SNZF220DFT1G [ONSEMI]
带 ESD 保护的 EMI 滤波器;NZF220DFT1
EMI Filter with ESD
Protection
Features
• 2 EMI/RFI Bi−directional “Pi” Low−Pass Filters
• ESD Protection Meets IEC61000−4−2
• Diode Capacitance: 7 − 10 pF
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• Zener/Resistor Line Capacitance: 22 ±20% pF
• Low Zener Diode Leakage: 1 mA Maximum
• Zener Breakdown Voltage; 6 − 8 V
• Pb−Free Package is Available
CIRCUIT DESCRIPTION
Pin 4
Pin 5
Benefits
• Designed to suppress EMI/RFI Noise in Systems Subjected to
Electromagnetic Interference
• Nominal Cutoff Frequency of 220 MHz (per Figure 2)
• Small Package Size Minimizes Parasitic Inductance, Thus a More
Pin 3
Pin 2
(GND)
Pin 1
“Ideal” Low Pass Filtering Response
Typical Applications
• Cellular Phones
• Communication Systems
• Computers
• Portable Products with Input/Output Conductors
SC−88A
DF SUFFIX
CASE 419A
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
MARKING DIAGRAM
Peak Power Dissipation (Note 1)
8 × 20 ms Pulse
P
PK
14
W
5
4
Maximum Junction Temperature
T
J
150
°C
NZF D
2
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1
3
1. Between I/O Pins
NZF
D
= Specific Device Code
= Date Code
ORDERING INFORMATION
†
Device
Package
Shipping
NZF220DFT1
SC−88A
3000/Tape & Reel
3000/Tape & Reel
NZF220DFT1G
SC−88A
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Semiconductor Components Industries, LLC, 2004
1
Publication Order Number:
July, 2004 − Rev. 7
NZF220DFT1/D
NZF220DFT1
ELECTRICAL CHARACTERISTICS
Symbol
Characteristic
Min
6.0
N/A
N/A
7.0
17.6
90
Typ
−
Max
8.0
1.0
1.5
10
Unit
V
V
Z
Zener Breakdown Voltage, @ I = 1 mA
ZT
I
r
Zener Leakage Current, @ V = 3 V
−
mA
V
R
V
F
Zener Forward Voltage, @ I = 50 mA
−
F
Capacitance
Capacitance
Resistor
Zener Internal Capacitance, @ 0 V Bias
Zener/Resistor Array Line Capacitance
Resistance
−
pF
pF
W
−
26.4
110
−
−
F
C
(Note 2)
Cutoff Frequency
−
220
MHz
2. 50 W Source and 50 W Lead Termination per Figure 2.
Applications Information
Suppressing Noise at the Source
• Filter all I/O signals leaving the noisy environment
• Locate I/O driver circuits close to the connector
• Use the longest rise/fall times possible for all digital signals
Reducing Noise at the Receiver
• Filter all I/O signals entering the unit
• Locate the I/O filters as close as possible to the connector
Minimizing Noise Coupling
• Use multilayer PCBs to minimize power and ground inductance
• Keep clock circuits away from the I/O connector
• Ground planes should be used whenever possible
• Minimize the loop area for all high speed signals
• Provide for adequate power decoupling
ESD Protection
• Locate the suppression devices as close to the I/O connector as possible
• Minimize the PCB trace length to the suppression device
• Minimize the PCB trace length for the ground return for the suppression device
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2
NZF220DFT1
FREQUENCY RESPONSE SPECIFICATION
TRACKING
GENERATOR
SPECTRUM
ANALYZER
50 W
TG OUTPUT
RF INPUT
NZF220DF
50 W
V
G
V
in
V
out
TEST BOARD
Test Conditions:
NZF220DF
Source Impedance = 50 W
Load Impedance = 50 W
Input Power = 0 dB
Figure 1. Measurement Conditions
0
−6.3
−10
Y
−20
−30
−40
OUTPUT
3 dB = 220 MHz
Y
−50
1.0
10
100
1000 3000
f, FREQUENCY (MHz)
Figure 2. Typical EMI Filter Response
(50 W Source and 50 W Lead Termination)
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3
NZF220DFT1
OUTLINE DIMENSIONS
SC−88A/SOT−323
CASE 419A−02
ISSUE G
NOTES:
A
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 419A−01 OBSOLETE. NEW STANDARD
419A−02.
G
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
5
4
3
−B−
S
INCHES
DIM MIN MAX
MILLIMETERS
MIN
1.80
1.15
0.80
0.10
MAX
2.20
1.35
1.10
0.30
1
2
A
B
C
D
G
H
J
0.071
0.045
0.031
0.004
0.087
0.053
0.043
0.012
0.026 BSC
0.65 BSC
M
M
0.2 (0.008)
B
D 5 PL
−−−
0.004
0.004
0.004
0.010
0.012
−−−
0.10
0.10
0.10
0.25
0.30
K
N
S
N
0.008 REF
0.20 REF
0.079
0.087
2.00
2.20
J
C
K
H
SOLDERING FOOTPRINT*
0.50
0.0197
0.65
0.025
0.65
0.025
0.40
0.0157
1.9
0.0748
mm
inches
ǒ
Ǔ
SCALE 20:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
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PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
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Order Literature: http://www.onsemi.com/litorder
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Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada
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Phone: 81−3−5773−3850
For additional information, please contact your
local Sales Representative.
NZF220DFT1/D
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