NXH25C120L2C2SG [ONSEMI]

IGBT Module, CIB 1200 V, 25 A IGBT;
NXH25C120L2C2SG
型号: NXH25C120L2C2SG
厂家: ONSEMI    ONSEMI
描述:

IGBT Module, CIB 1200 V, 25 A IGBT

双极性晶体管
文件: 总10页 (文件大小:372K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
TMPIM 25 A CIB Module  
NXH25C120L2C2SG  
The NXH25C120L2C2SG is a transfermolded power module  
containing a converterinverterbrake circuit consisting of six 25 A,  
1600 V rectifiers, six 25 A, 1200 V IGBTs with inverse diodes, one  
25 A, 1200 V brake IGBT with brake diode and an NTC thermistor.  
www.onsemi.com  
Features  
Low Thermal Resistance  
6 mm Clearance Distance between Pin to Heatsink  
Compact 73 mm × 40 mm × 8 mm Package  
Solderable Pins  
Thermistor  
These Devices are PbFree, Halogen Free/BFR Free and are RoHS  
Compliant  
Typical Applications  
Industrial Motor Drives  
Servo Drives  
DIP26 67.8x40  
CASE 181AD  
DBPLUS  
P
MARKING DIAGRAM  
GUP  
U
GVP  
V
GWP  
W
R
S
T
B
GB  
GUN  
GVN  
GWN  
TH1  
TH2  
NXH25C120L2C2SG = Specific Device Code  
ZZZ  
AT  
= Assembly Lot Code  
= Assembly & Test Location  
= Year  
DBMINUS  
NB  
NU  
NV  
NW  
Y
WW  
= Work Week  
Figure 1. NXH25C120L2C2SG Schematic Diagram  
ORDERING INFORMATION  
Device  
NXH25C120L2C2SG  
Package  
Shipping  
DIP26  
(PbFree)  
6 Units /  
Tube  
© Semiconductor Components Industries, LLC, 2020  
1
Publication Order Number:  
July, 2020 Rev. 1  
NXH25C120L2C2SG/D  
NXH25C120L2C2SG  
MAXIMUM RATINGS  
Rating  
Symbol  
Value  
Unit  
IGBT  
CollectorEmitter Voltage  
GateEmitter Voltage  
V
1200  
20  
V
V
A
A
CES  
V
GE  
Continuous Collector Current @ T = 80°C (Tv  
= 175°C)  
= 175°C)  
= 150°C)  
I
C
25  
C
Jmax  
Jmax  
Jmax  
Pulsed Collector Current  
DIODE  
I
75  
Cpulse  
Peak Repetitive Reverse Voltage  
V
RRM  
1200  
25  
V
A
A
Continuous Forward Current @ T = 80°C (Tv  
I
F
C
Repetitive Peak Forward Current  
RECTIFIER DIODE  
I
75  
FRM  
Peak Repetitive Reverse Voltage  
V
RRM  
1600  
25  
V
A
A
Continuous Forward Current @ T = 80°C (Tv  
I
F
C
Repetitive Peak Forward Current  
I
75  
FRM  
2
2
2
I t value (10 ms single halfsine wave) @ 25°C  
(10 ms single halfsine wave) @ 150°C  
I t  
680  
360  
A t  
Surge current (10 ms sin180°) @ 25°C  
THERMAL PROPERTIES  
Storage Temperature range  
INSULATION PROPERTIES  
Isolation test voltage, t = 1 sec, 50 Hz  
Internal isolation  
IFSM  
370  
40 to 125  
3000  
A
T
stg  
°C  
V
is  
V
RMS  
Al O  
2
3
Creepage distance  
6.0  
6.0  
mm  
mm  
Clearance distance  
Comperative Tracking Index  
CTI  
> 400  
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality  
should not be assumed, damage may occur and reliability may be affected.  
1. Refer to ELECTRICAL CHARACTERISTICS, RECOMMENDED OPERATING RANGES and/or APPLICATION INFORMATION for Safe  
Operating parameters.  
www.onsemi.com  
2
NXH25C120L2C2SG  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise specified)  
J
Parameter  
Test Conditions  
Symbol  
Min  
Typ  
Max  
Unit  
IGBT CHARACTERISTICS  
CollectorEmitter Cutoff Current  
CollectorEmitter Saturation Voltage  
V
V
V
V
V
= 0 V, V = 1200 V  
I
CES  
1.7  
1.9  
5.9  
250  
2.4  
mA  
GE  
GE  
GE  
GE  
GE  
CE  
V
V
V
= 15 V, I = 25 A, T = 25°C  
CE(sat)  
C
J
= 15 V, I = 25 A, T = 150°C  
C
J
GateEmitter Threshold Voltage  
Gate Leakage Current  
Turnon Delay Time  
Rise Time  
= V , I = 3.04 mA  
4.8  
6.8  
400  
V
CE  
C
GE(TH)  
= 20 V, V = 0 V  
I
nA  
ns  
CE  
GES  
T = 25 °C  
t
68  
J
d(on)  
V
V
= 600 V, I = 25 A  
CE  
GE  
C
t
r
63  
=
15 V, R = 20 W  
G
Turnoff Delay Time  
Fall Time  
t
235  
48  
d(off)  
t
f
mJ  
Turnon Switching Loss per Pulse  
Turn off Switching Loss per Pulse  
Turnon Delay Time  
Rise Time  
E
2200  
720  
72  
on  
off  
E
T = 125°C  
ns  
t
t
J
d(on)  
V
CE  
GE  
= 600 V, I = 25 A  
C
t
56  
r
V
=
15 V, R = 20 W  
G
Turnoff Delay Time  
Fall Time  
266  
54  
d(off)  
t
f
mJ  
Turnon Switching Loss per Pulse  
Turn off Switching Loss per Pulse  
Input Capacitance  
E
E
3050  
1200  
6200  
212  
117  
269  
on  
off  
V
= 20 V. V = 0 V  
pF  
C
CE  
GE  
ies  
oes  
f = 100 kHz  
Output Capacitance  
C
Reverse Transfer Capacitance  
Total Gate Charge  
C
res  
V
CE  
V
GE  
= 600 V, I = 25 A,  
Q
g
nC  
C
= 0 V ~ +15 V  
Temperature under switching conditions  
Thermal Resistance chiptocase  
DIODE CHARACTERISTICS  
Tvj op  
RthJC  
40  
150  
°C  
0.54  
°C/W  
Brake Diode Reverse Leakage Current  
Diode Forward Voltage  
VR = 1200 V  
IR  
1.9  
1.7  
1.35  
16  
200  
2.6  
mA  
V
F
V
I = 25 A, T = 25°C  
F
J
I = 25 A, T = 150°C  
F
J
T = 25°C  
Reverse Recovery Charge  
Q
mC  
A
J
rr  
V
V
= 600 V, I = 25 A  
CE  
GE  
C
Peak Reverse Recovery Current  
Reverse Recovery Energy  
I
I
RRM  
=
15 V, R = 20 W  
G
E
rr  
350  
3.6  
26  
mJ  
mC  
A
T = 150 °C  
Reverse Recovery Charge  
Q
rr  
RRM  
J
V
V
= 600 V, I = 25 A  
CE  
GE  
C
Peak Reverse Recovery Current  
Reverse Recovery Energy  
=
15 V, R = 20 W  
G
E
rr  
1050  
mJ  
°C  
Temperature under switching conditions  
Thermal Resistance chiptocase  
Tvj op  
RthJC  
40  
150  
1.10  
°C/W  
www.onsemi.com  
3
NXH25C120L2C2SG  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise specified) (continued)  
J
Parameter  
Test Conditions  
Symbol  
Min  
Typ  
Max  
Unit  
RECTIFIER DIODE CHARACTERISTICS  
Rectifier Reverse Leakage Current  
Rectifier Forward Voltage  
VR = 1600 V  
I = 25 A, T = 25°C  
IR  
1
200  
1.5  
mA  
V
F
V
F
J
I = 35 A, T = 150°C  
1.1  
F
J
Temperature under switching conditions  
Tvj op  
RthJC  
40  
150  
°C  
Thermal Resistance chiptocase  
THERMISTOR CHARACTERISTICS  
Nominal resistance  
Nominal resistance  
Deviation of R25  
0.86  
°C/W  
T = 25°C  
R
5
493.3  
5
kW  
W
25  
T = 100°C  
R
100  
nR/R  
5  
%
Power dissipation  
P
D
20  
mW  
mW/K  
K
Power dissipation constant  
Bvalue  
1.4  
B(25/50), tolerance 2%  
B(25/100), tolerance 2%  
3375  
3433  
Bvalue  
K
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
www.onsemi.com  
4
NXH25C120L2C2SG  
TYPICAL CHARACTERISTICS INVERTER/BRAKE IGBT & DIODE  
75  
75  
60  
45  
30  
15  
0
°
150 C  
°
25 C  
60  
V
GE  
= 20 V  
45  
30  
15  
0
V
GE  
= 20 V  
V
GE  
= 11 V  
V
GE  
= 11 V  
0
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
3.5  
4.0  
0
0.5  
1
1.5  
2
2.5  
3
3.5  
4
V
, COLLECTOREMITTER VOLTAGE (V)  
V
, COLLECTOREMITTER VOLTAGE (V)  
CE  
CE  
Figure 2. Inverter IGBT Typical Output  
Figure 3. Inverter IGBT Typical Output  
Characteristic (255C)  
Characteristic (1505C)  
70  
60  
50  
40  
30  
20  
10  
0
75  
60  
45  
30  
15  
0
°
150 C  
°
150 C  
°
25 C  
°
25 C  
0
2
4
6
8
10  
12  
0
0.5  
1
1.5  
2
2.5  
3
V
, GateEmitter Voltage (V)  
V , Forward Voltage (V)  
F
GE  
Figure 4. Inverter IGBT Typical Transfer  
Characteristic  
Figure 5. Inverter Diode Typical Forward  
Characteristic  
3
8
7
6
5
4
3
2
1
0
°
°
V
V
R
= 600 V  
= 15 V/15 V  
= 20 W  
V
V
R
= 600 V  
= 15 V/15 V  
= 20 W  
25 C  
25 C  
CE  
CE  
°
°
GE  
150 C  
GE  
150 C  
2.5  
G
G
2
1.5  
1
0.5  
0
0
5
10  
15  
20  
25  
30  
35  
40  
45  
50  
0
5
10  
15  
20  
25  
Ic (A)  
30  
35  
40  
45  
50  
Ic (A)  
Figure 6. Inverter IGBT Typical Turn On Loss vs IC  
Figure 7. Inverter IGBT Typical Turn Off Loss vs IC  
www.onsemi.com  
5
NXH25C120L2C2SG  
TYPICAL CHARACTERISTICS INVERTER/BRAKE IGBT & DIODE  
6
2
1.8  
1.6  
1.4  
1.2  
1
°
°
V
V
R
= 600 V  
= 15 V/15 V  
= 20 W  
V
V
I
= 600 V  
= 15 V/15 V  
= 25 A  
25 C  
25 C  
CE  
CE  
°
°
GE  
150 C  
GE  
125 C  
5
4
3
2
1
0
G
C
0.8  
0.6  
0.4  
0.2  
0
0
5
10  
15  
20  
25  
If (A)  
30  
35  
40  
45  
50  
0
20  
40  
60  
80  
100  
Rg (W)  
Figure 8. Inverter Diode Typical Reverse  
Recovery Energy vs IC  
Figure 9. Inverter IGBT Typical Turn On Loss vs RG  
1.6  
4.5  
4
°
°
V
V
I
= 600 V  
= 15 V/15 V  
= 25 A  
V
V
= 600 V  
= 15 V/15 V  
25 C  
25 C  
CE  
CE  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0
°
°
GE  
125 C  
GE  
125 C  
I = 25 A  
C
C
3.5  
3
2.5  
2
1.5  
1.0  
0.5  
0
0
20  
40  
60  
80  
100  
0
20  
40  
60  
80  
100  
Rg (W)  
Rg (W)  
Figure 10. Inverter IGBT Typical Turn Off Loss vs RG  
Figure 11. Inverter Diode Typical Reverse  
Recovery Energy vs RG  
18  
V
V
= 600 V  
= 15 V  
= 25 A  
CE  
GE  
15  
12  
9
I
C
6
3
0
0
30  
60  
90  
120  
150  
180  
210  
240  
270  
Charge (nC)  
Figure 12. Inverter IGBT Gate Voltage vs Gate Charge  
www.onsemi.com  
6
NXH25C120L2C2SG  
TYPICAL CHARACTERISTICS INVERTER/BRAKE IGBT & DIODE  
1
0.1  
0.01  
0.001  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
10  
pulse on time [s]  
Figure 13. IGBT JunctiontoCase Transient Thermal Impedance  
10  
1
0.1  
0.01  
0.001  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
10  
pulse on time [s]  
Figure 14. Diode JunctiontoCase Transient Thermal Impedance  
www.onsemi.com  
7
NXH25C120L2C2SG  
TYPICAL CHARACTERISTICS RECTIFIER  
50  
40  
30  
20  
°
°
150 C  
25 C  
10  
0
0
0.2  
0.4  
0.6  
0.8  
1
1.2  
1.4  
1.6  
V , Forward Voltage (V)  
F
Figure 15. Rectifier Typical Forward Characteristic  
10  
1
0.1  
0.01  
0.001  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
10  
pulse on time [s]  
Figure 16. Rectifier JunctiontoCase Transient Thermal Impedance  
www.onsemi.com  
8
MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
DIP26 67.8x40  
CASE 181AD  
ISSUE B  
DATE 05 AUG 2021  
GENERIC  
MARKING DIAGRAM*  
XXXXXXXXXXXXXXXXX  
ZZZATYWW  
XXX = Specific Device Code  
ZZZ = Assembly Lot Code  
AT = Assembly & Test Location  
Y
= Year  
WW = Work Week  
*This information is generic. Please refer to  
device data sheet for actual part marking.  
PbFree indicator, “G” or microdot “G”, may  
or may not be present. Some products may  
not follow the Generic Marking.  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98AON09519H  
DIP26 67.8x40  
PAGE 1 OF 1  
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www.onsemi.com  
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