2SB1499AP [PANASONIC]

Power Bipolar Transistor, 4A I(C), 80V V(BR)CEO, 1-Element, PNP, Silicon, Plastic/Epoxy, 3 Pin, MT4, 3 PIN;
2SB1499AP
型号: 2SB1499AP
厂家: PANASONIC    PANASONIC
描述:

Power Bipolar Transistor, 4A I(C), 80V V(BR)CEO, 1-Element, PNP, Silicon, Plastic/Epoxy, 3 Pin, MT4, 3 PIN

文件: 总3页 (文件大小:164K)
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Power Transistors  
2SB1499, 2SB1499A  
Silicon PNP epitaxial planar type  
For low-freauency power amplification  
Unit: mm  
Features  
High forward current transfer ratio hFE which has satisfactory linearity  
Low collector to emitter saturation voltage VCE(sat)  
5.0±0.1  
Allowing automatic insertion with radial taping  
10.0±0
1.0  
Absolute Maximum Ratings (T =25˚C)  
C
90°  
Parameter  
Symbol  
Ratings  
Unit  
C1.0  
Collector to  
2SB1499  
2SB1499A  
2SB1499  
–60  
2.25±0.2  
VCBO  
V
65±0.
1.05±0.1  
base voltage  
Collector to  
–80  
0.35±0
–60  
VCEO  
V
0.55±0.1  
5±0.1  
emitter voltage 2SB1499A  
Emitter to base voltage  
Peak collector current  
Collector current  
–80  
VEBO  
ICP  
–5  
A
A
1.0  
–8  
1
2 3  
IC  
–4  
2.5±0.2  
2.5±0.2  
Collector power TC=25°C  
1:Base  
PC  
W
2:Collector  
3:Emitter  
MT4 Type Package  
dissipation  
Ta=25°C  
2
Junction temperature  
Storage temperature  
Tj  
150  
˚C  
Tstg  
5 to +150  
Electrical Characeristcs (T =25˚C)  
C
Parameter  
Collectutoff  
Symbol  
ICES  
Condition
min  
typ  
max  
–400  
–400  
–700  
–700  
–1  
Unit  
1499  
B1499A  
2S1499  
2SB149A  
CE = –60V, VBE = 0  
µA  
current  
CE = –80V, VBE = 0  
VCE = –30V, IB = 0  
VCE = –60V, IB = 0  
VEB = –5V, IC = 0  
llector ctoff  
crent  
CEO  
IEBO  
VCEO  
µA  
mA  
V
Emittcutoff cu
Collector to e
voltage 9A  
–60  
–80  
70  
IC = –30mA, IB = 0  
*
hFE1  
VCE = –4V, IC = –1A  
250  
Forward current transfer ratio  
Base to emitter voltage  
hFE2  
VBE  
VCE = –4V, IC = –3A  
15  
VCE = –4V, IC = –3A  
–2  
V
V
Collector to emitter saturation voltage VCE(sat)  
IC = –4A, IB = – 0.4A  
–1.5  
Transition frequency  
Turn-on time  
Storage time  
Fall time  
fT  
ton  
tstg  
tf  
VCE = –10V, IC = – 0.1A, f = 10MHz  
30  
0.2  
0.5  
0.2  
MHz  
µs  
IC = –4A, IB1 = – 0.4A, IB2 = 0.4A  
µs  
µs  
*hFE1 Rank classification  
Rank  
hFE1  
Q
P
70 to 150  
120 to 250  
1
Power Transistors  
2SB1499, 2SB1499A  
PC — Ta  
IC — VCE  
IC — VBE  
20  
–6  
–5  
–4  
–3  
–2  
–1  
0
–10  
TC=25˚C  
VCE=–4V  
IB=–120mA  
(1) TC=Ta  
(2) Without heat sink  
(PC=2.0W)  
–100mA  
–80mA  
–60mA  
–8  
–4  
–2  
0
15  
10  
5
25˚C  
–25˚C  
TC=100˚C  
(1)  
–40mA  
–20mA  
–10mA  
–8mA  
–5A  
(2)  
0
0
20 40 60 80 100 120 140 160  
0
–2  
–4  
–6  
–8  
10 2  
0
– 0.4 
–1.6  
–2.0  
(
)
( )  
V
( )  
Base to emge VBE V  
Ambient temperature Ta ˚C  
Collector to emitter voltge VC
VCE(sat) — IC  
FE
fT — IC  
–100  
10000  
10000  
IC/IB=10  
VCE=–4V  
VCE=–5V  
f=10MHz  
TC=25˚C  
–30  
–10  
3000  
300
1000  
0  
5˚C  
–3  
–1  
00  
300  
100  
C=100˚C  
–25˚
25˚C  
TC=100˚C  
– 0.3  
– 0.1  
30  
10  
30  
10  
25˚C  
– 0.03  
– 0.01  
3
1
3
1
– 0.03 – 0.1 
1  
–3  
–10  
– 0.0– 0.03 – 0.1 – 0.3  
–1  
–3  
10  
– 0.01 – 0.03 – 0.1 – 0.3  
–1  
–3  
–10  
( )  
A
( )  
( )  
Collector current IC A  
Colctor cIC  
Collector current IC  
Area of safe operation ASO)  
Rth(t) — t  
–100  
10000  
1000  
100  
10  
ve pul
Note: Rth was measured at Ta=25˚C and under natural convection.  
(1) Without heat sink  
–30  
–10  
(2) With a 50 × 50 × 2mm Al heat sink  
ICP  
t=1s  
IC  
–3  
–1  
(1)  
(2)  
10ms  
DC  
– 0.3  
– 0.1  
1
– 0.03  
– 0.01  
0.1  
–1  
–3  
–10 –30 –100 –300 –1000  
10–4  
10–3  
10–2  
10–1  
1
10  
102  
103  
104  
( )  
V
( )  
s
Collector to emitter voltage VCE  
Time  
t
2
Request for your special attention and precautions in using the technical information and  
semiconductors described in this book  
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and  
regulations of the exporting country, especially, those with regard to security export control, must be observed.  
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples  
of the products, and no license is granted under any intellectual property right or other right owned by our company or any other  
company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other  
company which may arise as a result of the use of technical information described in this book.  
(3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office  
equipment, communications equipment, measuring instruments and household appliances).  
Consult our sales staff in advance for information on the following applications:  
Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support  
systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the prod-  
ucts may directly jeopardize life or harm the human body.  
Any applications other than the standard applications intended.  
(4) The products and product specifications described in this book are subject to change without notice for modification and/or im-  
provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product  
Standards in advance to make sure that the latest specifications satisfy your requirements.  
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions  
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute  
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any  
defect which may arise later in your equipment.  
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure  
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire  
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.  
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,  
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which  
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.  
(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita  
Electric Industrial Co., Ltd.  

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