PLBT3535HPF-YDNW70 [P-TEC]
ESD 8KV (HGM: MIL-STD883 Class 3B);
| 型号： | PLBT3535HPF-YDNW70 |
| 厂家： | 
P-tec Corporation |
| 描述： | ESD 8KV (HGM: MIL-STD883 Class 3B) |
| 文件： | 总17页 (文件大小：2745K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
PRODUCT SPECIFICATION
Part Number
PLBT3535HPF-YDxxxx
Details
Features
Binning based on ANSI C78.377
High Power 3535 FlipChip LED
3.5 x 3.5 x 2.0mm
1,000 piece reels
Emitting Color: White
InGaN based phosphor converted LED
MSL2 qualified according to J-STD 020
ESD 8KV (HGM: MIL-STD883 Class 3B)
RoHS & REACH Compliant
Mechanical Dimensions
Notes:
1. Dimensions in millimeters and tolerance is ±0.13mm unless otherwise noted
2. Specifications subject to change without notice
www.p-tec.net
102014 Rev1 MS
Page 1 of 17
Device Selection Guide
Luminous Flux (lm)
Forward
Voltage (V)
Basic Order Code
350mA
Min Min
Calculated
Min. @ 85Ԩ
Typical
CCT (K)
Model Number
CRI
700
mA
1000
mA
Group
@
@
Min Max
25Ԩ 85Ԩ
B35
B36
B34
B35
B34
B35
B36
B35
B36
B34
B35
B36
B33
B34
B35
B32
B32
B33
B34
B29
B30
B31
B34
B30
B31
B32
B33
120
130
110
120
110
120
130
120
130
110
120
130
100
110
120
90
102
110
93
102
93
102
110
102
110
93
102
110
85
93
102
76
76
85
93
59
63
68
178
192
162
178
162
178
192
178
192
162
178
192
148
162
178
133
133
148
162
122
131
119
162
178
192
133
148
224
242
204
224
204
224
242
224
242
204
224
242
187
204
224
167
167
187
204
133
142
149
204
224
242
167
187
PLBT3535HPF-YDCW70
PLBT3535HPF-YDCW82
>70
>82
5710-6530
5710-6530
2.8
2.8
3.4
3.4
PLBT3535HPF-YDPW82
PLBT3535HPF-YDPW70
PLBT3535HPF-YDNW70
>82
>70
>70
5310-6020
4745-5310
3710-4260
2.8
2.8
2.8
3.4
3.4
3.4
PLBT3535HPF-YDNW82
>82
3710-4260
2.8
3.4
90
PLBT3535HPF-YDWW82
PLBT3535HPF-YDWW70
>82
>70
100
110
70
75
80
110
120
130
90
2725-3045
1980-2240
2.8
2.8
3.4
3.4
93
PLBT3535HPF-YDCW82A >82
PLBT3535HPF-YDWW82A >82
102
110
76
6500
3000
2.8
2.8
3.4
3.4
100
85
Notes: 1. Forward voltage (VF ) ±0.05V, Luminous flux (Φv) ±5%; CRI ±2
2. IS standard testing.
www.p-tec.net
102014 Rev1 MS
Page 2 of 17
Absolute Maximum Ratings at Ta=25Ԩ
Rating
Parameter
Symbol
Unit
Min
--
--
2.8
--
--
--
-40
--
Typical
350
--
--
-5
--
150
--
Max
1000
1500
3.2
--
10
--
100
--
DC Forward Current
Pulse Forward Current
Forward Voltage
IF
IPF
VF
VR
IR
TJ
Tstg
Tsol
mA
mA
V
V
μA
Ԩ
Ԩ
Ԩ
Reverse Voltage
Leakage Current (5V)
Junction Temperature
Storage Temperature
Soldering Temperature
Thermal Resistance
Junction / Solder Point
Viewing Angle
260
RTH
--
--
8
--
--
Ԩ/W
2θ ½
120
deg
Notes: 1. For other ambient, limited setting of current will depend on derating curves
2. D=0.01s duty 1/10
3. When drive on maximum current, TJ must be kept below 150
4. Viewing angle (2θ ½) ±10°
www.p-tec.net
102014 Rev1 MS
Page 3 of 17
Intensity Binning
Bin Code (350mA)
Min. Φv
70
Max. Φv
75
B29
B30
B31
B32
B33
B34
B35
B36
75
80
90
100
110
120
130
80
90
100
110
120
130
140
Forward Voltage Binning
Bin Code (350mA)
V2830
Min. VF
2.8
Max. VF
3.0
V3032
3.0
3.2
www.p-tec.net
102014 Rev1 MS
Page 4 of 17
Color Coordinate Binning
www.p-tec.net
102014 Rev1 MS
Page 5 of 17
Color Coordinate Binning
CCT
CIE
3000K
X
Y
Center
306S
CCT
CIE
0.4400
0.4030
6STEP
6500K
X
Y
Center
656S
0.3130
0.3370
6STEP
www.p-tec.net
102014 Rev1 MS
Page 6 of 17
Relative Spectral Power Distribution
www.p-tec.net
102014 Rev1 MS
Page 7 of 17
Electronic-Optical Characteristics
Relative luminous Flux vs. Forward Current
Forward Current vs. Forward Voltage (Ta=25Ԩ)
(Ta=25Ԩ)
Relative Chromaticity vs. Ambient temperture
(IF=350mA)
Relative Flux vs. Junction Temperature (IF=350mA)
www.p-tec.net
102014 Rev1 MS
Page 8 of 17
Typical Spatial Distribution
Thermal Design for De-Rating
The maximum forward current is determined by the thermal resistance between the LED junction and ambient. It is
crucial for the end product to be designed in a manner that minimizes the thermal resistance from the solder point to
ambient in order to optimize lamp life and optical characteristics.
www.p-tec.net
102014 Rev1 MS
Page 9 of 17
Suggested Stencil Pattern (Recommendations for Reference)
Note: Suggested stencil t = 0.12mm
www.p-tec.net
102014 Rev1 MS
Page 10 of 17
Packaging and Reel Dimensions
www.p-tec.net
102014 Rev1 MS
Page 11 of 17
Notes:
1. Reeled products (minimum number of pieces is 100 and maximum is 1000) packed in sealed moisture-proof bags along with a desiccant;
a maximum of five moisture-proof bags packed inside the box (size: 240mm x 195mm x 100mm ±5mm) and a maximum of four inside
boxes are put in the outside box
2. (size: 410mm x 255mm x 240mm ±5mm) together with buffer material packed.
3. (Part No., Lot No., quantity should appear on the label of the moisture-proof bag and the cardboard box.)
www.p-tec.net
102014 Rev1 MS
Page 12 of 17
Reflow Profile
www.p-tec.net
102014 Rev1 MS
Page 13 of 17
Precautions
1. Recommendation for using LEDs
1.1 The lens of LEDs should not be exposed to dust or debris. Excessive dust and debris may cause a drastic
decrease in the luminosity.
1.2 Avoid mechanical stress on LED lens.
1.3 Do not touch the LED lens surface. It would affect the optical performance of the LED due to the LED lens’
damage.
1.4 Pick & place tools are recommended for the remove of LEDs from the factory tape & reel packaging
2. Pick & place nozzle
The pickup tool was recommended and shown as below)
3. Lens handling
Please follow the guideline to pick LEDs
3.1 Use tweezers to pick LEDs
3.2 Do not touch the lens by using tweezers
3.3 Do not touch lens with fingers
3.4 Do not apply more than 4N of lens (400g) directly onto the lens
www.p-tec.net
102014 Rev1 MS
Page 14 of 17
4. Lens cleaning
In the case which a small amount of dirt and dust particles remain on the lens surface, a suitable cleaning solution
can be applied.
4.1 Try a gentle wiping with dust-free cloth
4.2 If needed, use dust-free cloth and isopropyl alcohol to gently clean the dirt from the lens surface.
4.3 Do not use other solvents as they may directly react with the LED assembly
4.4 Do not use ultrasonic cleaning which will damage the LEDs
5. Carrier tape handling
The following items are recommended when handling the carrier tape of LEDs
5.1 Do not twist the carrier tape
5.2 The inward bending diameter should not be smaller than 6cm for each carrier tape.
5.3 Do not bend the tape outward.
www.p-tec.net
102014 Rev1 MS
Page 15 of 17
Test Items and Results of Reliability
Tested with P‐tec
Standard
Tested with P‐tec
Standard
Tested with P‐tec
Standard
Notes: 1. USL: Upper specification level
2. LSL: Lower specification level
www.p-tec.net
102014 Rev1 MS
Page 16 of 17
Approved By
Checked By
Prepared By
Customer Approval
Signatures
Record Of Revisions
Rev.
0
1
Comments
Released Spec
Added PLBT3535HPF-YDPW82
Page
--
2
Date
10/20/14
03/17/15
www.p-tec.net
102014 Rev1 MS
Page 17 of 17
相关型号：
©2020 ICPDF网 联系我们和版权申明