2SB1377R [PANASONIC]

Transistor, SIP-3;
2SB1377R
型号: 2SB1377R
厂家: PANASONIC    PANASONIC
描述:

Transistor, SIP-3

文件: 总4页 (文件大小:177K)
中文:  中文翻译
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Transistor  
2SB1377  
Silicon PNP epitaxial planer type  
For low-frequency power amplification and driver amplification  
Complementary to 2SD2071  
Unit: mm  
2.5±0.1  
1.05  
±0.05  
6.9.1  
4.0  
(1.45)  
0.8  
0.7  
Features  
Allowing supply with the radial taping.  
0.65 m
Absolute Maximum Ratings (Ta=25˚C)  
0.45+00..105  
Parameter  
Symbol  
VCBO  
VCEO  
VEBO  
ICP  
Ratings  
Un
V
2.5±2.5±0.5  
Collector to base voltage  
Collector to emitter voltage  
Emitter to base voltage  
Peak collector current  
Collector current  
–60  
1
2
3
–50  
–5  
V
–1  
00  
A
Noten addition to the  
1:Emitter  
2:Collector  
:Base  
lead type shown in  
the upper figure, the  
type as shown in  
the lower figure is  
also available.  
IC  
mA  
W
˚
˚C  
*
Collector power dissipation  
Junction temperature  
Storage temperature  
PC  
1
MT2 Type Package  
Tj  
150  
Tstg  
–55 ~ +150  
*
Printed circuit board: Copper il area of 1cm2 or mord the oard  
thickness of 1.7mm for thcollecor portion  
1.2±0.1  
0.65  
max.  
+
0.1  
0.45–0.05  
(HW type)  
Electrcal Characteristics (Ta=25˚C)  
Pameter  
Symol  
ICBO  
Conditions  
CB = –20V, IE = 0  
min  
typ  
max  
– 0.1  
–1  
Unit  
V
µA  
µA  
V
Collectocuto
ICEO  
VCE = –20V, IB = 0  
Collector to base v
Collector to emitter vole  
Emitter to base voltage  
VCBO  
VCE
VEBO  
IC = –10µA, IE = 0  
–60  
–50  
–5  
IC = –2mA, IB = 0  
V
IE = –10µA, IC = 0  
V
*
hFE1  
VCE = –10V, IC = –10mA  
VCE = –10V, IC = –500mA  
IC = –300mA, IB = –30mA  
IC = –300mA, IB = –30mA  
VCB = –10V, IE = 10mA, f = 200MHz  
VCB = –10V, IE = 0, f = 1MHz  
85  
160  
90  
340  
Forward current transfer ratio  
hFE2  
40  
Collector to emitter saturation voltage VCE(sat)  
Base to emitter saturation voltage VBE(sat)  
– 0.35  
–1.1  
200  
6
– 0.6  
–1.5  
V
V
Transition frequency  
fT  
MHz  
pF  
Collector output capacitance  
Cob  
15  
*hFE1 Rank classification  
Rank  
hFE1  
Q
R
S
85 ~ 170  
120 ~ 240  
170 ~ 340  
1
2SB1377  
Transistor  
PC — Ta  
IC — VCE  
IC — IB  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0
800  
700  
600  
500  
400  
300  
200  
100  
0
–800  
–700  
–600  
–50
–400  
0  
0  
00  
0
Ta=25˚C  
VCE=–10V  
Ta=25˚C  
Printed circut board: Copper  
foil area of 1cm2 or more, and  
the board thickness of 1.7mm  
for the collector portion.  
IB=–10mA  
–9mA  
–8mA  
–7mA  
–6mA  
–5mA  
–4mA  
–3mA  
–2mA  
–1mA  
0
20 40 60 80 100 120 140 160  
0
–4  
–8  
–12  
6  
0  
0
–2  
–8  
–10  
(
)
( )  
V
(
)
Ambient temperature Ta ˚C  
Collector to emitter voltge VC
Base B mA  
VCE(sat) — IC  
VE(sat) IC  
FE — IC  
–100  
–100  
600  
500  
400  
300  
200  
100  
0
IC/IB=10  
IC/IB=10  
VCE=–10V  
–30  
–10  
–30  
–3  
–1  
–3  
5˚C  
Ta=–25˚C  
75˚
Ta=75˚C  
25˚C  
Ta=75˚C  
– 0.3  
– 0.1  
– 0.3  
– 0.1  
25˚C  
–25˚C  
–25˚C  
– 0.03  
– 0.01  
– 0.03  
– 0.01  
– 0.01 0– 0.1 
–3  
–10  
– 0.0– 0.03 – 0.1 – 0.3  
–1  
–3  
–10  
– 0.01 – 0.03 – 0.1 – 0.3  
–1  
–3  
–10  
(
A
)
(
( )  
Collector current IC A  
olltor cIC  
Collector current IC  
fT — IE  
Cob — VCB  
VCER — RBE  
240  
200  
160  
120  
80  
24  
20  
16  
12  
8
–120  
–100  
–80  
–60  
–40  
–20  
0
IE=0  
f=1MHz  
Ta=25˚C  
–10V  
5˚C  
IC=–2mA  
Ta=25˚C  
40  
4
0
0
–1  
1
3
10  
30  
100  
–3  
–10  
–30  
–100  
1
3
10  
30  
100 300 1000  
(
)
( )  
V
(
)
Emitter current IE mA  
Collector to base voltage VCB  
Base to emitter resistance RBE k  
2
2SB1377  
Transistor  
ICEO — Ta  
104  
103  
102  
10  
VCE=–10V  
1
0
40  
80  
120  
160  
200  
(
)
Ambient temperature Ta ˚C  
3
Request for your special attention and precautions in using the technical information and  
semiconductors described in this book  
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and  
regulations of the exporting country, especially, those with regard to security export control, must be observed.  
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples  
of the products, and no license is granted under any intellectual property right or other right owned by our company or any other  
company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other  
company which may arise as a result of the use of technical information described in this book.  
(3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office  
equipment, communications equipment, measuring instruments and household appliances).  
Consult our sales staff in advance for information on the following applications:  
Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support  
systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the prod-  
ucts may directly jeopardize life or harm the human body.  
Any applications other than the standard applications intended.  
(4) The products and product specifications described in this book are subject to change without notice for modification and/or im-  
provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product  
Standards in advance to make sure that the latest specifications satisfy your requirements.  
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions  
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute  
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any  
defect which may arise later in your equipment.  
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure  
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire  
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.  
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,  
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which  
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.  
(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita  
Electric Industrial Co., Ltd.  

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