NDT451AN [ONSEMI]

N 沟道增强型场效应晶体管,30V,7.2A,35mΩ;
NDT451AN
型号: NDT451AN
厂家: ONSEMI    ONSEMI
描述:

N 沟道增强型场效应晶体管,30V,7.2A,35mΩ

PC 开关 脉冲 光电二极管 晶体管 场效应晶体管
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NDT451AN  
N-Channel Enhancement Mode Field Effect Transistor  
General Description  
Features  
Power SOT N-Channel enhancement mode power field  
7.2A, 30V. RDS(ON) = 0.035W @ VGS = 10V  
effect  
transistors  
are  
produced  
using  
ON  
RDS(ON) = 0.05W @ VGS = 4.5V.  
Semiconductor's  
proprietary, high cell density, DMOS  
technology. This very high density process is especially  
tailored to minimize on-state resistance and provide  
superior switching performance. These devices are  
particularly suited for low voltage applications such as DC  
motor control and DC/DC conversion where fast switching,  
low in-line power loss, and resistance to transients are  
needed.  
High density cell design for extremely low RDS(ON)  
.
High power and current handling capability in a widely used  
surface mount package.  
________________________________________________________________________________  
D
D
S
G
Absolute Maximum Ratings  
TA= 25°C unless otherwise noted  
Symbol Parameter  
NDT451AN  
30  
Units  
Drain-Source Voltage  
Gate-Source Voltage  
Drain Current - Continuous  
- Pulsed  
V
V
A
VDSS  
VGSS  
ID  
± 20  
(Note 1a)  
± 7.2  
± 25  
PD  
Maximum Power Dissipation  
(Note 1a)  
(Note 1b)  
(Note 1c)  
3
1.3  
W
1.1  
Operating and Storage Temperature Range  
-65 to 150  
°C  
TJ,TSTG  
THERMAL CHARACTERISTICS  
Thermal Resistance, Junction-to-Ambient  
(Note 1a)  
(Note 1)  
42  
12  
°C/W  
°C/W  
R
JA  
q
Thermal Resistance, Junction-to-Case  
R
JC  
q
Publication Order Number:  
@ 2009 Semiconductor Components Industries, LLC.  
September-2017, Rev. 4  
NDT451AN/D  
Electrical Characteristics (TA = 25°C unless otherwise noted)  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Units  
OFF CHARACTERISTICS  
BVDSS  
IDSS  
Drain-Source Breakdown Voltage  
VGS = 0 V, ID = 250 µA  
VDS = 24 V, VGS = 0 V  
30  
V
Zero Gate Voltage Drain Current  
1
µA  
µA  
nA  
nA  
10  
TJ = 55°C  
IGSSF  
IGSSR  
Gate - Body Leakage, Forward  
Gate - Body Leakage, Reverse  
VGS = 20 V, VDS = 0 V  
VGS = -20 V, VDS= 0 V  
100  
-100  
ON CHARACTERISTICS (Note 2)  
VGS(th)  
Gate Threshold Voltage  
VDS = VGS, ID = 250 µA  
VGS = 10 V, ID = 7.2 A  
VGS = 4.5 V, ID = 6.0 A  
1
1.6  
1.2  
3
V
TJ = 125°C  
TJ = 125°C  
TJ = 125°C  
0.7  
2.2  
Static Drain-Source On-Resistance  
0.03  
0.035  
RDS(ON)  
W
0.042 0.063  
0.042  
0.058  
0.05  
0.09  
On-State Drain Current  
25  
15  
A
S
ID(on)  
VGS = 10 V, VDS = 5 V  
VGS = 4.5 V, VDS = 5 V  
VDS = 10 V, ID = 7.2 A  
Forward Transconductance  
11  
gFS  
DYNAMIC CHARACTERISTICS  
Input Capacitance  
720  
370  
250  
pF  
pF  
pF  
Ciss  
Coss  
Crss  
VDS = 15 V, VGS = 0 V,  
f = 1.0 MHz  
Output Capacitance  
Reverse Transfer Capacitance  
SWITCHING CHARACTERISTICS (Note 2)  
tD(on)  
tr  
tD(off)  
tf  
Turn - On Delay Time  
Turn - On Rise Time  
Turn - Off Delay Time  
Turn - Off Fall Time  
Total Gate Charge  
VDD = 10 V, ID = 1 A,  
12  
13  
29  
10  
19  
2.3  
5.5  
20  
30  
50  
20  
30  
ns  
ns  
VGEN = 10 V, RGEN = 6 W  
ns  
ns  
Qg  
Qgs  
Qgd  
VDS = 10 V,  
ID = 7.2 A, VGS = 10 V  
nC  
nC  
nC  
Gate-Source Charge  
Gate-Drain Charge  
www.onsemi.com  
2
Electrical Characteristics (TA = 25°C unless otherwise noted)  
Symbol Parameter Conditions  
DRAIN-SOURCE DIODE CHARACTERISTICS AND MAXIMUM RATINGS  
Min  
Typ  
Max  
Units  
IS  
Maximum Continuous Drain-Source Diode Forward Current  
2.3  
1.3  
A
V
Drain-Source Diode Forward Voltage  
Reverse Recovery Time  
0.9  
VSD  
VGS = 0 V, IS = 7.2A (Note 2)  
trr  
VGS = 0 V, IF = 1.25 A, dIF/dt = 100 A/µs  
100  
ns  
Notes:  
1. RqJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. RqJC is guaranteed by  
design while RqCA is determined by the user's board design.  
T - T  
T - T  
J
A
J
A
PD  
=
=
(t)  
R
qJ  
= I2 (t) ´ RDS  
( )  
t
(
)
T
J
ON  
D
R
+R (t)  
C qCA  
qJ  
A
Typical RqJA using the board layouts shown below on 4.5"x5" FR-4 PCB in a still air environment:  
a. 42oC/W when mounted on a 1 in2 pad of 2oz copper.  
b. 95oC/W when mounted on a 0.066 in2 pad of 2oz copper.  
c. 110oC/W when mounted on a 0.0123 in2 pad of 2oz copper.  
1b  
1c  
1a  
Scale 1 : 1 on letter size paper  
2. Pulse Test: Pulse Width < 300µs, Duty Cycle < 2.0%.  
www.onsemi.com  
3
Typical Electrical Characteristics  
25  
3
2.5  
2
VGS =10V  
6.0  
5.0  
VGS = 3.0V  
4.5  
20  
3.5  
4.0  
4.0  
15  
10  
5
3.5  
4.5  
1.5  
1
5.0  
6.0  
10  
3.0  
0
0.5  
0
0.5  
1
1.5  
2
2.5  
3
0
5
10  
, DRAIN CURRENT (A)  
D
15  
20  
25  
V
, DRAIN-SOURCE VOLTAGE (V)  
I
DS  
Figure 2. On-Resistance Variation with Gate  
Voltage and Drain Current.  
Figure 1. On-Region Characteristics.  
1.6  
2
VGS = 10V  
ID = 7.2A  
VGS =10V  
1.75  
1.5  
1.4  
1.2  
1
T
= 125°C  
J
1.25  
1
25°C  
-55°C  
0.8  
0.6  
0.75  
0.5  
-50  
-25  
0
25  
50  
75  
100  
125  
150  
0
5
10  
15  
20  
25  
T
, JUNCTION TEMPERATURE (°C)  
J
I
, DRAIN CURRENT (A)  
D
Figure 3. On-Resistance Variation with  
Temperature.  
Figure 4. On-Resistance Variation with Drain  
Current and Temperature.  
25  
20  
15  
10  
5
1.2  
T
= -55°C  
VDS = 10V  
J
25°C  
VDS = VGS  
125°C  
1.1  
1
I D = 250µA  
0.9  
0.8  
0.7  
0.6  
0
-50  
-25  
0
25  
50  
75  
100  
125  
150  
1
2
3
4
5
6
T
, JUNCTION TEMPERATURE (°C)  
V
, GATE TO SOURCE VOLTAGE (V)  
J
GS  
Figure 6. Gate Threshold Variation with  
Temperature.  
Figure 5. Transfer Characteristics.  
www.onsemi.com  
4
Typical Electrical Characteristics  
1.1  
25  
10  
VGS =0V  
ID = 250µA  
1.05  
1
0.1  
T
= 125°C  
J
25°C  
1
-55°C  
0.95  
0.9  
0.01  
-50  
-25  
0
25  
50  
75  
100  
125  
150  
0.001  
0.2  
0.4  
V
0.6  
0.8  
1
1.2  
1.4  
T
, JUNCTION TEMPERATURE (°C)  
J
, BODY DIODE FORWARD VOLTAGE (V)  
SD  
Figure 7. Breakdown Voltage Variation with  
Temperature.  
Figure 8. Body Diode Forward Voltage Variation  
with Current and Temperature.  
2000  
10  
8
ID = 7.2A  
VDS = 5V  
1500  
1000  
10V  
20V  
C
iss  
6
C
500  
oss  
4
200  
100  
f = 1 MHz  
VGS = 0V  
2
C
rss  
0
0.1  
0.2  
0.5  
1
2
5
10  
20 30  
0
5
10  
15  
20  
25  
V
, DRAIN TO SOURCE VOLTAGE (V)  
Q
, GATE CHARGE (nC)  
g
DS  
Figure 10. Gate Charge Characteristics.  
Figure 9. Capacitance Characteristics.  
20  
VDS = 10V  
T
= -55°C  
J
16  
12  
8
25°C  
125°C  
4
0
0
5
10  
15  
20  
25  
I
, DRAIN CURRENT (A)  
D
Figure 11. Transconductance Variation with Drain  
Current and Temperature.  
www.onsemi.com  
5
Typical Thermal Characteristics  
3.5  
3
8
7
6
5
4
3
1a  
1a  
2.5  
2
1b  
1.5  
1b  
1c  
4.5"x5" FR-4 Board  
TA  
25o  
Still Air  
VGS 10V  
1c  
1
4.5"x5" FR-4 Board  
TA  
25o  
Still Air  
=
C
=
C
=
0.5  
0
0.2  
0.4  
0.6  
0.8  
1
0
0.2  
0.4  
0.6  
0.8  
1
2
2oz COPPER MOUNTING PAD AREA (in  
)
2
2oz COPPER MOUNTING PAD AREA (in  
)
Figure 13. Maximum Steady-State Drain Current  
versus Copper Mounting Pad Area.  
Figure 12. SOT-223 Maximum Steady-State  
Power Dissipation versus Copper  
Mounting Pad Area.  
30  
10  
5
1
0.5  
0.2  
VGS = 10V  
0.1  
SINGLE PULSE  
0.05  
R
= See Note 1c  
JA  
q
TA = 25°C  
0.01  
0.1  
0.2  
0.5  
V
1
2
5
10  
30  
50  
, DRAIN-SOURCE VOLTAGE (V)  
DS  
Figure 14. Maximum Safe Operating Area.  
1
0.5  
D = 0.5  
0.2  
0.2  
0.1  
R
(t) = r(t) * R  
JA  
JA  
q
q
0.1  
R
= See Note 1 c  
JA  
q
0.05  
0.05  
P(pk)  
0.02  
0.01  
0.02  
0.01  
t1  
t2  
0.005  
T
- T = P * R  
(t)  
J
A
JA  
Single Pulse  
q
Duty Cycle, D = t1 / t2  
0.002  
0.001  
0.0001  
0.001  
0.01  
0.1  
, TIME (sec)  
1
10  
100  
300  
t
1
Figure 15. Transient Thermal Response Curve.  
Note: Thermal characterization performed using the conditions described in note 1c. Transient thermal response will change  
depending on the circuit board design.  
www.onsemi.com  
6
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are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent  
coverage may be accessed at www.onsemi.com/site/pdf/PatentMarking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.  
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,  
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or  
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer  
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not  
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification  
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized  
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and  
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such  
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This  
literature is subject to all applicable copyright laws and is not for resale in any manner.  
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