NVBGS1D2N08H [ONSEMI]

Power MOSFET, 80 V, 1.2 mΩ, 353 A, Single N−Channel;
NVBGS1D2N08H
型号: NVBGS1D2N08H
厂家: ONSEMI    ONSEMI
描述:

Power MOSFET, 80 V, 1.2 mΩ, 353 A, Single N−Channel

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MOSFET - Power, Single  
N-Channel, D2PAK7  
80 V, 1.34 mW, 290 A  
NVBGS1D2N08H  
Features  
www.onsemi.com  
Low R  
to Minimize Conduction Losses  
Low Q and Capacitance to Minimize Driver Losses  
DS(on)  
G
AECQ101 Qualification  
V
R
MAX  
I MAX  
D
These Devices are PbFree, Halogen Free/BFR Free and are RoHS  
(BR)DSS  
DS(ON)  
Compliant  
80 V  
1.34 m@ 10 V  
290 A  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
1. Gate  
D (Pin 8, tab)  
Parameter  
DraintoSource Voltage  
Symbol  
Value  
80  
Unit  
V
2. Source  
3. Source  
5. Source  
6. Source  
7. Source  
8. Drain  
V
DSS  
GatetoSource Voltage  
V
GS  
20  
V
Continuous Drain  
T
= 25°C  
= 100°C  
= 25°C  
I
D
290  
205  
259  
130  
43  
A
C
G (Pin 1)  
Current R  
(Note 2)  
JC  
T
C
Steady  
State  
Power Dissipation  
(Note 2)  
T
C
P
D
W
A
S (Pins 2,3,5,6,7)  
NCHANNEL MOSFET  
R
JC  
T
C
= 100°C  
Continuous Drain  
Current R  
I
D
T = 25°C  
A
JA  
31  
T = 100°C  
A
(Notes 1, 2)  
Steady  
State  
MARKING  
DIAGRAM  
8
Power Dissipation  
T = 25°C  
A
P
D
5.7  
2.9  
900  
W
R
(Notes 1, 2)  
JA  
T = 100°C  
A
1
2
3
Pulsed Drain Current  
T = 25°C, t = 100 s  
A
I
DM  
A
p
BGS1D2  
N08H  
AYWWG  
5
6
7
Operating Junction and Storage Temperature  
Range  
T , T  
55 to  
+175  
°C  
J
stg  
2
D PAK7  
CASE 221BP  
Source Current (Body Diode)  
I
S
199  
A
Single Pulse DraintoSource Avalanche  
E
AS  
1500  
mJ  
Energy (I = 32 A  
)
L
pk  
BGS1D2N08H = Specific Device Code  
Lead Temperature for Soldering Purposes  
T
260  
°C  
L
A
Y
= Assembly Location  
= Year  
(1/8from case for 10 s)  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
WW = Work Week  
= PbFree Package  
G
THERMAL RESISTANCE MAXIMUM RATINGS  
ORDERING INFORMATION  
Parameter  
Symbol  
Value  
0.58  
Unit  
Device  
Package  
Shipping  
JunctiontoCase Steady State (Note 2)  
JunctiontoAmbient Steady State (Note 1)  
R
°C/W  
JC  
2
NVBGS1D2N08H  
800 / Tape &  
Reel  
D PAK7  
R
26.2  
JA  
(PbFree)  
2
1. Surfacemounted on FR4 board using a 1 in pad size, 2 oz. Cu pad.  
2. The entire application environment impacts the thermal resistance values shown,  
they are not constants and are only valid for the particular conditions noted.  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
© Semiconductor Components Industries, LLC, 2018  
1
Publication Order Number:  
March, 2021 Rev. 1  
NVBGS1D2N08H/D  
 
NVBGS1D2N08H  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise specified)  
J
Parameter  
Symbol  
Test Condition  
Min  
Typ  
Max  
Unit  
OFF CHARACTERISTICS  
DraintoSource Breakdown Voltage  
V
V
GS  
= 0 V, I = 250 A  
80  
V
(BR)DSS  
D
DraintoSource Breakdown Voltage  
Temperature Coefficient  
V
/
I
D
= 250 A, ref to 25°C  
56  
mV/°C  
(BR)DSS  
T
J
Zero Gate Voltage Drain Current  
I
V
= 0 V,  
T = 25°C  
10  
A  
A  
nA  
DSS  
GS  
DS  
J
V
= 80 V  
T = 125°C  
J
250  
100  
GatetoSource Leakage Current  
ON CHARACTERISTICS (Note 3)  
Gate Threshold Voltage  
I
V
= 0 V, V  
=
20 V  
GSS  
DS  
GS  
V
V
= V , I = 650 A  
2.0  
2.9  
7.5  
1.1  
4.0  
V
GS(TH)  
GS  
DS  
D
Negative Threshold Temperature Coefficient  
DraintoSource On Resistance  
Forward Transconductance  
V
/T  
J
I = 650 A, ref to 25°C  
D
mV/°C  
GS(TH)  
R
V
= 10 V, I = 50 A  
1.34  
mꢂ  
DS(on)  
GS  
D
g
FS  
V
= 5 V, I = 50 A  
213  
0.5  
S
DS  
D
GateResistance  
R
G
CHARGES, CAPACITANCES & GATE RESISTANCE  
Input Capacitance  
C
V
= 0 V, V = 40 V, f = 1 MHz  
10830  
1605  
45  
pF  
ISS  
GS  
DS  
Output Capacitance  
C
OSS  
RSS  
Reverse Transfer Capacitance  
Total Gate Charge  
C
Q
V
GS  
= 10 V, V = 40 V; I = 50 A  
160  
28  
nC  
G(TOT)  
DS  
D
Threshold Gate Charge  
GatetoSource Charge  
GatetoDrain Charge  
Plateau Voltage  
Q
G(TH)  
Q
43  
GS  
GD  
GP  
Q
V
33  
4.3  
V
SWITCHING CHARACTERISTICS  
TurnOn Delay Time  
Rise Time  
t
V
= 10 V, V = 64 V,  
40  
34  
ns  
d(ON)  
GS  
D
DS  
I
= 50 A, R = 6 ꢂ  
G
t
r
TurnOff Delay Time  
Fall Time  
t
134  
45  
d(OFF)  
t
f
DRAINSOURCE DIODE CHARACTERISTICS  
Forward Diode Voltage  
V
V
S
= 0 V,  
T = 25°C  
0.8  
0.65  
78  
1.3  
V
SD  
GS  
J
I
= 50 A  
T = 125°C  
J
Reverse Recovery Time  
t
V
= 0 V, dI /dt = 100 A/s,  
ns  
RR  
GS  
S
I
S
= 50 A  
Reverse Recovery Charge  
Q
122  
nC  
RR  
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
3. Pulse Test: pulse width 300 s, duty cycle 2%.  
www.onsemi.com  
2
 
NVBGS1D2N08H  
TYPICAL CHARACTERISTICS  
250  
250  
200  
150  
100  
10 V  
V
GS  
= 6.0 V  
V
DS  
= 5 V  
5.0 V  
200  
150  
100  
T = 25°C  
J
4.5 V  
50  
0
50  
0
T = 175°C  
J
T = 55°C  
J
0
0.3  
0.6  
0.9  
1.2  
1.5  
2
3
4
5
6
7
V
DS  
, DRAINTOSOURCE VOLTAGE (V)  
V
GS  
, GATETOSOURCE VOLTAGE (V)  
Figure 1. OnRegion Characteristics  
Figure 2. Transfer Characteristics  
6
20  
15  
10  
I
D
= 50 A  
5
4
3
2
5
0
V
= 10 V  
GS  
1
0
T = 125°C  
J
T = 25°C  
J
3
4
5
6
7
8
9
10  
0
50  
100  
150  
200  
250  
V
GS  
, GATETOSOURCE VOLTAGE (V)  
I , DRAIN CURRENT (A)  
D
Figure 3. OnResistance vs. GatetoSource  
Figure 4. OnResistance vs. Drain Current and  
Voltage  
Gate Voltage  
2.5  
1E02  
1E03  
1E04  
1E05  
1E06  
1E07  
I
V
= 50 A  
D
= 10 V  
GS  
T = 175°C  
J
2.0  
1.5  
T = 150°C  
J
T = 125°C  
J
T = 100°C  
J
T = 85°C  
J
1.0  
0.5  
T = 25°C  
J
1E08  
1E09  
75 50 25  
0
25 50 75 100 125 150 175  
5
15  
25  
35  
45  
55  
65  
75  
T , JUNCTION TEMPERATURE (°C)  
J
V
DS  
, REVERSE VOLTAGE (V)  
Figure 5. OnResistance Variation with  
Figure 6. DraintoSource Leakage Current  
Temperature  
vs. Voltage  
www.onsemi.com  
3
NVBGS1D2N08H  
TYPICAL CHARACTERISTICS  
100K  
10K  
1K  
10  
Q
G(TOT)  
C
C
iss  
V
DD  
= 30 V  
8
6
4
V
= 40 V  
V
= 50 V  
DD  
DD  
oss  
Q
Q
GD  
GS  
100  
C
rss  
10  
1
2
0
V
= 0 V  
GS  
f = 1 MHz  
0.1  
1
10  
80  
0
30  
60  
90  
120  
150  
180  
V
DS  
, DRAINTOSOURCE VOLTAGE (V)  
Q , TOTAL GATE CHARGE (nC)  
g
Figure 7. Capacitance Variation  
Figure 8. GatetoSource vs. Total Charge  
250  
100  
1000  
V
GS  
= 0 V  
t
d(off)  
t
10  
1
f
t
r
t
d(on)  
100  
10  
T = 175°C  
J
0.1  
0.01  
T = 25°C  
T = 55°C  
J
J
0.001  
0
10  
20  
30  
40  
50  
60  
0
0.2  
0.4  
0.6  
0.8  
1.0  
1.2  
R , GATE RESISTANCE ()  
G
V
SD  
, BODY DIODE FORWARD VOLTAGE (V)  
Figure 9. Resistive Switching Time Variation  
vs. Gate Resistance  
Figure 10. Diode Forward Voltage vs. Current  
1K  
1000  
100  
10  
100  
10 s  
T
= 25°C  
J(initial)  
0.5 ms  
V
10 V  
GS  
1 ms  
Single Pulse  
= 25°C  
T
= 125°C  
J(initial)  
10  
1
T
C
1
10 ms  
R
Limit  
DS(on)  
Thermal Limit  
Package Limit  
0.1  
0.1  
1
10  
100  
1000  
0.0001  
0.001  
t , TIME IN AVALANCHE (s)  
AV  
0.01  
V
DS  
, DRAINTOSOURCE VOLTAGE (V)  
Figure 11. Maximum Rated Forward Biased  
Safe Operating Area  
Figure 12. Maximum Drain Current vs. Time in  
Avalanche  
www.onsemi.com  
4
NVBGS1D2N08H  
TYPICAL CHARACTERISTICS  
100  
10  
1
Duty Cycle = 0.5  
0.2  
0.1  
0.05  
0.02  
0.01  
0.1  
0.01  
Single Pulse  
0.001  
0.000001  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
10  
100  
1000  
t, PULSE TIME (s)  
Figure 13. Transient Thermal Impedance  
www.onsemi.com  
5
NVBGS1D2N08H  
PACKAGE DIMENSIONS  
D2PAK7 (TO2637LD) 15.4x9.9x4.5  
CASE 221BP  
ISSUE A  
www.onsemi.com  
6
NVBGS1D2N08H  
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are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent  
coverage may be accessed at www.onsemi.com/site/pdf/PatentMarking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.  
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,  
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or  
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer  
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not  
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification  
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized  
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and  
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such  
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literature is subject to all applicable copyright laws and is not for resale in any manner.  
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