SNZF220DFT1G [ONSEMI]

带 ESD 保护的 EMI 滤波器;
SNZF220DFT1G
型号: SNZF220DFT1G
厂家: ONSEMI    ONSEMI
描述:

带 ESD 保护的 EMI 滤波器

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中文:  中文翻译
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NZF220DFT1  
EMI Filter with ESD  
Protection  
Features  
2 EMI/RFI Bi−directional “Pi” Low−Pass Filters  
ESD Protection Meets IEC61000−4−2  
Diode Capacitance: 7 − 10 pF  
http://onsemi.com  
Zener/Resistor Line Capacitance: 22 ±20% pF  
Low Zener Diode Leakage: 1 mA Maximum  
Zener Breakdown Voltage; 6 − 8 V  
Pb−Free Package is Available  
CIRCUIT DESCRIPTION  
Pin 4  
Pin 5  
Benefits  
Designed to suppress EMI/RFI Noise in Systems Subjected to  
Electromagnetic Interference  
Nominal Cutoff Frequency of 220 MHz (per Figure 2)  
Small Package Size Minimizes Parasitic Inductance, Thus a More  
Pin 3  
Pin 2  
(GND)  
Pin 1  
“Ideal” Low Pass Filtering Response  
Typical Applications  
Cellular Phones  
Communication Systems  
Computers  
Portable Products with Input/Output Conductors  
SC−88A  
DF SUFFIX  
CASE 419A  
MAXIMUM RATINGS  
Rating  
Symbol  
Value  
Unit  
MARKING DIAGRAM  
Peak Power Dissipation (Note 1)  
8 × 20 ms Pulse  
P
PK  
14  
W
5
4
Maximum Junction Temperature  
T
J
150  
°C  
NZF D  
2
Maximum ratings are those values beyond which device damage can occur.  
Maximum ratings applied to the device are individual stress limit values (not  
normal operating conditions) and are not valid simultaneously. If these limits are  
exceeded, device functional operation is not implied, damage may occur and  
reliability may be affected.  
1
3
1. Between I/O Pins  
NZF  
D
= Specific Device Code  
= Date Code  
ORDERING INFORMATION  
Device  
Package  
Shipping  
NZF220DFT1  
SC−88A  
3000/Tape & Reel  
3000/Tape & Reel  
NZF220DFT1G  
SC−88A  
(Pb−Free)  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
Semiconductor Components Industries, LLC, 2004  
1
Publication Order Number:  
July, 2004 − Rev. 7  
NZF220DFT1/D  
 
NZF220DFT1  
ELECTRICAL CHARACTERISTICS  
Symbol  
Characteristic  
Min  
6.0  
N/A  
N/A  
7.0  
17.6  
90  
Typ  
Max  
8.0  
1.0  
1.5  
10  
Unit  
V
V
Z
Zener Breakdown Voltage, @ I = 1 mA  
ZT  
I
r
Zener Leakage Current, @ V = 3 V  
mA  
V
R
V
F
Zener Forward Voltage, @ I = 50 mA  
F
Capacitance  
Capacitance  
Resistor  
Zener Internal Capacitance, @ 0 V Bias  
Zener/Resistor Array Line Capacitance  
Resistance  
pF  
pF  
W
26.4  
110  
F
C
(Note 2)  
Cutoff Frequency  
220  
MHz  
2. 50 W Source and 50 W Lead Termination per Figure 2.  
Applications Information  
Suppressing Noise at the Source  
Filter all I/O signals leaving the noisy environment  
Locate I/O driver circuits close to the connector  
Use the longest rise/fall times possible for all digital signals  
Reducing Noise at the Receiver  
Filter all I/O signals entering the unit  
Locate the I/O filters as close as possible to the connector  
Minimizing Noise Coupling  
Use multilayer PCBs to minimize power and ground inductance  
Keep clock circuits away from the I/O connector  
Ground planes should be used whenever possible  
Minimize the loop area for all high speed signals  
Provide for adequate power decoupling  
ESD Protection  
Locate the suppression devices as close to the I/O connector as possible  
Minimize the PCB trace length to the suppression device  
Minimize the PCB trace length for the ground return for the suppression device  
http://onsemi.com  
2
 
NZF220DFT1  
FREQUENCY RESPONSE SPECIFICATION  
TRACKING  
GENERATOR  
SPECTRUM  
ANALYZER  
50 W  
TG OUTPUT  
RF INPUT  
NZF220DF  
50 W  
V
G
V
in  
V
out  
TEST BOARD  
Test Conditions:  
NZF220DF  
Source Impedance = 50 W  
Load Impedance = 50 W  
Input Power = 0 dB  
Figure 1. Measurement Conditions  
0
−6.3  
−10  
Y
−20  
−30  
−40  
OUTPUT  
3 dB = 220 MHz  
Y
−50  
1.0  
10  
100  
1000 3000  
f, FREQUENCY (MHz)  
Figure 2. Typical EMI Filter Response  
(50 W Source and 50 W Lead Termination)  
http://onsemi.com  
3
NZF220DFT1  
OUTLINE DIMENSIONS  
SC−88A/SOT−323  
CASE 419A−02  
ISSUE G  
NOTES:  
A
1. DIMENSIONING AND TOLERANCING  
PER ANSI Y14.5M, 1982.  
2. CONTROLLING DIMENSION: INCH.  
3. 419A−01 OBSOLETE. NEW STANDARD  
419A−02.  
G
4. DIMENSIONS A AND B DO NOT INCLUDE  
MOLD FLASH, PROTRUSIONS, OR GATE  
BURRS.  
5
4
3
−B−  
S
INCHES  
DIM MIN MAX  
MILLIMETERS  
MIN  
1.80  
1.15  
0.80  
0.10  
MAX  
2.20  
1.35  
1.10  
0.30  
1
2
A
B
C
D
G
H
J
0.071  
0.045  
0.031  
0.004  
0.087  
0.053  
0.043  
0.012  
0.026 BSC  
0.65 BSC  
M
M
0.2 (0.008)  
B
D 5 PL  
−−−  
0.004  
0.004  
0.004  
0.010  
0.012  
−−−  
0.10  
0.10  
0.10  
0.25  
0.30  
K
N
S
N
0.008 REF  
0.20 REF  
0.079  
0.087  
2.00  
2.20  
J
C
K
H
SOLDERING FOOTPRINT*  
0.50  
0.0197  
0.65  
0.025  
0.65  
0.025  
0.40  
0.0157  
1.9  
0.0748  
mm  
inches  
ǒ
Ǔ
SCALE 20:1  
*For additional information on our Pb−Free strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
ON Semiconductor and  
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice  
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All  
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights  
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications  
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should  
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,  
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death  
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal  
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.  
PUBLICATION ORDERING INFORMATION  
LITERATURE FULFILLMENT:  
N. American Technical Support: 800−282−9855 Toll Free  
USA/Canada  
ON Semiconductor Website: http://onsemi.com  
Order Literature: http://www.onsemi.com/litorder  
Literature Distribution Center for ON Semiconductor  
P.O. Box 61312, Phoenix, Arizona 85082−1312 USA  
Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada  
Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada  
Email: orderlit@onsemi.com  
Japan: ON Semiconductor, Japan Customer Focus Center  
2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051  
Phone: 81−3−5773−3850  
For additional information, please contact your  
local Sales Representative.  
NZF220DFT1/D  

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