NTD360N65S3H [ONSEMI]

Power MOSFET, N-Channel, SUPERFET® III, FAST, 650 V, 10 A, 360 mΩ, DPAK;
NTD360N65S3H
型号: NTD360N65S3H
厂家: ONSEMI    ONSEMI
描述:

Power MOSFET, N-Channel, SUPERFET® III, FAST, 650 V, 10 A, 360 mΩ, DPAK

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www.onsemi.com  
onsemi andꢀꢀꢀꢀꢀꢀꢀand other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or  
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MOSFET - Power,  
N‐Channel, SUPERFET) III,  
FAST  
650 V, 360 mW, 10 A  
NTD360N65S3H  
www.onsemi.com  
Description  
SUPERFET III MOSFET is ON Semiconductor’s brand-new high  
voltage super-junction (SJ) MOSFET family that is utilizing charge  
balance technology for outstanding low on-resistance and lower gate  
charge performance. This advanced technology is tailored to minimize  
conduction loss, provides superior switching performance, and  
withstand extreme dv/dt rate.  
V
R
MAX  
I MAX  
D
DSS  
DS(ON)  
650 V  
360 mW @ 10 V  
10 A  
D
Consequently, SUPERFET III FAST MOSFET series helps  
minimize various power systems and improve system efficiency.  
Features  
G
700 V @ T = 150°C  
J
Typ. R  
= 296 mW  
DS(on)  
S
Ultra Low Gate Charge (Typ. Q = 17.5 nC)  
g
Low Effective Output Capacitance (Typ. C  
= 180 pF)  
oss(eff.)  
100% Avalanche Tested  
These Devices are PbFree and are RoHS Compliant  
Applications  
DPAK  
CASE 369AS  
Computing / Display Power Supplies  
Telecom / Server Power Supplies  
Industrial Power Supplies  
Lighting / Charger / Adapter  
MARKING DIAGRAM  
T360N  
65S3H  
AYWWZZ  
T360N65S3H = Specific Device Code  
A
Y
= Assembly Location  
= Year  
WW  
ZZ  
= Work Week  
= Lot Code  
ORDERING INFORMATION  
See detailed ordering and shipping information on page 2 of  
this data sheet.  
© Semiconductor Components Industries, LLC, 2020  
1
Publication Order Number:  
March, 2021 Rev. 2  
NTD360N65S3H/D  
NTD360N65S3H  
ABSOLUTE MAXIMUM RATINGS (T = 25°C, Unless otherwise specified)  
C
Symbol  
Parameter  
Value  
Unit  
V
V
DSS  
V
GSS  
Drain to Source Voltage  
Gate to Source Voltage  
650  
DC  
30  
V
AC (f > 1 Hz)  
30  
V
I
D
Drain Current  
Continuous (T = 25°C)  
10  
A
C
Continuous (T = 100°C)  
6
28  
C
I
Drain Current  
Pulsed (Note 1)  
A
mJ  
A
DM  
E
Single Pulsed Avalanche Energy (Note 2)  
Avalanche Current (Note 2)  
Repetitive Avalanche Energy (Note 1)  
MOSFET dv/dt  
75  
AS  
AS  
I
1.9  
E
0.83  
120  
mJ  
V/ns  
AR  
dv/dt  
Peak Diode Recovery dv/dt (Note 3)  
Power Dissipation  
20  
P
(T = 25°C)  
83  
W
W/°C  
°C  
D
C
Derate Above 25°C  
0.66  
55 to +150  
260  
T , T  
Operating and Storage Temperature Range  
J
STG  
T
Maximum Lead Temperature for Soldering, 1/8from Case for 5 s  
°C  
L
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality  
should not be assumed, damage may occur and reliability may be affected.  
1. Repetitive rating: pulse-width limited by maximum junction temperature.  
2. I = 1.9 A, R = 25 W, starting T = 25°C.  
AS  
G
J
3. I 5.0 A, di/dt 200 A/ms, V 400 V, starting T = 25°C.  
SD  
DD  
J
THERMAL CHARACTERISTICS  
Symbol  
Parameter  
Value  
1.51  
40  
Unit  
R
R
Thermal Resistance, Junction to Case, Max.  
_C/W  
q
JC  
JA  
Thermal Resistance, Junction to Ambient, Max. (Note 4)  
q
2
4. Device on 1 in pad 2 oz copper pad on 1.5 × 1.5 in. board of FR4 material.  
PACKAGE MARKING AND ORDERING INFORMATION  
Part Number  
Top Marking  
Package  
Reel Size  
Tape Width  
16 mm  
Shipping  
NTD360N65S3H  
T360N65S3H  
DPAK  
330 mm  
2500 / Tape & Reel  
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging  
Specifications Brochure, BRD8011/D.  
www.onsemi.com  
2
 
NTD360N65S3H  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)  
C
Symbol  
Parameter  
Test Conditions  
Min  
Typ  
Max  
Unit  
OFF CHARACTERISTICS  
BV  
Drain to Source Breakdown Voltage  
650  
700  
V
V
V
V
I
= 0 V, I = 1 mA, T = 25_C  
DSS  
GS  
D
J
= 0 V, I = 1 mA, T = 150_C  
GS  
D
J
DBV  
/DT  
Breakdown Voltage Temperature  
Coefficient  
= 10 mA, Referenced to 25_C  
0.63  
V/_C  
DSS  
J
D
I
Zero Gate Voltage Drain Current  
V
DS  
V
DS  
V
GS  
= 650 V, V = 0 V  
2.6  
3
mA  
DSS  
GS  
= 520 V, T = 125_C  
C
I
Gate to Body Leakage Current  
=
30 V, V = 0 V  
100  
nA  
GSS  
DS  
ON CHARACTERISTICS  
V
Gate Threshold Voltage  
V
GS  
V
GS  
V
DS  
= V , I = 0.7 mA  
2.4  
4.0  
360  
V
mW  
S
GS(th)  
DS(on)  
DS  
D
R
Static Drain to Source On Resistance  
Forward Transconductance  
= 10 V, I = 5.0 A  
296  
11.2  
D
g
FS  
= 20 V, I = 5.0 A  
D
DYNAMIC CHARACTERISTICS  
C
Input Capacitance  
V
= 400 V, V = 0 V, f = 250 kHz  
916  
15  
pF  
pF  
pF  
pF  
nC  
nC  
nC  
W
iss  
DS  
GS  
C
Output Capacitance  
oss  
C
Effective Output Capacitance  
Energy Related Output Capacitance  
Total Gate Charge at 10 V  
Gate to Source Gate Charge  
Gate to Drain “Miller” Charge  
Equivalent Series Resistance  
V
DS  
V
DS  
V
DS  
= 0 V to 400 V, V = 0 V  
180  
24  
oss(eff.)  
GS  
C
= 0 V to 400 V, V = 0 V  
GS  
oss(er.)  
Q
= 400 V, I = 5.0 A, V = 10 V  
17.5  
4.3  
5
g(tot)  
D
GS  
(Note 5)  
Q
gs  
Q
gd  
ESR  
f = 1 MHz  
0.9  
SWITCHING CHARACTERISTICS  
t
Turn-On Delay Time  
Turn-On Rise Time  
Turn-Off Delay Time  
Turn-Off Fall Time  
V
V
= 400 V, I = 5.0 A,  
15  
6.7  
45  
7
ns  
ns  
ns  
ns  
d(on)  
DD  
GS  
D
= 10 V, R = 12 W  
g
t
r
(Note 5)  
t
d(off)  
t
f
SOURCE-DRAIN DIODE CHARACTERISTICS  
I
Maximum Continuous Source to Drain Diode Forward Current  
Maximum Pulsed Source to Drain Diode Forward Current  
10  
28  
A
A
V
S
I
SM  
V
SD  
Source to Drain Diode Forward  
Voltage  
V
GS  
= 0 V, I = 5.0 A  
1.2  
SD  
t
Reverse Recovery Time  
V
= 400 V, I = 5.0 A,  
204  
1.8  
ns  
rr  
DD  
F
SD  
dI /dt = 100 A/ms  
Q
Reverse Recovery Charge  
mC  
rr  
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
5. Essentially independent of operating temperature typical characteristics.  
www.onsemi.com  
3
 
NTD360N65S3H  
TYPICAL CHARACTERISTICS  
20  
15  
10  
100  
V
GS  
= 10 V  
250 ms Pulse Test  
= 20 V  
6.0 V  
5.0 V  
V
DS  
7.0 V  
250 ms Pulse Test  
= 25°C  
T
C
10  
T = 25°C  
J
4.5 V  
4.0 V  
5
0
T = 150°C  
T = 55°C  
J
J
1
0
0
0
5
10  
15  
20  
2
0
0
3
4
5
6
V
, DRAINTOSOURCE VOLTAGE (V)  
V
, GATETOSOURCE VOLTAGE (V)  
DS  
GS  
Figure 1. OnRegion Characteristics  
Figure 2. Transfer Characteristics  
100  
10  
0.8  
0.6  
0.4  
250 ms Pulse Test  
= 0 V  
T
= 25°C  
V
C
GS  
V
= 10 V  
= 20 V  
GS  
V
GS  
1
0.2  
0
T = 25°C  
T = 55°C  
J
T = 150°C  
J
J
0.1  
5
10  
I , DRAIN CURRENT (A)  
15  
20  
0.2  
0.4  
0.6  
0.8  
1.0  
1.2  
V
, BODY DIODE FORWARD VOLTAGE (V)  
D
SD  
Figure 3. On Resistance Variation vs. Drain  
Current and Gate Voltage  
Figure 4. Diode Forward Voltage Variation vs.  
Source Current and Temperature  
6
10  
10  
8
V
DS  
= 130 V  
C
C
C
= C  
gd  
= C + C  
= C + C (C = shorted)  
f = 250 kHz  
= 0 V  
rss  
oss  
iss  
I
D
= 5.0 A  
V
5
ds  
gd  
GS  
10  
V
= 400 V  
gs  
gd  
ds  
DS  
4
10  
C
iss  
6
4
3
10  
2
10  
C
oss  
1
10  
C
rss  
2
0
0
10  
1  
10  
100  
200  
300  
400  
500  
600  
5
10  
15  
20  
V
DS  
, DRAINTOSOURCE VOLTAGE (V)  
Q , TOTAL GATE CHARGE (nC)  
G
Figure 5. Capacitance Characteristics  
Figure 6. Gate Charge Characteristics  
www.onsemi.com  
4
NTD360N65S3H  
TYPICAL CHARACTERISTICS  
1.2  
1.1  
1.0  
3.0  
I
V
= 10 mA  
I = 5.0 A  
D
D
= 0 V  
V
GS  
= 10 V  
GS  
2.5  
2.0  
1.5  
1.0  
0.9  
0.8  
0.5  
0
75 50 25  
0
25  
50 75 100 125 150 175  
75 50 25  
0
25  
50 75 100 125 150 175  
T , JUNCTION TEMPERATURE (°C)  
J
T , JUNCTION TEMPERATURE (°C)  
J
Figure 7. Breakdown Voltage Variation vs.  
Temperature  
Figure 8. OnResistance Variation vs.  
Temperature  
12  
10  
8
100  
10  
Single Pulse  
T
C
= 25°C  
T = 150°C  
J
10 ms  
100 ms  
6
1
4
1 ms  
DC  
Operation in this area  
is limited by R  
2
0
DS(on)  
0.1  
1
10  
100  
1000  
25  
50  
75  
100  
125  
150  
V
DS  
, DRAINTOSOURCE VOLTAGE (V)  
T , CASE TEMPERATURE (°C)  
C
Figure 9. Maximum Safe Operating Area  
Figure 10. Maximum Drain Current vs. Case  
Temperature  
4.0  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0
0
100  
200  
300  
400  
500  
600  
V
DS  
, DRAINTOSOURCE VOLTAGE (V)  
Figure 11. Eoss vs. DraintoSource Voltage  
www.onsemi.com  
5
NTD360N65S3H  
TYPICAL CHARACTERISTICS  
1
50% Duty Cycle  
20%  
10%  
P
DM  
5%  
2%  
0.1  
t
1
t
2
1%  
Z
q
(t) = r(t) x R  
q
JC  
JC  
Single Pulse  
0.00001  
R
= 1.51°C/W  
q
JC  
Peak T = P  
Duty Cycle, D = t / t  
x Z (t) + T  
q
JC C  
J
DM  
1
2
0.01  
0.0001  
0.001  
0.01  
0.1  
1
t, RECTANGULAR PULSE DURATION (sec)  
Figure 12. Transient Thermal Response Curve  
www.onsemi.com  
6
NTD360N65S3H  
V
GS  
R
Q
g
L
V
DS  
Q
Q
gs  
gd  
V
GS  
DUT  
I
G
= Const.  
Charge  
Figure 13. Gate Charge Test Circuit & Waveform  
R
L
V
DS  
GS  
90%  
90%  
10%  
90%  
V
DS  
V
DD  
V
GS  
R
G
10%  
V
DUT  
V
GS  
t
r
t
f
t
t
d(off)  
d(on)  
t
on  
t
off  
Figure 14. Resistive Switching Test Circuit & Waveforms  
L
2
1
2
EAS  
+
@ LIAS  
V
DS  
BV  
DSS  
I
D
I
AS  
R
G
V
DD  
I (t)  
D
DUT  
V
DD  
V
GS  
V
DS  
(t)  
t
p
Time  
t
p
Figure 15. Unclamped Inductive Switching Test Circuit & Waveforms  
www.onsemi.com  
7
NTD360N65S3H  
+
DUT  
V
SD  
I
SD  
L
Driver  
R
G
Same Type  
as DUT  
V
DD  
V
GS  
dv/dt controlled by R  
G
I controlled by pulse period  
SD  
Gate Pulse Width  
D +  
Gate Pulse Period  
V
GS  
10 V  
(Driver)  
I
, Body Diode Forward Current  
FM  
I
di/dt  
SD  
(DUT)  
I
RM  
Body Diode Reverse Current  
Body Diode Recovery dv/dt  
V
DS  
V
DD  
V
SD  
(DUT)  
Body Diode  
Forward Voltage Drop  
Figure 16. Peak Diode Recovery dv/dt Test Circuit & Waveforms  
SUPERFET is a registered trademark of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or  
other countries.  
www.onsemi.com  
8
NTD360N65S3H  
PACKAGE DIMENSIONS  
DPAK3 (TO252 3 LD)  
CASE 369AS  
ISSUE O  
www.onsemi.com  
9
NTD360N65S3H  
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent  
coverage may be accessed at www.onsemi.com/site/pdf/PatentMarking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.  
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,  
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or  
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer  
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not  
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification  
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized  
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and  
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such  
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This  
literature is subject to all applicable copyright laws and is not for resale in any manner.  
PUBLICATION ORDERING INFORMATION  
LITERATURE FULFILLMENT:  
Email Requests to: orderlit@onsemi.com  
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For additional information, please contact your local Sales Representative  
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