BP104SR [OSRAM]
Suitable for reflow soldering;
| 型号： | BP104SR |
| 厂家： | 
OSRAM GMBH |
| 描述： | Suitable for reflow soldering |
| 文件： | 总13页 (文件大小：434K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
2018-02-23
Silicon PIN Photodiode
Version 1.4
Features:
•
•
•
•
•
Suitable for reflow soldering
Especially suitable for applications from 400 nm to 1100 nm
Short switching time (typ. 20 ns)
Suitable for SMT
The product qualification test plan is based on the guidelines of AEC-Q101-REV-C, Stress Test Qualification
for Automotive Grade Discrete Semiconductors.
Applications
•
•
•
•
Photointerrupters
Industrial electronics
For control and drive circuits
IR remote control of hi-fi and TV sets, dimmers, remote controls of various equipment
Ordering Information
Type:
Photocurrent
Ordering Code
IP [µA]
Ev = 1000 lx, Std. Light A, VR = 5
V
BP 104 SR
55 (≥ 40)
Q65110A4262
2018-02-23
1
Version 1.4
Maximum Ratings (TA = 25 °C)
Parameter
Symbol
Top; Tstg
VR
Values
-40 ... 100
20
Unit
°C
Operating and storage temperature range
Reverse voltage
V
Total Power dissipation
Ptot
150
mW
V
ESD withstand voltage
(acc. to ANSI/ ESDA/ JEDEC JS-001 - HBM)
VESD
2000
Characteristics (TA = 25 °C)
Parameter
Symbol
(typ (min)) IP
Values
Unit
Photocurrent
(Ev = 1000 lx, Std. Light A, VR = 5 V)
55 (≥ 40)
µA
Wavelength of max. sensitivity
Spectral range of sensitivity
(typ)
(typ)
λS max
850
nm
λ10%
(typ) 400 nm
... 1100
Radiant sensitive area
(typ)
(typ)
A
4.84
mm2
Dimensions of radiant sensitive area
L x W
2.2 x 2.2
mm x
mm
Half angle
(typ)
ϕ
± 60
°
Dark current
(VR = 10 V)
(typ (max)) IR
2 (≤ 30)
nA
Spectral sensitivity of the chip
(λ = 850 nm)
(typ)
(typ)
Sλ typ
0.62
0.90
A / W
Quantum yield of the chip
(λ = 850 nm)
η
Electro
ns
/Photon
Open-circuit voltage
(typ (min)) VO
360 (≥280)
50
mV
(Ev = 1000 lx, Std. Light A)
Short-circuit current
(Ev = 1000 lx, Std. Light A)
(typ)
(typ)
(typ)
(typ)
(typ)
ISC
µA
Rise and fall time
(VR = 5 V, RL = 50 Ω, λ = 850 nm)
tr, tf
VF
0.02
1.3
µs
Forward voltage
(IF = 100mA, Ee = 0)
V
Capacitance
(VR = 0 V, f = 1 MHz, E = 0)
C0
48
pF
Temperature coefficient of VO
TCV
-2.6
mV / K
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Version 1.4
Parameter
Symbol
Values
Unit
Temperature coefficient of ISC
(Std. Light A)
(typ)
(typ)
(typ)
TCI
0.18
% / K
Noise equivalent power
(VR = 10 V, λ = 850 nm)
NEP
D*
0.041
pW /
½
Hz
Detection limit
5.4e12
cm x
½
Hz / W
Relative Spectral Sensitivity 1) page 12
Srel = f(λ)
Photocurrent / Open-Circuit Voltage 1) page 12
IP (VR = 5 V) / VO = f(EV)
10 3
µA
OHF02283 10 4
mV
OHF00078
100
%
Ι P
VO
Srel
80
10 2
10 3
10 2
10 1
VO
60
40
Ι P
10 1
10 0
20
0
10 -1
10 0
10 3 lx 10 4
EV
10 0
10 1
10 2
400 500 600 700 800 900 nm 1100
λ
2018-02-23
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Version 1.4
Dark Current 1) page 12
IR = f(VR), E = 0
Power Consumption
Ptot = f(TA)
OHF00394
OHF00080
160
mW
4000
P
Ι R
tot
140
120
100
80
pA
3000
2000
1000
0
60
40
20
0
0
20
40
60
80 ˚C 100
0
5
10
15
V
20
TA
VR
Dark Current 1) page 12
IR = f(VR), E = 0
Capacitance 1) page 12
C = f(VR), f = 1 MHz, E = 0
OHF01778
OHF02284
102
60
pF
50
C
nA
Ι R
101
100
10-1
40
30
20
10
0
10 -2
10 -1
10 0
10 1
V
VR
10 2
0
2
4
6
8
10 12 14 16
VR
V
20
2018-02-23
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Version 1.4
Dark Current 1) page 12
IR = f(TA), VR = 10 V, E = 0
OHF05717
104
nA
IR
103
102
101
100
10-1
0
20
40
60
80 ˚C 100
TA
Directional Characteristics 1) page 12
Srel = f(ϕ)
40
30
20
10
0
OHF01402
ϕ
1.0
50
0.8
0.6
0.4
60
70
0.2
0
80
90
100
1.0
0.8
0.6
0.4
0
20
40
60
80
100
120
2018-02-23
5
Version 1.4
Package Outline
Chip position
1.1 (0.043)
0.9 (0.035)
6.7 (0.264)
6.2 (0.244)
4.5 (0.177)
4.3 (0.169)
1.6 (0.063)±0.2 (0.008)
Photosensitive area Cathode lead
2.20 (0.087) x 2.20 (0.087)
GPLY7049
Dimensions in mm (inch).
Approximate Weight:
44 mg
Recommended Solder Pad
Dimensions in mm.
2018-02-23
6
Version 1.4
Reflow Soldering Profile
Product complies to MSL Level 4 acc. to JEDEC J-STD-020E
OHA04525
300
˚C
T
250
T
245 ˚C
p
240 ˚C
tP
tL
217 ˚C
200
150
tS
100
50
25 ˚C
0
0
50
100
150
200
250
s
300
t
OHA04612
Pb-Free (SnAgCu) Assembly
Profile Feature
Profil-Charakteristik
Symbol
Symbol
Unit
Einheit
Minimum
Recommendation
Maximum
Ramp-up rate to preheat*)
25 °C to 150 °C
2
3
K/s
Time tS
TSmin to TSmax
tS
60
100
2
120
3
s
Ramp-up rate to peak*)
K/s
TSmax to TP
TL
tL
Liquidus temperature
217
80
°C
s
Time above liquidus temperature
Peak temperature
100
TP
tP
245
20
260
30
°C
s
Time within 5 °C of the specified peak
temperature TP - 5 K
10
3
6
K/s
s
Ramp-down rate*
TP to 100 °C
480
Time
25 °C to TP
All temperatures refer to the center of the package, measured on the top of the component
* slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range
2018-02-23
7
Version 1.4
Taping
Dimensions in mm.
Tape and Reel
12 mm tape with 1500 pcs. on ∅ 180 mm reel
W1
D0
P0
P2
Label
P1
Direction of unreeling
Direction of unreeling
W2
Leader: min0 4±± mm *
Trailer: min0 16± mm *
*) Dimensions acc0 to IEC 6±.86-3; EIA 481-D
OHAY0324
2018-02-23
8
Version 1.4
Tape dimensions [mm]
Tape dimensions in mm
W
E
F
P0
P1
P2
D0
12 + 0.3 / - 0.1 4 ± 0.1
4 ± 0.1
or
8 ± 0.1
2 ± 0.05
1.5 ± 0.1
1.75 ± 0.1
5.5 ± 0.05
Reel dimensions [mm]
Reel dimensions in mm
A
W
Nmin
60
W1
W2max
18.4
180
12
12.4 + 2
Barcode-Product-Label (BPL)
Dry Packing Process and Materials
Moisture-sensitive label or print
Barcode label
OSRAM
Humidity indicator
Barcode label
D o n o t e a t .
A v o i d m e t a l c o n t a c t .
D i s c a r d i f c i r c l e s o v e r r u n .
b a g o p e n i n g .
P l e a s e c h e c k t h e H I C i m m i d i a t e l y a f t e r
c h e c k d o t
C o m p a r a t o r
W E T
b a k e u n i t s
e x a m i n e u n i t s , i f n e c e s s a r y
1 5 %
I f w e t ,
b a k e u n i t s
e x a m i n e u n i t s , i f n e c e s s a r y
1 0 %
I f w e t ,
c h a n g e d e s i c c a n t
p a r t s s t i l l a d e q a t e l y d r y .
I f w e t ,
u
5 %
M I L - I - 8 8 3 5
H u m i d i t y I n d i c a t o r
OSRAM
Desiccant
OHA00539
Note:
Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card.
Regarding dry pack you will find further information in the internet. Here you will also find the normative
references like JEDEC.
2018-02-23
9
Version 1.4
Transportation Packing and Materials
Barcode label
Barcode label
Bin1: P-1-20
Bin2: Q-1-20
Bin3:
Temp ST
220
240 C R
260
C
R
DEMY
R18
ML
2
C
RT
LSY T676
Multi T
2a
3
Additional TEXT
R077
PACKVAR:
P-1+Q-1
(G) GROUP:
0144
(9D) D/C:
210021998
2000
OSRAM Opto
Semiconductors
(Q)QTY:
123GH1234
(6P) BATCH NO:
5
2
4
1
0
0
1
(1T) LOT NO:
1
(X) PROD NO:
Bin1: P-1-20
Bin2: Q-1-20
Bin3:
Temp ST
220
240
260
C
R
C
DEMY
R18
ML
R
C RT
2
LSY T676
2a
3
Additional TEXT
R077
PACKVAR:
Multi TOP
P-1+Q-1
(G) GROUP:
0144
(9D) D/C:
210021998
2000
OSRAM Opto
Semiconductors
(Q)QTY:
123GH1234
(6P) BATCH NO:
5
2
4
1
0
0
1
(1T) LOT NO:
1
OSRAM
(X) PROD NO:
Packing
Sealing label
OHA02044
Dimensions of transportation box in mm
Width
Length
Height
195 ± 5
195 ± 5
30 ± 5
2018-02-23
10
Version 1.4
Disclaimer
Language english will prevail in case of any discrepancies or deviations between the two language wordings.
Attention please!
The information describes the type of component and shall not be considered as assured characteristics.
Terms of delivery and rights to change design reserved. Due to technical requirements components may contain
dangerous substances.
For information on the types in question please contact our Sales Organization.
If printed or downloaded, please find the latest version in the Internet.
Packing
Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office.
By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing
material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any
costs incurred.
Components used in life-support devices or systems must be expressly authorized for such purpose!
Critical components* may only be used in life-support devices** or systems with the express written approval of
OSRAM OS.
*) A critical component is a component used in a life-support device or system whose failure can reasonably be
expected to cause the failure of that life-support device or system, or to affect its safety or the effectiveness of that
device or system.
**) Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or
maintain and sustain human life. If they fail, it is reasonable to assume that the health and the life of the user may be
endangered.
2018-02-23
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Version 1.4
Glossary
1)
Typical Values: Due to the special conditions of the manufacturing processes of LED, the typical data or
calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily
correspond to the actual parameters of each single product, which could differ from the typical data and calculated
correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data
will be changed without any further notice.
2018-02-23
12
Version 1.4
Published by OSRAM Opto Semiconductors GmbH
Leibnizstraße 4, D-93055 Regensburg
www.osram-os.com © All Rights Reserved.
2018-02-23
13
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