概述
数据手册NLV74HC245ADTR2G 概述
Octal 3-State Noninverting Bus Transceiver
NLV74HC245ADTR2G 数据手册
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PDF下载MC74HC245A
Octal 3-State Noninverting
Bus Transceiver
High−Performance Silicon−Gate CMOS
The MC74HC245A is identical in pinout to the LS245. The device
inputs are compatible with standard CMOS outputs; with pull−up
resistors, they are compatible with LSTTL outputs.
http://onsemi.com
The HC245A is a 3−state noninverting transceiver that is used for
2−way asynchronous communication between data buses. The device
has an active−low Output Enable pin, which is used to place the I/O
ports into high−impedance states. The Direction control determines
whether data flows from A to B or from B to A.
SOIC−20
DW SUFFIX
CASE 751D
TSSOP−20
DT SUFFIX
CASE 948E
Features
PIN ASSIGNMENT
• Output Drive Capability: 15 LSTTL Loads
• Outputs Directly Interface to CMOS, NMOS, and TTL
• Operating Voltage Range: 2.0 to 6.0 V
• Low Input Current: 1 mA
• High Noise Immunity Characteristic of CMOS Devices
• In Compliance with the Requirements Defined by JEDEC Standard
No. 7 A
• Chip Complexity: 308 FETs or 77 Equivalent Gates
• NLV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
DIRECTION
20
V
CC
1
2
3
4
5
6
7
8
9
OUTPUT
ENABLE
A1
A2
A3
19
18
17
B1
B2
A4
A5
16
15
14
13
12
11
B3
B4
B5
B6
B7
B8
A6
A7
• These Devices are Pb−Free, Halogen Free and are RoHS Compliant
A8
LOGIC DIAGRAM
GND
10
2
18
17
16
15
14
13
A1
A2
A3
A4
A5
A6
A7
A8
B1
B2
3
4
5
6
7
MARKING DIAGRAMS
B3
B4
20
20
A
DATA
PORT
B
DATA
PORT
HC
B5
B6
B7
B8
HC245A
AWLYYWWG
245A
ALYWG
G
8
9
12
11
1
1
SOIC−20
TSSOP−20
1
A
WL, L
YY, Y
= Assembly Location
= Wafer Lot
= Year
DIRECTION
19
OUTPUT
ENABLE
PIN 10 = GND
PIN 20 = V
WW, W = Work Week
CC
G or G
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
© Semiconductor Components Industries, LLC, 2014
1
Publication Order Number:
November, 2014 − Rev. 16
MC74HC245A/D
MC74HC245A
FUNCTION TABLE
Control Inputs
Output
Enable
Direction
Operation
L
L
H
X
Data Transmitted from Bus B to Bus A
Data Transmitted from Bus A to Bus B
Buses Isolated (High−Impedance State)
L
H
X = don’t care
MAXIMUM RATINGS (Note 1)
Symbol
Parameter
Value
Unit
V
V
CC
DC Supply Voltage
−0.5 to +7.0
V
IN
DC Input Voltage
−0.5 to V + 0.5
V
CC
V
OUT
DC Output Voltage
(Note 2)
−0.5 to V + 0.5
V
CC
I
DC Input Diode Current
DC Output Diode Current
DC Output Sink Current
DC Supply Current per Supply Pin
DC Ground Current per Ground Pin
Storage Temperature Range
20
mA
mA
mA
mA
mA
_C
IK
I
35
35
OK
I
OUT
I
75
CC
I
75
GND
T
−65 to +150
260
STG
T
Lead Temperature, 1 mm from Case for 10 Seconds
Junction Temperature Under Bias
Thermal Resistance
_C
L
T
+150
_C
_C/W
J
q
SOIC
TSSOP
96
128
JA
P
D
Power Dissipation in Still Air at 85_C
SOIC
TSSOP
500
450
mW
MSL
Moisture Sensitivity
Flammability Rating
ESD Withstand Voltage
Level 1
F
R
Oxygen Index: 30% to 35%
UL 94 V−0 @ 0.125 in
V
ESD
Human Body Model (Note 3)
Machine Model (Note 4)
Charged Device Model (Note 5)
u2000
u200
V
u1000
I
Latchup Performance
Above V and Below GND at 85_C (Note 6)
300
mA
LATCHUP
CC
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 20 ounce copper trace with no air flow.
2. I absolute maximum rating must observed.
O
3. Tested to EIA/JESD22−A114−A.
4. Tested to EIA/JESD22−A115−A.
5. Tested to JESD22−C101−A.
6. Tested to EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
2.0
0
Max
Unit
V
V
CC
DC Supply Voltage (Referenced to GND)
6.0
V , V
in out
DC Input Voltage, Output Voltage (Referenced to GND)
Operating Temperature, All Package Types
V
CC
V
T
A
–55
+125
_C
ns
t , t
Input Rise and Fall Time
(Figure 1)
V
CC
V
CC
V
CC
= 2.0 V
= 4.5 V
= 6.0 V
0
0
0
1000
500
400
r
f
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
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2
MC74HC245A
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)
Guaranteed Limit
V
CC
–55 to
V
25_C
Symbol
Parameter
Test Conditions
= V – 0.1 V
|I | v 20 mA
v 85_C v 125_C
Unit
V
IH
Minimum High−Level Input Voltage
V
out
2.0
3.0
4.5
6.0
1.5
2.1
1.5
2.1
1.5
2.1
V
out
CC
3.15
4.2
3.15
4.2
3.15
4.2
V
Maximum Low−Level Input Voltage
V
= 0.1 V
2.0
3.0
4.5
6.0
0.5
0.9
1.35
1.8
0.5
0.9
1.35
1.8
0.5
0.9
1.35
1.8
V
V
IL
out
|I | v 20 mA
out
V
OH
Minimum High−Level Output
Voltage
V
in
= V
IH
2.0
4.5
6.0
1.9
4.4
5.9
1.9
4.4
5.9
1.9
4.4
5.9
|I | v 20 mA
out
V
= V |I | v 2.4 mA
3.0
4.5
6.0
2.48
3.98
5.48
2.34
3.84
5.34
2.2
3.7
5.2
in
IH out
|I | v 6.0 mA
out
|I | v 7.8 mA
out
V
OL
Maximum Low−Level Output
Voltage
V
in
= V
2.0
4.5
6.0
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
V
IL
|I | v 20 mA
out
V
= V |I | v 2.4 mA
3.0
4.5
6.0
0.26
0.26
0.26
0.33
0.33
0.33
0.4
0.4
0.4
in
IL
out
|I | v 6.0 mA
out
|I | v 7.8 mA
out
I
Maximum Input Leakage Current
V
in
= V or GND
6.0
6.0
0.1
0.5
1.0
5.0
1.0
10
mA
mA
in
CC
I
Maximum Three−State Leakage
Current
Output in High−Impedance State
= V or V
OZ
V
in
IL
IH
V
out
= V or GND
CC
I
Maximum Quiescent Supply Cur-
rent (per Package)
V
= V or GND
= 0 mA
6.0
4.0
40
160
mA
CC
in
CC
I
out
AC ELECTRICAL CHARACTERISTICS (C = 50 pF, Input t = t = 6 ns)
L
r
f
Guaranteed Limit
–55 to
V
CC
25_C
V
v 85_C v 125_C
Symbol
Parameter
Unit
t
t
t
,
Maximum Propagation Delay,
A to B, B to A
(Figures 1 and 3)
2.0
3.0
4.5
6.0
75
55
15
13
95
70
19
16
110
80
ns
PLH
t
PHL
22
19
,
Maximum Propagation Delay,
2.0
3.0
4.5
6.0
110
90
22
140
110
28
165
130
33
ns
ns
ns
PLZ
Direction or Output Enable to A or B
(Figures 2 and 4)
t
PHZ
19
24
28
,
Maximum Propagation Delay,
Output Enable to A or B
(Figures 2 and 4)
2.0
3.0
4.5
6.0
110
90
22
140
110
28
165
130
33
PZL
t
PZH
19
24
28
t
,
Maximum Output Transition Time,
Any Output
2.0
3.0
4.5
6.0
60
23
12
10
75
27
15
13
90
32
18
15
TLH
t
THL
(Figures 1 and 3)
C
Maximum Input Capacitance (Pin 1 or Pin 19)
−
−
10
15
10
15
10
15
pF
pF
in
C
Maximum Three−State I/O Capacitance
(I/O in High−Impedance State)
out
Typical @ 25°C, V = 5.0 V
CC
40
C
Power Dissipation Capacitance (Per Transceiver Channel) (Note 7)
pF
PD
2
7. Used to determine the no−load dynamic power consumption: P = C
V
f + I
V
.
D
PD CC
CC CC
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3
MC74HC245A
ORDERING INFORMATION
Device
†
Package
Shipping
MC74HC245ADWG
SOIC−20 WIDE
(Pb−Free)
38 Units / Rail
38 Units / Rail
NLV74HC245ADWG*
MC74HC245ADWR2G
NLV74HC245ADWR2G*
MC74HC245ADTG
SOIC−20 WIDE
(Pb−Free)
SOIC−20 WIDE
(Pb−Free)
1000 Tape & Reel
1000 Tape & Reel
75 Units / Rail
SOIC−20 WIDE
(Pb−Free)
TSSOP−20
(Pb−Free)
NLV74HC245ADTG*
MC74HC245ADTR2G
NLV74HC245ADTR2G*
TSSOP−20
(Pb−Free)
75 Units / Rail
TSSOP−20
(Pb−Free)
2500 Tape & Reel
2500 Tape & Reel
TSSOP−20
(Pb−Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP
Capable.
V
CC
DIRECTION
50%
GND
V
CC
OUTPUT
ENABLE
50%
t
t
f
r
GND
V
CC
INPUT
A OR B
90%
50%
t
t
PLZ
PZL
HIGH
IMPEDANCE
10%
GND
50%
t
t
PHL
PLH
A OR B
A OR B
10%
90%
V
V
OL
90%
50%
10%
OUTPUT
B OR A
t
t
PHZ
PZH
OH
50%
HIGH
IMPEDANCE
t
t
THL
TLH
Figure 1. Switching Waveform
Figure 2. Switching Waveform
TEST POINT
OUTPUT
TEST POINT
CONNECT TO V WHEN
CC
1 kW
OUTPUT
TESTING t
AND t
.
PLZ
PZL
DEVICE
UNDER
TEST
DEVICE
UNDER
TEST
CONNECT TO GND WHEN
TESTING t AND t
.
PZH
PHZ
C *
L
C *
L
*Includes all probe and jig capacitance
*Includes all probe and jig capacitance
Figure 3. Test Circuit
Figure 4. Test Circuit
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4
MC74HC245A
2
3
4
5
6
7
8
9
A1
A2
A3
A4
A5
A6
A7
A8
18
17
16
15
B1
B2
B3
B4
A
B
DATA
PORT
DATA
PORT
14
13
12
11
B5
B6
B7
B8
1
DIRECTION
19
OUTPUT ENABLE
Figure 5. Expanded Logic Diagram
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5
MC74HC245A
PACKAGE DIMENSIONS
TSSOP−20
DT SUFFIX
CASE 948E−02
ISSUE C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION:
MILLIMETER.
20X K REF
K
M
S
S
V
0.10 (0.004)
T U
S
K1
0.15 (0.006) T U
3. DIMENSION A DOES NOT INCLUDE
MOLD FLASH, PROTRUSIONS OR GATE
BURRS. MOLD FLASH OR GATE BURRS
SHALL NOT EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION
SHALL NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
J J1
20
11
2X L/2
B
SECTION N−N
L
−U−
PIN 1
IDENT
0.25 (0.010)
N
1
10
M
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
S
0.15 (0.006) T U
DETERMINED AT DATUM PLANE −W−.
N
A
−V−
MILLIMETERS
INCHES
MIN
F
DIM MIN
MAX
6.60
4.50
1.20
0.15
0.75
MAX
0.260
0.177
0.047
0.006
0.030
A
B
6.40
4.30
---
0.252
0.169
---
DETAIL E
C
D
0.05
0.50
0.002
0.020
−W−
C
F
G
H
0.65 BSC
0.026 BSC
0.27
0.09
0.09
0.19
0.19
0.37
0.20
0.16
0.30
0.25
0.011
0.004
0.004
0.007
0.007
0.015
0.008
0.006
0.012
0.010
G
D
J
H
J1
K
DETAIL E
0.100 (0.004)
−T− SEATING
K1
L
6.40 BSC
0.252 BSC
0
PLANE
M
0
8
8
_
_
_
_
SOLDERING FOOTPRINT*
7.06
1
0.65
PITCH
16X
0.36
16X
1.26
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
6
MC74HC245A
PACKAGE DIMENSIONS
SOIC−20
DW SUFFIX
CASE 751D−05
ISSUE G
NOTES:
D
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
A
q
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
PROTRUSION.
20
11
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION
SHALL BE 0.13 TOTAL IN EXCESS OF B
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
E
B
1
10
MILLIMETERS
DIM MIN
MAX
2.65
0.25
0.49
0.32
12.95
7.60
A
A1
B
C
D
E
2.35
0.10
0.35
0.23
12.65
7.40
20X B
M
S
S
B
T
0.25
A
e
1.27 BSC
H
h
10.05
0.25
0.50
0
10.55
0.75
0.90
7
A
L
q
_
_
SEATING
PLANE
18X e
A1
C
T
ON Semiconductor and the
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries.
SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed
at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation
or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets
and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each
customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended,
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PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5817−1050
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: orderlit@onsemi.com
For additional information, please contact your local
Sales Representative
MC74HC245A/D
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