Q65110A2091 [OSRAM]

IR-Lumineszenzdiode (850 nm) mit hoher Ausgangsleistung; IR- Lumineszenzdiode ( 850纳米),麻省理工学院达赫Ausgangsleistung
Q65110A2091
型号: Q65110A2091
厂家: OSRAM GMBH    OSRAM GMBH
描述:

IR-Lumineszenzdiode (850 nm) mit hoher Ausgangsleistung
IR- Lumineszenzdiode ( 850纳米),麻省理工学院达赫Ausgangsleistung

文件: 总8页 (文件大小:144K)
中文:  中文翻译
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IR-Lumineszenzdiode (850 nm) mit hoher Ausgangsleistung  
High Power Infrared Emitter (850 nm)  
Lead (Pb) Free Product - RoHS Compliant  
SFH 4350  
Features  
Wesentliche Merkmale  
• High Power Infrared LED  
• Emission angle ± 13°  
• Very high radiant intensity  
• Short switching times  
• UL version available  
• Infrarot LED mit hoher Ausgangsleistung  
• Abstrahlwinkel ± 13°  
• Sehr hohe Strahlstärke  
• Kurze Schaltzeiten  
• UL Version erhältlich  
Applications  
Anwendungen  
• Infrared Illumination for cameras  
• Sensor technology  
• Infrarotbeleuchtung für Kameras  
• Sensorik  
• Data transmission  
• Smoke detectors  
• Datenübertragung  
• Rauchmelder  
Safety Advices  
Sicherheitshinweise  
Depending on the mode of operation, these  
devices emit highly concentrated non visible  
infrared light which can be hazardous to the  
human eye. Products which incorporate these  
devices have to follow the safety precautions  
given in IEC 60825-1 and IEC 62471.  
Je nach Betriebsart emittieren diese Bauteile  
hochkonzentrierte, nicht sichtbare Infrarot-  
Strahlung, die gefährlich für das menschliche  
Auge sein kann. Produkte, die diese Bauteile  
enthalten, müssen gemäß den Sicherheits-  
richtlinien der IEC-Normen 60825-1 und 62471  
behandelt werden.  
Typ  
Type  
Bestellnummer  
Ordering Code  
Strahlstärkegruppierung1) (IF = 100 mA, tp = 20 ms)  
Radiant Intensity Grouping1)  
Ie (mW/sr)  
SFH 4350  
Q65110A2091  
40 (typ. 110)  
1) gemessen bei einem Raumwinkel Ω = 0.01 sr / measured at a solid angle of Ω = 0.01 sr  
2009-08-21  
1
SFH 4350  
Grenzwerte (TA = 25 °C)  
Maximum Ratings  
Bezeichnung  
Parameter  
Symbol  
Symbol  
Wert  
Value  
Einheit  
Unit  
Betriebs- und Lagertemperatur  
Top , Tstg  
– 40 + 100  
°C  
Operating and storage temperature range  
Sperrspannung  
Reverse voltage  
VR  
5
V
Vorwärtsgleichstrom  
Forward current  
IF  
100  
1.5  
180  
450  
mA  
A
Stoßstrom, tp = 10 μs, D = 0  
Surge current  
IFSM  
Ptot  
Verlustleistung  
Power dissipation  
mW  
K/W  
Wärmewiderstand Sperrschicht - Umgebung bei RthJA  
Montage auf FR4 Platine, Padgröße je 16 mm2  
Thermal resistance junction - ambient mounted  
on PC-board (FR4), padsize 16 mm2 each  
Kennwerte (TA = 25 °C)  
Characteristics  
Bezeichnung  
Parameter  
Symbol  
Symbol  
Wert  
Value  
Einheit  
Unit  
Wellenlänge der Strahlung  
Wavelength at peak emission  
IF = 100 mA  
λpeak  
860  
850  
42  
nm  
nm  
nm  
Centroid-Wellenlänge der Strahlung  
Centroid wavelength  
IF = 100 mA  
λcentroid  
Spektrale Bandbreite bei 50% von Imax  
Spectral bandwidth at 50% of Imax  
IF = 100 mA  
Δλ  
Abstrahlwinkel  
Half angle  
ϕ
± 13  
Grad  
deg.  
Aktive Chipfläche  
Active chip area  
0.09  
mm2  
A
Abmessungen der aktiven Chipfläche  
Dimension of the active chip area  
L × B  
L × W  
0.3 × 0.3  
mm²  
2009-08-21  
2
SFH 4350  
Kennwerte (TA = 25 °C)  
Characteristics (cont’d)  
Bezeichnung  
Parameter  
Symbol  
Symbol  
Wert  
Value  
Einheit  
Unit  
Schaltzeiten, Ie von 10% auf 90% und von 90% tr, tf  
auf 10%, bei IF = 100 mA, RL = 50 Ω  
12  
ns  
Switching times, Ιe from 10% to 90% and from  
90% to 10%, IF = 100 mA, RL = 50 Ω  
Durchlassspannung  
Forward voltage  
IF = 100 mA, tp = 20 ms  
IF = 1 A, tp = 100 µs  
VF  
VF  
1.5 (< 1.8)  
2.4 (< 3.0)  
V
V
Sperrstrom  
Reverse current  
IR  
not designed for μA  
reverse  
operation  
Gesamtstrahlungsfluss  
Total radiant flux  
IF = 100 mA, tp = 20 ms  
Φe typ  
TCI  
50  
mW  
Temperaturkoeffizient von Ie bzw. Φe,  
IF = 100 mA  
– 0.5  
%/K  
Temperature coefficient of Ie or Φe, IF = 100 mA  
Temperaturkoeffizient von VF, IF = 100 mA  
Temperature coefficient of VF, IF = 100 mA  
TCV  
TCλ  
– 0.7  
+ 0.3  
mV/K  
nm/K  
Temperaturkoeffizient von λ, IF = 100 mA  
Temperature coefficient of λ, IF = 100 mA  
2009-08-21  
3
SFH 4350  
Strahlstärke Ie in Achsrichtung1)  
gemessen bei einem Raumwinkel Ω = 0.01 sr  
Radiant Intensity Ie in Axial Direction  
at a solid angle of Ω = 0.01 sr  
Bezeichnung  
Parameter  
Symbol  
Werte  
Values  
Einheit  
Unit  
SFH 4350  
-U  
SFH 4350  
-V  
SFH 4350  
-AW  
SFH 4350  
-BW  
Strahlstärke  
Radiant intensity  
IF = 100 mA, tp = 20 ms  
Ie min  
Ie max  
40  
80  
63  
125  
100  
200  
160  
320  
mW/sr  
mW/sr  
Strahlstärke  
Ie typ  
500  
700  
900  
1100  
mW/sr  
Radiant intensity  
IF = 1 A, tp = 100 μs  
1) Nur eine Gruppe in einer Verpackungseinheit (Streuung kleiner 2:1) /  
Only one group in one packing unit (variation lower 2:1)  
Abstrahlcharakteristik  
Radiation Characteristics Irel = f (ϕ)  
40˚  
30˚  
20˚  
10˚  
0˚  
OHF02499  
1.0  
50˚  
0.8  
0.6  
0.4  
60˚  
70˚  
0.2  
0
80˚  
90˚  
100˚  
1.0  
0.8  
0.6  
0.4  
0˚  
20˚  
40˚  
60˚  
80˚  
100˚  
120˚  
2009-08-21  
4
SFH 4350  
Ie  
= f (IF)  
Relative Spectral Emission  
Irel = f (λ)  
Radiant Intensity  
Max. Permissible Forward Current  
IF = f (TA), RthJA = 450 K/W  
Ie 100 mA  
Single pulse, tp = 20 μs  
OHR00880  
125  
OHF04135  
OHL01715  
101  
100  
%
Ι F mA  
Ie  
Irel  
Ie (100 mA)  
100  
80  
60  
40  
20  
0
100  
5
75  
50  
25  
0
10-1  
5
10-2  
5
10-3  
100  
5
101  
5
102  
103  
mA  
0
20  
40  
60  
80 ˚C 100  
700  
750  
800  
850  
nm 950  
IF  
T
λ
Forward Current IF = f (VF)  
Single pulse, tp = 20 μs  
Permissible Pulse Handling  
Capability IF = f (τ), TA = 25 °C,  
duty cycle D = parameter  
OHF02505  
1.6  
A
tP  
OHL01713  
100  
tP  
IF  
IF  
D
= T  
A
1.4  
IF  
T
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0
10-1  
5
D
=
0.005  
0.01  
0.02  
0.033  
0.05  
0.1  
10-2  
5
0.2  
0.5  
1
10-3  
5
10-4  
0
0.5  
1
1.5  
2
2.5 V 3  
VF  
10-5 10-4 10-3 10-2 10-1 100 101 s 102  
tp  
2009-08-21  
5
SFH 4350  
Maßzeichnung  
Package Outlines  
5.2 (0.205)  
4.5 (0.177)  
4.1 (0.161)  
3.9 (0.154)  
Surface  
not flat  
0.6 (0.024)  
0.4 (0.016)  
2
1
4.0 (0.157)  
3.6 (0.142)  
Chip position  
3.3 (0.130)  
6.3 (0.248)  
5.9 (0.232)  
1.8 (0.071)  
1.2 (0.047)  
GEMY6689  
Maße in mm (inch) / Dimensions in mm (inch).  
Gehäuse / Package  
3 mm, klares Gehäuse / 1/10", clear package  
Anschlussbelegung  
Pin configuration  
1 = Anode / anode  
2 = Kathode / cathode  
Empfohlenes Lötpaddesign  
Wellenlöten TTW  
TTW Soldering  
Recommended Solder Pad Design  
Anode  
4 (0.157)  
OHLPY985  
Maße in mm (inch) / Dimensions in mm (inch).  
2009-08-21  
6
SFH 4350  
Lötbedingungen  
Soldering Conditions  
Wellenlöten (TTW)  
TTW Soldering  
(nach CECC 00802)  
(acc. to CECC 00802)  
OHLY0598  
300  
C
10 s  
Normalkurve  
standard curve  
250  
200  
150  
100  
50  
T
235 C ... 260 C  
Grenzkurven  
limit curves  
2. Welle  
2. wave  
1. Welle  
1. wave  
ca 200 K/s  
2 K/s  
5 K/s  
100 C ... 130 C  
Zwangskühlung  
forced cooling  
2 K/s  
0
0
50  
100  
150  
200  
s
250  
t
Published by  
OSRAM Opto Semiconductors GmbH  
Leibnizstraße 4, D-93055 Regensburg  
www.osram-os.com  
© All Rights Reserved.  
The information describes the type of component and shall not be considered as assured characteristics.  
Terms of delivery and rights to change design reserved. Due to technical requirements components may contain  
dangerous substances. For information on the types in question please contact our Sales Organization.  
Packing  
Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office.  
By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing  
material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs  
incurred.  
Components used in life-support devices or systems must be expressly authorized for such purpose! Critical  
components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS.  
1 A critical component is a component usedin a life-support device or system whose failure can reasonably be expected  
to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system.  
2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain  
and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered.  
2009-08-21  
7
Mouser Electronics  
Related Product Links  
720-SFH4350 - Osram Opto Semiconductor SFH 4350  

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