
Ta = 75°C  
25°C  
IB = 100 µA  
µA  
80 A  
70 µA  
60 µA  
A  
µA  
30 µA  
60  
50  
40  
20 µA  
10 µA  
25  
20  
0
0
0
20 40 60 80 100 120 140 160  
0
4
8
10  
1
0.4  
0.8  
2  
1.6  
2.0  
(
)
Ambient temperature Ta °C  
(
(
V
)
Collecto-emitter voltage VCE  
Base-emitter voltage VBE  
VCE(sat) IC  
hFE IC  
fT IE  
1800  
1500  
120
900  
300  
0
100  
250  
200  
150  
100  
50  
VCB = 10 V  
Ta = 25°C  
IC / IB = 10  
CE = 10 V  
10  
1
Ta = 75°C  
25°C  
25°C  
Ta = 75°C  
25
25°C  
.1  
0.01  
0
0.1  
1
10  
100  
1
10  
100  
0.1  
1  
10  
100  
(
)
(
)
(
)
Collector current IC mA  
urrenIC m
Emiter current IE mA  
VCB  
NV IC  
NV VCE  
8
7
6
5
4
3
2
1
0
100  
100  
80  
60  
40  
20  
0
VCE = 10 V  
IE = 0  
= 1 MHz  
Ta = 25°C  
GV = 80 dB  
Function = FLAT  
Ta = 25°C  
Rg = 100 kΩ  
80  
60  
40  
20  
0
Rg = 100 kΩ  
22 kΩ  
5 kΩ  
22 kΩ  
5 kΩ  
IC = 1 mA  
GV = 80 dB  
Function = FLAT  
Ta = 25°C  
1
10  
100  
1
10  
100  
0.01  
0.1  
1
(
V
)
(
V
)
(
)
Collector-base voltage VCB  
Collector-emitter voltage VCE  
Collector current IC mA  
SJC00408AED  
2
This product complies with the RoHS Directive (EU 2002/95/EC).  
SSMini3-F3  
Unit: mm  
1.60 +00..0035  
0.26 +00..0025  
3
1
2
0.13 +00..0025  
.50)  
(0.5)  
1.00 05  
(5°
Request for your special attention and precautions in using the technical information and  
semiconductors described in this book  
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and  
regulations of the exporting country, especially, those with regard to security export control, must be observed.  
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples  
of the products, and no license is granted under any intellectual property right or other right owned by our company or any other  
company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other  
company which may arise as a result of the use of technical information described in this book.  
(3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office  
equipment, communications equipment, measuring instruments and household appliances).  
Consult our sales staff in advance for information on the following applications:  
Special applications (such as for airplanes, aerospace, automobiles, traffic contrl equipment, combustion equipment, life support  
systems and safety devices) in which exceptional quality and reliability equired, or if the failure or malfunction of the prod-  
ucts may directly jeopardize life or harm the human body.  
Any applications other than the standard applications intended.  
(4) The products and product specifications described in this book re subjet to change wnotice for modification and/or im-  
provement. At the final stage of your design, purchasingouse f the roducts, therfor the most up-to-date Product  
Standards in advance to make sure that the latest specifictions saisfy your requirements.  
(5) When designing your equipment, comply with the rnge f absolute maximuing nd the guaranteed operating conditions  
(operating power supply voltage and operating nvirnt etc.). Especiallyplee be creful not to exceed the range of absolute  
maximum rating on the transient state, such as powpower-off and mode-witching. Otherwise, we will not be liable for any  
defect which may arise later in your equpment
Even when the products are used withthe guarnteed values, ake nto te cosideration of incidence of break down and failure  
mode, possible to occur to semicuctor roducts. Mesures the syems such as redundant design, arresting the spread of fire  
or preventing glitch are recomin ordeto prevent pysicainjury, fire, social damages, for example, by using the products.  
(6) Comply with the instructionfor ue in rder to prevent reakdown and characteristics change due to external factors (ESD, EOS,  
thermal stress and mcanical stress) at the time of handlin, mounting or at customer's process. When using products for which  
damp-proof packinis reqred, satisfy the condions, suh as shelf life and the elapsed time since first opening the packages.  
(7) This book may e noreprinted or repwhther wholly or partially, without the prior written permission of Matsushita  
Electric ndurial Co., Ltd.  

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