2SD2215Q [PANASONIC]
Power Bipolar Transistor, 0.75A I(C), 250V V(BR)CEO, 1-Element, NPN, Silicon, Plastic/Epoxy, 3 Pin, IPAK-3;![2SD2215Q](http://pdffile.icpdf.com/pdf2/p00310/img/icpdf/2SD2215AP-Y-_1868972_icpdf.jpg)
型号: | 2SD2215Q |
厂家: | ![]() |
描述: | Power Bipolar Transistor, 0.75A I(C), 250V V(BR)CEO, 1-Element, NPN, Silicon, Plastic/Epoxy, 3 Pin, IPAK-3 放大器 晶体管 |
文件: | 总3页 (文件大小:168K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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Power Transistors
2SD2215, 2SD2215A
Silicon NPN triple diffusion planar type
For power amplification
Unit: mm
7.0±0.3
3.0±0.2
3.5±0.2
Features
High collector to base voltage VCBO
■
●
1.1±0.1
0.85±0.1
0.4±0.1
●
I type package enabling direct soldering of the radiating fin to
0.75±0.1
the printed circuit board, etc. of small electronic equipment.
2.3±0.2
Absolute Maximum Ratings (T =25˚C)
■
C
4.6±0.4
Parameter
Symbol
Ratings
Unit
1
2
3
:Base
ollector
:Emitter
I Type Package
Collector to
2SD2215
2SD2215A
2SD2215
350
400
VCBO
V
base voltage
Collector to
Unit: mm
250
7
3.5±0.2
VCEO
V
2.2
3.0±0.2
0 to 0.15
emitter voltage 2SD2215A
Emitter to base voltage
Peak collector current
Collector current
300
VEBO
ICP
5
A
A
1.
IC
75
15
2.5
Collector power TC=25°C
PC
W
0.75±0.1
0.5 max.
0.9±0.1
dissipation
Ta=25°C
1.3
1.1±0.1
0 to 0.15
Junction temperature
Storage temperature
T
150
˚C
˚C
1
2
Tstg
–55 to +150
1:Base
2:Collector
2.3±0.2
3:Emitter
4.6±0.4
I Type Package (Y)
Electrical Characteristics (T =25˚C)
■
C
Paramete
Symbol
CES
Conditions
min
typ
max
Unit
Collectocuoff
2215
2SD2215A
2SD2215
2215
CE = 350V, VBE 0
1
1
1
1
1
mA
current
VCE = 400V, VBE = 0
VCE = 15V, IB = 0
VCE = 200V, IB = 0
VEB = 5V, IC = 0
ollector cuoff
currt
ICEO
EBO
VCEO
mA
mA
V
Emitter cutoff
Collector to emit
voltage 15A
250
300
70
IC = 30mA, IB = 0
*
hFE1
VCE = 10V, IC = 0.3A
250
Forward current transfer ratio
Base to emitter voltage
hFE2
VBE
V
CE = 10V, IC = 1A
10
VCE = 10V, IC = 1A
IC = 1A, IB = 0.2A
1.5
1
V
V
Collector to emitter saturation voltage VCE(sat)
Transition frequency
Turn-on time
Storage time
Fall time
fT
ton
tstg
tf
V
CE = 5V, IC = 0.5A, f = 10MHz
30
0.5
2
MHz
µs
IC = 1A, IB1 = 0.1A, IB2 = – 0.1A,
VCC = 50V
µs
0.5
µs
*hFE1 Rank classification
Rank
hFE1
Q
P
70 to 150
120 to 250
1
Power Transistors
2SD2215, 2SD2215A
PC — Ta
IC — VCE
IC — VBE
20
1.2
1.0
0.8
0.6
0.4
0.2
0
4.0
TC=25˚C
VCE=10V
(1) TC=Ta
(2) Without heat sink
(PC=1.3W)
3.2
2.
1.6
0.8
0
(1)
25˚C
TC=100˚C
15
10
5
–25˚C
IB=14mA
12mA
10mA
8mA
6mA
4mA
2mA
(2)
0
0
20 40 60 80 100 120 140 160
0
2
4
6
8
0
0
0.4
6
2.0
2.4
(
)
( )
V
(
V
)
Ambient temperature Ta ˚C
Collector to emitter voltge VC
Base to emge VBE
VCE(sat) — IC
FE —
fT — IC
10000
1000
VCE=10V
VCE=10V
f=10MHz
TC=25˚C
IC/IB=10
10
3000
30
100
TC=100˚C
3
1
0
00
30
10
C=100˚C
25˚C
0.3
0.1
–25˚C
25˚C
30
10
3
1
–25˚C
0.03
0.01
3
1
0.3
0.1
0.01
.03
0.1
1
3
0.00.03
0.1
0.3
1
3
0
0.001 0.003 0.01 0.03
0.1
0.3
1
(
A
)
( )
( )
Collector current IC A
Colctor cIC
Collector current IC
Area of safe operation ASO)
Rth(t) — t
10
1000
100
10
Note: Rth was measured at Ta=25˚C and under natural convection.
(1) Without heat sink
ve pul
3
1
(2) With a 50 × 50 × 2mm Al heat sink
ICP
IC
(1)
(2)
=1ms
10ms
DC
0.3
0.1
0.03
0.01
1
0.003
0.001
0.1
1
3
10
30
100 300 1000
10–3
10–2
10–1
1
10
102
103
104
(
V
)
( )
t s
Collector to emitter voltage VCE
Time
2
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products, and no license is granted under any intellectual property right or other right owned by our company or any other
company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other
company which may arise as a result of the use of technical information described in this book.
(3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office
equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
– Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support
systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the prod-
ucts may directly jeopardize life or harm the human body.
– Any applications other than the standard applications intended.
(4) The products and product specifications described in this book are subject to change without notice for modification and/or im-
provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.
(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita
Electric Industrial Co., Ltd.
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