NJVMJD44H11D3T4G [ONSEMI]

8 A,80 V,NPN 双极功率晶体管;
NJVMJD44H11D3T4G
型号: NJVMJD44H11D3T4G
厂家: ONSEMI    ONSEMI
描述:

8 A,80 V,NPN 双极功率晶体管

开关 晶体管
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中文:  中文翻译
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MJD44H11 (NPN)  
MJD45H11 (PNP)  
Preferred Device  
Complementary Power  
Transistors  
DPAK For Surface Mount Applications  
http://onsemi.com  
Designed for general purpose power and switching such as output or  
driver stages in applications such as switching regulators, converters,  
and power amplifiers.  
SILICON  
POWER TRANSISTORS  
8 AMPERES  
Features  
Pb−Free Packages are Available  
Lead Formed for Surface Mount Application in Plastic Sleeves  
(No Suffix)  
80 VOLTS  
20 WATTS  
Straight Lead Version in Plastic Sleeves (“−1” Suffix)  
Lead Formed Version in 16 mm Tape and Reel for Surface Mount  
(“T4” Suffix)  
MARKING  
DIAGRAMS  
Electrically Similar to Popular D44H/D45H Series  
Low Collector Emitter Saturation Voltage −  
4
YWW  
J4  
xH11  
DPAK  
CASE 369C  
STYLE 1  
V
CE(sat)  
= 1.0 Volt Max @ 8.0 Amperes  
Fast Switching Speeds  
Complementary Pairs Simplifies Designs  
2
1
3
Epoxy Meets UL 94, V−0 @ 0.125 in  
ESD Ratings: Human Body Model, 3B u 8000 V  
Machine Model, C u 400 V  
4
YWW  
J4  
xH11  
DPAK−3  
CASE 369D  
STYLE 1  
MAXIMUM RATINGS  
1
Rating  
Collector−Emitter Voltage  
Emitter−Base Voltage  
Symbol  
Max  
80  
5
Unit  
Vdc  
Vdc  
Adc  
2
3
V
CEO  
V
EB  
Y
= Year  
WW  
x
= Work Week  
= 4 or 5  
I
C
8
16  
Collector Current − Continuous  
Peak  
P
20  
0.16  
W
W/°C  
Total Power Dissipation @ T = 25°C  
D
D
C
Derate above 25°C  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
P
1.75  
0.014  
Total Power Dissipation* @ T = 25°C  
W
W/°C  
A
Derate above 25°C  
dimensions section on page 3 of this data sheet.  
Operating and Storage Junction Temperature  
Range  
T , T  
55 to  
+150  
°C  
J
stg  
Preferred devices are recommended choices for future use  
Maximum ratings are those values beyond which device damage can occur.  
Maximum ratings applied to the device are individual stress limit values (not  
normal operating conditions) and are not valid simultaneously. If these limits  
are exceeded, device functional operation is not implied, damage may occur  
and reliability may be affected.  
and best overall value.  
THERMAL CHARACTERISTICS  
Characteristic  
Symbol  
Max  
Unit  
Thermal Resistance, Junction−to−Case  
Thermal Resistance, Junction−to−Ambient*  
Lead Temperature for Soldering  
R
6.25  
71.4  
260  
°C/W  
°C/W  
°C  
q
q
JC  
JA  
L
R
T
*These ratings are applicable when surface mounted on the minimum pad sizes  
recommended.  
Semiconductor Components Industries, LLC, 2004  
1
Publication Order Number:  
August, 2004 − Rev. 6  
MJD44H11/D  
MJD44H11 (NPN) MJD45H11 (PNP)  
ELECTRICAL CHARACTERISTICS (T = 25_C unless otherwise noted)  
C
Characteristic  
Symbol  
Min  
Typ  
Max  
Unit  
OFF CHARACTERISTICS  
Collector−Emitter Sustaining Voltage  
V
80  
Vdc  
mA  
CEO(sus)  
(I = 30 mA, I = 0)  
C
B
Collector Cutoff Current  
(V = Rated V , V = 0)  
I
10  
50  
CES  
CE  
CEO BE  
Emitter Cutoff Current  
(V = 5 Vdc)  
I
mA  
EBO  
EB  
ON CHARACTERISTICS  
Collector−Emitter Saturation Voltage  
V
V
1
1.5  
Vdc  
Vdc  
CE(sat)  
(I = 8 Adc, I = 0.4 Adc)  
C
B
Base−Emitter Saturation Voltage  
(I = 8 Adc, I = 0.8 Adc)  
BE(sat)  
C
B
DC Current Gain  
h
FE  
60  
40  
(V = 1 Vdc, I = 2 Adc)  
CE  
C
DC Current Gain  
(V = 1 Vdc, I = 4 Adc)  
CE  
C
DYNAMIC CHARACTERISTICS  
Collector Capacitance  
C
pF  
cb  
(V = 10 Vdc, f  
CB  
= 1 MHz)  
MJD44H11  
MJD45H11  
test  
130  
230  
Gain Bandwidth Product  
(I = 0.5 Adc, V = 10 Vdc, f = 20 MHz)  
f
T
MHz  
MJD44H11  
MJD45H11  
C
CE  
50  
40  
SWITCHING TIMES  
Delay and Rise Times  
t + t  
ns  
ns  
ns  
d
r
(I = 5 Adc, I = 0.5 Adc)  
MJD44H11  
MJD45H11  
C
B1  
300  
135  
Storage Time  
t
s
(I = 5 Adc, I = I = 0.5 Adc)  
MJD44H11  
MJD45H11  
C
B1  
B2  
500  
500  
Fall Time  
t
f
(I = 5 Adc, I = I = 0.5 Adc)  
MJD44H11  
MJD45H11  
C
B1  
B2  
140  
100  
http://onsemi.com  
2
MJD44H11 (NPN) MJD45H11 (PNP)  
ORDERING INFORMATION  
Device  
Package Type  
DPAK  
Package  
369C  
Shipping  
MJD44H11  
75 Units / Rail  
75 Units / Rail  
75 Units / Rail  
MJD44H11−001  
MJD44H11G  
DPAK−3  
369D  
DPAK  
369C  
(Pb−Free)  
MJD44H11RL  
MJD44H11T4  
MJD44H11T4G  
DPAK  
DPAK  
369C  
369C  
369C  
1800 Tape & Reel  
2500 Tape & Reel  
2500 Tape & Reel  
DPAK  
(Pb−Free)  
MJD44H11T5  
MJD45H11  
DPAK  
DPAK  
369C  
369C  
369D  
369C  
2500 Tape & Reel  
75 Units / Rail  
75 Units / Rail  
75 Units / Rail  
MJD45H11−001  
MJD45H11G  
DPAK−3  
DPAK  
(Pb−Free)  
MJD45H11RL  
MJD45H11T4  
MJD45H11T4G  
DPAK  
DPAK  
369C  
369C  
369C  
1800 Tape & Reel  
2500 Tape & Reel  
2500 Tape & Reel  
DPAK  
(Pb−Free)  
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging  
Specifications Brochure, BRD8011/D.  
http://onsemi.com  
3
MJD44H11 (NPN) MJD45H11 (PNP)  
1
0.7  
0.5  
D = 0.5  
0.3  
0.2  
0.2  
0.1  
P
(pk)  
R
R
= r(t) R  
q
JC  
q
JC(t)  
= 6.25°C/W MAX  
q
JC  
0.1  
0.07  
0.05  
0.05  
0.02  
D CURVES APPLY FOR POWER  
PULSE TRAIN SHOWN  
t
1
READ TIME AT t  
1
t
2
0.01  
T
− T = P q  
C (pk) JC(t)  
J(pk)  
0.03  
0.02  
DUTY CYCLE, D = t /t  
1 2  
SINGLE PULSE  
0.01  
0.01  
0.02 0.03 0.05  
0.1  
0.2 0.3 0.5  
1
2
3
5
10  
20 30  
50  
100  
200 300 500  
1 k  
t, TIME (ms)  
Figure 1. Thermal Response  
20  
There are two limitations on the power handling ability of  
a transistor: average junction temperature and second  
100ꢀms  
10  
5
500ꢀms  
breakdown. Safe operating area curves indicate I − V  
C
CE  
1ꢀms  
limits of the transistor that must be observed for reliable  
operation; i.e., the transistor must not be subjected to greater  
dissipation than the curves indicate.  
3
2
5ꢀms  
dc  
1
The data of Figure 2 is based on T  
variable depending on conditions. Second breakdown pulse  
= 150_C; T is  
J(pk)  
C
0.5  
0.3  
THERMAL LIMIT @ T = 25°C  
WIRE BOND LIMIT  
C
limits are valid for duty cycles to 10% provided T  
J(pk)  
v 150_C.  
T
may be calculated from the data in  
0.1  
J(pk)  
Figure 1. At high case temperatures, thermal limitations will  
reduce the power that can be handled to values less than the  
limitations imposed by second breakdown.  
0.05  
0.02  
1
3
5
7
10  
20 30  
50 70 100  
V
CE  
, COLLECTOR−EMITTER VOLTAGE (VOLTS)  
Figure 2. Maximum Forward Bias  
Safe Operating Area  
T
A
T
C
2.5 25  
2
20  
T
C
1.5 15  
T
1
0.5  
0
10  
5
A
SURFACE  
MOUNT  
0
25  
50  
75  
100  
125  
150  
T, TEMPERATURE (°C)  
Figure 3. Power Derating  
http://onsemi.com  
4
 
MJD44H11 (NPN) MJD45H11 (PNP)  
1000  
100  
10  
1000  
V
CE  
= 4 V  
1 V  
V
= 4 V  
CE  
100  
V
CE  
= 1 V  
T = 25°C  
J
T = 25°C  
J
10  
0.1  
0.1  
1
10  
1
10  
I , COLLECTOR CURRENT (AMPS)  
C
I , COLLECTOR CURRENT (AMPS)  
C
Figure 4. MJD44H11 DC Current Gain  
Figure 5. MJD45H11 DC Current Gain  
1000  
1000  
100  
10  
T = 125°C  
J
25°C  
T = 125°C  
J
−ꢁ40°C  
25°C  
100  
−ꢁ40°C  
V
CE  
= 1 V  
V
CE  
= 1 V  
10  
0.1  
1
10  
0.1  
1
10  
I , COLLECTOR CURRENT (AMPS)  
C
I , COLLECTOR CURRENT (AMPS)  
C
Figure 6. MJD44H11 Current Gain  
versus Temperature  
Figure 7. MJD45H11 Current Gain  
versus Temperature  
1.2  
1
1.2  
1
V
V
BE(sat)  
BE(sat)  
0.8  
0.6  
0.4  
0.2  
0
0.8  
0.6  
0.4  
0.2  
0
I /I = 10  
C B  
I /I = 10  
C B  
T = 25°C  
J
T = 25°C  
J
V
CE(sat)  
10  
V
CE(sat)  
0.1  
1
10  
0.1  
1
I , COLLECTOR CURRENT (AMPS)  
C
I , COLLECTOR CURRENT (AMPS)  
C
Figure 8. MJD44H11 On−Voltages  
Figure 9. MJD45H11 On−Voltages  
http://onsemi.com  
5
MJD44H11 (NPN) MJD45H11 (PNP)  
PACKAGE DIMENSIONS  
DPAK  
CASE 369C  
ISSUE O  
NOTES:  
SEATING  
PLANE  
−T−  
1. DIMENSIONING AND TOLERANCING  
PER ANSI Y14.5M, 1982.  
C
2. CONTROLLING DIMENSION: INCH.  
B
R
INCHES  
DIM MIN MAX  
MILLIMETERS  
E
V
MIN  
5.97  
6.35  
2.19  
0.69  
0.46  
0.94  
MAX  
6.22  
6.73  
2.38  
0.88  
0.58  
1.14  
A
B
C
D
E
F
G
H
J
0.235 0.245  
0.250 0.265  
0.086 0.094  
0.027 0.035  
0.018 0.023  
0.037 0.045  
0.180 BSC  
0.034 0.040  
0.018 0.023  
0.102 0.114  
0.090 BSC  
4
2
Z
A
K
S
1
3
4.58 BSC  
U
0.87  
0.46  
2.60  
1.01  
0.58  
2.89  
K
L
2.29 BSC  
F
J
R
S
U
V
Z
0.180 0.215  
0.025 0.040  
4.57  
0.63  
0.51  
0.89  
3.93  
5.45  
1.01  
−−−  
1.27  
−−−  
L
H
0.020  
0.035 0.050  
0.155 −−−  
−−−  
D 2 PL  
M
G
0.13 (0.005)  
T
STYLE 1:  
PIN 1. BASE  
2. COLLECTOR  
3. EMITTER  
4. COLLECTOR  
SOLDERING FOOTPRINT*  
6.20  
3.0  
0.244  
0.118  
2.58  
0.101  
5.80  
0.228  
1.6  
0.063  
6.172  
0.243  
mm  
inches  
ǒ
Ǔ
SCALE 3:1  
*For additional information on our Pb−Free strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
http://onsemi.com  
6
MJD44H11 (NPN) MJD45H11 (PNP)  
PACKAGE DIMENSIONS  
DPAK−3  
CASE 369D−01  
ISSUE B  
NOTES:  
C
B
R
1. DIMENSIONING AND TOLERANCING PER  
ANSI Y14.5M, 1982.  
2. CONTROLLING DIMENSION: INCH.  
V
S
E
INCHES  
DIM MIN MAX  
MILLIMETERS  
MIN  
5.97  
6.35  
2.19  
0.69  
0.46  
0.94  
MAX  
6.35  
6.73  
2.38  
0.88  
0.58  
1.14  
4
2
Z
A
B
C
D
E
F
G
H
J
K
R
S
V
Z
0.235 0.245  
0.250 0.265  
0.086 0.094  
0.027 0.035  
0.018 0.023  
0.037 0.045  
0.090 BSC  
0.034 0.040  
0.018 0.023  
0.350 0.380  
0.180 0.215  
0.025 0.040  
0.035 0.050  
A
K
1
3
−T−  
SEATING  
PLANE  
2.29 BSC  
0.87  
0.46  
8.89  
4.45  
0.63  
0.89  
3.93  
1.01  
0.58  
9.65  
5.45  
1.01  
1.27  
−−−  
J
F
H
0.155  
−−−  
D 3 PL  
STYLE 1:  
PIN 1. BASE  
G
M
T
0.13 (0.005)  
2. COLLECTOR  
3. EMITTER  
4. COLLECTOR  
http://onsemi.com  
7
MJD44H11 (NPN) MJD45H11 (PNP)  
ON Semiconductor and  
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice  
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All  
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights  
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications  
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should  
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,  
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death  
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal  
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.  
PUBLICATION ORDERING INFORMATION  
LITERATURE FULFILLMENT:  
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USA/Canada  
ON Semiconductor Website: http://onsemi.com  
Order Literature: http://www.onsemi.com/litorder  
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Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada  
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2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051  
Phone: 81−3−5773−3850  
For additional information, please contact your  
local Sales Representative.  
MJD44H11/D  

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