SFH-213 [OSRAM]
Silicon PIN Photodiode;
OSRAM GMBH 
2015-12-23
Silicon PIN Photodiode
Version 1.3
SFH 213
Features:
•
•
•
Wavelength range (S10%) 400 nm to 1100 nm
Short switching time (typ. 5 ns)
5 mm LED plastic package
Applications
•
•
•
High speed photointerrupters
Industrial electronics
For control and drive circuits
Ordering Information
Type:
Photocurrent
Ordering Code
IP [µA]
VR = 5 V, Std. Light A, EV =
1000 lx
SFH 213
135 (≥ 100)
Q62702P0930
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Version 1.3
SFH 213
Maximum Ratings (TA = 25 °C)
Parameter
Symbol
Top; Tstg
VR
Values
-40 ... 100
20
Unit
°C
V
Operating and storage temperature range
Reverse voltage
Reverse voltage
(t < 2 min)
VR
50
V
Total Power dissipation
Ptot
150
mW
V
ESD withstand voltage
(acc. to ANSI/ ESDA/ JEDEC JS-001 - HBM)
VESD
2000
Characteristics (TA = 25 °C)
Parameter
Symbol
(typ (min)) IP
Values
Unit
Photocurrent
(Ev = 1000 lx, Std. Light A, VR = 5 V, T = 2856 K)
135 (≥ 100)
µA
Wavelength of max. sensitivity
Spectral range of sensitivity
(typ)
(typ)
λS max
850
nm
λ10%
(typ) 400 nm
... 1100
1.00
Radiant sensitive area
(typ)
(typ)
A
mm2
Dimensions of radiant sensitive area
L x W
1 x 1
mm x
mm
Half angle
(typ)
ϕ
± 10
°
Dark current
(VR = 20 V)
(typ (max)) IR
1 (≤ 5)
nA
Spectral sensitivity of the chip
(λ = 870 nm)
(typ)
(typ)
Sλ typ
0.65
0.93
A / W
Quantum yield of the chip
(λ = 870 nm)
η
Electro
ns
/Photon
Open-circuit voltage
(typ (min)) VO
430 (≥ 350)
125
mV
µA
(Ev = 1000 lx, Std. Light A)
Short-circuit current
(Ev = 1000 lx, Std. Light A)
(typ)
(typ)
(typ)
(typ)
(typ)
ISC
Rise and fall time
(VR = 20 V, RL = 50 Ω, λ = 850 nm)
tr, tf
VF
0.005
1.3
µs
Forward voltage
(IF = 100 mA, E = 0)
V
Capacitance
(VR = 0 V, f = 1 MHz, E = 0)
C0
11
pF
Temperature coefficient of VO
TCV
-2.6
mV / K
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Version 1.3
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Parameter
Symbol
Values
Unit
Temperature coefficient of ISC
(Std. Light A)
(typ)
(typ)
(typ)
TCI
0.18
% / K
Noise equivalent power
(VR = 20 V, λ = 870 nm)
NEP
D*
0.028
pW /
½
Hz
Detection limit
(VR = 20 V, λ = 870 nm)
3.6e12
cm x
½
Hz / W
Relative Spectral Sensitivity 1) page 8
Srel = f(λ)
Photocurrent / Open-Circuit Voltage 1) page 8
IP (VR = 5 V) / VO = f(EV)
OHF01034
100
%
Srel
80
60
40
20
0
400
600
800
1000 nm 1200
λ
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Version 1.3
SFH 213
Dark Current 1) page 8
IR = f(VR), E = 0
Power Consumption
Ptot = f(TA)
OHF00394
160
mW
P
tot
140
120
100
80
60
40
20
0
0
20
40
60
80 ˚C 100
TA
Capacitance 1) page 8
C = f(VR), f = 1 MHz, E = 0
Dark Current 1) page 8
IR = f(TA), VR = 20 V, E = 0
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Version 1.3
SFH 213
Directional Characteristics 1) page 8
Srel = f(ϕ)
Package Outline
9.0 (0.354)
8.2 (0.323)
7.8 (0.307)
7.5 (0.295)
Area not flat
0.6 (0.024)
0.4 (0.016)
5.9 (0.232)
5.5 (0.217)
1.8 (0.071)
1.2 (0.047)
0.6 (0.024)
0.4 (0.016)
5.7 (0.224)
5.1 (0.201)
29 (1.142)
27 (1.063)
Chip position
Cathode (Diode)
GEXY6260
Collector (Transistor)
Dimensions in mm (inch).
Package
5mm Radial (T 1 ¾), Epoxy
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Version 1.3
SFH 213
Approximate Weight:
0.4 g
Note
Packing information is available on the internet (online product catalog).
Recommended Solder Pad
Dimensions in mm.
Note:
pad 1: anode
2015-12-23
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Version 1.3
SFH 213
TTW Soldering
IEC-61760-1 TTW
OHA04645
300
˚C
10 s max., max. contact time 5 s per wave
T
Continuous line: typical process
Dotted line: process limits
250
235 ˚C - 260 ˚C
First wave
Second wave
∆T < 150 K
200
150
100
50
Cooling
Preheating
ca. 3.5 K/s typical
ca. 2 K/s
130 ˚C
120 ˚C
100 ˚C
ca. 5 K/s
Typical
0
0
20
40
60
80
100
120
140
160
180
200
220 s 240
t
Disclaimer
Language english will prevail in case of any discrepancies or deviations between the two language wordings.
Attention please!
The information describes the type of component and shall not be considered as assured characteristics.
Terms of delivery and rights to change design reserved. Due to technical requirements components may contain
dangerous substances.
For information on the types in question please contact our Sales Organization.
If printed or downloaded, please find the latest version in the Internet.
Packing
Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office.
By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing
material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any
costs incurred.
Components used in life-support devices or systems must be expressly authorized for such purpose!
Critical components* may only be used in life-support devices** or systems with the express written approval of
OSRAM OS.
*) A critical component is a component used in a life-support device or system whose failure can reasonably be
expected to cause the failure of that life-support device or system, or to affect its safety or the effectiveness of that
device or system.
**) Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or
maintain and sustain human life. If they fail, it is reasonable to assume that the health and the life of the user may be
endangered.
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SFH 213
Glossary
1)
Typical Values: Due to the special conditions of the manufacturing processes of LED, the typical data or
calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily
correspond to the actual parameters of each single product, which could differ from the typical data and calculated
correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data
will be changed without any further notice.
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Version 1.3
SFH 213
Published by OSRAM Opto Semiconductors GmbH
Leibnizstraße 4, D-93055 Regensburg
www.osram-os.com © All Rights Reserved.
2015-12-23
9
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