NVMYS005N10MCLTWG [ONSEMI]

MOSFET – Power, Single N-Channel 100 V, 5.1 mΩ, 108 A;
NVMYS005N10MCLTWG
型号: NVMYS005N10MCLTWG
厂家: ONSEMI    ONSEMI
描述:

MOSFET – Power, Single N-Channel 100 V, 5.1 mΩ, 108 A

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DATA SHEET  
www.onsemi.com  
MOSFET – Power, Single  
N-Channel  
100 V, 5.1 mW, 108 A  
V
R
MAX  
I MAX  
D
(BR)DSS  
DS(ON)  
5.1 mW @ 10 V  
7.1 mW @ 4.5 V  
100 V  
108 A  
NVMYS005N10MCL  
D (5)  
Features  
Small Footprint (5x6 mm) for Compact Design  
G (4)  
Low R  
to Minimize Conduction Losses  
DS(on)  
Low Q and Capacitance to Minimize Driver Losses  
G
AECQ101 Qualified and PPAP Capable  
These Devices are PbFree, Halogen Free/BFR Free, Beryllium Free  
and are RoHS Compliant  
S (1,2,3)  
NCHANNEL MOSFET  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
MARKING  
DIAGRAM  
J
Parameter  
DraintoSource Voltage  
Symbol  
Value  
100  
20  
Unit  
V
D
V
DSS  
GatetoSource Voltage  
V
GS  
V
005N10  
MCL  
AWLYW  
Continuous Drain  
T
= 25°C  
= 100°C  
= 25°C  
I
108  
76  
A
C
D
LFPAK4  
CASE 760AB  
Current R  
(Note 1)  
q
JC  
T
C
Steady  
State  
1
Power Dissipation  
(Note 1)  
T
C
P
131  
65  
W
A
D
S
S
S
G
R
q
JC  
T
C
= 100°C  
005N10MCL = Specific Device Code  
A
= Assembly Location  
= Wafer Lot  
Continuous Drain  
Current R  
T = 25°C  
I
18.4  
13.0  
3.8  
A
D
WL  
Y
q
JA  
T = 100°C  
A
(Notes 1, 2)  
= Year  
Steady  
State  
W
= Work Week  
Power Dissipation  
T = 25°C  
A
P
W
D
R
(Notes 1, 2)  
q
JA  
T = 100°C  
A
1.9  
Pulsed Drain Current  
T = 25°C, t = 10 ms  
I
DM  
736  
A
A
p
ORDERING INFORMATION  
See detailed ordering, marking and shipping information on  
page 5 of this data sheet.  
Operating Junction and Storage Temperature  
Range  
T , T  
55 to  
+175  
°C  
J
stg  
Source Current (Body Diode)  
I
100  
365  
A
S
Single Pulse DraintoSource Avalanche  
E
AS  
mJ  
Energy (I  
= 6.5 A)  
L(pk)  
Lead Temperature Soldering Reflow for Solder-  
ing Purposes (1/8from case for 10 s)  
T
L
260  
°C  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
THERMAL RESISTANCE RATINGS  
Parameter  
Symbol  
Value  
1.15  
40  
Unit  
JunctiontoCase Steady State (Note 1)  
JunctiontoAmbient Steady State (Note 2)  
R
°C/W  
q
JC  
R
q
JA  
1. The entire application environment impacts the thermal resistance values shown,  
they are not constants and are only valid for the particular conditions noted.  
2
2. Surfacemounted on FR4 board using 1 in pad size, 2 oz. Cu pad.  
© Semiconductor Components Industries, LLC, 2020  
1
Publication Order Number:  
June, 2022 Rev. 1  
NVMYS005N10MCL/D  
 
NVMYS005N10MCL  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise specified)  
J
Parameter  
OFF CHARACTERISTICS  
Symbol  
Test Condition  
Min  
Typ  
Max  
Unit  
DraintoSource Breakdown Voltage  
V
V
GS  
= 0 V, I = 250 mA  
100  
V
(BR)DSS  
D
DraintoSource Breakdown Voltage  
Temperature Coefficient  
V
/
I
D
= 250 mA, ref to 25°C  
52  
mV/°C  
(BR)DSS  
T
J
Zero Gate Voltage Drain Current  
I
V
DS  
= 0 V,  
T = 25°C  
1
mA  
DSS  
GS  
J
V
= 100 V  
T = 125°C  
J
100  
100  
GatetoSource Leakage Current  
ON CHARACTERISTICS  
I
V
= 0 V, V = 20 V  
nA  
GSS  
DS  
GS  
Gate Threshold Voltage  
V
V
GS  
= V , I = 192 mA  
1
3
V
GS(TH)  
DS  
D
Threshold Temperature Coefficient  
DraintoSource On Resistance  
V
/T  
I = 192 mA, ref to 25°C  
D
5.6  
4.2  
mV/°C  
mW  
GS(TH)  
J
R
V
GS  
GS  
= 10 V, I = 34 A  
5.1  
7.1  
DS(on)  
D
V
= 4.5 V, I = 27 A  
5.6  
D
Forward Transconductance  
GateResistance  
g
V
DS  
= 10 V, I = 50 A  
155  
0.85  
S
FS  
D
R
T = 25°C  
A
W
G
CHARGES & CAPACITANCES  
Input Capacitance  
C
V
= 0 V, f = 1 MHz, V = 50 V  
4100  
1350  
22  
26  
55  
11  
pF  
ISS  
GS  
DS  
Output Capacitance  
C
OSS  
RSS  
Reverse Transfer Capacitance  
Total Gate Charge  
C
Q
V
GS  
= 4.5 V, V = 50 V, I = 34 A  
nC  
nC  
G(TOT)  
G(TOT)  
DS  
D
Total Gate Charge  
Q
V
= 10 V, V = 50 V, I = 34 A  
GS DS D  
GatetoSource Charge  
GatetoDrain Charge  
Plateau Voltage  
Q
Q
GS  
GD  
GP  
5
V
3
V
Threshold Gate Charge  
SWITCHING CHARACTERISTICS (Note 3)  
TurnOn Delay Time  
Q
6
nC  
G(TH)  
t
V
= 10 V, V = 50 V,  
17  
6.7  
57  
ns  
d(ON)  
GS  
D
DS  
I
= 34 A, R = 6 W  
G
Rise Time  
t
r
TurnOff Delay Time  
t
d(OFF)  
Fall Time  
t
f
12.3  
DRAINSOURCE DIODE CHARACTERISTICS  
Forward Diode Voltage  
V
V
S
= 0 V,  
T = 25°C  
0.85  
0.73  
56  
1.3  
V
SD  
RR  
GS  
J
I
= 34 A  
T = 125°C  
J
Reverse Recovery Time  
Reverse Recovery Charge  
Charge Time  
t
V
= 0 V, dI /dt = 100 A/ms,  
ns  
nC  
ns  
ns  
GS  
S
I
S
= 17 A  
Q
54  
RR  
t
25  
a
b
Discharge Time  
t
31  
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
3. Switching characteristics are independent of operating junction temperatures  
www.onsemi.com  
2
 
NVMYS005N10MCL  
TYPICAL CHARACTERISTICS  
100  
80  
100  
V
= 10 to 3.2 V  
GS  
V
DS  
= 10 V  
3.0 V  
2.8 V  
80  
60  
40  
60  
T = 25°C  
J
40  
2.6 V  
2.4 V  
20  
0
20  
0
T = 150°C  
J
T = 55°C  
J
0
1
2
3
4
0
1
2
3
4
5
V
DS  
, DRAINTOSOURCE VOLTAGE (V)  
V
GS  
, GATETOSOURCE VOLTAGE (V)  
Figure 1. OnRegion Characteristics  
Figure 2. Transfer Characteristics  
18  
16  
14  
12  
10  
8
7
6
T = 25°C  
J
T = 25°C  
D
J
I
= 34 A  
V
= 4.5 V  
= 10 V  
GS  
5
4
V
GS  
6
4
3
2
2
0
1
2
3
4
5
6
7
8
9
10  
10  
15  
20  
25  
30  
35  
40  
45  
50  
V
GS  
, GATETOSOURCE VOLTAGE (V)  
I , DRAIN CURRENT (A)  
D
Figure 3. OnResistance vs. GatetoSource  
Figure 4. OnResistance vs. Drain Current and  
Voltage  
Gate Voltage  
100  
10  
1
2.5  
2.0  
1.5  
T = 175°C  
V
= 10 V  
= 34 A  
J
GS  
I
D
T = 150°C  
J
T = 125°C  
J
T = 85°C  
J
0.1  
T = 25°C  
J
1.0  
0.5  
0.01  
0.001  
50 25  
0
25  
50  
75  
100 125 150 175  
10 20  
30  
40  
50  
60  
70  
80  
90 100  
T , JUNCTION TEMPERATURE (°C)  
J
V
DS  
, DRAINTOSOURCE VOLTAGE (V)  
Figure 5. OnResistance Variation with  
Figure 6. DraintoSource Leakage Current  
Temperature  
vs. Voltage  
www.onsemi.com  
3
NVMYS005N10MCL  
TYPICAL CHARACTERISTICS  
10K  
1K  
10  
C
iss  
9
8
7
6
5
4
3
2
C
oss  
100  
Q
GD  
Q
GS  
C
rss  
10  
1
V
I
= 50 V  
= 34 A  
V
= 0 V  
DS  
GS  
T = 25°C  
D
J
1
0
T = 25°C  
J
f = 1 MHz  
0
10 20 30 40 50 60 70 80  
, DRAINTOSOURCE VOLTAGE (V)  
90 100  
0
10  
20  
30  
40  
50  
60  
V
DS  
Q , TOTAL GATE CHARGE (nC)  
G
Figure 7. Capacitance Variation  
Figure 8. GatetoSource vs. Total Charge  
1000  
100  
V
GS  
= 0 V  
t
t
d(off)  
10  
d(on)  
10  
1
t
t
f
V
= 10 V  
= 50 V  
= 34 A  
r
GS  
V
DS  
I
D
T = 125°C  
T = 25°C  
T = 55°C  
J
J
J
1
0.4  
0.5  
0.6  
0.7  
0.8  
0.9  
1.0  
1
10  
R , GATE RESISTANCE (W)  
G
V
SD  
, SOURCETODRAIN VOLTAGE (V)  
Figure 9. Resistive Switching Time Variation  
vs. Gate Resistance  
Figure 10. Diode Forward Voltage vs. Current  
100  
10  
1000  
100  
10  
10 ms  
T (initial) = 25°C  
J
T
V
= 25°C  
C
T (initial) = 125°C  
J
10 V  
GS  
Single Pulse  
1
0.5 ms  
1 ms  
10 ms  
1
R
Limit  
DS(on)  
Thermal Limit  
Package Limit  
0.1  
0.1  
0.1  
1
10  
100  
1000  
0.0001  
0.001  
TIME IN AVALANCHE (sec)  
0.01  
V
DS  
, DRAINTOSOURCE VOLTAGE (V)  
Figure 11. Maximum Rated Forward Biased  
Safe Operating Area  
Figure 12. Maximum Drain Current vs. Time in  
Avalanche  
www.onsemi.com  
4
NVMYS005N10MCL  
TYPICAL CHARACTERISTICS  
100  
10  
1
50% Duty Cycle  
20%  
10%  
5%  
2%  
1%  
0.1  
Single Pulse  
0.00001 0.0001  
0.01  
0.000001  
0.001  
0.01  
0.1  
1
10  
100  
1000  
t, PULSE TIME (sec)  
Figure 13. Thermal Response  
DEVICE ORDERING INFORMATION  
Device  
Marking  
Package  
Shipping  
NVMYS005N10MCLTWG  
005N10MCL  
LFPAK4  
(PbFree)  
3000 / Tape & Reel  
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging  
Specifications Brochure, BRD8011/D.  
www.onsemi.com  
5
NVMYS005N10MCL  
PACKAGE DIMENSIONS  
LFPAK4 5x6  
CASE 760AB  
ISSUE C  
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