NTP165N65S3H [ONSEMI]

Power MOSFET, N-Channel, SUPERFET® III, FAST, 650 V, 19 A, 165 mΩ, TO-220;
NTP165N65S3H
型号: NTP165N65S3H
厂家: ONSEMI    ONSEMI
描述:

Power MOSFET, N-Channel, SUPERFET® III, FAST, 650 V, 19 A, 165 mΩ, TO-220

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onsemi andꢀꢀꢀꢀꢀꢀꢀand other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or  
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MOSFET - Power,  
N‐Channel, SUPERFET) III,  
FAST  
650 V, 165 mW, 19 A  
NTP165N65S3H  
www.onsemi.com  
Description  
SUPERFET III MOSFET is ON Semiconductor’s brand-new high  
voltage super-junction (SJ) MOSFET family that is utilizing charge  
balance technology for outstanding low on-resistance and lower gate  
charge performance. This advanced technology is tailored to minimize  
conduction loss, provides superior switching performance, and  
withstand extreme dv/dt rate.  
V
R
MAX  
I MAX  
D
DSS  
DS(ON)  
650 V  
165 mW @ 10 V  
19 A  
D
Consequently, SUPERFET III MOSFET FAST series helps  
minimize various power systems and improve system efficiency.  
Features  
G
700 V @ T = 150°C  
J
Typ. R  
= 132 mW  
DS(on)  
S
Ultra Low Gate Charge (Typ. Q = 35 nC)  
g
Low Effective Output Capacitance (Typ. C  
100% Avalanche Tested  
= 326 pF)  
oss(eff.)  
These Devices are PbFree and are RoHS Compliant  
Applications  
G
D
Telecom / Server Power Supplies  
Industrial Power Supplies  
UPS / Solar  
S
TO2203LD  
CASE 340AT  
MARKING DIAGRAM  
T165N  
65S3H  
AYWWZZ  
T165N65S3H = Specific Device Code  
A
Y
= Assembly Location  
= Year  
WW  
ZZ  
= Work Week  
= Lot Code  
ORDERING INFORMATION  
See detailed ordering and shipping information on page 2 of  
this data sheet.  
© Semiconductor Components Industries, LLC, 2020  
1
Publication Order Number:  
March, 2021 Rev. 1  
NTP165N65S3H/D  
NTP165N65S3H  
ABSOLUTE MAXIMUM RATINGS (T = 25°C, Unless otherwise specified)  
C
Symbol  
Parameter  
Value  
650  
30  
Unit  
V
V
DSS  
V
GSS  
Drain to Source Voltage  
Gate to Source Voltage  
DC  
V
AC (f > 1 Hz)  
30  
V
I
D
Drain Current  
Continuous (T = 25°C)  
19  
A
C
Continuous (T = 100°C)  
12  
C
I
Drain Current  
Pulsed (Note 1)  
53  
A
mJ  
A
DM  
E
Single Pulsed Avalanche Energy (Note 2)  
Avalanche Current (Note 2)  
Repetitive Avalanche Energy (Note 1)  
MOSFET dv/dt  
163  
4
AS  
AS  
I
E
1.42  
120  
20  
mJ  
V/ns  
AR  
dv/dt  
Peak Diode Recovery dv/dt (Note 3)  
Power Dissipation  
P
(T = 25°C)  
C
142  
1.14  
55 to +150  
260  
W
W/°C  
°C  
D
Derate Above 25°C  
T , T  
Operating and Storage Temperature Range  
J
STG  
T
Maximum Lead Temperature for Soldering, 1/8from Case for 5 s  
°C  
L
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality  
should not be assumed, damage may occur and reliability may be affected.  
1. Repetitive rating: pulse-width limited by maximum junction temperature.  
2. I = 4 A, R = 25 W, starting T = 25°C.  
AS  
G
J
3. I 9.5 A, di/dt 200 A/ms, V 400 V, starting T = 25°C.  
SD  
DD  
J
THERMAL CHARACTERISTICS  
Symbol  
Parameter  
Value  
0.88  
Unit  
R
Thermal Resistance, Junction to Case, Max.  
Thermal Resistance, Junction to Ambient, Max.  
_C/W  
q
JC  
JA  
R
62.5  
q
PACKAGE MARKING AND ORDERING INFORMATION  
Part Number  
Top Marking  
Package  
Shipping  
50 Units / Tube  
NTP165N65S3H  
T165N65S3H  
TO2203LD  
(Pb-Free / Halogen Free)  
www.onsemi.com  
2
 
NTP165N65S3H  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)  
C
Symbol  
Parameter  
Test Conditions  
Min  
Typ  
Max  
Unit  
OFF CHARACTERISTICS  
BV  
Drain to Source Breakdown Voltage  
650  
700  
V
V
V
= 0 V, I = 1 mA, T = 25_C  
DSS  
GS  
D
J
V
GS  
= 0 V, I = 1 mA, T = 150_C  
D
J
DBV  
/DT  
Breakdown Voltage Temperature  
Coefficient  
I
D
= 10 mA, Referenced to 25_C  
0.63  
1.0  
V/_C  
DSS  
J
I
Zero Gate Voltage Drain Current  
V
DS  
= 650 V, V = 0 V  
1
mA  
DSS  
GS  
V
= 520 V, T = 125_C  
DS  
C
I
Gate to Body Leakage Current  
V
=
30 V, V = 0 V  
100  
nA  
GSS  
GS  
DS  
ON CHARACTERISTICS  
V
Gate Threshold Voltage  
V
= V , I = 1.6 mA  
2.4  
4.0  
V
mW  
S
GS(th)  
DS(on)  
GS  
DS  
D
R
Static Drain to Source On Resistance  
Forward Transconductance  
V
= 10 V, I = 9.5 A  
132  
24  
165  
GS  
DS  
D
g
FS  
V
= 20 V, I = 9.5 A  
D
DYNAMIC CHARACTERISTICS  
C
Input Capacitance  
V
= 400 V, V = 0 V, f = 250 kHz  
1808  
27  
pF  
pF  
pF  
pF  
nC  
nC  
nC  
W
iss  
DS  
GS  
C
Output Capacitance  
oss  
C
Effective Output Capacitance  
Energy Related Output Capacitance  
Total Gate Charge at 10 V  
Gate to Source Gate Charge  
Gate to Drain “Miller” Charge  
Equivalent Series Resistance  
V
= 0 V to 400 V, V = 0 V  
326  
47  
oss(eff.)  
DS  
GS  
C
V
= 0 V to 400 V, V = 0 V  
GS  
oss(er.)  
DS  
Q
35  
g(tot)  
V
= 400 V, I = 9.5 A, V = 10 V  
DS  
D
GS  
Q
8.4  
9.2  
1.1  
gs  
(Note 4)  
Q
gd  
ESR  
f = 1 MHz  
SWITCHING CHARACTERISTICS  
t
Turn-On Delay Time  
Turn-On Rise Time  
Turn-Off Delay Time  
Turn-Off Fall Time  
20  
8.5  
68  
3
ns  
ns  
ns  
ns  
d(on)  
V
= 400 V, I = 9.5 A,  
D
t
r
DD  
V
= 10 V, R = 10 W  
GS  
g
t
d(off)  
(Note 4)  
t
f
SOURCE-DRAIN DIODE CHARACTERISTICS  
I
Maximum Continuous Source to Drain Diode Forward Current  
Maximum Pulsed Source to Drain Diode Forward Current  
Source to Drain Diode Forward  
19  
53  
A
A
V
S
I
SM  
V
SD  
1.2  
V
GS  
= 0 V, I = 9.5 A  
SD  
Voltage  
t
Reverse Recovery Time  
Reverse Recovery Charge  
264  
3.6  
ns  
rr  
V
DD  
= 400 V, I = 9.5 A,  
SD  
F
dI /dt = 100 A/ms  
Q
mC  
rr  
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
4. Essentially independent of operating temperature typical characteristics.  
www.onsemi.com  
3
 
NTP165N65S3H  
TYPICAL CHARACTERISTICS (T = 25°C unless otherwise noted)  
C
100  
40  
30  
V
= 20 V  
250 ms Pulse Test  
= 25°C  
DS  
V
GS  
= 10.0 V  
250 ms Pulse Test  
T
C
V
= 7.0 V  
GS  
V
GS  
= 5.0 V  
V
= 6.0 V  
GS  
150°C  
25°C  
20  
10  
0
10  
V
= 4.5 V  
= 4.0 V  
GS  
55°C  
V
GS  
1
0
10  
20  
5
15  
6
2
3
4
5
V
DS  
, DRAINSOURCE VOLTAGE (V)  
V
GS  
, GATESOURCE VOLTAGE (V)  
Figure 2. Transfer Characteristics  
Figure 1. OnRegion Characteristics  
100  
0.3  
0.2  
0.1  
V
= 0 V  
GS  
T
C
= 25°C  
250 ms Pulse Test  
10  
150°C  
V
GS  
= 10 V  
25°C  
V
GS  
= 20 V  
1
55°C  
0.1  
0
0.0  
0.2  
0.4  
0.6  
0.8  
1.0  
1.2  
0
10  
20  
30  
40  
I , DRAIN CURRENT (A)  
D
V
SD  
, BODY DIODE FORWARD VOLTAGE (V)  
Figure 3. OnResistance Variation vs.  
Figure 4. Body Diode Forward Voltage  
Variation vs. Source Current and Temperature  
Drain Current and Gate Voltage  
6
10  
10  
V
= 0 V  
GS  
C
C
C
= C + C (C = shorted)  
gs gd ds  
I
D
= 9.5 A  
iss  
f = 250 kHz  
= C + C  
5
oss  
rss  
ds  
gd  
10  
= C  
gd  
8
6
4
V
DS  
= 130 V  
V
4
10  
3
10  
C
C
= 400 V  
iss  
DS  
2
10  
1
10  
oss  
2
0
C
0
rss  
10  
1  
10  
0
100  
V
200  
300  
400  
500  
600  
40  
0
10  
30  
20  
Q , TOTAL GATE CHARGE (nC)  
g
, DRAINSOURCE VOLTAGE (V)  
DS  
Figure 6. Gate Charge Characteristics  
Figure 5. Capacitance Characteristics  
www.onsemi.com  
4
NTP165N65S3H  
TYPICAL CHARACTERISTICS (T = 25°C unless otherwise noted) (continued)  
C
1.2  
1.1  
1.0  
3.0  
V
= 10 V  
= 9.5 A  
GS  
V
= 0 V  
= 10 mA  
GS  
I
D
I
D
2.5  
2.0  
1.5  
1.0  
0.9  
0.8  
0.5  
0.0  
75 50 25  
0
25 50 75 100 125 150 175  
75 50 25  
0
25 50 75 100 125 150 175  
T , JUNCTION TEMPERATURE (°C)  
J
T , JUNCTION TEMPERATURE (°C)  
J
Figure 7. Breakdown Voltage Variation  
vs. Temperature  
Figure 8. OnResistance Variation  
vs. Temperature  
100  
10  
25  
20  
10 ms  
100 ms  
15  
10  
1 ms  
Operation in this  
Area is Limited  
10 ms  
by R  
1
DS(on)  
DC  
5
0
T
= 25°C  
C
T = 150°C  
J
Single Pulse  
0.1  
25  
50  
75  
100  
125  
150  
1
10  
100  
1000  
T , CASE TEMPERATURE (°C)  
C
V
DS  
, DRAINSOURCE VOLTAGE (V)  
Figure 10. Maximum Drain Current vs. Case  
Temperature  
Figure 9. Maximum Safe Operating Area  
7
6
5
4
3
2
1
0
600  
0
100  
200  
300  
400  
500  
V
DS  
, DRAINTOSOURCE VOLTAGE (V)  
Figure 11. EOSS vs. Drain to Source Voltage  
www.onsemi.com  
5
NTP165N65S3H  
TYPICAL CHARACTERISTICS (T = 25°C unless otherwise noted) (continued)  
C
1
Duty Cycle Descending Order  
D = 0.5  
D = 0.2  
D = 0.1  
P
DM  
D = 0.05  
D = 0.02  
0.1  
t
1
t
2
D = 0.01  
Z
q
(t) = r(t) x R  
q
JC  
JC  
R
= 0.88°C/W  
q
JC  
Single Pulse  
Peak T = P  
x Z (t) + T  
q
JC C  
J
DM  
Duty Cycle, D = t /t  
1
2
0.01  
0.00001  
1
0.1  
0.001  
0.01  
0.0001  
t, RECTANGULAR PULSE DURATION (sec)  
Figure 12. Transient Thermal Response Curve  
www.onsemi.com  
6
NTP165N65S3H  
V
GS  
R
Q
g
L
V
DS  
Q
Q
gs  
gd  
V
GS  
DUT  
I
G
= Const.  
Charge  
Figure 13. Gate Charge Test Circuit & Waveform  
R
L
V
DS  
GS  
90%  
90%  
10%  
90%  
V
DS  
V
DD  
V
GS  
R
G
10%  
V
DUT  
V
GS  
t
r
t
f
t
t
d(off)  
d(on)  
t
on  
t
off  
Figure 14. Resistive Switching Test Circuit & Waveforms  
L
2
1
2
EAS  
+
@ LIAS  
V
DS  
BV  
DSS  
I
D
I
AS  
R
G
V
DD  
I (t)  
D
DUT  
V
DD  
V
GS  
V
DS  
(t)  
t
p
Time  
t
p
Figure 15. Unclamped Inductive Switching Test Circuit & Waveforms  
www.onsemi.com  
7
NTP165N65S3H  
+
DUT  
V
SD  
I
SD  
L
Driver  
R
G
Same Type  
as DUT  
V
DD  
V
GS  
dv/dt controlled by R  
G
I controlled by pulse period  
SD  
Gate Pulse Width  
D +  
Gate Pulse Period  
V
GS  
10 V  
(Driver)  
I
, Body Diode Forward Current  
FM  
I
di/dt  
SD  
(DUT)  
I
RM  
Body Diode Reverse Current  
Body Diode Recovery dv/dt  
V
DS  
V
DD  
V
SD  
(DUT)  
Body Diode  
Forward Voltage Drop  
Figure 16. Peak Diode Recovery dv/dt Test Circuit & Waveforms  
SUPERFET is a registered trademark of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or  
other countries.  
www.onsemi.com  
8
NTP165N65S3H  
PACKAGE DIMENSIONS  
TO2203LD  
CASE 340AT  
ISSUE A  
www.onsemi.com  
9
NTP165N65S3H  
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent  
coverage may be accessed at www.onsemi.com/site/pdf/PatentMarking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.  
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,  
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or  
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer  
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not  
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification  
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized  
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and  
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such  
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This  
literature is subject to all applicable copyright laws and is not for resale in any manner.  
PUBLICATION ORDERING INFORMATION  
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