NL17SG07DFT2G [ONSEMI]
Buffer with Open-Drain Output;
| 型号： | NL17SG07DFT2G |
| 厂家： | 
ONSEMI |
| 描述： | Buffer with Open-Drain Output |
| 文件： | 总10页 (文件大小：201K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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Is Now
To learn more about onsemi™, please visit our website at
www.onsemi.com
onsemi andꢀꢀꢀꢀꢀꢀꢀand other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or
subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of onsemi
product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. onsemi reserves the right to make changes at any time to any products or information herein, without
notice. The information herein is provided “as-is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality,
or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all
liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using onsemi products, including compliance with all laws,
regulations and safety requirements or standards, regardless of any support or applications information provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/
or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application
by customer’s technical experts. onsemi does not convey any license under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized
for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for
implantation in the human body. Should Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and holdonsemi and its officers, employees,
subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal Opportunity/Affirmative
Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. Other names and brands may be claimed as the property of others.
Buffer with Open Drain
Output
NL17SG07
The NL17SG07 MiniGatet is an advanced high−speed CMOS
Buffer with Open Drain Output in ultra−small footprint.
The NL17SG07 input structures provides protection when voltages
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up to 5.5 V are applied with V greater than or equal to 0.9 volts,
CC
otherwise the protection is up to 4.6 volts regardless of the supply
voltage.
MARKING
DIAGRAMS
Features
• Wide Operating V Range: 0.9 V to 3.6 V
CC
SOT−953
CASE 527AE
6 M
1
• High Speed: t = 2.5 ns (Typ) at V = 3.0 V, C = 15 pF
PD
CC
L
• Low Power Dissipation: I = 0.5 mA (Max) at T = 25°C
CC
A
UDFN6
1.0 x 1.0
CASE 517BX
• 5.5 V Overvoltage Tolerant (OVT) Input Pins (V ≥ 0.9 V)
• Ultra−Small Packages
J
CC
M
• These are Pb−Free and Halide−Free Devices
UDFN6
1.45 x 1.0
CASE 517AQ
V
M
IN A
GND
NC
1
2
3
NC
IN A
GND
1
2
3
5
V
5
4
V
CC
CC
SC−88A
DF SUFFIX
CASE 419A
AQ M G
G
4
OUT Y
OUT Y
M
= Date Code*
G
= Pb−Free Package
Figure 1. SOT−953
(Top View)
Figure 2. SC−88A
(Note: Microdot may be in either location)
(Top View)
*Date Code orientation and/or position may vary
depending upon manufacturing location.
NC
1
2
3
6
5
4
V
CC
PIN ASSIGNMENT
PIN
SOT−953 SC−88A
UDFN6
NC
IN A
1
2
3
4
5
6
IN A
GND
NC
NC
IN A
NC
IN A
OUT Y
GND
GND
OUT Y
GND
OUT Y
NC
OUT Y
Figure 3. UDFN
V
CC
V
CC
(Top View)
−
−
V
CC
1
IN A
OUT Y
FUNCTION TABLE
Figure 4. Logic Symbol
Input A
Output Y
L
L
Z
H
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
© Semiconductor Components Industries, LLC, 2014
1
Publication Order Number:
February, 2020 − Rev. 7
NL17SG07/D
NL17SG07
MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
V
V
CC
DC Supply Voltage
DC Input Voltage
−0.5 to +5.5
V
IN
V
CC
V
CC
≥ 0.9 V
< 0.9 V
−0.5 to +5.5
−0.5 to +4.6
V
V
OUT
DC Output Voltage
−0.5 to V + 0.5
V
CC
I
DC Input Diode Current
V
< GND
< GND
OUT
−20
mA
mA
mA
mA
mA
°C
IK
IN
I
DC Output Diode Current
V
−20
OK
I
DC Output Source/Sink Current
DC Supply Current per Supply Pin
DC Ground Current per Ground Pin
Storage Temperature Range
20
OUT
I
20
CC
I
20
−65 to +150
260
GND
T
STG
T
Lead Temperature, 1 mm from Case for 10 Seconds
Junction Temperature Under Bias
Moisture Sensitivity
°C
L
T
+150
°C
J
MSL
Level 1
F
R
Flammability Rating
Oxygen Index: 28 to 34
UL 94 V−0 @ 0.125 in
V
ESD
ESD Withstand Voltage
Human Body Model (Note 2)
Machine Model (Note 3)
>2000
>100
V
I
Latch−up Performance above V and below GND at 125°C (Note 4)
75
mA
LATCHUP
CC
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow.
2. Tested to EIA/JESD22−A114−A.
3. Tested to EIA/JESD22−A115−A.
4. Tested to EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol
Characteristics
Min
0.9
0.0
Max
3.6
Unit
V
V
CC
Positive DC Supply Voltage
Digital Input Voltage
Output Voltage
V
IN
3.6
V
V
OUT
Output at High or Low State
0.0
0.0
0.0
V
CC
V
Tri−State Mode (Note 5)
3.6
3.6
Power−Down Mode (V = 0 V)
CC
T
Operating Temperature Range
Input Transition Rise or Fail Rate
−55
+125
10
°C
A
Dt / DV
V
= 3.3 V 0.3 V
0
ns/V
CC
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
5. Applicable to devices with outputs that may be tri−stated.
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2
NL17SG07
DC ELECTRICAL CHARACTERISTICS
T
A
= 255C
Typ
−555C 3 T 3 1255C
A
V
(V)
CC
Min
Max
Min
Max
Symbol
Parameter
Condition
Unit
V
IH
High−Level
Input Voltage
0.9
V
V
CC
CC
0.70 x
0.70 x
1.1 to 1.3
1.4 to 1.6
V
CC
V
CC
0.65 x
0.65 x
V
CC
V
CC
V
0.65 x
CC
0.65 x
CC
1.65 to 1.95
V
V
2.3 to 2.7
3.0 to 3.6
0.9
1.7
2.0
1.7
2.0
V
IL
Low−Level
Input Voltage
GND
GND
0.30 x
0.30 x
1.1 to 1.3
1.4 to 1.6
V
CC
V
CC
0.35 x
0.35 x
V
CC
V
CC
V
V
0.35 x
CC
0.35 x
CC
1.65 to 1.95
V
V
2.3 to 2.7
3.0 to 3.6
0.9
0.7
0.8
0.7
0.8
V
OL
Low−Level
Output Voltage
V
=
0.1
0.1
I
= 20 mA
IN
IH
OL
V
or
I
I
= 0.3 mA
0.25 x
0.25 x
OL
V
IL
1.1 to 1.3
1.4 to 1.6
V
CC
V
CC
= 1.7 mA
0.25 x
0.25 x
OL
V
CC
V
CC
I
I
I
= 3.0 mA
= 4.0 mA
= 8.0 mA
1.65 to 1.95
2.3 to 2.7
3.0 to 3.6
0 to 3.6
0.45
0.4
0.4
0.1
0.45
0.4
0.4
1.0
OL
OL
OL
I
Input Leakage
Current
0 ≤ V ≤ 3.6 V
mA
mA
IN
IN
I
Quiescent
Supply Current
V
IN
= V or GND
3.6
0.5
10
CC
CC
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
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3
NL17SG07
AC ELECTRICAL CHARACTERISTICS (Input t = t = 3.0 ns)
r
f
T
=
A
T
A
= 255C
−555C to +1255C
Min
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
Typ
12
Max
−
Min
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
Max
Symbol
t
Parameter
Test Condition
V
(V)
Unit
CC
Propagation Delay,
Enable Time,
A to Y
C = 10 pF,
0.9
−
ns
PZL
L
R = R = 5 kW
1
L
1.1 to 1.3
1.4 to 1.6
1.65 to 1.95
2.3 to 2.7
3.0 to 3.6
0.9
5.5
4.0
3.3
2.7
2.4
12.5
5.8
4.1
3.4
2.8
2.5
13.2
6.2
4.5
3.5
3.0
2.6
8.0
6.5
5.2
4.9
3.8
3.5
11.1
9.0
7.9
7.6
6.3
6.0
16.2
14
6.8
5.7
3.9
3.3
2.9
−
8.8
7.3
5.9
4.5
3.7
−
C = 15 pF,
ns
ns
ns
ns
ns
L
R = R = 5 kW
1
L
1.1 to 1.3
1.4 to 1.6
1.65 to 1.95
2.3 to 2.7
3.0 to 3.6
0.9
7.0
6.0
4.0
3.4
3.0
−
9.0
7.4
6.2
4.6
3.7
−
C = 30 pF,
L
R = R = 5 kW
1
L
1.1 to 1.3
1.4 to 1.6
1.65 to 1.95
2.3 to 2.7
3.0 to 3.6
0.9
7.4
6.2
4.2
3.6
3.1
−
9.4
7.6
6.4
4.7
3.9
−
t
Propagation Delay,
Disable Time,
A to Y
C = 10 pF,
L
PLZ
R = R = 5 kW
1
L
1.1 to 1.3
1.4 to 1.6
1.65 to 1.95
2.3 to 2.7
3.0 to 3.6
0.9
10.9
7.2
7.0
6.5
6.2
−
11.5
8.3
7.8
7.3
6.8
−
C = 15 pF,
L
R = R = 5 kW
1
L
1.1 to 1.3
1.4 to 1.6
1.65 to 1.95
2.3 to 2.7
3.0 to 3.6
0.9
13.4
10
14
10.8
10.5
10
9.5
7.8
7.2
−
9.3
−
C = 30 pF,
L
R = R = 5 kW
1
L
1.1 to 1.3
1.4 to 1.6
1.65 to 1.95
2.3 to 2.7
3.0 to 3.6
0 to 3.6
18.4
15
20
13
16
12.5
11.2
11
14.5
13.5
13.2
−
15.8
15.4
14.3
−
C
Input Capacitance
3
pF
pF
IN
C
Power Dissipation
Capacitance (Note 6)
PD
0.9 to 3.6
−
4
−
−
−
6. C is defined as the value of the internal equivalent capacitance which is calculated from the dynamic operating current consumption without
PD
load. Average operating current can be obtained by the equation: I
) = C ꢀ V ꢀ f + I . C is used to determine the no−load
CC(OPR
PD CC in CC PD
2
dynamic power consumption; P = C ꢀ V
ꢀ f + I ꢀ V
.
D
PD
CC
in
CC
CC
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4
NL17SG07
V
CC
A
Y
50%
GND
t
t
PLZ
PZL
HIGH
IMPEDANCE
50% V
CC
10% V
CC
Figure 5. Switching Waveform
V
CC
V
2
CC
R
1
PULSE
GENERATOR
GND
DUT
R
T
C
R
L
L
Test
Switch
t
t
V
V
x 2
x 2
PZL
CC
PLZ
CC
Figure 6. Test Circuit
ORDERING INFORMATION
†
Device
NL17SG07P5T5G
Package
Shipping
SOT−953
(Pb−Free)
8000 / Tape & Reel
NL17SG07DFT2G
SC−88A
3000 / Tape & Reel
3000 / Tape & Reel
3000 / Tape & Reel
3000 / Tape & Reel
(Pb−Free)
NL17SG07AMUTCG
NL17SG07CMUTBG*
NL17SG07MU3TBG*
UDFN6 1.45x1 mm
(Pb−Free)
UDFN6 1x1 mm
(Pb−Free)
UDFN6 1x1 mm
(Pb−Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*In Development
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5
NL17SG07
PACKAGE DIMENSIONS
SOT−953
CASE 527AE
ISSUE E
NOTES:
X
Y
D
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
A
2. CONTROLLING DIMENSION: MILLIMETERS
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF THE BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS.
5
4
3
PIN ONE
H
E
INDICATOR
E
1
2
MILLIMETERS
DIM MIN
NOM
0.37
0.15
0.12
1.00
MAX
0.40
0.20
0.17
1.05
0.85
A
b
0.34
0.10
0.07
0.95
0.75
C
TOP VIEW
e
C
D
SIDE VIEW
E
e
0.80
0.35 BSC
HE
L
0.95
1.00
0.175 REF
1.05
5X
L
L2
L3
0.05
−−−
0.10
−−−
0.15
0.15
5X
5X
L3
L2
SOLDERING FOOTPRINT*
5X
0.35
5X
0.20
5X
b
PACKAGE
OUTLINE
0.08 X
Y
BOTTOM VIEW
1.20
1
0.35
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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6
NL17SG07
PACKAGE DIMENSIONS
UDFN6 1.0x1.0, 0.35P
CASE 517BX
ISSUE O
NOTES:
A B
D
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.20 MM FROM TERMINAL TIP.
4. PACKAGE DIMENSIONS EXCLUSIVE OF
BURRS AND MOLD FLASH.
PIN ONE
REFERENCE
E
2X
0.10
C
MILLIMETERS
DIM MIN
MAX
0.55
0.05
A
A1
A3
b
0.45
0.00
0.13 REF
2X
0.10
C
TOP VIEW
0.12
0.22
A3
D
E
e
L
1.00 BSC
1.00 BSC
0.35 BSC
0.05
C
C
A
0.25
0.30
0.35
0.40
L1
0.05
A1
SEATING
RECOMMENDED
C
SIDE VIEW
e
PLANE
SOLDERING FOOTPRINT*
05.4X8
6X
0.22
5X L
3
1
L1
1.18
6
4
6X b
1
0.35
0.53
M
M
0.10
C A B
PITCH
PKG
OUTLINE
NOTE 3
0.05
C
DIMENSIONS: MILLIMETERS
BOTTOM VIEW
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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7
NL17SG07
PACKAGE DIMENSIONS
UDFN6 1.45x1.0, 0.5P
CASE 517AQ
ISSUE O
A
B
D
L
L
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
L1
DETAIL A
PIN ONE
REFERENCE
OPTIONAL
E
MILLIMETERS
CONSTRUCTIONS
DIM MIN
0.45
A1 0.00
MAX
0.55
0.05
A
0.10
C
EXPOSED Cu
MOLD CMPD
A2
b
0.07 REF
0.20
1.45 BSC
TOP VIEW
0.30
0.10
C
D
E
e
1.00 BSC
0.50 BSC
DETAIL B
L
L1
0.30
−−−
0.40
0.15
DETAIL B
OPTIONAL
0.05
0.05
C
C
CONSTRUCTIONS
A
MOUNTING FOOTPRINT
6X
A1
6X
SEATING
PLANE
A2
C
SIDE VIEW
e
0.30
PACKAGE
OUTLINE
6X L
1.24
3
1
DETAIL A
6X
1
0.53
0.50
PITCH
6
4
DIMENSIONS: MILLIMETERS
6X b
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
0.10 C A B
NOTE 3
C
0.05
BOTTOM VIEW
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8
NL17SG07
PACKAGE DIMENSIONS
SC−88A (SC−70−5/SOT−353)
CASE 419A−02
A
ISSUE L
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 419A−01 OBSOLETE. NEW STANDARD
419A−02.
G
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
5
4
3
−B−
S
INCHES
DIM MIN MAX
MILLIMETERS
MIN
1.80
1.15
0.80
0.10
MAX
2.20
1.35
1.10
0.30
1
2
A
B
C
D
G
H
J
0.071
0.045
0.031
0.004
0.087
0.053
0.043
0.012
0.026 BSC
0.65 BSC
M
M
B
D 5 PL
0.2 (0.008)
---
0.004
0.004
0.004
0.010
0.012
---
0.10
0.10
0.10
0.25
0.30
K
N
S
N
0.008 REF
0.20 REF
0.079
0.087
2.00
2.20
J
C
K
H
SOLDER FOOTPRINT*
0.50
0.0197
0.65
0.025
0.65
0.025
0.40
0.0157
1.9
0.0748
mm
inches
ǒ
Ǔ
SCALE 20:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
MiniGate is a trademark of Semiconductor Components Industries, LLC (SCILLC).
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are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
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Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or
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