NLSX5014_18 [ONSEMI]
4-Bit 100 Mb/s Configurable Dual-Supply Level Translator;型号: | NLSX5014_18 |
厂家: | ONSEMI |
描述: | 4-Bit 100 Mb/s Configurable Dual-Supply Level Translator |
文件: | 总14页 (文件大小:172K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
NLSX5014
4-Bit 100 Mb/s Configurable
Dual-Supply Level
Translator
The NLSX5014 is a 4-bit configurable dual-supply autosensing
bidirectional level translator that does not require a direction control
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pin. The I/O V - and I/O V -ports are designed to track two
CC
L
different power supply rails, V and V respectively. Both the V
CC
L
CC
MARKING
DIAGRAMS
and the V supply rails are configurable from 0.9 V to 4.5 V. This
L
allows a logic signal on the V side to be translated to either a higher
L
or a lower logic signal voltage on the V side, and vice-versa.
UQFN12
MU SUFFIX
CASE 523AE
CC
AAMG
The NLSX5014 offers the feature that the values of the V and
CC
G
1
V
L
supplies are independent. Design flexibility is maximized
because V can be set to a value either greater than or less than the
L
M
G
= Date Code
= Pb−Free Package
V
CC
supply. In contrast, the majority of competitive auto sense
translators have a restriction that the value of the V supply must be
L
(Note: Microdot may be in either location)
equal to less than (V - 0.4) V.
CC
The NLSX5014 has high output current capability, which allows the
14
translator to drive high capacitive loads such as most high frequency
SOIC−14
D SUFFIX
CASE 751A
NLSX5014G
AWLYWW
14
EMI filters. Another feature of the NLSX5014 is that each I/O_V and
Ln
1
I/O_V
channel can function as either an input or an output.
CCn
1
An Output Enable (EN) input is available to reduce the power
consumption. The EN pin can be used to disable both I/O ports by
putting them in 3-state which significantly reduces the supply current
14
NLSX
5014
ALYWG
G
TSSOP−14
DT SUFFIX
CASE 948G
from both V and V . The EN signal is referenced to the V supply.
CC
L
L
14
1
Features
1
• Wide V , V Operating Range: 0.9 V to 4.5 V
CC
L
• V and V are independent
A
=
=
=
=
Assembly Location
Wafer Lot
L
CC
WL, L
YY, Y
WW, W
G or G
− V may be greater than, equal to, or less than V
L
CC
Year
Work Week
• High 100 pF Capacitive Drive Capability
• High−Speed with 140 Mb/s Guaranteed Date Rate
= Pb−Free Package
(Note: Microdot may be in either location)
for V , V > 1.8 V
CC
L
• Low Bit−to−Bit Skew
• Overvoltage Tolerant Enable and I/O Pins
• Non−preferential Powerup Sequencing
• Power−Off Protection
• Small packaging: 1.7 mm x 2.0 mm UQFN12, SOIC14, TSSOP14
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
ORDERING INFORMATION
†
Device
Package
Shipping
NLSX5014MUTAG
NLSX5014DR2G
NLSX5014DTR2G
UQFN12 3000/Tape & Reel
(Pb−Free)
SO−14
2500/Tape & Reel
(Pb−Free)
Typical Applications
TSSOP14 2500/Tape & Reel
(Pb−Free)
• Mobile Phones, PDAs, Other Portable Devices
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Important Information
• ESD Protection for All Pins:
♦ HBM (Human Body Model) > 7000 V
©
Semiconductor Components Industries, LLC, 2014
1
Publication Order Number:
April, 2018 − Rev. 8
NLSX5014/D
NLSX5014
P
V
L
V
CC
One−Shot
R1
+1.8V
+3.6V
1k
N
V
L
V
CC
One−Shot
NLSX5014
+1.8 V System
+3.6 V System
I/O V
I/O V
CC
L
P
One−Shot
I/O V 1 I/O V
1
I/O1
I/O1
I/On
L
CC
I/On
GND OE
I/O V n I/O V
n
R2
1k
L
CC
EN
GND
GND
N
One−Shot
Figure 1. Typical Application Circuit
Figure 2. Simplified Functional Diagram (1 I/O Line)
2.5 V
2.5 V
3.0 V
1.8 V
V
L
V
CC
V
L
V
CC
mC
mC
Temperature
Sensor
Temperature
Sensor
NLSX5014
NLSX5014
CE
I/O V 1 I/O V
1
2
3
CE
CE
I/O V 1 I/O V
1
2
3
CE
L
CC
CC
CC
L
CC
CC
CC
I/O V 2 I/O V
I/O V 2 I/O V
SCK
SDO
SCK
SDI
SDO
SCK
SDO
SCK
SDI
SDO
L
L
I/O V 3 I/O V
I/O V 3 I/O V
L
L
SDI
I/O V 4 I/O V
4
SDI
I/O V 4 I/O V
4
L
CC
L
CC
ANO
EN
GND
ANO
EN
GND
Figure 3. Application Example for VL < VCC
Figure 4. Application Example for VL > VCC
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2
NLSX5014
V
1
2
3
4
5
6
7
14
13
12
11
10
9
EN
V
L
I/O V 1
CC
L
EN
12
V
I/O V 2
I/O V
I/O V
1
2
V
L
1
2
3
4
5
11
10
9
L
CC
CC
I/O V 1
I/O V
1
L
CC
I/O V 3
CC
L
I/O V 2
I/O V
I/O V
2
3
L
CC
I/O V 4
I/O V
NC
3
CC
L
I/O V 3
8
L
CC
NC
6
7
I/O V
4
CC
I/O V 4
L
I/O V
4
CC
8
GND
GND
UQFN12
(Top View)
TSSOP/SOIC
(Top View)
Figure 1. Pin Assignments
V
L
V
CC
GND
EN
I/O V 1
I/O V 1
CC
L
I/O V 2
I/O V
I/O V
2
3
L
CC
I/O V 3
L
CC
I/O V 4
I/O V 4
CC
L
Figure 2. Logic Diagram
PIN ASSIGNMENT
Pins
FUNCTION TABLE
Description
EN
L
Operating Mode
Hi−Z
V
CC
L
V
CC
Input Voltage
V
V Input Voltage
L
H
I/O Buses Connected
GND
EN
Ground
Output Enable
I/O V
n
I/O Port, Referenced to V
CC
CC
L
I/O V n
I/O Port, Referenced to V
L
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3
NLSX5014
MAXIMUM RATINGS
Symbol
Parameter
Value
−0.5 to +5.5
−0.5 to +5.5
−0.5 to +5.5
−0.5 to +5.5
−0.5 to +5.5
−50
Condition
Unit
V
V
High−side DC Supply Voltage
Low−side DC Supply Voltage
−Referenced DC Input/Output Voltage
CC
L
V
V
I/O V
I/O V
V
CC
V
CC
V −Referenced DC Input/Output Voltage
L
V
L
V
Enable Control Pin DC Input Voltage
DC Input Diode Current
V
I
I
I
I
I
I
V < GND
mA
mA
mA
mA
mA
°C
IK
I
DC Output Diode Current
−50
V < GND
O
OK
CC
L
DC Supply Current Through V
$100
CC
DC Supply Current Through V
$100
L
DC Ground Current Through Ground Pin
Storage Temperature
$100
GND
T
STG
−65 to +150
ESD Rating
Machine Model
Human Body Model
Charged Device Model
LU Pass
400
7000
2000
100
V
V
V
mA
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
High−side Positive DC Supply Voltage
Min
0.9
Max
4.5
4.5
4.5
Unit
V
V
CC
V
L
Low−side Positive DC Supply Voltage
Enable Control Pin Voltage
0.9
V
V
I
GND
V
V
IO
Bus Input/Output Voltage
I/O V
GND
GND
4.5
4.5
V
CC
L
I/O V
T
Operating Temperature Range
−55
+125
10
°C
A
Dt/DV
Input Transition Rise or Rate
0
ns
V , V from 30% to 70% of V ; V = 3.3 V $ 0.3 V
I
IO
CC CC
Functionaloperation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the
RecommendedOperating Ranges limits may affect device reliability.
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4
NLSX5014
DC ELECTRICAL CHARACTERISTICS
−405C to +855C
−555C to +1255C
Typ
Test Conditions
(Note 1)
V
(V)
V (V)
(Note 3)
CC
L
(Note 4)
(Note 2)
Min
Max
Min
Max
Symbol
Parameter
I/O V Input HIGH Voltage
Unit
V
IHC
0.9 – 4.5 0.9 – 4.5
0.9 – 4.5 0.9 – 4.5
0.9 – 4.5 0.9 – 4.5
0.9 – 4.5 0.9 – 4.5
1.2 – 4.5 1.2 – 4.5
1.2 – 4.5 1.2 – 4.5
2/3 *
CC
−
−
2/3 *
CC
−
V
CC
V
V
V
I/O V Input LOW Voltage
−
−
−
−
−
−
−
−
−
−
−
−
−
1/3 *
−
2/3 * V
−
1/3 *
V
V
ILC
IHL
CC
V
CC
V
CC
V
I/O V Input HIGH Voltage
2/3 *
−
−
1/3 * V
−
L
L
V
L
V
ILL
I/O V Input LOW Voltage
−
1/3 *
V
L
L
V
L
V
IH
Control Pin Input HIGH Volt-
age
T = +25°C
2/3 *
−
2/3 * V
−
V
A
L
V
L
V
IL
Control Pin Input LOW Volt-
age
T = +25°C
A
−
1/3 *
1/3 * V
−
V
L
V
L
V
IH
Control Pin Input HIGH Volt-
age
T = +25°C
A
V
V
< 1.2 V < 1.2
V
L
−
V
L
V
CC
L
V
IL
Control Pin Input LOW Volt-
age
T = +25°C
A
< 1.2 V < 1.2
−
0
−
−
0
V
CC
L
V
OHC
I/O V Output HIGH Volt-
I/O V source
0.9 – 4.5 0.9 – 4.5
0.9 – 4.5 0.9 – 4.5
0.9 – 4.5 0.9 – 4.5
0.9 *
0.9 *
−
V
CC
CC
age
current = 20 mA
V
CC
V
CC
V
I/O V Output LOW Voltage
I/O V sink
−
0.2
−
−
0.2
−
V
OLC
OHL
CC
CC
current = 20 mA
V
I/O V Output HIGH Voltage
I/O V source
0.9 *
0.9 * V
V
L
L
L
current = 20 mA
V
L
V
OLL
I/O V Output LOW Voltage
I/O V sink current 0.9 – 4.5 0.9 – 4.5
−
0.2
1
−
−
0.2
2.5
V
L
L
= 20 mA
I
V
CC
Supply Current
EN = V , I = 0 A, 0.9 – 4.5 0.9 – 4.5
−
mA
QVCC
L O
(I/O V = 0 V or
CC
V
, I/O V = float)
CC
L
or
(I/O V = float, I/O
CC
I
V Supply Current
L
0.9 – 4.5 0.9 – 4.5
0.9 – 4.5 0.9 – 4.5
−
−
−
−
1
−
−
2.5
1.5
mA
mA
QVL
V = 0 V or V )
L
L
I
V
Tristate Output Mode
T = +25°C,
0.5
TS−VCC
CC
A
Supply Current
EN = 0 V
(I/O V = 0 V or
CC
V
, I/O V = float)
CC
L
I
V Tristate Output Mode
0.9 – 4.5 0.9 – 4.5
−
−
−
−
0.5
1
−
−
1.5
1.5
mA
mA
or
TS−VL
L
Supply Current
(I/O V = float, I/O
CC
V = 0 V or V )
L
L
I
I/O Tristate Output Mode
Leakage Current
T = +25°C,
0.9 – 4.5 0.9 – 4.5
0.9 – 4.5 0.9 – 4.5
OZ
A
EN = 0V
I
I
Control Pin Input Current
T = +25°C
A
−
−
−
−
−
−
−
−
1
1
−
−
−
−
1
1.5
1.5
1.5
mA
mA
I
Power Off Leakage Current
I/O V = 0 to 4.5V,
0
0
0
OFF
CC
I/O V = 0 to 4.5 V 0.9 – 4.5
1
L
0
0.9 – 4.5
1
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performancemay not be indicated by the Electrical Characteristics if operated under different conditions.
1. Normal test conditions are V = 0 V, C
≤ 15 pF and C
≤ 15 pF, unless otherwise specified.
CC
I
IOVCC
IOVL
2. V is the supply voltage associated with the I/O V port, and V ranges from +0.9 V to 4.5 V under normal operating conditions.
CC
CC
3. V is the supply voltage associated with the I/O V port, and V ranges from +0.9 V to 4.5 V under normal operating conditions.
L
L
L
4. Typical values are for V = +2.8 V, V = +1.8 V and T = +25°C. All units are production tested at T = +25°C. Limits over the operating
CC
L
A
A
temperaturerange are guaranteed by design.
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5
NLSX5014
TIMING CHARACTERISTICS
−555C to +1255C
Typ
Test Conditions
V
(V)
V (V)
CC
L
(Note 8)
(Note 5)
(Note 6)
0.9 – 4.5
1.8 – 4.5
0.9 – 4.5
1.8 – 4.5
0.9 – 4.5
1.8 – 4.5
0.9 – 4.5
1.8 – 4.5
(Note 7)
0.9 – 4.5
1.8 – 4.5
0.9 – 4.5
1.8 – 4.5
0.9 – 4.5
1.8 – 4.5
0.9 – 4.5
1.8 – 4.5
0.9 – 4.5
Min
−
Max
8.5
3.5
8.5
3.5
8.5
3.5
8.5
3.5
Symbol
Parameter
I/O V Rise Time
Unit
t
C
= 15 pF
= 15 pF
= 15 pF
= 15 pF
−
−
−
−
−
−
−
−
nS
R−VCC
CC
IOVCC
−
t
I/O V Fall Time
C
IOVCC
−
nS
nS
nS
W
F−VCC
CC
−
t
I/O V Rise Time
C
−
R−VL
L
IOVL
−
t
I/O V Fall Time
C
−
F−VL
L
IOVL
−
Z
I/O V One−Shot
(Note 9)
0.9
1.8
4.5
−
−
−
37
20
6.0
−
−
−
OVCC
CC
Output Impedance
Z
OVL
I/O V One−Shot Out-
(Note 9)
0.9
1.8
4.5
0.9 – 4.5
−
−
−
37
20
6.0
−
−
−
W
L
put Impedance
t
Propagation Delay
C
C
C
= 15 pF
0.9 – 4.5
1.8 – 4.5
0.9 – 4.5
1.8 – 4.5
1.0 – 4.5
1.8 – 4.5
1.2 – 4.5
1.8 – 4.5
0.9 – 4.5
1.8 – 4.5
0.9 – 4.5
1.8 – 4.5
1.0 – 4.5
1.8 – 4.5
1.2 – 4.5
1.8 – 4.5
0.9 – 4.5
0.9 – 4.5
1.8 – 4.5
0.9 – 4.5
1.8 – 4.5
1.0 – 4.5
1.8 – 4.5
1.2 – 4.5
1.8 – 4.5
0.9 – 4.5
1.8 – 4.5
0.9 – 4.5
1.8 – 4.5
1.0 – 4.5
1.8 – 4.5
1.2 – 4.5
1.8 – 4.5
0.9 – 4.5
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
35
10
35
10
37
11
nS
PD_VL−VCC
IOVCC
IOVCC
IOVCC
(Driving I/O V
)
CC
= 30 pF
= 50 pF
= 100 pF
= 15 pF
= 30 pF
= 50 pF
= 100 pF
C
IOVCC
40
13
35
10
35
10
37
11
t
Propagation Delay
C
C
C
nS
PD_VCC−VL
IOVL
IOVL
IOVL
(Driving I/O V )
L
C
40
13
0.15
IOVL
t
SK
Channel−to−Channel
Skew
C
IOVCC
= 15 pF, C = 15 pF
IOVL
nS
(Note 9)
I
Input Driver Maximum
Peak Current
EN = V ;
0.9 – 4.5
0.9 – 4.5
−
−
5.0
mA
IN_PEAK
L
I/O_V = 1 MHz Square Wave,
CC
Amplitude = V , or
CC
I/O_V = 1 MHz Square Wave,
L
Amplitude = V (Note 9)
L
5. Normal test conditions are V = 0 V, C
≤ 15 pF and C
≤ 15 pF, unless otherwise specified.
CC
I
IOVCC
IOVL
6. V is the supply voltage associated with the I/O V port, and V ranges from +0.9 V to 4.5 V under normal operating conditions.
CC
CC
7. V is the supply voltage associated with the I/O V port, and V ranges from +0.9 V to 4.5 V under normal operating conditions.
L
L
L
8. Typical values are for V = +2.8 V, V = +1.8 V and T = +25°C. All units are production tested at T = +25°C. Limits over the operating
CC
L
A
A
temperaturerange are guaranteed by design.
9. Guaranteed by design.
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6
NLSX5014
TIMING CHARACTERISTICS (continued)
−555C to +1255C
Typ
Test Conditions
V
(V)
V (V)
(Note 12)
CC
L
(Note 13)
(Note 10)
(Note 11)
Min
Max
Symbol
Parameter
I/O_V Output Enable Time
Unit
t
t
C
= 15 pF,
IOVCC
0.9 – 4.5
0.9 – 4.5
−
−
160
nS
EN−VCC
CC
PZH
I/O_V = V
L
L
t
C
= 15 pF,
IOVCC
0.9 – 4.5
0.9 – 4.5
0.9 – 4.5
0.9 – 4.5
0.9 – 4.5
0.9 – 4.5
0.9 – 4.5
0.9 – 4.5
0.9 – 4.5
0.9 – 4.5
0.9 – 4.5
0.9 – 4.5
0.9 – 4.5
0.9 – 4.5
−
−
−
−
−
−
−
−
−
−
−
−
−
−
130
160
130
210
175
210
175
PZL
I/O_V = 0 V
L
t
I/O_V Output Enable Time
t
C = 15 pF,
IOVL
I/O_V = V
nS
nS
EN−VL
L
PZH
CC
CC
t
C
= 15 pF,
PZL
IOVL
I/O_V = 0 V
CC
t
I/O_V Output Disable Time
t
C = 15 pF,
IOVCC
DIS−VCC
CC
PHZ
I/O_V = V
L
L
t
C
= 15 pF,
IOVCC
PLZ
PHZ
I/O_V = 0 V
L
t
I/O_V Output Disable Time
t
C = 15 pF,
IOVL
I/O_V = V
nS
DIS−VL
L
CC
CC
t
C
= 15 pF,
PLZ
IOVL
I/O_V = 0 V
CC
MDR
Maximum Data Rate
C
C
C
= 15 pF
= 30 pF
= 50 pF
= 100 pF
0.9 – 4.5
1.8 – 4.5
0.9 – 4.5
1.8 – 4.5
1.0 – 4.5
1.8 – 4.5
1.2 – 4.5
1.8 – 4.5
0.9 – 4.5
1.8 – 4.5
0.9 – 4.5
1.8 – 4.5
1.0 – 4.5
1.8 – 4.5
1.2 – 4.5
1.8 – 4.5
50
140
40
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
mbps
IO
IO
IO
120
30
100
20
C
IO
60
10.Normal test conditions are V = 0 V, C
≤ 15 pF and C
≤ 15 pF, unless otherwise specified.
CC
I
IOVCC
IOVL
11. V is the supply voltage associated with the I/O V port, and V ranges from +0.9 V to 4.5 V under normal operating conditions.
CC
CC
12.V is the supply voltage associated with the I/O V port, and V ranges from +0.9 V to 4.5 V under normal operating conditions.
L
L
L
13.Typical values are for V = +2.8 V, V = +1.8 V and T = +25°C. All units are production tested at T = +25°C. Limits over the operating
CC
L
A
A
temperaturerange are guaranteed by design.
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7
NLSX5014
DYNAMIC POWER CONSUMPTION (T = +25°C)
A
Symbol
Parameter
Test Conditions
V
CC
(V)
V (V)
L
Typ
Unit
(Note 14)
0.9
1.5
1.8
1.8
1.8
2.5
2.8
4.5
0.9
1.5
1.8
1.8
1.8
2.5
2.8
4.5
0.9
1.5
1.8
1.8
1.8
2.5
2.8
4.5
0.9
1.5
1.8
1.8
1.8
2.5
2.8
4.5
(Note 15)
4.5
1.8
1.5
1.8
2.8
2.5
1.8
0.9
4.5
1.8
1.5
1.8
2.8
2.5
1.8
0.9
4.5
1.8
1.5
1.8
2.8
2.5
1.8
0.9
4.5
1.8
1.5
1.8
2.8
2.5
1.8
0.9
(Note 16)
C
V = Input port,
CC
C = 0, f = 1 MHz,
Load
39
20
17
14
13
14
13
19
37
30
29
29
29
30
29
19
29
29
29
29
29
30
29
35
21
18
18
14
13
14
13
30
pF
PD_VL
L
V
= Output Port EN = V (outputs enabled)
L
V
= Input port,
C
Load
= 0, f = 1 MHz,
pF
pF
pF
CC
L
V = Output Port EN = V (outputs enabled)
L
C
V = Input port,
CC
C = 0, f = 1 MHz,
Load
PD_VCC
L
V
= Output Port EN = V (outputs enabled)
L
V
= Input port,
C
Load
= 0, f = 1 MHz,
CC
L
V = Output Port EN = V (outputs enabled)
L
14.V
is the supply voltage associated with the I/O VCC port, and VCC ranges from +0.9 V to 4.5 V under normal operating conditions.
CC
15.V is the supply voltage associated with the I/O VL port, and VL ranges from +0.9 V to 4.5 V under normal operating conditions.
L
16.Typical values are at T = +25°C.
A
17.C
and C
are defined as the value of the IC’s equivalent capacitance from which the operating current can be calculated for the
PD VL
PD VCC
V and V power supplies, respectively. I = I (dynamic) + I (static) ≈ I (operating) ≈ C x V x f x N
L
+ I
where I = I
CC CC_VCC
CC
and N
CC
CC
CC
CC
PD
CC
IN
SW
= total number of outputs switching.
CC VL
SW
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8
NLSX5014
STATIC POWER CONSUMPTION (T = +25°C)
A
Symbol
Parameter
Test Conditions
V
CC
(V)
V (V)
L
Typ
Unit
(Note 18)
0.9
1.5
1.8
1.8
1.8
2.5
2.8
4.5
0.9
1.5
1.8
1.8
1.8
2.5
2.8
4.5
0.9
1.5
1.8
1.8
1.8
2.5
2.8
4.5
0.9
1.5
1.8
1.8
1.8
2.5
2.8
4.5
(Note 19)
4.5
1.8
1.5
1.8
2.8
2.5
1.8
0.9
4.5
1.8
1.5
1.8
2.8
2.5
1.8
0.9
4.5
1.8
1.5
1.8
2.8
2.5
1.8
0.9
4.5
1.8
1.5
1.8
2.8
2.5
1.8
0.9
(Note 20)
C
V = Input port,
CC
C = 0, f = 1 MHz,
Load
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
pF
PD_VL
L
V
= Output Port EN = GND (outputs disabled)
V
= Input port,
C
Load
= 0, f = 1 MHz,
pF
pF
pF
CC
L
V = Output Port EN = GND (outputs disabled)
C
V = Input port,
CC
C
Load
= 0, f = 1 MHz,
PD_VCC
L
V
= Output Port EN = GND (outputs disabled)
V
= Input port,
C
Load
= 0, f = 1 MHz,
CC
L
V = Output Port EN = GND (outputs disabled)
18.V
is the supply voltage associated with the I/O VCC port, and VCC ranges from +0.9 V to 4.5 V under normal operating conditions.
CC
19.V is the supply voltage associated with the I/O VL port, and VL ranges from +0.9 V to 4.5 V under normal operating conditions.
L
20.Typical values are at T = +25°C
A
www.onsemi.com
9
NLSX5014
NLSX5014
NLSX5014
V
L
V
CC
V
L
V
CC
EN
EN
I/O V
I/O V
L
I/O V
L
I/O V
CC
CC
Source
C
IOVL
C
IOVCC
Source
t
v
I/O V
t
RISE/FALL
v 3 ns
RISE/FALL
I/O V
CC
L
3 ns
90%
50%
10%
90%
50%
10%
t
t
t
t
PD_VCC−VL
PD_VCC−VL
PD_VL−VCC
PD_VL−VCC
I/O V
I/O V
CC
L
90%
50%
10%
90%
50%
10%
t
t
R−VCC
t
t
R−VL
F−VCC
F−VL
Figure 3. Driving I/O VL Test Circuit and Timing
Figure 4. Driving I/O VCC Test Circuit and Timing
V
CC
2xV
CC
OPEN
R
1
PULSE
GENERATOR
DUT
R
T
C
L
R
L
Test
Switch
t
t
, t
Open
PZH PHZ
, t
2 x V
CC
PZL PLZ
C = 15 pF or equivalent (Includes jig and probe capacitance)
L
R = R = 50 kW or equivalent
L
T
1
OUT
R = Z
of pulse generator (typically 50 W)
Figure 5. Test Circuit for Enable/Disable Time Measurement
t
t
F
V
R
L
50%
EN
V
CC
90%
50%
Input
GND
10%
GND
t
t
PLZ
PZL
t
t
PHL
PLH
HIGH
IMPEDANCE
90%
50%
10%
50%
Output
Output
10%
90%
V
OL
t
t
PHZ
PZH
t
R
t
F
V
OH
50%
Output
HIGH
IMPEDANCE
Figure 6. Timing Definitions for Propagation Delays and Enable/Disable Measurement
www.onsemi.com
10
NLSX5014
IMPORTANT APPLICATIONS INFORMATION
Level Translator Architecture
V pins to a high impedance state. Normal translation
L
The NLSX5014 auto−sense translator provides
bi−directional logic voltage level shifting to transfer data
in multiple supply voltage systems. These level translators
operation occurs when the EN pin is equal to a logic high
signal. The EN pin is referenced to the V supply and has
L
Over−Voltage Tolerant (OVT) protection.
have two supply voltages, V and V , which set the logic
L
CC
Uni−Directional versus Bi−Directional Translation
levels on the input and output sides of the translator. When
used to transfer data from the I/O V to the I/O V ports,
The NLSX5014 translator can function as
a
L
CC
non−inverting uni−directional translator. One advantage of
using the translator as a uni−directional device is that each
I/O pin can be configured as either an input or output. The
configurable input or output feature is especially useful in
applications such as SPI that use multiple uni−directional
I/O lines to send data to and from a device. The flexible I/O
port of the auto sense translator simplifies the trace
connections on the PCB.
input signals referenced to the V supply are translated to
L
output signals with a logic level matched to V . In a
CC
similar manner, the I/O V to I/O V translation shifts
CC
L
input signals with a logic level compatible to V to an
CC
output signal matched to V .
L
The NLSX5014 translator consists of bi−directional
channels that independently determine the direction of the
data flow without requiring a directional pin. One−shot
circuits are used to detect the rising or falling input signals.
In addition, the one−shots decrease the rise and fall times
of the output signal for high−to−low and low−to−high
transitions.
Power Supply Guidelines
The values of the V and V supplies can be set to
L
CC
anywhere between 0.9 and 4.5 V. Design flexibility is
maximized because V may be either greater than or less
L
than the V supply. In contrast, the majority of the
competitive auto sense translators has a restriction that the
CC
Input Driver Requirements
Auto−sense translators such as the NLSX5014 have a
wide bandwidth, but a relatively small DC output current
rating. The high bandwidth of the bi−directional I/O circuit
is used to quickly transform from an input to an output
driver and vice versa. The I/O ports have a modest DC
current output specification so that the output driver can be
over driven when data is sent in the opposite direction. For
proper operation, the input driver to the auto−sense
translator should be capable of driving 2 mA of peak output
current. The bi−directional configuration of the translator
results in both input stages being active for a very short time
period. Although the peak current from the input signal
circuit is relatively large, the average current is small and
consistent with a standard CMOS input stage.
value of the V supply must be equal to less than (V
−
L
CC
0.4) V.
The sequencing of the power supplies will not damage
the device during power−up operation. In addition, the I/O
V
CC
and I/O V pins are in the high impedance state if
L
either supply voltage is equal to 0 V. For optimal
performance, 0.01 to 0.1 mF decoupling capacitors should
be used on the V and V power supply pins. Ceramic
L
CC
capacitors are a good design choice to filter and bypass any
noise signals on the voltage lines to the ground plane of the
PCB. The noise immunity will be maximized by placing
the capacitors as close as possible to the supply and ground
pins, along with minimizing the PCB connection traces.
The NLSX5014 translators have a power down feature
that provides design flexibility. The output ports are
Enable Input (EN)
The NLSX5014 translator has an Enable pin (EN) that
provides tri−state operation at the I/O pins. Driving the
Enable pin to a low logic level minimizes the power
disabled when either power supply is off (V or V = 0 V).
This feature causes all of the I/O pins to be in the power
saving high impedance state.
L
CC
consumption of the device and drives the I/O V and I/O
CC
www.onsemi.com
11
NLSX5014
PACKAGE DIMENSIONS
UQFN12 1.7x2.0, 0.4P
CASE 523AE
ISSUE A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
D
A B
2. CONTROLLING DIMENSION: MILLIMETERS
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND 0.30 MM
FROM TERMINAL TIP.
L1
PIN 1 REFERENCE
4. MOLD FLASH ALLOWED ON TERMINALS
ALONG EDGE OF PACKAGE. FLASH 0.03
MAX ON BOTTOM SURFACE OF
TERMINALS.
5. DETAIL A SHOWS OPTIONAL
CONSTRUCTION FOR TERMINALS.
DETAIL A
E
NOTE 5
0.10
0.10
C
C
2X
2X
MILLIMETERS
TOP VIEW
DIM MIN
MAX
0.55
0.05
A
A1
A3
b
0.45
0.00
0.127 REF
DETAIL B
A
0.15
0.25
0.05
0.05
C
DETAIL B
OPTIONAL
CONSTRUCTION
D
1.70 BSC
2.00 BSC
0.40 BSC
E
e
12X
C
K
0.20
----
0.55
0.03
A1
SEATING
PLANE
C
L
0.45
0.00
0.15 REF
A3
SIDE VIEW
L1
L2
8X
K
5
1
7
DETAIL A
12X L
e
MOUNTING FOOTPRINT
SOLDERMASK DEFINED
2.00
11
12X
b
0.10
1
L2
M
M
C A B
C
BOTTOM VIEW
0.05
NOTE 3
0.40
0.32
PITCH
2.30
11X
0.22
12X
0.69
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
MountingTechniques Reference Manual, SOLDERRM/D.
www.onsemi.com
12
NLSX5014
PACKAGE DIMENSIONS
SOIC−14
D SUFFIX
CASE 751A−03
ISSUE L
NOTES:
D
A
B
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION
SHALL BE 0.13 TOTAL IN EXCESS OF AT
MAXIMUM MATERIAL CONDITION.
4. DIMENSIONS D AND E DO NOT INCLUDE
MOLD PROTRUSIONS.
14
8
7
A3
E
H
5. MAXIMUM MOLD PROTRUSION 0.15 PER
SIDE.
L
DETAIL A
1
MILLIMETERS
DIM MIN MAX
INCHES
MIN MAX
13X b
M
M
B
0.25
A
A1
A3
b
D
E
1.35
0.10
0.19
0.35
8.55
3.80
1.75 0.054 0.068
0.25 0.004 0.010
0.25 0.008 0.010
0.49 0.014 0.019
8.75 0.337 0.344
4.00 0.150 0.157
M
S
S
B
0.25
C A
DETAIL A
h
A
X 45
_
e
H
h
L
1.27 BSC
0.050 BSC
6.20 0.228 0.244
0.50 0.010 0.019
1.25 0.016 0.049
5.80
0.25
0.40
0
0.10
M
A1
e
M
7
0
7
_
_
_
_
SEATING
PLANE
C
SOLDERING FOOTPRINT*
6.50
14X
1.18
1
1.27
PITCH
14X
0.58
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
MountingTechniques Reference Manual, SOLDERRM/D.
www.onsemi.com
13
NLSX5014
PACKAGE DIMENSIONS
TSSOP−14
DT SUFFIX
CASE 948G
ISSUE C
NOTES:
14X K REF
1. DIMENSIONING AND TOLERANCING PER
M
S
S
V
ANSI Y14.5M, 1982.
0.10 (0.004)
T U
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
S
0.15 (0.006) T U
N
0.25 (0.010)
14
8
2X L/2
M
B
L
N
−U−
PIN 1
IDENT.
F
7
1
DETAIL E
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
S
K
0.15 (0.006) T U
A
−V−
K1
MILLIMETERS
DIM MIN MAX
INCHES
MIN MAX
A
B
C
D
F
G
H
J
4.90
4.30
−−−
0.05
0.50
0.65 BSC
0.50
0.09
5.10 0.193 0.200
4.50 0.169 0.177
J J1
1.20
−−− 0.047
0.15 0.002 0.006
0.75 0.020 0.030
SECTION N−N
0.026 BSC
0.60 0.020 0.024
0.20 0.004 0.008
0.16 0.004 0.006
0.30 0.007 0.012
0.25 0.007 0.010
−W−
C
J1 0.09
0.19
K
0.10 (0.004)
K1 0.19
L
M
6.40 BSC
0.252 BSC
SEATING
PLANE
−T−
H
G
DETAIL E
D
0
8
0
8
_
_
_
_
SOLDERING FOOTPRINT
7.06
1
0.65
PITCH
01.34X6
14X
1.26
DIMENSIONS: MILLIMETERS
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