RB520S30TD [ONSEMI]

Schottky Barrier Diode; 肖特基二极管


型号：	RB520S30TD
厂家：	ONSEMI
描述：	Schottky Barrier Diode 肖特基二极管肖特基二极管
文件：	总3页 (文件大小：47K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

RB520S30T1

Schottky Barrier Diode

These Schottky barrier diodes are designed for high−speed

switching applications, circuit protection, and voltage clamping.

Extremely low forward voltage reduces conduction loss. Miniature

surface mount package is excellent for hand−held and portable

applications where space is limited.

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Features

• Extremely Fast Switching Speed

30 VOLT SCHOTTKY

BARRIER DIODE

• Extremely Low Forward Voltage 0.6 V (max) @ I = 200 mA

• Low Reverse Current

• ESD Rating: Class 3B per Human Body Model

Class C per Machine Model

CATHODE

ANODE

• These are Pb−Free Devices

MAXIMUM RATINGS

Rating

Symbol

Value

Unit

Reverse Voltage

Forward Current DC

Vdc

200

Maximum ratings are those values beyond which device damage can occur.

Maximum ratings applied to the device are individual stress limit values (not

normal operating conditions) and are not valid simultaneously. If these limits are

exceeded, device functional operation is not implied, damage may occur and

reliability may be affected.

SOD−523

CASE 502

PLASTIC

THERMAL CHARACTERISTICS

Characteristic

Symbol

Max

Unit

MARKING DIAGRAM

Total Device Dissipation FR−5 Board,

200

(Note 1) T = 25°C

Derate above 25°C

1.57

635

mW/°C

°C/W

°C

5J MG

Thermal Resistance, Junction−to−Ambient

ꢀ

Junction and Storage Temperature Range T , T

−55 to +150

stg

1. FR−5 Minimum Pad.

ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)

5J = Device Code

= Date Code*

Characteristic

Symbol Min Typ Max Unit

= Pb−Free Package

(Note: Microdot may be in either location)

Reverse Leakage

−

1.0

ꢁ

*Date Code orientation position may vary depending

upon manufacturing location.

(V = 10 V)

Forward Voltage

−

0.60 Vdc

(I = 200 mA)

ORDERING INFORMATION

†

Device

Package

Shipping

RB520S30T1

SOD−523* 3000/Tape & Reel

RB520S30T1G

*This package is inherently Pb−Free.

†For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specifications

Brochure, BRD8011/D.

Semiconductor Components Industries, LLC, 2005

Publication Order Number:

December, 2005 − Rev. 7

RB520S30T1/D

125 °C

RB520S30T1

820

ꢂ

+10 V

2 k

100 ꢁ H

0.1 ꢁ F

10%

DUT

90%

50 ꢂ Output

Pulse

50 ꢂ Input

Sampling

= 1 mA

R(REC)

Generator

Oscilloscope

OUTPUT PULSE

INPUT SIGNAL

(I = I = 10 mA; measured

at i

= 1 mA)

R(REC)

Notes: 1. A 2.0 kꢂ variable resistor adjusted for a Forward Current (I ) of 10 mA.

Notes: 2. Input pulse is adjusted so I

is equal to 10 mA.

R(peak)

Notes: 3. t » t

Figure 1. Recovery Time Equivalent Test Circuit

200

1000

T = 150°C

100

T = 125°C

1ꢀ50 °C

85°C

1.0

T = 85°C

0.1

1.0

0.1

25°C

0.01

−ꢀ40 °C

−55°C

T = 25°C

0.001

0.0

0.1

0.2

0.3

0.4

0.5

0.6

V , FORWARD VOLTAGE (VOLTS)

V , REVERSE VOLTAGE (VOLTS)

Figure 2. Forward Voltage

Figure 3. Leakage Current

V , REVERSE VOLTAGE (VOLTS)

Figure 4. Total Capacitance

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RB520S30T1

PACKAGE DIMENSIONS

SOD−523

CASE 502−01

ISSUE B

NOTES:

−X−

1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M,

1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH

THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM

THICKNESS OF BASE MATERIAL.

−Y−

MILLIMETERS

INCHES

NOM

0.047

0.032

0.024

0.012

DIM

MIN

1.10

0.70

0.50

0.25

0.07

0.15

1.50

NOM

1.20

0.80

0.60

0.30

0.14

0.20

1.60

MAX

MIN

MAX

0.051

0.035

0.028

0.014

1.30

0.90

0.70

0.35

0.043

0.028

0.020

0.010

D 2 PL

0.08 (0.003)

0.20 0.0028 0.0055 0.0079

0.25

1.70

0.006

0.059

0.008

0.063

0.010

0.067

−T−

SEATING

PLANE

SOLDERING FOOTPRINT*

1.40

0.0547

0.40

0.0157

0.40

inches

0.0157

SCALE 10:1

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

ON Semiconductor and

are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice

to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability

arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.

“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All

operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights

nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications

intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should

Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,

and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death

associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal

Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.

PUBLICATION ORDERING INFORMATION

LITERATURE FULFILLMENT:

N. American Technical Support: 800−282−9855 Toll Free

USA/Canada

ON Semiconductor Website: http://onsemi.com

Order Literature: http://www.onsemi.com/litorder

Literature Distribution Center for ON Semiconductor

P.O. Box 61312, Phoenix, Arizona 85082−1312 USA

Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada

Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada

Email: orderlit@onsemi.com

Japan: ON Semiconductor, Japan Customer Focus Center

2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051

Phone: 81−3−5773−3850

For additional information, please contact your

local Sales Representative.

RB520S30T1/D

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