NST3904MX2T5G [ONSEMI]

200 mA, 40 V, NPN Bipolar Transistor in SOT-883;
NST3904MX2T5G
型号: NST3904MX2T5G
厂家: ONSEMI    ONSEMI
描述:

200 mA, 40 V, NPN Bipolar Transistor in SOT-883

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DATA SHEET  
www.onsemi.com  
COLLECTOR  
General Purpose Transistor  
NPN Silicon  
3
1
BASE  
NST3904MX2  
2
EMITTER  
Features  
These Devices are PbFree, Halogen Free/BFR Free and are RoHS  
3
Compliant  
1
2
MAXIMUM RATINGS  
X2DFN3 (1.0 x 0.6 mm)  
CASE 714AC  
Rating  
Symbol  
Value  
40  
Unit  
Vdc  
CollectorEmitter Voltage  
CollectorBase Voltage  
V
CEO  
V
CBO  
V
EBO  
60  
Vdc  
EmitterBase Voltage  
6.0  
Vdc  
MARKING DIAGRAM  
Collector Current Continuous (Note 1)  
Collector Current Peak (Note 1)  
I
200  
900  
mAdc  
mAdc  
C
AH M  
I
CM  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
AH = Specific Device Code  
M
= Date Code  
THERMAL CHARACTERISTICS  
ORDERING INFORMATION  
Characteristic  
Symbol  
Max  
Unit  
Total Power Dissipation (Note 2)  
P
Device  
NST3904MX2T5G  
Package  
Shipping  
D
@ T = 25°C  
165  
mW  
A
X2DFN3  
(PbFree)  
8000 / Tape &  
Reel  
Derate above 25°C  
1.39  
mW/°C  
Thermal Resistance,  
JunctiontoAmbient (Note 2)  
R
720  
°C/W  
q
JA  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
Total Power Dissipation (Note 3)  
P
D
@ T = 25°C  
590  
4.93  
mW  
mW/°C  
A
Derate above 25°C  
Thermal Resistance,  
JunctiontoAmbient (Note 3)  
R
203  
°C/W  
q
JA  
Junction and Storage Temperature Range  
T , T  
55 to  
+150  
°C  
J
stg  
1. Reference SOA Curve  
2
2
2. Surfacemounted on FR4 board using a 0.6 mm , 2 oz. Cu pad  
3. Surfacemounted on FR4 board using a 100 mm , 2 oz. Cu pad  
© Semiconductor Components Industries, LLC, 2018  
1
Publication Order Number:  
January, 2022 Rev. 1  
NST3904MX/D  
 
NST3904MX2  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)  
A
Characteristic  
Symbol  
Min  
Max  
Unit  
OFF CHARACTERISTICS  
CollectorEmitter Breakdown Voltage (I = 1.0 mAdc, I = 0)  
V
40  
60  
6.0  
Vdc  
Vdc  
C
B
(BR)CEO  
(BR)CBO  
(BR)EBO  
CollectorBase Breakdown Voltage (I = 10 mAdc, I = 0)  
V
V
C
E
EmitterBase Breakdown Voltage (I = 10 mAdc, I = 0)  
Vdc  
E
C
Base Cutoff Current (V = 30 Vdc, V = 3.0 Vdc)  
I
BL  
50  
50  
nAdc  
nAdc  
CE  
EB  
Collector Cutoff Current (V = 30 Vdc, V = 3.0 Vdc)  
I
CEX  
CE  
EB  
ON CHARACTERISTICS (Note 4)  
DC Current Gain  
H
FE  
(I = 0.1 mAdc, V = 1.0 Vdc)  
40  
70  
100  
60  
30  
300  
C
CE  
(I = 1.0 mAdc, V = 1.0 Vdc)  
C
CE  
CE  
CE  
CE  
(I = 10 mAdc, V = 1.0 Vdc)  
C
(I = 50 mAdc, V = 1.0 Vdc)  
C
(I = 100 mAdc, V = 1.0 Vdc)  
C
CollectorEmitter Saturation Voltage  
(I = 10 mAdc, I = 1.0 mAdc)  
V
Vdc  
Vdc  
CE(sat)  
0.2  
0.3  
C
B
(I = 50 mAdc, I = 5.0 mAdc)  
C
B
BaseEmitter Saturation Voltage  
(I = 10 mAdc, I = 1.0 mAdc)  
V
BE(sat)  
0.65  
0.85  
0.95  
C
B
(I = 50 mAdc, I = 5.0 mAdc)  
C
B
SMALLSIGNAL CHARACTERISTICS  
CurrentGain Bandwidth Product (I = 10 mAdc, V = 20 Vdc, f = 100 MHz)  
f
T
250  
MHz  
pF  
C
CE  
Output Capacitance (V = 5.0 Vdc, I = 0, f = 1.0 MHz)  
C
obo  
4.0  
8.0  
10  
CB  
E
Input Capacitance (V = 0.5 Vdc, I = 0, f = 1.0 MHz)  
C
ibo  
pF  
EB  
C
Input Impedance (V = 10 Vdc, I = 1.0 mAdc, f = 1.0 kHz)  
h
1.0  
0.5  
100  
1.0  
kW  
CE  
C
ie  
re  
fe  
4  
Voltage Feedback Ratio (V = 10 Vdc, I = 1.0 mAdc, f = 1.0 kHz)  
h
h
8.0  
400  
40  
X 10  
CE  
C
SmallSignal Current Gain (V = 10 Vdc, I = 1.0 mAdc, f = 1.0 kHz)  
CE  
C
Output Admittance (V = 10 Vdc, I = 1.0 mAdc, f = 1.0 kHz)  
h
oe  
mmhos  
dB  
CE  
C
Noise Figure (V = 5.0 Vdc, I = 100 mAdc, R = 1.0 k ohms, f = 1.0 kHz)  
NF  
5.0  
CE  
C
S
SWITCHING CHARACTERISTICS  
Delay Time  
t
t
35  
35  
d
(V = 3.0 Vdc, V = 0.5 Vdc,  
CC  
BE  
ns  
ns  
I
= 10 mAdc, I = 1.0 mAdc)  
C
B1  
Rise Time  
t
r
Storage Time  
210  
50  
s
(V = 3.0 Vdc,  
CC  
I
= 10 mAdc, I = I = 1.0 mAdc)  
C
B1 B2  
Fall Time  
t
f
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
4. Pulse Test: Pulse Width v 300 ms, Duty Cycle v 2.0%.  
www.onsemi.com  
2
 
NST3904MX2  
TYPICAL CHARACTERISTICS  
Turnon  
Turnoff  
+3V  
+3V  
PW = 20us  
Duty Cycle=<2%  
PW = 300ns  
Duty Cycle=<2%  
RC = 275Ohms  
RC = 275Ohms  
+10.9V  
0V  
+10.9 V  
RB = 10K Ohms  
RB = 10KOhms  
0V  
0.5 V  
Cs<15pF*  
Cs<15pF*  
1N916or  
equivalent  
9.1V  
VCC = 3V, IC = 10mA, IB = 1mA  
Forced HFE= 10  
VCC = 3V, IC = 10mA  
IB1 = 1mA, IB2 = 1mA  
Forced HFE = 10  
* Total shunt capacitance of test jig and conne. ctors  
* Total shunt capacitance of test jig and conne. ctors  
Figure 1. Delay and Rise Time Equivalent Test  
Circuit  
Figure 2. Storage and Fall Time Equivalent  
Test Circuit  
10  
1000  
I /I = 10  
C
B
V
CC  
= 40 V  
C
ibo  
V
CC  
= 20 V  
V
CC  
= 5 V  
C
100  
10  
1
obo  
0.1  
0.1  
1
10  
60  
1
10  
100  
REVERSE BIAS VOLTAGE (V)  
I , COLLECTOR CURRENT (mA)  
C
Figure 3. Capacitance  
Figure 4. TurnOn Time  
1000  
1000  
I /I = 10  
t= t 1/8 x t  
C
B
s
s
= I  
f
I
B1  
B2  
V
CC  
= 40 V  
I /I = 10  
C
B
V
CC  
= 40 V  
V
CC  
= 5 V  
V
CC  
= 20 V  
100  
10  
100  
10  
V
CC  
= 20 V  
V
CC  
= 5 V  
1
10  
100  
1
10  
100  
I , COLLECTOR CURRENT (mA)  
C
I , COLLECTOR CURRENT (mA)  
C
Figure 5. Rise Time  
Figure 6. Storage Time  
www.onsemi.com  
3
NST3904MX2  
TYPICAL CHARACTERISTICS  
1000  
1000  
I
B1  
= I  
B2  
V
CC  
= 1 V  
V
CC  
= 40 V  
T = 150°C  
A
T = 25°C  
A
V
CC  
= 20 V  
T = 55°C  
A
100  
10  
100  
10  
V
CC  
= 5 V  
1
10  
100  
0.1  
1
10  
100  
I , COLLECTOR CURRENT (mA)  
C
I , COLLECTOR CURRENT (mA)  
C
Figure 7. Fall Time  
Figure 8. DC Current Gain  
1000  
1.0  
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
I
= 100 mA  
I
C
= 200 mA  
C
V
CC  
= 10 V  
T = 150°C  
A
T = 25°C  
A
T = 55°C  
A
100  
10  
I
C
= 10 mA  
0.2  
0.1  
0
I
= 1 mA  
C
0.1  
1
10  
100  
0.001  
0.01  
0.1  
1
10  
100  
I , COLLECTOR CURRENT (mA)  
C
I , BASE CURRENT (mA)  
B
Figure 9. DC Current Gain  
Figure 10. Collector Saturation Region  
0.35  
1.2  
1.0  
0.8  
0.6  
0.4  
I /I = 10  
I /I = 10  
T = 25°C  
A
C
B
C
B
0.30  
0.25  
0.20  
0.15  
0.10  
T = 25°C  
A
0.2  
0
0.05  
0
0.001  
0.01  
I , COLLECTOR CURRENT (A)  
0.1  
0.001  
0.01  
I , COLLECTOR CURRENT (A)  
0.1  
C
C
Figure 11. CollectorEmitter Saturation  
Figure 12. BaseEmitter Saturation Voltage vs.  
Voltage vs. Collector Current  
Collector Current  
www.onsemi.com  
4
NST3904MX2  
TYPICAL CHARACTERISTICS  
200  
180  
160  
140  
120  
100  
80  
1000  
I
B
= 5.0 mA  
4.5 mA  
4.0 mA  
3.5 mA  
3.0 mA  
2.5 mA  
2.0 mA  
1.5 mA  
100  
1.0 mA  
0.5 mA  
10  
1
60  
40  
V
CE  
= 2 V  
T = 25°C  
A
20  
0
0
0.5  
1.0  
1.5  
2.0  
2.5  
1
10  
I , COLLECTOR CURRENT (mA)  
100  
V
CE  
, COLLECTOREMITTER VOLTAGE (V)  
C
Figure 13. Collector Current vs.  
Figure 14. Current Gain Bandwidth vs.  
Collector Current  
CollectorEmitter Voltage  
1
1 ms  
Thermal Limit  
10 ms  
100 ms  
1 s  
0.1  
0.01  
0.001  
0.01  
0.1  
1
10  
100  
V
CE  
, COLLECTOREMITTER VOLTAGE (V)  
Figure 15. Safe Operating Area  
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5
NST3904MX2  
PACKAGE DIMENSIONS  
X2DFN3 1.0x0.6, 0.35P  
CASE 714AC  
ISSUE A  
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