NTB27N06 [ONSEMI]
Power MOSFET 27 Amps, 60 Volts N?Channel TO?220 and D2PAK; 功率MOSFET 27安培， 60伏特N'渠道？ 220和D2PAK
| 型号： | NTB27N06 |
| 厂家： | 
ONSEMI |
| 描述： | Power MOSFET 27 Amps, 60 Volts N?Channel TO?220 and D2PAK |
| 文件： | 总12页 (文件大小：86K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
NTP27N06, NTB27N06
Power MOSFET
27 Amps, 60 Volts
2
N–Channel TO–220 and D PAK
Designed for low voltage, high speed switching applications in
power supplies, converters, power motor controls and bridge circuits.
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Features
• Higher Current Rating
27 AMPERES
60 VOLTS
• Lower R
• Lower V
DS(on)
DS(on)
R
= 46 mΩ
DS(on)
• Lower Capacitances
Typical Applications
• Power Supplies
• Converters
N–Channel
D
• Power Motor Controls
• Bridge Circuits
G
MAXIMUM RATINGS (T = 25°C unless otherwise noted)
C
4
Rating
Drain–to–Source Voltage
Drain–to–Gate Voltage (R
Symbol
Value
60
Unit
Vdc
Vdc
Vdc
S
4
V
DSS
1
2
= 10 MΩ)
V
DGR
60
GS
3
Gate–to–Source Voltage
– Continuous
2
D PAK
V
V
"20
"30
TO–220AB
CASE 221A
STYLE 5
GS
GS
CASE 418B
STYLE 2
– Non–Repetitive (t v10 ms)
p
1
Drain Current
– Continuous @ T = 25°C
2
I
I
27
15
80
Adc
Apk
3
MARKING DIAGRAMS
& PIN ASSIGNMENTS
A
D
D
– Continuous @ T 100°C
A
– Single Pulse (t v10 µs)
I
p
DM
4
4
Drain
Drain
Total Power Dissipation @ T = 25°C
Derate above 25°C
P
D
88.2
0.59
W
W/°C
A
Operating and Storage Temperature Range
T , T
J stg
–55 to
+175
°C
NTx27N06
LLYWW
Single Pulse Drain–to–Source Avalanche
E
109
mJ
AS
NTx27N06
LLYWW
Energy – Starting T = 25°C
J
GS
(V
= 50 Vdc, V
= 10 Vdc,
1
2
3
DD
1
Gate
3
L = 0.3 mH, I (pk) = 27 A,V
DS
= 60 Vdc)
Gate Drain Source
L
Source
Thermal Resistance – Junction–to–Case
R
1.7
°C/W
°C
θJC
NTx27N06 = Device Code
2
Maximum Lead Temperature for Soldering
Purposes, 1/8″ from case for 10 seconds
T
260
L
x
= B or P
Drain
LL
Y
= Location Code
= Year
WW
= Work Week
ORDERING INFORMATION
Device
Package
Shipping
NTP27N06
NTB27N06
NTB27N06T4
TO–220AB
50 Units/Rail
50 Units/Rail
2
D PAK
2
D PAK
800/Tape & Reel
Semiconductor Components Industries, LLC, 2001
1
Publication Order Number:
August, 2001 – Rev. 2
NTP27N06/D
NTP27N06, NTB27N06
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)
J
Characteristic
Symbol
Min
Typ
Max
Unit
OFF CHARACTERISTICS
Drain–to–Source Breakdown Voltage (Note 1.)
(V = 0 Vdc, I = 250 µAdc)
V
Vdc
(BR)DSS
60
–
70
79.4
–
–
GS
D
Temperature Coefficient (Positive)
mV/°C
µAdc
Zero Gate Voltage Drain Current
I
DSS
(V
DS
(V
DS
= 60 Vdc, V
= 60 Vdc, V
= 0 Vdc)
= 0 Vdc, T = 150°C)
–
–
–
–
1.0
10
GS
GS
J
Gate–Body Leakage Current (V
= ±20 Vdc, V
DS
= 0 Vdc)
I
–
–
±100
nAdc
Vdc
GS
GSS
ON CHARACTERISTICS (Note 1.)
Gate Threshold Voltage (Note 1.)
V
GS(th)
(V
DS
= V , I = 250 µAdc)
GS
2.0
–
2.8
6.9
4.0
–
D
Threshold Temperature Coefficient (Negative)
mV/°C
mW
Static Drain–to–Source On–Resistance (Note 1.)
R
V
DS(on)
(V = 10 Vdc, I = 13.5 Adc)
–
37.5
46
GS
D
Static Drain–to–Source On–Resistance (Note 1.)
Vdc
DS(on)
(V
GS
(V
GS
= 10 Vdc, I = 27 Adc)
–
–
1.05
2.12
1.5
–
D
= 10 Vdc, I = 13.5 Adc, T = 150°C)
D
J
Forward Transconductance (Note 1.) (V
= 7.0 Vdc, I = 6.0 Adc)
g
FS
–
13.2
–
mhos
pF
DS
D
DYNAMIC CHARACTERISTICS
Input Capacitance
C
–
–
–
725
213
58
1015
300
iss
(V
= 25 Vdc, V
= 0 Vdc,
DS
GS
f = 1.0 MHz)
Output Capacitance
C
oss
Transfer Capacitance
C
120
rss
SWITCHING CHARACTERISTICS (Note 2.)
Turn–On Delay Time
t
–
–
–
–
–
–
–
13.6
62.7
26.6
70.4
21.2
5.6
30
125
60
140
30
–
ns
d(on)
(V
DD
= 30 Vdc, I = 27 Adc,
D
GS
= 9.1 Ω) (Note 1.)
Rise Time
t
r
V
= 10 Vdc,
Turn–Off Delay Time
Fall Time
t
d(off)
R
G
t
f
Gate Charge
Q
T
Q
1
Q
2
nC
(V
V
= 48 Vdc, I = 27 Adc,
D
= 10 Vdc) (Note 1.)
DS
GS
7.3
–
SOURCE–DRAIN DIODE CHARACTERISTICS
Forward On–Voltage
S
V
Vdc
ns
SD
(I = 27 Adc, V
= 0 Vdc) (Note 1.)
–
–
1.05
0.93
1.25
–
GS
(I = 27 Adc, V
= 0 Vdc, T = 150°C)
S
GS
J
Reverse Recovery Time
t
–
–
–
–
42
26
–
–
–
–
rr
(I = 27 Adc, V
= 0 Vdc,
GS
S
t
a
dI /dt = 100 A/µs) (Note 1.)
S
t
16
b
Reverse Recovery Stored Charge
Q
0.07
µc
RR
1. Pulse Test: Pulse Width ≤ 300 µs, Duty Cycle ≤ 2%.
2. Switching characteristics are independent of operating junction temperature.
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2
NTP27N06, NTB27N06
56
48
56
V
w 10 V
7.5 V
V
= 10 V
DS
7 V
6.5 V
6 V
GS
9 V
8 V
48
40
32
24
16
8
40
32
24
16
8
5.5 V
T = 25°C
J
5 V
4.5 V
T = 100°C
J
T = –55°C
J
0
0
2.6
0
1
2
3
4
5
6
3.4
4.2
5
5.8
6.6
7.4
8.2
V , DRAIN–TO–SOURCE VOLTAGE (VOLTS)
DS
V , GATE–TO–SOURCE VOLTAGE (VOLTS)
GS
Figure 1. On–Region Characteristics
Figure 2. Transfer Characteristics
0.095
0.085
0.075
0.065
0.095
0.085
0.075
0.065
V
GS
= 10 V
V
GS
= 15 V
T = 100°C
J
T = 100°C
J
0.055
0.045
0.055
0.045
T = 25°C
J
T = 25°C
J
0.035
0.025
0.035
0.025
T = –55°C
J
T = –55°C
J
0.015
0.015
0
8
16
24
32
40
48
56
0
8
16
24
32
40
48
56
I , DRAIN CURRENT (AMPS)
D
I , DRAIN CURRENT (AMPS)
D
Figure 3. On–Resistance versus
Gate–to–Source Voltage
Figure 4. On–Resistance versus Drain Current
and Gate Voltage
2.2
1.8
1.4
1
10000
1000
I
V
= 13.5 A
V
GS
= 0 V
D
= 10 V
GS
T = 150°C
J
T = 125°C
J
100
10
T = 100°C
J
0.6
–50 –25
1
0
25
50
75 100 125 150 175
0
10
20
30
40
50
60
T , JUNCTION TEMPERATURE (°C)
J
V , DRAIN–TO–SOURCE VOLTAGE (VOLTS)
DS
Figure 5. On–Resistance Variation with
Temperature
Figure 6. Drain–to–Source Leakage Current
versus Voltage
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NTP27N06, NTB27N06
POWER MOSFET SWITCHING
Switching behavior is most easily modeled and predicted
by recognizing that the power MOSFET is charge
controlled. The lengths of various switching intervals (∆t)
are determined by how fast the FET input capacitance can
be charged by current from the generator.
The capacitance (C ) is read from the capacitance curve at
a voltage corresponding to the off–state condition when
iss
calculating t
and is read at a voltage corresponding to the
on–state when calculating t
d(on)
.
d(off)
At high switching speeds, parasitic circuit elements
complicate the analysis. The inductance of the MOSFET
source lead, inside the package and in the circuit wiring
which is common to both the drain and gate current paths,
produces a voltage at the source which reduces the gate drive
current. The voltage is determined by Ldi/dt, but since di/dt
is a function of drain current, the mathematical solution is
complex. The MOSFET output capacitance also
complicates the mathematics. And finally, MOSFETs have
finite internal gate resistance which effectively adds to the
resistance of the driving source, but the internal resistance
is difficult to measure and, consequently, is not specified.
The resistive switching time variation versus gate
resistance (Figure 9) shows how typical switching
performance is affected by the parasitic circuit elements. If
the parasitics were not present, the slope of the curves would
maintain a value of unity regardless of the switching speed.
The circuit used to obtain the data is constructed to minimize
common inductance in the drain and gate circuit loops and
is believed readily achievable with board mounted
components. Most power electronic loads are inductive; the
data in the figure is taken with a resistive load, which
approximates an optimally snubbed inductive load. Power
MOSFETs may be safely operated into an inductive load;
however, snubbing reduces switching losses.
The published capacitance data is difficult to use for
calculating rise and fall because drain–gate capacitance
varies greatly with applied voltage. Accordingly, gate
charge data is used. In most cases, a satisfactory estimate of
average input current (I
) can be made from a
G(AV)
rudimentary analysis of the drive circuit so that
t = Q/I
G(AV)
During the rise and fall time interval when switching a
resistive load, V remains virtually constant at a level
GS
known as the plateau voltage, V
. Therefore, rise and fall
SGP
times may be approximated by the following:
t = Q x R /(V
– V )
GSP
r
2
G
GG
t = Q x R /V
f
2
G
GSP
where
= the gate drive voltage, which varies from zero to V
V
GG
= the gate drive resistance
GG
R
G
and Q and V
GSP
are read from the gate charge curve.
2
During the turn–on and turn–off delay times, gate current is
not constant. The simplest calculation uses appropriate
values from the capacitance curves in a standard equation for
voltage change in an RC network. The equations are:
t
t
= R
C
In [V /(V
GG GG
In (V /V
iss GG GSP
– V )]
GSP
)
d(on)
d(off)
G
iss
= R
C
G
1800
1600
1400
1200
V
= 0 V V = 0 V
GS
DS
T = 25°C
J
C
iss
1000
800
600
400
C
rss
C
iss
C
oss
200
0
C
rss
10
5
0
5
10
15
20
25
V
GS
V
DS
GATE–TO–SOURCE OR DRAIN–TO–SOURCE VOLTAGE (VOLTS)
Figure 7. Capacitance Variation
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NTP27N06, NTB27N06
1000
12
10
8
Q
T
100
t
f
V
GS
Q
Q
2
1
6
t
r
t
d(off)
4
10
t
d(on)
V
= 30 V
= 27 A
= 10 V
DS
2
0
I
= 27 A
I
V
D
J
D
T = 25°C
GS
1
0
10
20
30
40
50
60
70
1
10
R , GATE RESISTANCE (Ω)
G
100
Q
, TOTAL GATE CHARGE (nC)
G
Figure 8. Gate–To–Source and Drain–To–Source
Voltage versus Total Charge
Figure 9. Resistive Switching Time
Variation versus Gate Resistance
DRAIN–TO–SOURCE DIODE CHARACTERISTICS
60
V
= 0 V
GS
T = 25°C
J
50
40
30
20
10
0
0.6
0.68
0.76
0.84
0.92
1
V
SD
, SOURCE–TO–DRAIN VOLTAGE (VOLTS)
Figure 10. Diode Forward Voltage versus Current
SAFE OPERATING AREA
The Forward Biased Safe Operating Area curves define
the maximum simultaneous drain–to–source voltage and
drain current that a transistor can handle safely when it is
forward biased. Curves are based upon maximum peak
reliable operation, the stored energy from circuit inductance
dissipated in the transistor while in avalanche must be less
than the rated limit and adjusted for operating conditions
differing from those specified. Although industry practice is
to rate in terms of energy, avalanche energy capability is not
a constant. The energy rating decreases non–linearly with an
increase of peak current in avalanche and peak junction
temperature.
junction temperature and a case temperature (T ) of 25°C.
C
Peak repetitive pulsed power limits are determined by using
the thermal response data in conjunction with the procedures
discussed in AN569, “Transient Thermal Resistance –
General Data and Its Use.”
Although many E–FETs can withstand the stress of
drain–to–source avalanche at currents up to rated pulsed
Switching between the off–state and the on–state may
traverse any load line provided neither rated peak current
current (I
), the energy rating is specified at rated
DM
(I
) nor rated voltage (V
) is exceeded and the
continuous current (I ), in accordance with industry custom.
DM DSS
D
transition time (t ,t ) do not exceed 10 µs. In addition the total
power averaged over a complete switching cycle must not
The energy rating must be derated for temperature as shown
in the accompanying graph (Figure 12). Maximum energy at
r f
exceed (T
– T )/(R
).
currents below rated continuous I can safely be assumed to
equal the values indicated.
J(MAX)
C
θJC
D
A Power MOSFET designated E–FET can be safely used
in switching circuits with unclamped inductive loads. For
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NTP27N06, NTB27N06
SAFE OPERATING AREA
100
10
1
200
175
150
V
= 20 V
I
D
= 27 A
GS
SINGLE PULSE
T
C
= 25°C
125
100
10 µs
100 µs
75
50
1 ms
R
LIMIT
DS(on)
THERMAL LIMIT
PACKAGE LIMIT
10 ms
25
0
dc
0.1
1
10
100
25
50
75
100
125
150
175
V , DRAIN–TO–SOURCE VOLTAGE (VOLTS)
DS
T , STARTING JUNCTION TEMPERATURE (°C)
J
Figure 11. Maximum Rated Forward Biased
Safe Operating Area
Figure 12. Maximum Avalanche Energy versus
Starting Junction Temperature
1
D = 0.5
0.2
0.1
0.05
0.01
SINGLE PULSE
0.1
0.0001
0.001
0.01
0.1
1
10
t, TIME (s)
Figure 13. Thermal Response
di/dt
I
S
t
rr
t
a
t
b
TIME
0.25 I
t
p
S
I
S
Figure 14. Diode Reverse Recovery Waveform
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NTP27N06, NTB27N06
2
INFORMATION FOR USING THE D PAK SURFACE MOUNT PACKAGE
RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the
total design. The footprint for the semiconductor packages
must be the correct size to ensure proper solder connection
interface between the board and the package. With the
correct pad geometry, the packages will self align when
subjected to a solder reflow process.
0.33
8.38
0.08
2.032
0.24
0.42
10.66
6.096
0.04
1.016
0.12
3.05
0.63
17.02
inches
mm
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NTP27N06, NTB27N06
SOLDER STENCIL GUIDELINES
Prior to placing surface mount components onto a printed
pattern of the opening in the stencil for the drain pad is not
critical as long as it allows approximately 50% of the pad to
be covered with paste.
circuit board, solder paste must be applied to the pads.
Solder stencils are used to screen the optimum amount.
These stencils are typically 0.008 inches thick and may be
made of brass or stainless steel. For packages such as the
SC–59, SC–70/SOT–323, SOD–123, SOT–23, SOT–143,
SOT–223, SO–8, SO–14, SO–16, and SMB/SMC diode
packages, the stencil opening should be the same as the pad
size or a 1:1 registration. This is not the case with the DPAK
SOLDER PASTE
OPENINGS
2
and D PAK packages. If one uses a 1:1 opening to screen
solder onto the drain pad, misalignment and/or
“tombstoning” may occur due to an excess of solder. For
these two packages, the opening in the stencil for the paste
should be approximately 50% of the tab area. The opening
for the leads is still a 1:1 registration. Figure 15 shows a
STENCIL
Figure 15. Typical Stencil for DPAK and
2
D PAK Packages
2
typical stencil for the DPAK and D PAK packages. The
SOLDERING PRECAUTIONS
The melting temperature of solder is higher than the rated
temperature of the device. When the entire device is heated
to a high temperature, failure to complete soldering within
a short time could result in device failure. Therefore, the
following items should always be observed in order to
minimize the thermal stress to which the devices are
subjected.
• Always preheat the device.
• The delta temperature between the preheat and
soldering should be 100°C or less.*
• When shifting from preheating to soldering, the
maximum temperature gradient shall be 5°C or less.
• After soldering has been completed, the device should
be allowed to cool naturally for at least three minutes.
Gradual cooling should be used as the use of forced
cooling will increase the temperature gradient and
result in latent failure due to mechanical stress.
• Mechanical stress or shock should not be applied
during cooling.
• When preheating and soldering, the temperature of the
leads and the case must not exceed the maximum
temperature ratings as shown on the data sheet. When
using infrared heating with the reflow soldering
method, the difference shall be a maximum of 10°C.
• The soldering temperature and time shall not exceed
260°C for more than 10 seconds.
* Soldering a device without preheating can cause
excessive thermal shock and stress which can result in
damage to the device.
* Due to shadowing and the inability to set the wave height
2
to incorporate other surface mount components, the D PAK
is not recommended for wave soldering.
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NTP27N06, NTB27N06
TYPICAL SOLDER HEATING PROFILE
For any given circuit board, there will be a group of
The line on the graph shows the actual temperature that
might be experienced on the surface of a test board at or
near a central solder joint. The two profiles are based on a
high density and a low density board. The Vitronics
SMD310 convection/infrared reflow soldering system was
used to generate this profile. The type of solder used was
62/36/2 Tin Lead Silver with a melting point between
177–189°C. When this type of furnace is used for solder
reflow work, the circuit boards and solder joints tend to
heat first. The components on the board are then heated by
conduction. The circuit board, because it has a large surface
area, absorbs the thermal energy more efficiently, then
distributes this energy to the components. Because of this
effect, the main body of a component may be up to 30
degrees cooler than the adjacent solder joint.
control settings that will give the desired heat pattern. The
operator must set temperatures for several heating zones,
and a figure for belt speed. Taken together, these control
settings make up a heating “profile” for that particular
circuit board. On machines controlled by a computer, the
computer remembers these profiles from one operating
session to the next. Figure 16 shows a typical heating
profile for use when soldering a surface mount device to a
printed circuit board. This profile will vary among
soldering systems but it is a good starting point. Factors that
can affect the profile include the type of soldering system in
use, density and types of components on the board, type of
solder used, and the type of board or substrate material
being used. This profile shows temperature versus time.
STEP 1
PREHEAT
ZONE 1
“RAMP”
STEP 2
VENT
“SOAK” ZONES 2 & 5
“RAMP”
STEP 3
HEATING
STEP 4
HEATING
ZONES 3 & 6
“SOAK”
STEP 5
HEATING
ZONES 4 & 7
“SPIKE”
STEP 6
VENT
STEP 7
COOLING
205° TO 219°C
PEAK AT
SOLDER
JOINT
170°C
DESIRED CURVE FOR HIGH
MASS ASSEMBLIES
200°C
150°C
100°C
5°C
160°C
150°C
SOLDER IS LIQUID FOR
40 TO 80 SECONDS
(DEPENDING ON
100°C
140°C
MASS OF ASSEMBLY)
DESIRED CURVE FOR LOW
MASS ASSEMBLIES
TIME (3 TO 7 MINUTES TOTAL)
T
MAX
Figure 16. Typical Solder Heating Profile
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9
NTP27N06, NTB27N06
PACKAGE DIMENSIONS
2
D PAK
CASE 418B–03
ISSUE D
C
E
V
–B–
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
4
2. CONTROLLING DIMENSION: INCH.
INCHES
DIM MIN MAX
MILLIMETERS
A
MIN
8.64
9.65
4.06
0.51
1.14
MAX
9.65
10.29
4.83
0.89
1.40
A
B
C
D
E
G
H
J
0.340
0.380
0.160
0.020
0.045
0.380
0.405
0.190
0.035
0.055
S
1
2
3
–T–
SEATING
PLANE
K
0.100 BSC
2.54 BSC
0.080
0.018
0.090
0.575
0.045
0.110
0.025
0.110
0.625
0.055
2.03
0.46
2.79
0.64
J
G
K
S
V
2.29
14.60
1.14
2.79
15.88
1.40
H
D 3 PL
M
M
T B
0.13 (0.005)
STYLE 2:
PIN 1. GATE
2. DRAIN
3. SOURCE
4. DRAIN
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10
NTP27N06, NTB27N06
PACKAGE DIMENSIONS
TO–220
CASE 221A–09
ISSUE AA
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
SEATING
PLANE
–T–
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION Z DEFINES A ZONE WHERE ALL
BODY AND LEAD IRREGULARITIES ARE
ALLOWED.
C
S
B
F
T
4
INCHES
DIM MIN MAX
MILLIMETERS
MIN
14.48
9.66
4.07
0.64
3.61
2.42
2.80
0.46
12.70
1.15
4.83
2.54
2.04
1.15
5.97
0.00
1.15
---
MAX
15.75
10.28
4.82
0.88
3.73
2.66
3.93
0.64
14.27
1.52
5.33
3.04
2.79
1.39
6.47
1.27
---
A
K
Q
Z
A
B
C
D
F
0.570
0.380
0.160
0.025
0.142
0.095
0.110
0.018
0.500
0.045
0.190
0.100
0.080
0.045
0.235
0.000
0.045
---
0.620
0.405
0.190
0.035
0.147
0.105
0.155
0.025
0.562
0.060
0.210
0.120
0.110
0.055
0.255
0.050
---
1
2
3
U
H
G
H
J
K
L
L
R
J
N
Q
R
S
T
V
G
D
U
V
Z
N
0.080
2.04
STYLE 5:
PIN 1. GATE
2. DRAIN
3. SOURCE
4. DRAIN
http://onsemi.com
11
NTP27N06, NTB27N06
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