SZNZ9F4V3T5G [ONSEMI]
ZENER DIODE,SINGLE, TWO TERMINAL,4.3V V(Z),5%,SOD-923;
| 型号： | SZNZ9F4V3T5G |
| 厂家： | 
ONSEMI |
| 描述： | ZENER DIODE,SINGLE, TWO TERMINAL,4.3V V(Z),5%,SOD-923 测试 二极管 |
| 文件： | 总4页 (文件大小：96K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
NZ9F2V4T5G,
SZNZ9F2V4T5G SERIES
Zener Voltage Regulators
200 mW SOD−923 Surface Mount
This series of Zener diodes is packaged in a SOD−923 surface
mount package. They are designed to provide voltage regulation
protection and are especially attractive in situations where space is at a
premium. They are well suited for applications such as cellular
phones, hand held portables, and high density PC boards.
http://onsemi.com
1
2
Cathode
Anode
Specification Features:
• Standard Zener Breakdown Voltage Range − 2.4 V to 24 V
• Steady State Power Rating of 200 mW
MARKING
DIAGRAM
2
• Small Body Outline Dimensions:
0.039″ x 0.024″ (1.00 mm x 0.60 mm)
• Low Body Height: 0.016″ (0.40 mm)
• ESD Rating of Class 3 (>16 kV) per Human Body Model
1
X MG
SOD−923
CASE 514AB
G
1
2
• SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
• These are Pb−Free Devices
X
M
G
= Specific Device Code
= Month Code
= Pb−Free Package
(Note: Microdot may be in either location)
Mechanical Characteristics:
CASE: Void-free, transfer-molded, thermosetting plastic
Epoxy Meets UL 94 V−0
LEAD FINISH: 100% Matte Sn (Tin)
MOUNTING POSITION: Any
ORDERING INFORMATION
Device
Package
Shipping†
QUALIFIED MAX REFLOW TEMPERATURE: 260°C
Device Meets MSL 1 Requirements
NZ9FxxxxT5G,
SZNZ9FxxxxT5G
SOD−923 8000/Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
MAXIMUM RATINGS
Rating
Symbol
Max
Unit
Total Device Dissipation FR−5 Board,
P
D
DEVICE MARKING INFORMATION
See specific marking information in the device marking
column of the Electrical Characteristics tables starting on
page 3 of this data sheet.
(Note 1) @ T = 25°C
250
2.0
mW
A
Derate above 25°C
mW/°C
Thermal Resistance from
Junction−to−Ambient
R
500
°C/W
q
JA
Junction and Storage Temperature Range
T , T
−65 to
°C
J
stg
+150
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FR−4 Minimum Pad.
© Semiconductor Components Industries, LLC, 2013
1
Publication Order Number:
April, 2013 − Rev. 3
NZ9F2V4/D
NZ9F2V4T5G, SZNZ9F2V4T5G SERIES
ELECTRICAL CHARACTERISTICS
I
(T = 25°C unless otherwise noted,
A
I
F
V = 0.9 V Max. @ I = 10 mA for all types)
F
F
Symbol
Parameter
V
Z
Reverse Zener Voltage @ I
ZT
I
ZT
Reverse Current
V
Z
V
R
V
I
V
F
Z
Maximum Zener Impedance @ I
Reverse Current
R
ZT
ZT
ZK
ZT
I
I
Z
ZK
Maximum Zener Impedance @ I
ZK
I
Reverse Leakage Current @ V
Reverse Voltage
R
R
V
R
I
F
Forward Current
Zener Voltage Regulator
V
F
Forward Voltage @ I
F
QV
Maximum Temperature Coefficient of V
Z
Z
C
Max. Capacitance @V = 0 and f = 1 MHz
R
100
80
60
40
20
0
0
25
50
75
100
125
150
TEMPERATURE (°C)
Figure 1. Steady State Power Derating
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2
NZ9F2V4T5G, SZNZ9F2V4T5G SERIES
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted, V = 0.9 V Max. @ I = 10 mA for all types)
A
F
F
Zener Voltage
(Note 1)
Zener Impedance
Leakage Current
C
Z
ZT
QV
(mV/k) @ I
@ V = 0
Z
R
@ I
V (Volts)
@ I
Z
ZK
@ I
I @ V
R R
f = 1 MHz
ZT
Z
ZT
ZK
ZT
Device
Marking
Min
2.28
2.57
2.85
3.14
3.42
3.71
4.09
4.47
4.85
5.32
5.89
6.46
7.13
7.79
8.65
Max
mA
W
100
100
100
100
100
100
100
100
80
W
1000
1000
1000
1000
1000
1000
1000
800
500
200
100
60
mA
1
mA
50
20
10
10
10
5
Volts
1
Min
−3.5
−3.5
−3.5
−3.5
−3.5
−3.5
−3.5
−3.5
−2.7
−2.0
0.4
Max
0
pF
Device***
SZ, NZ9F2V4T5G
SZ, NZ9F2V7T5G
SZ, NZ9F3V0T5G
SZ, NZ9F3V3T5G
SZ, NZ9F3V6T5G
SZ, NZ9F3V9T5G
SZ, NZ9F4V3T5G
SZ, NZ9F4V7T5G
SZ, NZ9F5V1T5G
SZ, NZ9F5V6T5G
SZ, NZ9F6V2T5G
SZ, NZ9F6V8T5G
SZ, NZ9F7V5T5G
SZ, NZ9F8V2T5G
SZ, NZ9F9V1T5G
SZ, NZ9F10VT5G
SZ, NZ9F11VT5G
SZ, NZ9F12VT5G
SZ, NZ9F13VT5G
SZ, NZ9F15VT5G
SZ, NZ9F16VT5G
SZ, NZ9F18VT5G
SZ, NZ9F20VT5G
SZ, NZ9F22VT5G
SZ, NZ9F24VT5G
J
E**
T**
Q
2.52
2.84
3.15
3.47
3.78
4.10
4.52
4.94
5.36
5.88
6.51
7.14
7.88
8.61
9.56
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
210
210
210
210
210
210
210
150
130
115
110
105
100
90
1
1
0
1
1
0
1
1
0
3**
V**
Y**
3
1
1
0
1
1
−2.5
0
1
5
1
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
2
1
0.2
1.2
2.5
3.7
4.5
5.3
6.2
7
4
2
1.5
2.5
3
5
60
1
6
60
1
A*
D*
E*
F*
J*
40
0.5
0.5
0.5
0.5
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
3.5
4
1.2
30
60
2.5
30
60
5
3.2
30
60
6
3.8
80
9.50 10.50
10.45 11.55
11.40 12.60
12.35 13.65
14.25 15.75
15.20 16.80
17.10 18.90
19.00 21.00
20.90 23.10
22.80 25.20
30
60
7
4.5
8
80
K*
L*
P*
Q*
R*
T*
V*
Y*
F
30
60
8
5.4
9
80
30
80
9
6
10
11
13
14
16
18
20
22
80
37
80
10
11
12
14
15.4
16.8
18.9
7
75
42
80
9.2
70
50
80
10.4
12.4
14.4
15.4
16.8
65
50
80
60
55
100
100
120
55
55
55
70
50
*Rotated 90°.
**Rotated 270°.
***SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP
Capable.
1. Zener voltage is measured with a pulse test current I at an ambient temperature of 25°C.
Z
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3
NZ9F2V4T5G, SZNZ9F2V4T5G SERIES
PACKAGE DIMENSIONS
SOD−923
CASE 514AB
ISSUE C
−X−
D
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
−Y−
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS.
E
1
2
2X b
0.08 X Y
TOP VIEW
MILLIMETERS
DIM MIN NOM MAX
INCHES
NOM MAX
MIN
A
b
c
0.34
0.15
0.07
0.75
0.55
0.95
0.37
0.20
0.12
0.80
0.60
1.00
0.19 REF
0.10
0.40
0.25
0.17
0.85
0.65
1.05
0.013 0.015 0.016
0.006 0.008 0.010
0.003 0.005 0.007
0.030 0.031 0.033
0.022 0.024 0.026
0.037 0.039 0.041
0.007 REF
A
D
E
H
E
L
c
L2 0.05
0.15
0.002 0.004 0.006
H
E
SIDE VIEW
SOLDERING FOOTPRINT*
2X
L
1.20
2X
2X
0.25
0.36
2X
L2
PACKAGE
OUTLINE
BOTTOM VIEW
DIMENSIONS: MILLIMETERS
See Application Note AND8455/D for more mounting details
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
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NZ9F2V4/D
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