NUP6012PMUTAG [ONSEMI]
Six-Line Transient Voltage Suppressor Array; 六线瞬态电压抑制器阵列
| 型号： | NUP6012PMUTAG |
| 厂家： | 
ONSEMI |
| 描述： | Six-Line Transient Voltage Suppressor Array |
| 文件： | 总3页 (文件大小：135K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
NUP6012PMU
Six-Line Transient Voltage
Suppressor Array
ESD Protection Diodes with Ultra−Low
(0.7 pF) Capacitance
http://onsemi.com
The six−line voltage transient suppressor array is designed to protect
voltage−sensitive components that require ultra−low capacitance from
ESD and transient voltage events. This device features a common anode
design which protects six independent high speed data lines in a single
six−lead UDFN low profile package.
D
1
D
2
D
3
D
4
D
5
D
6
Excellent clamping capability, low capacitance, low leakage, and fast
response time make these parts ideal for ESD protection on designs
where board space is at a premium. Because of its low capacitance, it is
suited for use in high frequency designs.
Features
• Low Capacitance Data Lines (0.7 pF Typical)
• Protects up to Six Data Lines
MARKING
DIAGRAM
• UDFN Package, 1.6 x 1.6 mm
1
• Low Profile of 0.50 mm for Ultra Slim Design
• ESD Rating: IEC61000−4−2: Level 4
− Contact (14 kV)
UDFN6 1.6x1.6
MU SUFFIX
CASE 517AP
6
XX MG
G
1
• D , D , D , D ,D and D Pins = 5.2 V Minimum Protection
XX
M
G
= Specific Device Code
= Date Code
= Pb−Free Package
1
2
3
4
5
6
• RoHS Compliant
• This is a Pb−Free Device
Typical Applications
(Note: Microdot may be in either location)
• USB 2.0 High−Speed Interface
• Cell Phones
PIN CONNECTIONS
• MP3 Players
6
5
4
D
6
D
1
D
2
D
3
1
2
3
• SIM Card Protection
GND
D
D
MAXIMUM RATINGS (T = 25°C, unless otherwise specified)
5
J
Symbol
Rating
Value
−40 to 125
−55 to 150
260
Unit
°C
4
T
T
T
Operating Junction Temperature Range
Storage Temperature Range
J
°C
STG
L
Lead Solder Temperature – Maximum
(10 seconds)
°C
ORDERING INFORMATION
ESD
IEC 61000−4−2 Contact
14000
V
†
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
Device
Package
Shipping
NUP6012PMUTAG
UDFN6 3000/Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
©
Semiconductor Components Industries, LLC, 2008
1
Publication Order Number:
June, 2008− Rev. 0
NUP6012PMU/D
NUP6012PMU
ELECTRICAL CHARACTERISTICS
(T = 25°C unless otherwise noted)
A
Symbol
Parameter
Maximum Reverse Peak Pulse Current
Clamping Voltage @ I
I
I
PP
I
F
V
C
PP
V
RWM
Working Peak Reverse Voltage
I
R
Maximum Reverse Leakage Current @ V
RWM
V
C
V
V
BR RWM
V
Breakdown Voltage @ I
Test Current
BR
T
V
I
V
F
R
T
I
I
T
I
F
Forward Current
V
F
Forward Voltage @ I
F
I
PP
P
Peak Power Dissipation
Max. Capacitance @ V = 0 and f = 1.0 MHz
pk
C
R
Uni−Directional TVS
ELECTRICAL CHARACTERISTICS (T = 25°C, unless otherwise specified)
J
Parameter
Reverse Working Voltage (D , D , D , D , D and D )
Conditions
Symbol
Min
−
Typ
−
Max
4.0
−
Unit
V
(Note 1)
I = 1 mA, (Note 2)
V
RWM
1
2
3
4
5
6
Breakdown Voltage (D , D , D , D , D and D )
V
BR
5.2
−
5.5
−
V
1
2
3
4
5
6
T
Reverse Leakage Current (D , D , D , D , D and D )
@ V
I
R
1.0
0.9
mA
pF
1
2
3
4
5
6
RWM
Capacitance (D , D , D , D , D and D )
V
R
= 0 V, f = 1 MHz (Line to GND)
C
J
−
0.7
1
2
3
4
5
6
1. TVS devices are normally selected according to the working peak reverse voltage (V
or continuous peak operating voltage level.
), which should be equal or greater than the DC
RWM
2. V is measured at pulse test current I .
BR
T
Figure 1. ESD Clamping Voltage Screenshot
Figure 2. ESD Clamping Voltage Screenshot
Positive 8 kV Contact per IEC61000−4−2
Negative 8 kV Contact per IEC61000−4−2
http://onsemi.com
2
NUP6012PMU
PACKAGE DIMENSIONS
UDFN6, 1.6x1.6, 0.5P
CASE 517AP−01
ISSUE O
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
A
D
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM TERMINAL.
B
2X
L
0.10
C
L1
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
PIN ONE
E
DETAIL A
OPTIONAL
REFERENCE
MILLIMETERS
CONSTRUCTION
DIM MIN
0.45
A1 0.00
MAX
0.55
0.05
2X
A
0.10
C
MOLD CMPD
EXPOSED Cu
A3
b
D
E
0.13 REF
TOP VIEW
0.20
0.30
1.60 BSC
1.60 BSC
0.50 BSC
A3
A
(A3)
e
DETAIL B
D2 1.10
E2 0.45
1.30
0.65
−−−
0.40
0.15
0.05
0.05
C
C
A1
K
L
0.20
0.20
DETAIL B
OPTIONAL
6X
L1 0.00
CONSTRUCTION
SIDE VIEW
SEATING
PLANE
C
A1
SOLDERMASK DEFINED
MOUNTING FOOTPRINT*
DETAIL A
6X L
D2
1.26
3
1
E2
6X
6
5
0.52
0.61 1.90
6X K
6X b
0.10
0.05
C A B
e
NOTE 3
C
1
BOTTOM VIEW
0.50 PITCH
6X
0.32
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5773−3850
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: orderlit@onsemi.com
For additional information, please contact your local
Sales Representative
NUP6012PMU/D
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