NLSX4014_15 [ONSEMI]

4-Bit 100 Mb/s Configurable Dual-Supply Level Translator;
NLSX4014_15
型号: NLSX4014_15
厂家: ONSEMI    ONSEMI
描述:

4-Bit 100 Mb/s Configurable Dual-Supply Level Translator

文件: 总13页 (文件大小:112K)
中文:  中文翻译
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NLSX4014  
4-Bit 100 Mb/s Configurable  
Dual-Supply Level  
Translator  
The NLSX4014 is a 4−bit configurable dual−supply bidirectional  
level translator without a direction control pin. The I/O V − and I/O  
www.onsemi.com  
MARKING  
CC  
V −ports are designed to track two different power supply rails, V  
L
CC  
and V respectively. The V supply rail is configurable from 1.3 V  
L
CC  
DIAGRAMS  
to 4.5 V while the V supply rail is configurable from 0.9 V to (V  
L
CC  
− 0.4) V. This allows lower voltage logic signals on the V side to be  
L
UQFN12  
MU SUFFIX  
CASE 523AE  
WAMG  
translated into higher voltage logic signals on the V  
side, and  
CC  
G
vice−versa. Both I/O ports are auto−sensing; thus, no direction pin is  
required.  
The Output Enable (EN) input, when Low, disables both I/O ports  
by putting them in 3−state. This significantly reduces the supply  
1
WA = Specific Device Code  
M
G
= Date Code  
= Pb−Free Package  
(Note: Microdot may be in either location)  
currents from both V and V . The EN signal is designed to track  
CC  
L
V .  
L
14  
SOIC−14  
D SUFFIX  
CASE 751A  
Features  
NLSX4014G  
AWLYWW  
14  
Wide High−Side V Operating Range: 1.3 V to 4.5 V  
CC  
1
Wide Low−Side V Operating Range: 0.9 V to (V − 0.4) V  
L
CC  
1
Power Supply Isolation  
All Outputs are in the High Impedance State if Either V or V  
L
CC  
14  
is at Ground  
NLSX  
4014  
ALYWG  
G
TSSOP−14  
DT SUFFIX  
CASE 948G  
14  
High−Speed with 100 Mb/s Guaranteed Date Rate for V > 1.6 V  
Low Bit−to−Bit Skew  
L
1
1
Overvoltage Tolerant Enable and I/O Pins  
Non−preferential Powerup Sequencing  
Small packaging: 1.7 mm x 2.0 mm UQFN12  
NLV Prefix for Automotive and Other Applications Requiring  
Unique Site and Control Change Requirements; AEC−Q100  
Qualified and PPAP Capable  
A
L, WL  
Y, YY  
W, WW  
G or G  
=
=
=
=
Assembly Location  
Wafer Lot  
Year  
Work Week  
= Pb−Free Package  
(Note: Microdot may be in either location)  
These are Pb−Free Devices  
ORDERING INFORMATION  
Typical Applications  
Device  
NLSX4014MUTAG  
Package  
Shipping  
Mobile Phones, PDAs, Other Portable Devices  
UQFN12 3000/Tape & Reel  
(Pb−Free)  
NLVSX4014MUTAG UQFN12 3000/Tape & Reel  
(Pb−Free)  
NLSX4014DR2G  
SO−14  
2500/Tape & Reel  
(Pb−Free)  
NLSX4014DTR2G  
TSSOP14 2500/Tape & Reel  
(Pb−Free)  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specification  
Brochure, BRD8011/D.  
©
Semiconductor Components Industries, LLC, 2015  
1
Publication Order Number:  
December, 2015 − Rev. 5  
NLSX4014/D  
NLSX4014  
V
EN  
1
2
3
4
5
6
7
14  
13  
L
EN  
12  
I/O V 1  
V
CC  
L
V
V
L
1
2
3
4
5
11  
10  
9
CC  
I/O V 1  
I/O V 2  
12 I/O V  
1
CC  
I/O V  
1
CC  
L
L
I/O V 2  
L
I/O V  
I/O V  
2
3
CC  
11  
10  
9
I/O V 3  
I/O V  
I/O V  
2
CC  
3
CC  
L
I/O V 3  
L
8
CC  
I/O V 4  
L
6
7
I/O V  
4
CC  
I/O V 4  
L
NC  
NC  
GND  
(Top View)  
8
GND  
I/O V  
4
CC  
Figure 1. Pin Assignments  
V
L
V
CC  
GND  
EN  
I/O V 1  
I/O V 1  
CC  
L
I/O V 2  
I/O V  
I/O V  
2
3
L
CC  
I/O V 3  
L
CC  
I/O V 4  
I/O V 4  
CC  
L
Figure 2. Logic Diagram  
PIN ASSIGNMENT  
Pins  
FUNCTION TABLE  
Description  
EN  
L
Operating Mode  
V
V
V
Input Voltage  
Hi−Z  
CC  
CC  
V Input Voltage  
L
H
I/O Buses Connected  
L
GND  
EN  
Ground  
Output Enable  
I/O V  
n
I/O Port, Referenced to V  
I/O Port, Referenced to V  
CC  
CC  
I/O V n  
L
L
www.onsemi.com  
2
NLSX4014  
P
V
L
V
CC  
One−Shot  
+1.8V  
+3.6V  
4 kW  
V
L
V
CC  
NLSX4014  
N
+1.8 V System  
+3.6 V System  
I/O1  
One−Shot  
I/O V  
I/O V  
CC  
L
I/O V 1 I/O V  
1
I/O1  
L
CC  
P
I/On  
I/O V n I/O V  
n
I/On  
L
CC  
One−Shot  
GND EN  
EN  
GND  
GND  
4 kW  
N
One−Shot  
Figure 3. Typical Application Circuit  
Figure 4. Simplified Functional Diagram (1 I/O Line)  
(EN = 1)  
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3
NLSX4014  
MAXIMUM RATINGS  
Symbol  
Parameter  
Value  
Condition  
Unit  
V
V
V
V
Supply Voltage  
−0.5 to +5.5  
−0.5 to +5.5  
CC  
CC  
V Supply Voltage  
L
V
L
I/O V  
I/O V  
V
−Referenced DC Input/Output Voltage  
−0.5 to (V + 0.3)  
V
CC  
CC  
CC  
V −Referenced DC Input/Output Voltage  
L
−0.5 to (V + 0.3)  
V
L
L
V
Enable Control Pin DC Input Voltage  
Input Diode Clamp Current  
−0.5 to +5.5  
−50  
V
EN  
I
I
I
I
I
V < GND  
mA  
mA  
mA  
mA  
mA  
°C  
IK  
I
Output Diode Clamp Current  
−50  
V < GND  
O
OK  
CC  
L
DC Supply Current Through V  
$100  
CC  
DC Supply Current Through V  
$100  
L
DC Ground Current Through Ground Pin  
Storage Temperature  
$100  
GND  
T
STG  
−65 to +150  
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality  
should not be assumed, damage may occur and reliability may be affected.  
RECOMMENDED OPERATING CONDITIONS  
Symbol  
Parameter  
Min  
1.3  
Max  
Unit  
V
V
CC  
V
CC  
Supply Voltage  
4.5  
V
L
V Supply Voltage  
L
0.9  
V − 0.4  
CC  
V
V
Enable Control Pin Voltage  
Bus Input/Output Voltage  
GND  
4.5  
V
EN  
V
I/O V  
I/O V  
GND  
GND  
4.5  
4.5  
V
IO  
CC  
L
T
Operating Temperature Range  
Input Transition Rise or Rate  
−40  
0
+85  
10  
°C  
A
DI/DV  
ns  
V , V from 30% to 70% of V ; V = 3.3 V $ 0.3 V  
I
IO  
CC CC  
Functionaloperation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the  
RecommendedOperating Ranges limits may affect device reliability.  
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4
NLSX4014  
DC ELECTRICAL CHARACTERISTICS  
−405C to +855C  
Typ  
Test Conditions  
V
CC  
(V)  
V (V)  
L
(Note 4)  
(Note 1)  
(Note 2)  
(Note 3)  
Min  
Max  
Symbol  
Parameter  
Unit  
V
I/O V Input HIGH  
Voltage  
1.3 to 4.5 0.9 to (V – 0.4)  
0.8 *  
V
IHC  
CC  
CC  
V
CC  
V
V
I/O V Input LOW  
1.3 to 4.5 0.9 to (V – 0.4)  
0.2 *  
V
V
V
V
V
V
V
V
V
ILC  
CC  
CC  
Voltage  
V
CC  
I/O V Input HIGH  
1.3 to 4.5 0.9 to (V – 0.4) 0.8 * V  
0.2 * V  
IHL  
L
CC  
L
Voltage  
V
I/O V Input LOW  
1.3 to 4.5 0.9 to (V – 0.4)  
ILL  
L
CC  
L
Voltage  
V
Control Pin Input HIGH  
Voltage  
T = +25°C  
1.3 to 4.5 0.9 to (V – 0.4) 0.8 * V  
CC  
IH  
A
L
V
Control Pin Input LOW  
Voltage  
T = +25°C  
A
1.3 to 4.5 0.9 to (V – 0.4)  
0.2 * V  
IL  
CC  
L
V
OHC  
I/O V Output HIGH  
I/O V Source Current =  
1.3 to 4.5 0.9 to (V – 0.4)  
0.8 *  
CC  
CC  
CC  
Voltage  
20 mA  
V
CC  
V
I/O V Output LOW  
I/O V Sink Current = 20 mA 1.3 to 4.5 0.9 to (V – 0.4)  
0.2 *  
OLC  
OHL  
CC  
CC  
CC  
Voltage  
V
CC  
V
I/O V Output HIGH  
I/O V Source Current = 20 mA 1.3 to 4.5 0.9 to (V – 0.4) 0.8 * V  
L
L
CC  
L
Voltage  
V
OLL  
I/O V Output LOW  
I/O V Sink Current = 20 mA  
1.3 to 4.5 0.9 to (V – 0.4)  
0.2 * V  
L
L
CC  
L
Voltage  
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performancemay not be indicated by the Electrical Characteristics if operated under different conditions.  
1. Normal test conditions are V = 0 V, C  
= 15 pF and C  
= 15 pF, unless otherwise specified.  
EN  
IOVCC  
IOVL  
2. V is the supply voltage associated with the high voltage port, and V ranges from +1.3 V to 4.5 V under normal operating conditions.  
CC  
CC  
3. V is the supply voltage associated with the low voltage port. V must be less than or equal to (V – 0.4) V during normal operation. However,  
L
L
CC  
during startup and shutdown conditions, V can be greater than (V – 0.4) V.  
L
CC  
4. Typical values are for V = +2.8 V, V = +1.8 V and T = +25°C. All units are production tested at T = +25°C. Limits over the operating  
CC  
L
A
A
temperaturerange are guaranteed by design.  
www.onsemi.com  
5
 
NLSX4014  
POWER CONSUMPTION  
−405C to +855C  
Test Conditions  
V
(V)  
V (V)  
(Note 7)  
CC  
L
(Note 5)  
(Note 6)  
Min  
Typ  
Max  
Symbol  
Parameter  
Unit  
I
Supply Current from EN = V I/O V  
= 0 V, I/O V = 0 V, 1.3 to 3.6 0.9 to (V – 0.4)  
1.0  
2.0  
2.0  
1.0  
mA  
Q−VCC  
L;  
CCn  
Ln  
CC  
V
CC  
I/O V = V or I/O V = V and I = 0  
CCn CC Ln L o  
0
4.1  
4.5  
0
I
Supply Current from EN = V I/O V  
= 0 V, I/O V = 0 V, 1.3 to 3.6 0.9 to (V – 0.4)  
mA  
Q−VL  
L;  
CCn  
Ln  
CC  
V
L
I/O V = V or I/O V = V and I = 0  
CCn CC Ln L o  
< (V – 0.2)  
CC  
EN = V , I/O V  
= 0 V, I/O V = 0 V,  
Ln  
L
CCn  
0
4.1  
0
I/O V  
= V or I/O V = (V  
2.0  
1.0  
CCn  
CC  
Ln  
CC  
0.2 V) and I = 0  
o
4.5  
I
V
Tristate Output  
EN = 0 V  
1.3 to 3.6 0.9 to (V – 0.4)  
mA  
mA  
mA  
TS−VCC  
CC  
CC  
Mode Supply  
Current  
I
V Tristate Output  
EN = 0 V  
EN = 0 V  
EN = 0 V  
EN = 0 V  
1.3 to 3.6 0.9 to (V – 0.4)  
0.2  
2.0  
TS−VL  
L
CC  
Mode Supply  
Current  
V
CC  
− 0.2  
I
I
I/O Tristate Output  
Mode Leakage  
Current  
1.3 to 3.6 0.9 to (V – 0.4)  
0.15  
2.0  
OZ  
EN  
CC  
V
CC  
– 0.2  
Output Enable Pin  
Input Current  
1.3 to 3.6 0.9 to (V – 0.4)  
1.0  
mA  
mA  
CC  
I
V Port  
L
I/O V = 0 to 4.1 V  
0 to 4.5  
0
0
2.0  
2.0  
OFF  
Ln  
V
CC  
Port  
I/O V  
= 0 to 4.5 V  
0 to 4.1  
CCn  
5. Normal test conditions are V = 0 V, C  
= 15 pF and C  
= 15 pF, unless otherwise specified.  
EN  
IOVCC  
IOVL  
6. V is the supply voltage associated with the high voltage port, and V ranges from +1.3 V to 3.6 V.  
CC  
CC  
7. V is the supply voltage associated with the low voltage port. V must be less than or equal to (V – 0.4) V during normal operation. However,  
L
L
CC  
during startup and shutdown conditions, V can be greater than (V – 0.4) V.  
L
CC  
www.onsemi.com  
6
 
NLSX4014  
TIMING CHARACTERISTICS  
−405C to +855C  
Typ  
Test Conditions  
V
CC  
(V)  
V (V)  
L
(Note 11)  
(Note 8)  
(Note 9)  
(Note 10)  
Min  
Max  
Symbol  
Parameter  
I/O V Rise Time  
Unit  
t
C
C
= 15 pF  
= 15 pF  
= 15 pF  
= 15 pF  
1.3 to 4.5 0.9 to (V – 0.4)  
0.7  
2.4  
ns  
R−VCC  
CC  
IOVCC  
CC  
(Output = I/O_V  
)
CC  
t
I/O V Falltime  
1.3 to 4.5 0.9 to (V – 0.4)  
0.5  
1.0  
0.6  
30  
1.0  
3.8  
1.2  
ns  
ns  
ns  
W
F−VCC  
CC  
IOVCC  
CC  
(Output = I/O_V  
)
CC  
t
I/O V Risetime  
C
1.3 to 4.5 0.9 to (V – 0.4)  
CC  
R−VL  
L
IOVL  
(Output = I/O_V )  
L
t
I/O V Falltime  
C
1.3 to 4.5 0.9 to (V – 0.4)  
CC  
F−VL  
L
IOVL  
(Output = I/O_V )  
L
Z
I/O V One−Shot  
1.3 to 4.5 0.9 to (V – 0.4)  
CC  
O−VCC  
CC  
Output Impedance  
Z
O−VL  
I/O V One−Shot  
Output Impedance  
1.3 to 4.5 0.9 to (V – 0.4)  
30  
W
L
CC  
t
t
Propagation Delay  
C
= 15 pF  
= 15 pF  
= 15 pF  
= 15 pF  
1.3 to 4.5 0.9 to (V – 0.4)  
4.5  
9.3  
6.5  
0.3  
0.3  
ns  
PD_VL−VCC  
IOVCC  
CC  
(Output = I/O_V  
,
CC  
t
, t  
)
PHL PLH  
Propagation Delay  
(Output = I/O_V ,  
C
1.3 to 4.5 0.9 to (V – 0.4)  
3.0  
0.2  
0.2  
ns  
nS  
PD_VCC−VL  
IOVL  
CC  
L
t
, t  
)
PHL PLH  
t
Channel−to−Channel  
Skew (Output =  
C
1.3 to 4.5 0.9 to (V – 0.4)  
CC  
SK VL−VCC  
IOVCC  
IOVCC  
I/O_V )  
CC  
t
Channel−to−Channel  
Skew  
C
1.3 to 4.5 0.9 to (V – 0.4)  
nS  
SK_VCC−VL  
CC  
(Output = I/O_V )  
L
MDR  
Maximum Data Rate  
(Output = I/O_V  
,
1.3 to 4.5 0.9 to (V – 0.4)  
110  
140  
Mb/s  
CC  
CC  
C
IOVCC  
= 15 pF)  
(Output = I/O_V ,  
L
> 2.2  
> 1.8  
C
IOVL  
= 15 pF)  
8. Normal test conditions are V = 0 V, C  
= 15 pF and C  
IOVL  
= 15 pF, unless otherwise specified.  
EN  
IOVCC  
9. V is the supply voltage associated with the high voltage port, and V ranges from +1.3 V to 4.5 V under normal operating conditions.  
CC  
CC  
10.V is the supply voltage associated with the low voltage port. V must be less than or equal to (V – 0.4) V during normal operation. However,  
L
L
CC  
during startup and shutdown conditions, V can be greater than (V – 0.4) V.  
L
CC  
11. Typical values are for V = +2.8 V, V = +1.8 V and T = +25°C. All units are production tested at T = +25°C. Limits over the operating  
CC  
L
A
A
temperaturerange are guaranteed by design.  
www.onsemi.com  
7
 
NLSX4014  
ENABLE / DISABLE TIME MEASUREMENTS  
−405C to +855C  
Typ  
Test Conditions  
V
CC  
(V)  
V (V)  
L
(Note 15)  
(Note 12)  
(Note 13)  
(Note 14)  
Min  
Max  
Symbol  
Parameter  
Unit  
t
Turn−On Enable Time (Output =  
C
C
C
C
= 15 pF  
= 15 pF  
= 15 pF  
= 15 pF  
= 15 pF  
= 15 pF  
= 15 pF  
= 15 pF  
1.3 to 4.5 0.9 to (V – 0.4)  
130  
180  
ns  
EN−VCC  
IOVCC  
CC  
I/O_V , t  
)
CC pZH  
Turn−On Enable Time (Output =  
I/O_V , t  
C
IOVL  
1.3 to 4.5 0.9 to (V – 0.4)  
100  
95  
150  
185  
110  
250  
190  
250  
220  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
CC  
)
CC pZL  
t
Turn−On Enable Time (Output =  
I/O_V , t  
1.3 to 4.5 0.9 to (V – 0.4)  
CC  
EN−VL  
IOVCC  
)
pZH  
L
Turn−On Enable Time (Output =  
I/O_V , t  
C
IOVL  
1.3 to 4.5 0.9 to (V – 0.4)  
70  
CC  
)
pZL  
L
t
Turn−Off Disable Time (Output =  
I/O_V , t  
1.3 to 4.5 0.9 to (V – 0.4)  
175  
150  
180  
160  
DIS−VCC  
IOVCC  
CC  
)
CC pHZ  
Propagation Delay (Output =  
I/O_V , t  
C
IOVL  
1.3 to 4.5 0.9 to (V – 0.4)  
CC  
)
CC PLZ  
t
Turn−Off Disable Time (Output =  
I/O_V , t  
1.3 to 4.5 0.9 to (V – 0.4)  
CC  
DIS−VL  
IOVCC  
)
pHZ  
L
Propagation Delay (Output = I/O_V ,  
C
1.3 to 4.5 0.9 to (V – 0.4)  
L
IOVL  
CC  
t
)
PLZ  
12.Normal test conditions are V = 0 V, C  
= 15 pF and C = 15 pF, unless otherwise specified.  
IOVL  
EN  
IOVCC  
13.V is the supply voltage associated with the high voltage port, and V ranges from +1.3 V to 4.5 V under normal operating conditions.  
CC  
CC  
14.V is the supply voltage associated with the low voltage port. V must be less than or equal to (V – 0.4) V during normal operation. However,  
L
L
CC  
during startup and shutdown conditions, V can be greater than (V – 0.4) V.  
L
CC  
15.Typical values are for V = +2.8 V, V = +1.8 V and T = +25 °C. All units are production tested at T = +25 °C. Limits over the operating  
CC  
L
A
A
temperature range are guaranteed by design.  
NLSX4014  
NLSX4014  
V
L
V
CC  
V
L
V
CC  
EN  
EN  
I/O V  
I/O V  
L
I/O V  
L
I/O V  
CC  
CC  
Source  
C
IOVL  
C
IOVCC  
Source  
t
v
I/O V  
t
RISE/FALL  
v 3 ns  
RISE/FALL  
I/O V  
CC  
L
3 ns  
90%  
50%  
10%  
90%  
50%  
10%  
t
L
t
t
t
PD_VCC−VL  
PD_VCC−VL  
PD_VL−VCC  
PD_VL−VCC  
I/O V  
I/O V  
CC  
90%  
50%  
10%  
90%  
50%  
10%  
t
t
R−VCC  
t
t
R−VL  
F−VCC  
F−VL  
Figure 5. Driving I/O VL Test Circuit and Timing  
Figure 6. Driving I/O VCC Test Circuit and Timing  
www.onsemi.com  
8
 
NLSX4014  
V
CC  
2xV  
CC  
OPEN  
R
1
PULSE  
GENERATOR  
DUT  
R
T
C
L
R
L
Test  
Switch  
t
t
, t  
Open  
PZH PHZ  
, t  
2 x V  
CC  
PZL PLZ  
C = 15 pF or equivalent (Includes jig and probe capacitance)  
L
R = R = 50 kW or equivalent  
L
1
OUT  
R = Z  
T
of pulse generator (typically 50 W)  
Figure 7. Test Circuit for Enable/Disable Time Measurement  
t
t
F
V
R
L
50%  
EN  
V
CC  
90%  
50%  
10%  
Input  
GND  
GND  
t
t
PLZ  
PZL  
t
t
PHL  
PLH  
HIGH  
90%  
50%  
IMPEDANCE  
50%  
Output  
Output  
10%  
90%  
V
OL  
10%  
t
t
PHZ  
PZH  
t
t
F
V
OH  
R
50%  
Output  
HIGH  
IMPEDANCE  
Figure 8. Timing Definitions for Propagation Delays and Enable/Disable Measurement  
www.onsemi.com  
9
NLSX4014  
IMPORTANT APPLICATIONS INFORMATION  
Level Translator Architecture  
Uni−Directional versus Bi−Directional Translation  
The NLSX4014 can function as a non−inverting  
uni−directional translator. One advantage of using the  
translator as a uni−directional device is that each I/O pin  
can be configured as either an input or output. The  
configurable input or output feature is especially useful in  
applications such as SPI that use multiple uni−directional  
I/O lines to send data to and from a device. The flexible I/O  
port of the auto sense translator simplifies the trace  
connections on the PCB.  
The NLSX4014 auto sense translator provides  
bi−directional voltage level shifting to transfer data in  
multiple supply voltage systems. This device has two  
supply voltages, V and V , which set the logic levels on  
L
CC  
the input and output sides of the translator. When used to  
transfer data from the V to the V ports, input signals  
L
CC  
referenced to the V supply are translated to output signals  
L
with a logic level matched to V . In a similar manner, the  
CC  
V
CC  
to V translation shifts input signals with a logic level  
L
compatible to V to an output signal matched to V .  
CC  
L
Power Supply Guidelines  
It is recommended that the V supply should be less than  
or equal to the value of the V  
sequencing of the power supplies will not damage the  
device during the power up operation; however, the current  
The NLSX4014 consists of four bi−directional channels  
that independently determine the direction of the data flow  
without requiring a directional pin. The one−shot circuits  
are used to detect the rising or falling input signals. In  
addition, the one shots decrease the rise and fall time of the  
output signal for high−to−low and low−to−high transitions.  
L
minus 0.4 V. The  
CC  
consumption of the device will increase if V exceeds V  
minus 0.4 V. In addition, the I/O V and I/O V pins are  
L
CC  
CC  
L
Input Driver Requirements  
in the high impedance state if either supply voltage is equal  
to 0 V.  
For optimal performance, 0.01 to 0.1 mF decoupling  
For proper operation, the input driver to the auto sense  
translator should be capable of driving 2.0 mA of peak  
output current.  
capacitors should be used on the V and V power supply  
L
CC  
pins. Ceramic capacitors are a good design choice to filter  
and bypass any noise signals on the power supply voltage  
lines to the ground plane of the PCB. The noise immunity  
will be maximized by placing the capacitors as close as  
possible to the supply and ground pins, along with  
minimizing the PCB connection traces.  
Output Load Requirements  
The NLSX4014 is designed to drive CMOS inputs.  
Resistive pullup or pulldown loads of less than 50 kW  
should not be used with this device. The NLSX3373 or  
NLSX3378 open−drain auto sense translators are alternate  
translator options for an application such as the I C bus that  
requires pullup resistors.  
2
The NLSX4014 provides power supply isolation if either  
supply voltage V or V is equal to 0 V. The isolation  
L
CC  
occurs because the I/O pins are in the high impedance state.  
It is recommended that pulldown resistors should be used  
Enable Input (EN)  
The NLSX4014 has an Enable pin (EN) that provides  
tri−state operation at the I/O pins. Driving the Enable pin  
to a low logic level minimizes the power consumption of  
the device and drives the I/O V and I/O V pins to a high  
impedance state. Normal translation operation occurs  
when the EN pin is equal to a logic high signal. The EN pin  
if the V or V are floated or in a high impedance state.  
L
CC  
A pulldown resistor connected from the supply voltage to  
ground ensures that the translator’s supply voltage is equal  
to 0 V.  
CC  
L
is referenced to the V supply and has Over−Voltage  
L
Tolerant (OVT) protection.  
www.onsemi.com  
10  
NLSX4014  
PACKAGE DIMENSIONS  
UQFN12 1.7x2.0, 0.4P  
CASE 523AE  
ISSUE A  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ASME  
Y14.5M, 1994.  
D
A B  
2. CONTROLLING DIMENSION: MILLIMETERS  
3. DIMENSION b APPLIES TO PLATED TERMINAL  
AND IS MEASURED BETWEEN 0.15 AND 0.30 MM  
FROM TERMINAL TIP.  
L1  
PIN 1 REFERENCE  
4. MOLD FLASH ALLOWED ON TERMINALS  
ALONG EDGE OF PACKAGE. FLASH 0.03  
MAX ON BOTTOM SURFACE OF  
TERMINALS.  
5. DETAIL A SHOWS OPTIONAL  
CONSTRUCTION FOR TERMINALS.  
DETAIL A  
E
NOTE 5  
0.10  
0.10  
C
C
2X  
2X  
MILLIMETERS  
TOP VIEW  
DIM MIN  
MAX  
0.55  
0.05  
A
A1  
A3  
b
0.45  
0.00  
0.127 REF  
DETAIL B  
A
0.15  
0.25  
0.05  
0.05  
C
DETAIL B  
OPTIONAL  
CONSTRUCTION  
D
1.70 BSC  
2.00 BSC  
0.40 BSC  
E
e
12X  
C
K
0.20  
----  
0.55  
0.03  
A1  
SEATING  
PLANE  
C
L
0.45  
0.00  
0.15 REF  
A3  
SIDE VIEW  
L1  
L2  
8X  
K
5
1
7
DETAIL A  
12X L  
e
MOUNTING FOOTPRINT  
SOLDERMASK DEFINED  
2.00  
11  
12X  
b
1
L2  
M
M
C
C
A B  
0.10  
0.05  
BOTTOM VIEW  
NOTE 3  
0.40  
0.32  
PITCH  
2.30  
11X  
0.22  
12X  
0.69  
DIMENSIONS: MILLIMETERS  
*For additional information on our Pb−Free strategy and soldering  
details, please download the ON Semiconductor Soldering and  
MountingTechniques Reference Manual, SOLDERRM/D.  
www.onsemi.com  
11  
NLSX4014  
PACKAGE DIMENSIONS  
SOIC−14  
D SUFFIX  
CASE 751A−03  
ISSUE K  
NOTES:  
D
A
B
1. DIMENSIONING AND TOLERANCING PER  
ASME Y14.5M, 1994.  
2. CONTROLLING DIMENSION: MILLIMETERS.  
3. DIMENSION b DOES NOT INCLUDE DAMBAR  
PROTRUSION. ALLOWABLE PROTRUSION  
SHALL BE 0.13 TOTAL IN EXCESS OF AT  
MAXIMUM MATERIAL CONDITION.  
4. DIMENSIONS D AND E DO NOT INCLUDE  
MOLD PROTRUSIONS.  
14  
8
7
A3  
E
H
5. MAXIMUM MOLD PROTRUSION 0.15 PER  
SIDE.  
L
DETAIL A  
1
MILLIMETERS  
DIM MIN MAX  
INCHES  
MIN MAX  
13X b  
M
M
B
0.25  
A
A1  
A3  
b
D
E
1.35  
0.10  
0.19  
0.35  
8.55  
3.80  
1.75 0.054 0.068  
0.25 0.004 0.010  
0.25 0.008 0.010  
0.49 0.014 0.019  
8.75 0.337 0.344  
4.00 0.150 0.157  
M
S
S
B
0.25  
C
A
DETAIL A  
h
A
X 45  
_
e
H
h
L
1.27 BSC  
0.050 BSC  
6.20 0.228 0.244  
0.50 0.010 0.019  
1.25 0.016 0.049  
5.80  
0.25  
0.40  
0
M
A1  
e
M
7
0
7
_
_
_
_
SEATING  
PLANE  
C
SOLDERING FOOTPRINT*  
6.50  
14X  
1.18  
1
1.27  
PITCH  
14X  
0.58  
DIMENSIONS: MILLIMETERS  
*For additional information on our Pb−Free strategy and soldering  
details, please download the ON Semiconductor Soldering and  
MountingTechniques Reference Manual, SOLDERRM/D.  
www.onsemi.com  
12  
NLSX4014  
PACKAGE DIMENSIONS  
TSSOP−14  
DT SUFFIX  
CASE 948G  
ISSUE B  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER  
14X K REF  
M
S
S
V
ANSI Y14.5M, 1982.  
0.10 (0.004)  
T
U
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DIMENSION A DOES NOT INCLUDE MOLD  
FLASH, PROTRUSIONS OR GATE BURRS.  
MOLD FLASH OR GATE BURRS SHALL NOT  
EXCEED 0.15 (0.006) PER SIDE.  
4. DIMENSION B DOES NOT INCLUDE  
INTERLEAD FLASH OR PROTRUSION.  
INTERLEAD FLASH OR PROTRUSION SHALL  
NOT EXCEED 0.25 (0.010) PER SIDE.  
5. DIMENSION K DOES NOT INCLUDE  
DAMBAR PROTRUSION. ALLOWABLE  
DAMBAR PROTRUSION SHALL BE 0.08  
(0.003) TOTAL IN EXCESS OF THE K  
DIMENSION AT MAXIMUM MATERIAL  
CONDITION.  
S
0.15 (0.006) T  
U
N
0.25 (0.010)  
14  
8
2X L/2  
M
B
−U−  
L
N
PIN 1  
IDENT.  
F
7
1
DETAIL E  
6. TERMINAL NUMBERS ARE SHOWN FOR  
REFERENCE ONLY.  
7. DIMENSION A AND B ARE TO BE  
DETERMINED AT DATUM PLANE −W−.  
S
K
0.15 (0.006) T  
U
A
K1  
−V−  
MILLIMETERS  
DIM MIN MAX  
INCHES  
MIN MAX  
A
B
C
D
F
4.90  
4.30  
−−−  
0.05  
0.50  
5.10 0.193 0.200  
4.50 0.169 0.177  
J J1  
1.20  
−−− 0.047  
0.15 0.002 0.006  
0.75 0.020 0.030  
SECTION N−N  
G
H
J
0.65 BSC  
0.50  
0.09  
0.026 BSC  
0.60 0.020 0.024  
0.20 0.004 0.008  
0.16 0.004 0.006  
0.30 0.007 0.012  
0.25 0.007 0.010  
−W−  
C
J1 0.09  
0.19  
K
0.10 (0.004)  
K1 0.19  
L
M
6.40 BSC  
0.252 BSC  
SEATING  
PLANE  
−T−  
H
G
DETAIL E  
D
0
8
0
8
_
_
_
_
SOLDERING FOOTPRINT  
7.06  
1
0.65  
PITCH  
14X  
0.36  
14X  
1.26  
DIMENSIONS: MILLIMETERS  
ON Semiconductor and the  
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries.  
SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed  
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representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product  
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NLSX4014/D  

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