SFH-4231 [OSRAM]
IR-Lumineszenzdiode (940 nm) mit hoher Ausgangsleistung;
| 型号： | SFH-4231 |
| 厂家： | 
OSRAM GMBH |
| 描述： | IR-Lumineszenzdiode (940 nm) mit hoher Ausgangsleistung |
| 文件： | 总8页 (文件大小：268K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
IR-Lumineszenzdiode (940 nm) mit hoher Ausgangsleistung
High Power Infrared Emitter (940 nm)
Lead (Pb) Free Product - RoHS Compliant
SFH 4231
Wesentliche Merkmale
Features
• IR-Lichtquelle mit hohem Wirkungsgrad
• Chipgröße (emittierende Fläche) 1 x 1 mm2
• max. Gleichstrom 1 A
• IR lightsource with high efficiency
• die-size (emitting area) 1 x 1 mm2
• max. DC-current 1 A
• niedriger Wärmewiderstand (15 K/W)
• Schwerpunktswellenlänge 940 nm
• ESD-sicher bis 2 kV nach JESD22-A114-E
• Low thermal resistance (15 K/W)
• Center of spectral emission at 940 nm
• ESD save up to 2 kV acc. to JESD22-A114-E
Anwendungen
Applications
• Infrarotbeleuchtung für Kameras
• Überwachungssysteme
• IR-Datenübertragung
• Fahrer-Assistenz Systeme
• Maschinensicherheit
• Infrared Illumination for cameras
• Surveillance systems
• IR Data Transmission
• Driver assistance systems
• Machine security
Sicherheitshinweise
Safety Advices
Je nach Betriebsart emittieren diese Bauteile Depending on the mode of operation, these
hochkonzentrierte, nicht sichtbare Infrarot- devices emit highly concentrated non visible
Strahlung, die gefährlich für das menschliche infrared light which can be hazardous to the
Auge sein kann. Produkte, die diese Bauteile human eye. Products which incorporate these
enthalten, müssen gemäß den Sicherheits- devices have to follow the safety precautions
richtlinien der IEC-Normen 60825-1 und 62471 given in IEC 60825-1 and IEC 62471.
behandelt werden.
Typ
Type
Bestellnummer
Ordering Code
Gesamtstrahlungsfluss1) (IF = 1A, tp = 100 µs)
Total Radiant Flux1)
Φe (mW)
SFH 4231
Q65110A4808
≥ 320 (typ. 500)
1) gemessen mit Ulbrichtkugel / measured with integrating sphere
2009-09-08
1
SFH 4231
Grenzwerte (TA = 25 °C)
Maximum Ratings
Bezeichnung
Parameter
Symbol
Symbol
Wert
Value
Einheit
Unit
Betriebs- und Lagertemperatur
Top , Tstg
– 40 … + 100
°C
Operating and storage temperature range
Sperrschichttemperatur
Junction temperature
TJ
+ 125
1
°C
V
Sperrspannung
Reverse voltage
VR
Vorwärtsgleichstrom
Forward current
IF
1
A
Stoßstrom, tp < 1 ms, D = 0.2
Surge current
IFSM
Ptot
2
A
Leistungsaufnahme
Power consumption
2.4
15
W
K/W
Wärmewiderstand Sperrschicht - Lötstelle bei
Montage auf Metall-Block
RthJS
Thermal resistance junction - soldering point,
mounted on metal block
Kennwerte (TA = 25 °C)
Characteristics
Bezeichnung
Parameter
Symbol
Symbol
Wert
Value
Einheit
Unit
Wellenlänge der Strahlung
Wavelength at peak emission
IF = 1 A, tp = 10 ms
λpeak
λcentroid
Δλ
950
940
45
nm
nm
nm
Centroid-Wellenlänge der Strahlung
Centroid wavelength
IF = 1 A, tp = 10 ms
Spektrale Bandbreite bei 50% von Imax
Spectral bandwidth at 50% of Imax
IF = 1 A, tp = 10 ms
Abstrahlwinkel
Half angle
ϕ
± 60
1
Grad
deg.
mm2
Aktive Chipfläche
Active chip area
A
Abmessungen der aktiven Chipfläche
Dimension of the active chip area
L × B
L × W
1 × 1
mm²
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2
SFH 4231
Kennwerte (TA = 25 °C)
Characteristics (cont’d)
Bezeichnung
Parameter
Symbol
Symbol
Wert
Value
Einheit
Unit
Schaltzeiten, Ie von 10% auf 90% und von 90% tr, tf
auf 10%, IF = 1 A, RL = 50 Ω
20
ns
Switching times, Ιe from 10% to 90% and from
90% to 10%, IF = 1 A, RL = 50 Ω
Durchlassspannung
Forward voltage
IF = 1 A, tp = 100 µs
VF
1.8 (< 2.4)
170
V
Strahlstärke
Radiant intensity
IF = 1 A, tp = 100 μs
Ie typ
mW/sr
%/K
Temperaturkoeffizient von Ie bzw. Φe
Temperature coefficient of Ie or Φe
IF = 1 A, tp = 10 ms
TCI
– 0.5
– 1
Temperaturkoeffizient von VF
Temperature coefficient of VF
IF = 1 A, tp = 10 ms
TCV
mV/K
nm/K
Temperaturkoeffizient von λ
Temperature coefficient of λ
IF = 1 A, tp = 10 ms
TCλ,centroid
+ 0.3
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3
SFH 4231
Gesamtstrahlungsfluss1) Φe
Total Radiant Flux1) Φe
Bezeichnung
Parameter
Symbol
Werte
Values
Einheit
Unit
SFH 4231-CX SFH 4231-DX
Gesamtstrahlungsfluss
Total Radiant Flux
Φe min
Φe max
320
630
500
1000
mW
mW
IF = 1 A, tp = 100 µs
1)
Nur eine Gruppe in einer Verpackungseinheit (Streuung kleiner 2:1) /
Only one group in one packing unit (variation lower 2:1)
Abstrahlcharakteristik
Radiation Characteristics Irel = f (ϕ)
OHL01660
40˚
30˚
20˚
10˚
0˚
ϕ
1.0
50˚
0.8
0.6
0.4
0.2
0
60˚
70˚
80˚
90˚
100˚
1.0
0.8
0.6
0.4
0˚
20˚
40˚
60˚
80˚
100˚
120˚
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SFH 4231
Relative spektrale Emission
Relative Spectral Emission
Durchlassstrom
Forward Current
IF = f (VF)
Relativer Gesamtstrahlungsfluss
Relative Total Radiant Flux
Φe/Φe(1000mA) = f (IF)
Irel = f (λ)
Single pulse, tp = 100 μs
Single pulse, tp = 100 μs
OHF02906
101
OHF02895
OHF02894
101
100
Φe
A
%
Irel
IF
Φe (1000 mA)
80
60
40
20
100
5
100
5
10-1
5
10-1
5
10-2
5
10-3
10-2
0
800
101
5
102
5
103
mA 104
IF
0
0.5
1
1.5
2
2.5 V 3
VF
850
900
950
nm 1025
λ
Max. zulässiger Durchlassstrom
Max. Permissible Forward Current
IF = f (TA), RthJS = 15 K/W
Zulässige Impulsbelastbarkeit
Permissible Pulse Handling
Capability IF = f (tp), TA = 85 °C,
Duty cycle D = parameter
OHF02803
OHF02801
2.5
1200
A
mA
D
=
IF
IF
0.005
0.01
0.02
0.05
0.1
0.2
0.5
2.0
1.5
1.0
0.5
0
800
600
400
200
0
1
tP
tP
IF
D
= T
T
10-5 10-4 10-3 10-2 10-1 100 101 s 102
0
20
40
60
80 ˚C 100
tp
TS
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SFH 4231
Maßzeichnung1)
Package Outlines
0...0.1 (0.004)
6.2 (0.244)
5.8 (0.228)
0.29 (0.011)
0.24 (0.009)
R1.5 (0.059)
Cathode
1.9 (0.075)
1.7 (0.067)
1.0 (0.039)
0.8 (0.031)
2.0 (0.079)
1.6 (0.063)
GPLY7071
Kathodenkennung:
Cathode mark:
Gewicht / Approx. weight:
Markierung
mark
0.2 g
Gurtung / Polarität und Lage
Method of Taping / Polarity and Orientation
Verpackungseinheit 800/Rolle, ø180 mm
Packing unit 800/reel, ø180 mm
Cathode/Collector Side
4 (0.157)
0.3 (0.012)
0.3 (0.012)
1.55 (0.061)
2 (0.079)
6.35 (0.250)
8 (0.315)
1.9 (0.075)
OHAY0508
1)
Maße in mm (inch) / Dimensions in mm (inch)
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6
SFH 4231
Empfohlenes Lötpaddesign
Recommended Solder Pad Design
12.0 (0.472)
11.6 (0.457)
11.6 (0.457)
1.6 (0.063)
3 Lötstellen
3 solder points
ø2.5 (0.098)
ø4.0 (0.157)
Heatsink attach
ø4.0 (0.157)
1.6 (0.063)
Kupfer
Copper
Thermisch optimiertes PCB
Thermal enhanced PCB
Footprint
Lötstopplack
Solder resist
Lötpasten Schablone
Solder paste stencil
Bare Copper
Freies Kupfer
OHAY0681
Achtung:
Anode und Heatsink sind elektrisch verbunden
Attention:
Anode and Heatsink are electrically connected
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7
SFH 4231
Lötbedingungen
Vorbehandlung nach JEDEC Level 4
Soldering Conditions
Preconditioning acc. to JEDEC Level 4
Reflow Lötprofil für bleifreies Löten
Reflow Soldering Profile for lead free soldering
(nach J-STD-020C)
(acc. to J-STD-020C)
OHLA0687
300
Maximum Solder Profile
Recommended Solder Profile
Minimum Solder Profile
˚C
+0 ˚C
-5 ˚C
260 ˚C
245 ˚C
235 ˚C
255 ˚C
240 ˚C
250
T
±5 ˚C
+5 ˚C
-0 ˚C
217 ˚C
10 s min
200
150
100
50
30 s max
Ramp Down
6 K/s (max)
100 s max
120 s max
Ramp Up
3 K/s (max)
25 ˚C
0
0
50
100
150
200
250
s
300
t
Published by
OSRAM Opto Semiconductors GmbH
Leibnizstraße 4, D-93055 Regensburg
www.osram-os.com
© All Rights Reserved.
The information describes the type of component and shall not be considered as assured characteristics.
Terms of delivery and rights to change design reserved. Due to technical requirements components may contain
dangerous substances. For information on the types in question please contact our Sales Organization.
Packing
Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office.
By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing
material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs
incurred.
Components used in life-support devices or systems must be expressly authorized for such purpose! Critical
components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS.
1 A critical component is a component usedin a life-support device or system whose failure can reasonably be expected
to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system.
2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain
and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered.
2009-09-08
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