NRVTSAF360T3G [ONSEMI]

沟槽肖特基整流器,低正向,60V,3A,SMA-FL 封装;
NRVTSAF360T3G
型号: NRVTSAF360T3G
厂家: ONSEMI    ONSEMI
描述:

沟槽肖特基整流器,低正向,60V,3A,SMA-FL 封装

功效 瞄准线 光电二极管
文件: 总6页 (文件大小:133K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
NRTSAF360, NRVTSAF360  
Trench-based Schottky  
Rectifier  
Features  
Fine Lithography Trench−based Schottky Technology for Very Low  
Forward Voltage and Low Leakage  
www.onsemi.com  
Fast Switching with Exceptional Temperature Stability  
Low Power Loss and Lower Operating Temperature  
Higher Efficiency for Achieving Regulatory Compliance  
High Surge Capability  
NRV Prefix for Automotive and Other Applications Requiring  
Unique Site and Control Change Requirements; AEC−Q101  
Qualified and PPAP Capable  
TRENCH SCHOTTKY  
RECTIFIER  
3.0 AMPERE  
60 VOLTS  
These are Pb−Free and Halide−Free Devices  
Typical Applications  
SMA−FL  
CASE 403AA  
STYLE 6  
Switching Power Supplies including Tablet Adapters, and Flat Panel  
Display  
High Frequency and DC−DC Converters  
Freewheeling and OR−ing diodes  
Reverse Battery Protection  
Instrumentation  
MARKING DIAGRAM  
3M6  
AYWWG  
Automotive LED Lighting  
Mechanical Characteristics:  
Case: Epoxy, Molded  
3M6  
A
Y
WW  
G
= Specific Device Code  
= Assembly Location  
= Year  
= Work Week  
= Pb−Free Package  
Epoxy Meets Flammability Rating UL 94−0 @ 0.125 in.  
Lead Finish: 100% Matte Sn (Tin)  
Lead and Mounting Surface Temperature for Soldering Purposes:  
260°C Max. for 10 Seconds  
Device Meets MSL 1 Requirements  
Weight: 95 mg (Approximately)  
ORDERING INFORMATION  
Device  
Package  
Shipping  
NRTSAF360T3G  
SMA−FL  
(Pb−Free)  
5000 / Tape &  
Reel  
NRVTSAF360T3G  
SMA−FL  
(Pb−Free)  
5000 / Tape &  
Reel  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specification  
Brochure, BRD8011/D.  
© Semiconductor Components Industries, LLC, 2016  
1
Publication Order Number:  
November, 2016 − Rev. 1  
NRTSAF360/D  
NRTSAF360, NRVTSAF360  
MAXIMUM RATINGS  
Rating  
Symbol  
Value  
Unit  
Peak Repetitive Reverse Voltage  
Working Peak Reverse Voltage  
DC Blocking Voltage  
V
60  
V
RRM  
V
RWM  
V
R
Average Rectified Forward Current  
(T = 143°C)  
L
I
A
A
A
O
3.0  
6.0  
Peak Repetitive Forward Current  
I
FRM  
(Rated V , Square Wave, 20 kHz) T = 138°C  
R
L
Non−Repetitive Peak Surge Current  
I
FSM  
(Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz)  
100  
Storage Temperature Range  
T
−65 to +175  
−55 to +175  
°C  
°C  
stg  
Operating Junction Temperature (Note 1)  
T
J
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality  
should not be assumed, damage may occur and reliability may be affected.  
1. The heat generated must be less than the thermal conductivity from Junction−to−Ambient: dP /dT < 1/R .  
q
JA  
D
J
THERMAL CHARACTERISTICS  
Characteristic  
Symbol  
Value  
24.5  
81  
Unit  
°C/W  
°C/W  
Thermal Resistance, Junction−to−Lead (Note 2)  
Y
JCL  
Thermal Resistance, Junction−to−Ambient (Note 2)  
R
q
JA  
2. 1 inch square pad size (1 × 0.5 inch) for each lead on FR4 board.  
ELECTRICAL CHARACTERISTICS  
Rating  
Symbol  
Typ  
Max  
Unit  
V
F
V
Instantaneous Forward Voltage (Note 3)  
0.48  
0.41  
0.57  
0.64  
0.58  
0.78  
(I = 3 A, T = 25°C)  
F
J
(I = 3 A, T = 125°C)  
F
J
(I = 6 A, T = 25°C)  
F
J
Instantaneous Reverse Current (Note 3)  
I
R
(Rated dc Voltage, T = 25°C)  
4.5  
3.5  
50  
15  
mA  
mA  
J
(Rated dc Voltage, T = 125°C)  
J
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
3. Pulse Test: Pulse Width 380 ms, Duty Cycle 2.0%.  
www.onsemi.com  
2
 
NRTSAF360, NRVTSAF360  
TYPICAL CHARACTERISTICS  
100  
10  
100  
10  
T = 175°C  
A
T = 175°C  
A
T = 150°C  
A
T = 150°C  
A
T = 125°C  
A
T = 125°C  
A
T = 85°C  
A
1
1
T = 85°C  
A
T = 25°C  
A
T = 25°C  
A
T = −55°C  
T = −55°C  
A
A
0.1  
0.1  
0
0.1  
0.2  
0.3  
0.4  
0.5  
0.6  
0.7  
0.8  
0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2  
V , INSTANTANEOUS FORWARD VOLTAGE (V)  
F
V , INSTANTANEOUS FORWARD VOLTAGE (V)  
F
Figure 1. Typical Instantaneous Forward  
Characteristics  
Figure 2. Maximum Instantaneous Forward  
Characteristics  
1.E−01  
1.E−02  
1.E−03  
1.E−04  
1.E−05  
1.E+00  
1.E−01  
1.E−02  
1.E−03  
1.E−04  
1.E−05  
1.E−06  
T = 175°C  
T = 175°C  
T = 150°C  
A
A
A
T = 150°C  
A
T = 125°C  
A
T = 125°C  
A
T = 85°C  
A
T = 85°C  
A
T = 25°C  
A
T = 25°C  
A
1.E−06  
1.E−07  
5
10 15 20 25 30 35 40 45 50 55 60  
5
10 15 20 25 30 35 40 45 50 55 60  
V , INSTANTANEOUS REVERSE VOLTAGE (V)  
R
V , INSTANTANEOUS REVERSE VOLTAGE (V)  
R
Figure 3. Typical Reverse Characteristics  
Figure 4. Maximum Reverse Characteristics  
1000  
5
T = 25°C  
J
4.5  
DC  
4
3.5  
Square Wave  
3
2.5  
100  
2
1.5  
1
0.5  
R
= 24.5°C/W  
q
JL  
10  
0
0.1  
1
10  
0
20  
40  
60  
80  
100 120 140 160 175  
V , REVERSE VOLTAGE (V)  
R
T , LEAD TEMPERATURE (°C)  
L
Figure 5. Typical Junction Capacitance  
Figure 6. Current Derating  
www.onsemi.com  
3
NRTSAF360, NRVTSAF360  
TYPICAL CHARACTERISTICS  
6
5
4
3
2
I
/I  
= 20  
I /I = 10  
PK AV  
PK AV  
I
/I = 5  
PK AV  
Square Wave  
DC  
1
0
0
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
3.5  
4.0  
I , AVERAGE FORWARD CURRENT (A)  
F(AV)  
Figure 7. Forward Power Dissipation  
100  
50% Duty Cycle  
10 20%  
10%  
5%  
2%  
1%  
1
0.1  
0.01  
0.001  
Single Pulse  
1E−06  
1E−07  
1E−05  
0.0001  
0.001  
0.01  
0.1  
1
10  
100  
1000  
t, PULSE TIME (S)  
Figure 8. Typical Transient Thermal Response Characteristics, Junction−to−Ambient  
www.onsemi.com  
4
MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
SMAFL  
CASE 403AA  
ISSUE O  
DATE 02 MAR 2011  
SCALE 2:1  
E
E1  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER  
ASME Y14.5M, 1994.  
2. CONTROLLING DIMENSION: MILLIMETERS.  
MILLIMETERS  
DIM MIN  
MAX  
1.10  
1.65  
0.30  
2.80  
5.40  
4.60  
1.10  
D
A
b
c
D
E
0.90  
1.25  
0.15  
2.40  
4.80  
TOP VIEW  
E1 4.00  
0.70  
L
A
RECOMMENDED  
SOLDER FOOTPRINT*  
c
5.56  
SEATING  
PLANE  
C
L
SIDE VIEW  
1.76  
2X b  
1.30  
DIMENSIONS: MILLIMETERS  
2X  
*For additional information on our PbFree strategy and soldering  
details, please download the onsemi Soldering and Mounting  
Techniques Reference Manual, SOLDERRM/D.  
BOTTOM VIEW  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98AON55210E  
SMAFL  
PAGE 1 OF 1  
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TECHNICAL PUBLICATIONS:  
Technical Library: www.onsemi.com/design/resources/technicaldocumentation  
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