RHRG3060CC [ONSEMI]

60A,600V,Hyperfast 双二极管;
RHRG3060CC
型号: RHRG3060CC
厂家: ONSEMI    ONSEMI
描述:

60A,600V,Hyperfast 双二极管

软恢复二极管 超快速软恢复二极管 局域网
文件: 总6页 (文件大小:306K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Hyperfast Dual Diode  
60 A, 400 V - 600 V  
RHRG3060CC, RHRG3040CC  
Description  
The RHRG3060CC, RHRG3040CC is a hyperfast dual diode  
with soft recovery characteristics. It has the half recovery time  
of ultrafast diodes and is silicon nitride passivated ionimplanted  
epitaxial planar construction  
www.onsemi.com  
These devices are intended to be used as freewheeling/ clamping  
diodes and diodes in a variety of switching power supplies and other  
power switching applications. Their low stored charge and hyperfast  
soft recovery minimize ringing and electrical noise in many power  
switching circuits reducing power loss in the switching transistors.  
CATHODE  
(BOTTOM SIDE METAL)  
ANODE 2  
CATHODE  
ANODE 1  
Features  
TO2473LD  
CASE 340CK  
Hyperfast Recovery t = 45 ns (@ I = 30 A)  
rr  
F
Max Forward Voltage, V = 2.1 V (@ T = 25°C)  
F
C
High Reverse Voltage and High Reliability  
Avalanche Energy Rated  
K
These Devices are PbFree and are RoHS Compliant  
Applications  
A
Switching Power Supplies  
Power Switching Circuits  
General Purpose  
A
2
1
MARKING DIAGRAM  
$Y&Z&3&K  
RHRG30XXC  
$Y  
&Z  
&3  
&K  
= ON Semiconductor Logo  
= Assembly Plant Code  
= Numeric Date Code  
= Lot Code  
RHRG30XXC  
XX  
= Specific Device Code  
= 60, 40  
ORDERING INFORMATION  
See detailed ordering and shipping information on page 2 of  
this data sheet.  
© Semiconductor Components Industries, LLC, 2001  
1
Publication Order Number:  
February, 2020 Rev. 3  
RHRG3060CC/D  
RHRG3060CC, RHRG3040CC  
ABSOLUTE MAXIMUM RATING (Per Leg) (T = 25°C, unless otherwise specified)  
J
Description  
Peak Repetitive Reverse Voltage  
Symbol  
RHRG3060CC  
RHRG3040CC  
Unit  
V
V
600  
600  
400  
400  
RRM  
RWM  
Working Peak Reverse Voltage  
DC Blocking Voltage  
V
V
V
R
600  
400  
V
Average Rectified Forward Current (T = 120°C)  
I
)
30  
30  
A
C
F(AV  
Repetitive Peak Surge Current (Square Wave, 20 kHz)  
Nonrepetitive Peak Surge Current (Halfwave, 1 Phase, 60 Hz)  
Maximum Power Dissipation  
I
70  
70  
A
FRM  
I
325  
325  
A
FSM  
P
D
125  
125  
W
mJ  
°C  
Avalanche Energy (See Figures 10 and 11)  
Operating and Storage Temperature  
E
20  
20  
AVL  
T
, T  
65 to 175  
65 to 175  
STG  
J
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality  
should not be assumed, damage may occur and reliability may be affected.  
PACKAGE MARKING AND ORDERING INFORMATION  
Part Number  
RHRG3060CC  
RHRG3040CC  
Top Mark  
RHRG3060C  
RHRG3040C  
Package  
TO2473L  
TO2473L  
Shipping  
450 / Tube  
450 / Tube  
ELECTRICAL SPECIFICATIONS (Per Leg) (T = 25°C, unless otherwise specified)  
J
RHRG3060CC  
RHRG3040CC  
Unit  
Unit  
V
Min  
Typ  
Max  
2.1  
1.7  
Min  
Typ  
Max  
Characteristic  
Symbol  
Test Conditions  
Instantaneous Forward Voltage  
(Pulse Width = 300 ms,  
Duty Cycle = 2%)  
V
F
I = 30 A  
2.1  
1.7  
250  
F
I = 30 A, T = 150°C  
F
V
C
Instantaneous Reverse Current  
I
R
V
= 400 V  
= 600 V  
mA  
mA  
mA  
mA  
ns  
R
V
R
V
R
V
R
250  
= 400 V, T = 150°C  
1.0  
C
= 600 V, T = 150°C  
1.0  
40  
45  
C
Reverse Recovery Time  
(See Figure 9),  
Summation of ta + tb.  
T
rr  
40  
45  
I = 1 A, dI /dt = 200 A/ms  
F
F
I = 30 A, dI /dt = 200 A/ms  
ns  
F
F
Time to Reach Peak Reverse  
Current (See Figure 9).  
t
t
I = 30 A, dI /dt = 200 A/ms  
22  
22  
ns  
a
F
F
Time from Peak I  
to Projected  
RM  
I = 30 A, dI /dt = 200 A/ms  
18  
18  
ns  
RM  
b
F
F
Zero Crossing of I  
Based on  
a Straight Line from Peak I  
RM  
through 25% of I  
(See Figure 9).  
RM  
Reverse Recovery Charge  
Junction Capacitance  
Q
I = 30 A, dI /dt = 200 A/ms  
100  
85  
100  
85  
nC  
pF  
rr  
F
F
C
V = 10 V, I = 0 A  
R F  
J
Thermal Resistance Junction  
to Case  
R
1.2  
1.2  
°C/W  
q
JC  
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
www.onsemi.com  
2
RHRG3060CC, RHRG3040CC  
TYPICAL PERFORMANCE CURVES  
300  
100  
2000  
175°C  
100°C  
100  
10  
100°C  
175°C  
25°C  
10  
1
1
0.1  
0.01  
25°C  
4
0
1
2
3
0
200  
300  
400  
500  
600  
100  
V , Forward Voltage (V)  
F
V , Reverse Voltage (V)  
R
Figure 2. Reverse Current vs. Reverse Voltage  
Figure 1. Forward Current vs. Forward Voltage  
50  
40  
30  
100  
T
C
= 25°C, dI /dt = 200 A/ms  
T
C
= 100°C, dI /dt = 200 A/ms  
F
F
80  
T
rr  
T
rr  
60  
40  
20  
t
a
t
a
20  
0
t
b
t
b
10  
0
1
10  
I , Forward Current (A)  
30  
30  
1
10  
I , Forward Current (A)  
F
F
Figure 4. Trr, ta and tb Curves vs. Forward Current  
Figure 3. Trr, ta and tb Curves vs. Forward Current  
150  
125  
100  
75  
30  
T
C
= 175°C, dI /dt = 200 A/ms  
F
25  
20  
15  
DC  
T
rr  
SQ. WAVE  
t
a
10  
5
50  
25  
0
t
b
0
30  
125  
150  
175  
1
10  
I , Forward Current (A)  
75  
100  
F
T , Case Temperature (°C)  
C
Figure 5. Trr, ta and tb Curves vs. Forward Current  
Figure 6. Current Derating Curve  
www.onsemi.com  
3
RHRG3060CC, RHRG3040CC  
TYPICAL PERFORMANCE CURVES (continued)  
150  
125  
100  
75  
50  
25  
0
200  
0
100  
150  
50  
V , Reverse Voltage (V)  
R
Figure 7. Junction Capacitance vs. Reverse Voltage  
TEST CIRCUITS AND WAVEFORMS  
V
AMPLITUDE AND  
GE  
G
R
CONTROL dI /dt  
F
L
t AND t Control I  
1
2
F
dI  
dt  
T
rr  
F
I
F
t
b
t
a
DUT CURRENT  
SENSE  
0
R
G
+
0.25 I  
V
DD  
RM  
V
GE  
IGBT  
t
I
FIGURE  
1
RM  
t
2
Figure 9. Trr Waveforms and Definitions  
Figure 8. Trr Test Circuit  
I
= 1 A  
MAX  
L = 40 mH  
R < 0.1 W  
2
E
= 1/2LI [V  
/(V  
V )]  
R(AVL  
AVL  
1
R(AVL)  
CES  
R(AVL) DD  
V
AVL  
Q = IGBT (BV  
> DUT V  
)
R
L
I
L
+
V
I
L
CURRENT  
SENSE  
DD  
I V  
Q
1
V
DD  
DUT  
t
t
1
t
2
t
0
Figure 11. Avalanche Current and Voltage Waveforms  
Figure 10. Avalanche Energy Test Circuit  
www.onsemi.com  
4
MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
TO2473LD SHORT LEAD  
CASE 340CK  
ISSUE A  
DATE 31 JAN 2019  
P1  
D2  
A
E
P
A
A2  
Q
E2  
S
D1  
D
E1  
B
2
2
1
3
L1  
A1  
b4  
L
c
(3X) b  
(2X) b2  
M
M
B A  
0.25  
MILLIMETERS  
MIN NOM MAX  
4.58 4.70 4.82  
2.20 2.40 2.60  
1.40 1.50 1.60  
1.17 1.26 1.35  
1.53 1.65 1.77  
2.42 2.54 2.66  
0.51 0.61 0.71  
20.32 20.57 20.82  
(2X) e  
DIM  
A
A1  
A2  
b
b2  
b4  
c
GENERIC  
D
MARKING DIAGRAM*  
D1 13.08  
~
~
D2  
E
0.51 0.93 1.35  
15.37 15.62 15.87  
AYWWZZ  
XXXXXXX  
XXXXXXX  
E1 12.81  
~
~
E2  
e
L
4.96 5.08 5.20  
5.56  
15.75 16.00 16.25  
3.69 3.81 3.93  
3.51 3.58 3.65  
XXXX = Specific Device Code  
~
~
A
Y
= Assembly Location  
= Year  
WW = Work Week  
ZZ = Assembly Lot Code  
L1  
P
*This information is generic. Please refer to  
device data sheet for actual part marking.  
PbFree indicator, “G” or microdot “G”, may  
or may not be present. Some products may  
not follow the Generic Marking.  
P1 6.60 6.80 7.00  
Q
S
5.34 5.46 5.58  
5.34 5.46 5.58  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98AON13851G  
TO2473LD SHORT LEAD  
PAGE 1 OF 1  
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding  
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically  
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the  
rights of others.  
© Semiconductor Components Industries, LLC, 2018  
www.onsemi.com  
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, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates  
and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.  
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TECHNICAL PUBLICATIONS:  
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