NCP81142MNTXG [ONSEMI]

VR 多相控制器;
NCP81142MNTXG
型号: NCP81142MNTXG
厂家: ONSEMI    ONSEMI
描述:

VR 多相控制器

控制器
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中文:  中文翻译
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NCP81142  
Multiple-Phase Controller  
with SVID Interface for  
Desktop and Notebook CPU  
Applications  
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MARKING  
The NCP81142 Multi−Phase buck solution is optimized for  
Intel® VR12.5 compatible CPUs with user configurations of 4/3/2/1  
phases. The controller combines true differential voltage sensing,  
differential inductor DCR current sensing, input voltage  
feed−forward, and adaptive voltage positioning to provide accurately  
regulated power for both Desktop and Notebook applications. The  
control system is based on Dual−Edge pulse−width modulation  
(PWM) combined with DCR current sensing providing the fastest  
initial response to dynamic load events at reduced system cost. It has  
the capability to shed to single phase during light load operation and  
can auto frequency scale in light load conditions while maintaining  
excellent transient performance.  
High performance operational error amplifiers are provided to  
simplify compensation of the system. Patented Dynamic Reference  
Injection further simplifies loop compensation by eliminating the need  
to compromise between closed−loop transient response and Dynamic  
VID performance. Patented Total Current Summing provides highly  
accurate digital current monitoring.  
DIAGRAM  
NCP  
81142  
ALYWG  
G
1
QFN32  
CASE 485CD  
A
L
Y
W
G
= Assembly Location  
= Wafer Lot  
= Year  
= Work Week  
= Pb−Free Package  
(Note: Microdot may be in either location)  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 19 of this data sheet.  
Features  
Meets Intel VR12.5 Specifications  
Current Mode Dual Edge Modulation for Fastest Initial Response to  
Transient Loading  
High Performance Operational Error Amplifier  
Digital Soft Start Ramp  
Dynamic Reference Injection  
Accurate Total Summing Current Amplifier  
Dual High Impedance Differential Voltage and Total  
Current Sense Amplifiers  
Power Saving Phase Shedding  
Vin Feed Forward Ramp Slope  
Phase−to−Phase Dynamic Current Balancing  
“Lossless” DCR Current Sensing for Current Balancing  
True Differential Current Balancing Sense Amplifiers  
for Each Phase  
Over Voltage Protection (OVP) & Under Voltage  
Protection (UVP)  
Over Current Protection (OCP)  
VR−RDY Output with Internal Delays  
These are Pb−Free Devices  
Adaptive Voltage Positioning (AVP)  
Switching Frequency Range of 290 kHz – 590 kHz  
Applications  
Startup into Pre−Charged Loads While Avoiding False  
Desktop and Notebook Processors  
OVP  
© Semiconductor Components Industries, LLC, 2015  
1
Publication Order Number:  
NCP81142/D  
August, 2018 − Rev. 3  
NCP81142  
CS  
Amp  
Current  
Measurement  
& Limit  
VSN  
VSP  
+
DAC  
GND  
Error  
Amp  
DIFFAMP  
CSREF  
VSP  
VSN  
OVP  
TSENSE  
VRHOT  
Thermal  
Monitor  
OVP  
VSP−VSN  
TSENSE  
VBOOT  
IOUT  
SDIO  
SVID Interface  
Data  
Registers  
MUX  
ALERT  
ADC  
SCLK  
IMAX  
ADDR  
CSN4  
DAC  
DAC  
CSP4  
CSN2  
CSP2  
CSN3  
CSP3  
Enable  
IPH4  
VR Ready  
Comparator  
VSP  
VSN  
VRDY  
IPH3  
IPH2  
IPH1  
Current  
Balance  
DAC  
CSN1  
CSP1  
RAMP1  
RAMP2  
RAMP3  
RAMP4  
OVP  
PWM  
Generators  
COMP  
Enable  
Enable  
GND  
Ramp  
Generators  
Enable  
UVLO & EN  
VCC  
ENABLE  
Power State  
Stage  
NCP81142  
Figure 1. Block Diagram for NCP81142  
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2
NCP81142  
32  
31  
30  
29  
28  
27  
26  
25  
ENABLE  
VCC  
1
2
24 CSCOMP  
CSSUM  
CSREF  
CSN4  
CSP4  
23  
22  
21  
20  
19  
18  
17  
VR_HOT#  
SDIO  
3
4
5
6
7
8
NCP81142  
ALERT#  
SCLK  
CSN2  
CSP2  
VR_RDY  
TSENSE  
CSN3  
9
10  
11  
12  
13  
14  
15  
16  
Figure 2. NCP81142 Pin Configurations  
NCP81142 PIN DESCRIPTIONS  
Pin No.  
Symbol  
ENABLE  
VCC  
Description  
1
2
Logic input. Logic high enables the output and logic low disables the output.  
Power for the internal control circuits. A decoupling capacitor is connected from this pin to ground  
Thermal logic output for over temperature  
3
VR_HOT#  
SDIO  
4
Serial VID data interface  
5
ALERT#  
Serial VID ALERT#.  
6
SCLK  
Serial VID clock  
7
VR_RDY  
TSENSE  
PWM4/ROSC  
PWM2/VBOOT  
Open drain output. High indicates that the output is regulating  
Temp Sense input for the multiphase converter  
8
9
Phase 4 PWM output. A resistance from this pin to ground programs the oscillator frequency  
10  
Phase 2 PWM output. Also as VBOOT input pin to adjust the boot−up voltage. During start up it is  
used to program VBOOT with a resistor to ground  
11  
12  
PWM3/IMAX  
Phase 3 PWM output. Also as ICC_MAX Input Pin. During start up it is used to program ICC_MAX  
with a resistor to ground  
PWM1/INT_SEL  
Phase 1 PWM output. Also as Int_sel program pin. A resistor to ground on this pin programs the  
INT_Select value  
13  
14  
15  
16  
DRON  
CSP1  
CSN1  
CSP3  
Bidirectional gate drive enable output  
Non−inverting input to current balance sense amplifier for phase 1  
Inverting input to current balance sense amplifier for phase 1  
Non−inverting input to current balance sense amplifier for phase 3  
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3
NCP81142  
NCP81142 PIN DESCRIPTIONS  
Pin No.  
Symbol  
Description  
17  
CSN3  
Inverting input to current balance sense amplifier for phase 3. Pull this Pin to VCC, configure as  
1−phase operation  
18  
19  
CSP2  
CSN2  
Non−inverting input to current balance sense amplifier for phase 2  
Inverting input to current balance sense amplifier for phase 2. Pull this Pin to VCC, configure as  
2−phase operation  
20  
21  
CSP4  
CSN4  
Non−inverting input to current balance sense amplifier for phase 4  
Inverting input to current balance sense amplifier. Pull this Pin to VCC, configure as 3−phase op-  
eration  
22  
CSREF  
Total output current sense amplifier reference voltage input, a capacitor on this pin is used to en-  
sure CSREF voltage signal integrity  
23  
24  
25  
26  
27  
CSSUM  
CSCOMP  
ILIM  
Inverting input of total current sense amplifier  
Output of total current sense amplifier  
Over current shutdown threshold setting. Resistor to CSCOMP to set threshold  
Total output current monitor.  
IOUT  
VRMP  
Feed−forward input of Vin for the ramp slope compensation. The current fed into this pin is used  
to control the ramp of PWM slope  
28  
29  
30  
31  
32  
33  
COMP  
FB  
Output of the error amplifier and the inverting inputs of the PWM comparators  
Error amplifier voltage feedback  
DIFFOUT  
VSN  
Output of the differential remote sense amplifier  
Inverting input to differential remote sense amplifier  
Non−inverting input to the differential remote sense amplifier  
Power supply return (QFN Flag)  
VSP  
FLAG / GND  
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4
NCP81142  
ABSOLUTE MAXIMUM RATINGS  
ELECTRICAL INFORMATION  
Pin Symbol  
V
MAX  
V
MIN  
COMP  
VCC + 0.3 V  
VCC + 0.3 V  
GND + 300 mV  
VCC + 0.3 V  
VCC + 0.3 V  
6.5 V  
−0.3 V  
−0.3 V  
CSCOMP  
VSN  
GND – 300 mV  
−0.3 V  
DIFFOUT  
VR_RDY  
−0.3 V  
VCC  
−0.3 V  
IOUT  
2.0 V  
−0.3 V  
VRMP  
+25 V  
−0.3 V  
All Other Pins  
VCC + 0.3 V  
−0.3 V  
*All signals referenced to GND unless noted otherwise.  
THERMAL INFORMATION  
Description  
Symbol  
Typ  
Unit  
Thermal Characteristic  
QFN Package (Note 1)  
R
68  
_C/W  
q
JA  
Operating Junction Temperature Range (Note 2)  
Operating Ambient Temperature Range  
Maximum Storage Temperature Range  
Max Power Dissipation  
T
−40 to +125  
−40 to +100  
−40 to +150  
110 to 131  
1
_C  
_C  
J
T
_C  
STG  
Pd  
mW  
Moisture Sensitivity Level  
QFN Package  
MSL  
*The maximum package power dissipation must be observed.  
1. JESD 51−5 (1S2P Direct−Attach Method) with 0 LFM  
2. JESD 51−7 (1S2P Direct−Attach Method) with 0 LFM  
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5
 
NCP81142  
ELECTRICAL CHARACTERISTICS  
Unless otherwise stated: −40°C < T < 100°C; V = 5 V; C = 0.1 mF  
A
CC  
VCC  
Parameter  
Test Conditions  
Min  
Typ  
Max  
Unit  
ERROR AMPLIFIER  
Input Bias Current  
Open Loop DC Gain  
@ 1.3 V  
−27  
27  
mA  
CL = 20 pF to GND,  
RL = 10 kW to GND  
80  
20  
20  
dB  
Open Loop Unity Gain Bandwidth  
Slew Rate  
CL = 20 pF to GND,  
RL = 10 kW to GND  
MHz  
DVin = 100 mV, G = −10 V/V,  
DVout = 1.5 V – 2.5 V,  
CL = 20 pF to GND,  
V/ms  
DC Load = 10k to GND  
Maximum Output Voltage  
Minimum Output Voltage  
I
= 2.0 mA  
3.5  
V
V
SOURCE  
I
= 2.0 mA  
1
SINK  
DIFFERENTIAL SUMMING AMPLIFIER  
Input Bias Current  
VSP, VSN = 1.3 V  
−15  
−0.3  
−0.3  
15  
3.0  
0.3  
uA  
V
VSP Input Voltage Range  
VSN Input Voltage Range  
V
CL = 20 pF to GND,  
RL = 10 kW to GND  
−3dB Bandwidth  
10  
MHz  
V/V  
VS+ to VS− = 0.5 to 1.3 V  
Closed Loop DC gain  
1.0  
CURRENT SUMMING AMPLIFIER  
Offset Voltage (Vos)  
−300  
−10  
300  
10  
mV  
mA  
dB  
Input Bias Current  
CSSUM = CSREF= 1 V  
Open Loop Gain  
80  
10  
C = 20 pF to GND,  
L
Current Sense Unity Gain Bandwidth  
MHz  
R = 10 kW to GND  
L
CURRENT BALANCE AMPLIFIER  
Maximum CSCOMP Output Voltage  
Minimum CSCOMP Output Voltage  
Input Bias Current  
I
= 2 mA  
3.5  
V
V
source  
I
= 500 mA  
0.1  
50  
sink  
CSP  
= CSN  
= 1.2  
nA  
1−4  
1−4  
−50  
Common Mode Input Voltage Range  
Differential Mode Input Voltage Range  
Input Offset Voltage Matching  
CSPx = CSNx  
CSNx = 1.2 V  
0
2.3  
100  
1.5  
V
−100  
−1.5  
mV  
mV  
CSPx = CSNx = 1.2 V,  
Measured from the average  
Current Sense Amplifier Gain  
Multiphase Current Sense Gain Matching  
−3dB Bandwidth  
0 V < CSPx − CSNx < 0.1 V,  
CSP−CSN = 10 mV to 30 mV  
5.7  
−3  
6.0  
8
6.3  
3
V/V  
%
MHz  
INPUT SUPPLY  
Supply Voltage Range  
4.75  
5.25  
V
VCC Quiescent Current  
EN = high, PS0,1,2 Mode  
EN = high, PS3 Mode  
EN = low  
25  
15  
30  
mA  
mA  
mA  
3. Guaranteed by design or characterization data, not in production test.  
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NCP81142  
ELECTRICAL CHARACTERISTICS  
Unless otherwise stated: −40°C < T < 100°C; V = 5 V; C = 0.1 mF  
A
CC  
VCC  
Parameter  
Test Conditions  
Min  
4
Typ  
Max  
Unit  
INPUT SUPPLY  
UVLO Threshold  
VCC rising  
VCC falling  
4.5  
V
V
VCC UVLO Hysteresis  
UVLO Threshold  
160  
mV  
V
VRMP rising  
VRMP failing  
4.2  
3
V
DAC SLEW RATE  
Soft Start Slew Rate  
Slew Rate Slow  
Slew Rate Fast  
5
5
mv/ms  
mv/ms  
mv/ms  
20  
ENABLE INPUT  
Enable High Input Leakage Current  
Upper Threshold  
External 1k pull−up to 3.3 V  
1.0  
0.3  
5
mA  
V
V
0.8  
UPPER  
LOWER  
Lower Threshold  
V
V
Total Hysteresis  
V
– V  
90  
mV  
ms  
UPPER  
LOWER  
Enable Delay Time  
Measure time from Enable  
transitioning HI to when DRON goes  
high  
DRON  
Output High Voltage  
Output Low Voltage  
Sourcing 500 mA  
Sinking 500 mA  
3.0  
V
V
0.1  
CL (PCB) = 20 pF,  
DVo = 10% to 90%  
Rise Time  
156  
ns  
Fall Time  
55  
70  
ns  
Internal Pull Down Resistance  
IOUT OUTPUT  
EN = Low  
kW  
Input Referred Offset Voltage  
Output Source Current  
Current Gain  
Ilimit to CSREF  
−3.5  
9.5  
3.5  
850  
10.5  
mV  
Ilimit sink current = 80 mA  
mA  
(IOUT  
) / (ILIMIT  
),  
10  
CURRENT  
= 20k, R  
CURRENT  
R
= 5.0k , DAC =  
ILIM  
IOUT  
0.8 V, 1.25 V, 1.52 V  
OSCILLATOR  
Switching Frequency Range  
4 Phase Operation  
290  
590  
600  
KHz  
kHz  
OUTPUT OVER VOLTAGE & UNDER VOLTAGE PROTECTION (OVP & UVP)  
Absolute Over Voltage Threshold During Soft Start  
Over Voltage Threshold Above DAC  
Over Voltage Delay  
CSREF  
2.75  
350  
2.9  
400  
50  
3
V
VSP rising  
425  
mV  
ns  
VSP rising to PWMx low  
Ckt in development  
Ckt in development  
Under Voltage  
300  
5
mV  
ms  
Under−voltage Delay  
3. Guaranteed by design or characterization data, not in production test.  
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NCP81142  
ELECTRICAL CHARACTERISTICS  
Unless otherwise stated: −40°C < T < 100°C; V = 5 V; C = 0.1 mF  
A
CC  
VCC  
Parameter  
Test Conditions  
Min  
Typ  
Max  
Unit  
OVERCURRENT PROTECTION  
ILIM Threshold Current (OCP shutdown after 50 ms  
delay)  
(PS0) Rlim = 20k  
(PS0) Rlim = 20k  
9.0  
10  
11.0  
16.5  
mA  
ILIM Threshold Current (immediate OCP shutdown)  
13.5  
15  
mA  
mA  
ILIM Threshold Current (OCP shutdown after 50 ms  
(PS1, PS2, PS3) Rlim = 20k,  
10/N  
delay)  
N = number of phases in PS0 mode  
ILIM Threshold Current (immediate OCP shutdown)  
(PS1, PS2, PS3) Rlim = 20k,  
N = number of phases in PS0 mode  
15/N  
mA  
MODULATORS (PWM Comparators)  
0% Duty Cycle  
COMP voltage when the PWM  
outputs remain LO  
1.3  
2.5  
V
V
100% Duty Cycle  
COMP voltage when the PWM  
outputs remain HI VRMP = 12.0 V  
PWM Ramp Duty Cycle Matching  
PWM Phase Angle Error  
Ramp Feed−forward Voltage range  
VR_HOT#  
COMP = 2 V, PWM Ton matching  
1
5
%
deg  
V
Between adjacent phases at 25°  
5
20  
Output Low Voltage  
I_VRHOT = −4 mA  
0.3  
1.0  
V
Output Leakage Current  
TSENSE  
High Impedance State  
−1.0  
mA  
Alert# Assert Threshold  
Alert# De−assert Threshold  
VRHOT Assert Threshold  
VRHOT Rising Threshold  
TSENSE Bias Current  
ADC  
491  
513  
472  
494  
120  
mV  
mV  
mV  
mV  
mA  
115  
125  
Voltage Range  
0
2
+1  
1
V
%
Total Unadjusted Error (TUE)  
Differential Nonlinearity (DNL)  
Power Supply Sensitivity  
Conversion Time  
−1  
8−bit  
LSB  
%
1
30  
90  
ms  
Round Robin  
ms  
VR_RDY, (Power Good) OUTPUT  
Output Low Saturation Voltage  
I
= 4 mA  
0.3  
V
VR_RDY  
External pull−up of 1 kW to 3.3 V,  
= 45 pF, DVo = 10% to 90%  
Rise Time  
Fall Time  
100  
ns  
C
TOT  
External pull−up of 1 kW to 3.3 V,  
= 45 pF, DVo = 90% to 10%  
10  
ns  
C
TOT  
Output Voltage at Power−up  
Output Leakage Current When High  
VR_RDY Delay (rising)  
VR_RDY pulled up to 5 V via 2 kW  
VR_RDY = 5.0 V  
1.0  
V
−1.0  
1.0  
mA  
ms  
ms  
DAC=TARGET to VR_RDY  
From OCP or OVP  
5
5
VR_RDY Delay (falling)  
3. Guaranteed by design or characterization data, not in production test.  
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NCP81142  
ELECTRICAL CHARACTERISTICS  
Unless otherwise stated: −40°C < T < 100°C; V = 5 V; C = 0.1 mF  
A
CC  
VCC  
Parameter  
Test Conditions  
Min  
Typ  
Max  
Unit  
PWM OUTPUTS  
VCC  
Output High Voltage  
Sourcing 500 mA  
V
0.2V  
Output Mid Voltage  
Output Low Voltage  
No Load, SetPS = 02  
1.9  
2.0  
2.1  
0.7  
V
V
Sinking 500 mA  
CL (PCB) = 50 pF,  
DVo = GND to VCC  
Rise and Fall Time  
10  
ns  
PHASE DETECTION  
CSN Pin Threshold Voltage  
Phase Detect Timer  
4.5  
50  
V
ms  
3. Guaranteed by design or characterization data, not in production test.  
STATE TRUTH TABLE  
Error AMP  
Method of  
Comp Pin  
Reset  
STATE  
VR_RDY Pin  
OVP & UVP  
DRON Pin  
POR  
N/A  
N/A  
N/A  
Resistive pull down  
0 < VCC < UVLO  
Disabled  
EN < threshold  
UVLO > threshold  
Low  
Low  
Low  
Low  
Disabled  
Disabled  
Low  
Low  
Start up Delay &  
Calibration  
EN > threshold  
UVLO > threshold  
DRON Fault  
EN > threshold  
UVLO > threshold  
DRON < threshold  
Low  
Low  
High  
Low  
Disabled  
Resistive pull up  
High  
Driver must  
release DRON  
to high  
Soft Start  
Operational  
Operational  
Active /  
EN > threshold  
UVLO > threshold  
DRON > High  
No latch  
Normal Operation  
EN > threshold  
UVLO >threshold  
DRON > High  
Active /  
High  
N/A  
Latching  
Over Voltage  
Over Current  
Low  
Low  
N/A  
DAC + 150 mV  
Last DAC Code  
Disabled  
High  
Low  
Operational  
V
OUT  
= 0 V  
Low: if Reg34h:bit0 = 0;  
High:if Reg34h:bit0 = 1  
Clamped at  
0.9 V  
High, PWM outputs  
in low state  
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NCP81142  
(VCCANDVRMP) > UVLO  
Disable  
EN = 1  
Controller  
POR  
VCC < UVLO OR  
VRMP < UVLO  
Calibrate  
Cal Done  
Phase Detection and  
Power On Configuration  
POC done  
Set DRVON High  
VCCP > UVLO and DRVON High  
EN = 0  
Check VBoot  
VBoot > 0V  
DRVON  
Pulled Low  
VBoot = 0 V  
DRVON Latch off  
Turn off Drive  
Wait for SVID  
command  
EN = 0  
DRVON  
Pulled Low  
First VID code programmed  
DRVON Pulled Low  
EN = 0  
Boost Cap Refresh  
Boost cap done  
CSREF OVP  
Current Limit  
Occurs  
OVP Latch off.  
Turn off Drive  
VR_RDY = Low.  
Maintain DAC voltage  
and monitor for OVP  
Soft Start Ramp  
VR_RDY = Low  
Ramp output to 0V  
then force LS ON  
Soft start done  
(DAC + 400mV) OVP  
or CSREF OVP occurs  
Current Limit  
Occurs  
(DAC + 400mV) OVP or  
CSREF OVP occurs  
Normal Operation,  
VR_RDY = High  
DRVON Pulled  
Low  
DAC = VID/offset programmed.  
Power state = PS programmed  
EN = 0  
UVP Occurs  
VR_RDY = Low  
DAC = VID/offset programmed.  
Power state = PS programmed  
Figure 3.  
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10  
NCP81142  
General  
The NCP81142 is a four phase dual edge modulated multiphase PWM controller, designed to meet the Intel VR12.5  
specifications with a serial SVID control interface. It is designed to work in notebook, desktop, and server applications.  
Serial VID interface (SVID)  
For SVID Interface communication details please contact Intel Inc.  
BOOT VOLTAGE PROGRAMMING  
The NCP81142 has a Vboot voltage that can be externally programmed. The Boot voltage for the NCP81142 is set using  
VBOOT pin on power up. A 10uA current is sourced from the VBoot pin and the resulting voltage is measured. This is  
compared with the thresholds in table below. This value is set on power up and cannot be changed after the initial power up  
sequence is complete.  
BOOT VOLTAGE TABLE  
R
VBoot  
0 V  
Phase Number in PS1  
30.1k  
49.9k  
69.8k  
90.9k  
130k  
150k  
169k  
Open  
1
1
1
1
2
2
2
2
1.65 V  
1.70 V  
1.75 V  
0 V  
1.65 V  
1.70 V  
1.75 V  
Remote Sense Amplifier  
A high performance high input impedance true differential amplifier is provided to accurately sense the output voltage of  
the regulator. The VSP and VSN inputs should be connected to the regulator’s output voltage sense points. The remote sense  
amplifier takes the difference of the output voltage with the DAC voltage and adds the droop voltage to  
ǒ
Ǔ
ǒ
Ǔ
ǒ
Ǔ
VDIFOUT + VVSP * VVSN ) 1.3 V * VDAC ) VDROOP * VCSREF  
This signal then goes through a standard error compensation network and into the inverting input of the error amplifier. The  
non−inverting input of the error amplifier is connected to the same 1.3 V reference used for the differential sense amplifier  
output bias.  
High Performance Voltage Error Amplifier  
The Remote Sense Amplifier output is applied to a Type 3 compensation network formed by the error amplifier and external  
tuning components. The non−inverting input of the error amplifier is connected to the same reference voltage used to bias the  
Remote Sense Amplifier output. The integrating function of the Type 3 feedback compensation is performed internally and  
does not require external capacitor Cf1 (see below).  
Cf  
Cf  
Rin1  
Rin1  
Cin  
Cf1  
Rf  
Cin  
Rin2  
Rin2  
Rf  
_
_
COMP  
ERROR  
COMP  
ERROR  
+
+
Vbias  
Vbias  
Figure 4. Traditional Type 3 External Compensation  
Figure 5. NCP81142 Modified Type 3 External  
Compensation  
Initial tuning should be based on traditional Type 3 compensation. When ideal Type 3 component values have been  
determined, the closest setting for the internal integrator is should be chosen based on the following table and Rin value used.  
www.onsemi.com  
11  
NCP81142  
Rin1 = 1k, Rf = 3k IN NEW CONTROLLER  
Divider Gain from Digital  
Equivalent Cf1 in Type III  
Network  
Equivalent Rf in Type III  
Network  
Integrator  
Address Resistor  
10k  
22k  
1
2
0.079n  
0.157n  
0.32n  
0.63n  
0.79n  
0.95n  
1.26n  
2.52n  
5.04n  
3000  
3000  
3000  
3000  
3000  
3000  
3000  
3000  
3000  
26k  
4
51k  
8
68k  
10  
12  
16  
32  
64  
91k  
120k  
160k  
220k  
Rin1 = 1k, Rf = 5k IN NEW CONTROLLER  
Divider Gain from Digital  
Equivalent Cf1 in Type III  
Network  
Equivalent Rf in Type III  
Network  
Integrator  
Address Resistor  
10k  
22k  
1
2
0.047n  
0.094n  
0.19n  
0.38n  
0.47n  
0.57n  
0.76n  
1.51n  
3.02n  
5000  
5000  
5000  
5000  
5000  
5000  
5000  
5000  
5000  
26k  
4
51k  
8
68k  
10  
12  
16  
32  
64  
91k  
120k  
160k  
220k  
Rin1 = 1k, Rf = 7.5k IN NEW CONTROLLER  
Divider Gain from Digital  
Equivalent Cf1 in Type III  
Network  
Equivalent Rf in Type III  
Network  
Integrator  
Address Resistor  
10k  
22k  
1
2
0.031n  
0.063n  
0.13n  
0.25n  
0.32n  
0.38n  
0.50n  
1.01n  
2.02n  
7500  
7500  
7500  
7500  
7500  
7500  
7500  
7500  
7500  
26k  
4
51k  
8
68k  
10  
12  
16  
32  
64  
91k  
120k  
160k  
220k  
Rin1 = 1k, Rf = 10k IN NEW CONTROLLER  
Divider Gain from Digital  
Equivalent Cf1 in Type III  
Network  
Equivalent Rf in Type III  
Network  
Integrator  
Address Resistor  
10k  
22k  
26k  
1
2
4
0.024n  
0.047n  
0.09n  
10000  
10000  
10000  
www.onsemi.com  
12  
NCP81142  
Rin1 = 1k, Rf = 10k IN NEW CONTROLLER  
Divider Gain from Digital  
Equivalent Cf1 in Type III  
Network  
Equivalent Rf in Type III  
Network  
Integrator  
Address Resistor  
51k  
68k  
8
0.19n  
0.24n  
0.28n  
0.38n  
0.76n  
1.51n  
10000  
10000  
10000  
10000  
10000  
10000  
10  
12  
16  
32  
64  
91k  
120k  
160k  
220k  
Optimization of the traditional Type 3 compensation should be rechecked using the closest Type 3 Cf1 equivalent in order  
to determine if readjustment of other component values is needed.  
Differential Current Feedback Amplifiers  
Each phase has a low offset differential amplifier to sense that phase current for current balance. The inputs to the CSNx and  
CSPx pins are high impedance inputs. It is recommended that any external filter resistor RCSN does not exceed 10 kW to avoid  
offset issues with leakage current. It is also recommended that the voltage sense element be no less than 0.5 mW for accurate  
current balance. Fine tuning of this time constant is generally not required. The individual phase current is summed into the  
PWM comparator feedback this way current is balanced via a current mode control approach.  
RCSN  
DCR  
CCSN  
LPHASE  
RCSN  
+
CCSN * DCR  
SWNx  
VOUT  
LPHASE  
1
2
Figure 6.  
Total Current Sense Amplifier  
The NCP81142 uses a patented approach to sum the phase currents into a single temperature compensated total current  
signal. This signal is then used to generate the output voltage droop, total current limit, and the output current monitoring  
functions. The total current signal is floating with respect to CSREF. The current signal is the difference between CSCOMP  
and CSREF. The Ref(n) resistors sum the signals from the output side of the inductors to create a low impedance virtual ground,  
the capacitor is used to ensure that the CSREF voltage signal integrity. The amplifier actively filters and gains up the voltage  
applied across the inductors to recover the voltage drop across the inductor series resistance (DCR). Rth is placed near an  
inductor to sense the temperature of the inductor. This allows the filter time constant and gain to be a function of the Rth NTC  
resistor and compensate for the change in the DCR with temperature.  
www.onsemi.com  
13  
NCP81142  
Rref1 10  
CSN1  
CSN2  
CSN3  
Rref2  
10  
10  
Cref  
1nF  
Rfer3  
Rref4  
0
U1A  
10  
CSN4  
CSREF  
+
CSCOMP  
CSSUM  
Ccs1  
Rph1  
SWN1  
SWN2  
SWN3  
SWN4  
Ccs2  
Rph2  
Rph3  
Rph4  
R10  
R
R9  
R
RT1  
100k  
Figure 7.  
The DC gain equation for the current sensing:  
Rcs1*Rth  
Rcs2 ) Rcs1)Rth  
ǒ * DCRǓ  
* IoutTotal  
VCSCOMP−CSREF  
+
Rph  
Set the gain by adjusting the value of the Rph resistors. The DC gain should be set to the output voltage droop. If the voltage  
from CSCOMP to CSREF is less than 100 mV at ICCMAX then it is recommend increasing the gain of the CSCOMP amp.  
This is required to provide a good current signal to offset voltage ratio for the ILIMIT pin. When no droop is needed, the gain  
of the amplifier should be set to provide ~100mV across the current limit programming resistor at full load. The values of Rcs1  
and Rcs2 are set based on the 100k NTC and the temperature effect of the inductor and should not need to be changed. The  
NTC should be placed near the closest inductor. The output voltage droop should be set with the droop filter divider.  
The pole frequency in the CSCOMP filter should be set equal to the zero from the output inductor. This allows the circuit  
to recover the inductor DCR voltage drop current signal. Ccs1 and Ccs2 are in parallel to allow for fine tuning of the time  
constant using commonly available values. It is best to fine tune this filter during transient testing.  
DCR@25° C  
Fz +  
2 * PI * LPhase  
Programming the Current Limit  
The current limit thresholds are programmed with a resistor between the ILIMIT and CSCOMP pins. The ILIMIT pin mirrors  
the voltage at the CSREF pin and mirrors the sink current internally to IOUT (reduced by the IOUT Current Gain) and the  
current limit comparators. The 100% current limit trips if the ILIMIT sink current exceeds 10 mA for 50 ms. The 150% current  
limit trips with minimal delay if the ILIMIT sink current exceeds 15 mA. Set the value of the current limit resistor based on  
the CSCOMP−CSREF voltage as shown below.  
Rcs1*Rth  
Rcs2)  
Rcs1)Rth  
ǒ
Ǔ
* IoutLIMIT * DCR  
lVCSCOMP−CSREF@ILIMIT  
Rph  
RLIMIT  
+
or RLIMIT +  
10m  
10m  
Programming IOUT  
The IOUT pin sources a current in proportion to the ILIMIT sink current. The voltage on the IOUT pin is monitored by the  
internal A/D converter and should be scaled with an external resistor to ground such that a load equal to ICCMAX generates  
a 2 V signal on IOUT. A pull−up resistor from 5 V V can be used to offset the IOUT signal positive if needed.  
CC  
2.0 V * RLIMIT  
RIOUT  
+
Rcs1*Rth  
Rcs2)  
Rcs1)Rth  
ǒ
* DCRǓ  
10 *  
* IoutICC_MAX  
Rph  
www.onsemi.com  
14  
NCP81142  
Programming ICC_MAX  
A resistor to Ground is monitored on startup and this sets the ICC_MAX value. 10 mA is sourced from these pins to generate  
a voltage on the program resistor. The resistor value should be no less than 10k.  
R * 10 mA * 256 A  
ICC_MAX +  
2 V  
Programming TSENSE  
A temperature sense inputs are provided. A precision current is sourced out the output of the TSENSE pin to generate a  
voltage on the temperature sense network. The voltage on the temperature sense input is sampled by the internal A/D converter.  
A 100k NTC similar to the VISHAY ERT−J1VS104JA should be used. Rcomp1 is mainly used for noise. See the specification  
table for the thermal sensing voltage thresholds and source current.  
TSENSE  
Rcomp1  
0.0  
Cfilter  
0.1uF  
Rcomp2  
8.2K  
RNTC  
100K  
AGND  
AGND  
Figure 8.  
Precision Oscillator  
A programmable precision oscillator is provided. The clock oscillator serves as the master clock to the ramp generator circuit.  
This oscillator is programmed by a resistor to ground on the ROSC pin. The oscillator frequency range is between 280 kHz  
to 650 kHz on the NCP81142 The graph below lists the resistor options and associated frequency setting.  
NCP81142 Operating Frequency vs. R  
osc  
Figure 9. NCP81142 Rosc vs. Frequency  
www.onsemi.com  
15  
NCP81142  
The oscillator generates triangle ramps that are 0.5~2.5 V in amplitude depending on the VRMP pin voltage to provide input  
voltage feed forward compensation. The ramps are equally spaced out of phase with respect to each other.  
Programming the Ramp Feed−Forward Circuit  
The ramp generator circuit provides the ramp used by the PWM comparators. The ramp generator provides voltage  
feed−forward control by varying the ramp magnitude with respect to the VRMP pin voltage. The VRMP pin also has a 4 V  
UVLO function. The VRMP UVLO is only active after the controller is enabled. The VRMP pin is high impedance input when  
the controller is disabled.  
The PWM ramp time is changed according to the following,  
VRAMPpkäpkPP + 0.1 * VVRMP  
Vin  
Vramp_pp  
Comp−IL  
Duty  
PWM Comparators  
The noninverting input of the comparator for each phase is connected to the summed output of the error amplifier (COMP)  
and each phase current (I *DCR*Phase Balance Gain Factor). The inverting input is connected to the oscillator ramp voltage  
L
with a 1.3 V offset. The operating input voltage range of the comparators is from 0 V to 3.0 V and the output of the comparator  
generates the PWM output.  
During steady state operation, the duty cycle is centered on the valley of the sawtooth ramp waveform. The steady state duty  
cycle is still calculated by approximately Vout/Vin. During a transient event, the controller will operate in a hysteretic mode  
with the duty cycles pull in for all phases as the error amp signal increases with respect to all the ramps.  
PHASE DETECTION SEQUENCE  
During start−up, the number of operational phases and their phase relationship is determined by the internal circuitry  
monitoring the CSN Pins. Normally, NCP81142 operates as a 4−phase Vcore PWM controller. Connecting CSN4 pin to V  
CC  
programs 3−phase operation, connecting CSN2 and CSN4 pin to V programs 2−phase operation, connecting CSN2, CSN3  
CC  
and CSN4 pin to V programs 1−phase operation. Prior to soft start, while ENABLE is high, CSN4 to CSN2 pins sink  
CC  
approximately 50 mA. An internal comparator checks the voltage of each pin versus a threshold of 4.5 V. If the pin is tied to  
V , its voltage is above the threshold. Otherwise, an internal current sink pulls the pin to GND, which is below the threshold.  
CC  
PWM1 is low during the phase detection interval, which takes 30 ms. After this time, if the remaining CSN outputs are not  
pulled to V , the 50 mA current sink is removed, and NCP81142 functions as normal 4 phase controller. If the CSNs are pulled  
CC  
to V , the 50 mA current source is removed, and the outputs are driven into a high impedance state.  
CC  
The PWM outputs are logic−level devices intended for driving fast response external gate drivers such as the NCP5901 and  
NCP5911 .Because each phase is monitored independently, operation approaching 100% duty cycle is possible. In addition,  
more than one PWM output can be on at the same time to allow overlapping phases.  
PROTECTION FEATURES  
Under voltage Lockouts  
There are several under voltage monitors in the system. Hysteresis is incorporated within the comparators. NCP81142  
monitors the VCC Shunt supply. The gate driver monitors both the gate driver V and the BST voltage. When the voltage  
CC  
on the gate driver is insufficient it will pull DRON low and prevents the controller from being enabled. The gate driver will  
hold DRON low for a minimum period of time to allow the controller to hold off it’s startup sequence. In this case the PWM  
is set to the MID state to begin soft start.  
Gate Driver UVLO Restart  
www.onsemi.com  
16  
NCP81142  
Figure 10.  
Soft Start  
Soft start is implemented internally. A digital counter steps the DAC up from zero to the target voltage based on the  
predetermined rate in the spec table. The PWM signals will start out open with a test current to collect data on phase count and  
for setting internal registers. After the configuration data is collected, if the controller is enabled the PWMs will be set to 2.0 V  
MID state to indicate that the drivers should be in diode mode. DRON will then be asserted. As the DAC ramps the PWM  
outputs will begin to fire. Each phase will move out of the MID state when the first PWM pulse is produced. When the controller  
is disabled the PWM signal will return to the MID state.  
Figure 11.  
Over Current Latch− Off Protection  
The NCP81142 compares a programmable current−limit set point to the voltage from the output of the current−summing  
amplifier. The level of current limit is set with the resistor from the ILIM pin to CSCOMP. The current through the external  
resistor connected between ILIM and CSCOMP is then compared to the internal current limit current I . If the current  
CL  
generated through this resistor into the ILIM pin (Ilim) exceeds the internal current−limit threshold current (I ), an internal  
CL  
latch−off counter starts, and the controller shuts down if the fault is not removed after 50 ms (shut down immediately for 150%  
load current) after which the outputs will remain disabled until the V voltage or EN is toggled.  
CC  
www.onsemi.com  
17  
NCP81142  
On startup a clim1/clim2 current limit protection is enabled once the output voltage has exceeded 250 mV or if the internal  
DAC voltage has increased above 300 mV, this allow for protection again a Vout short to ground. This is necessary because  
the voltage swing of CSCOMP cannot go below ground. This limits the voltage drop across the DCR through the current  
balance circuitry.  
The over−current limit is programmed by a resistor on the ILIM pin. The resistor value can be calculated by the following  
equation:  
I
LIM * DCR * RCSńRPH  
RILIM  
+
ICL  
Where I = 10 mA  
CL  
CSSUM  
RCS  
RPH  
RPH  
RPH  
RPH  
CSCOMP  
RLIM  
ILIM  
CSREF  
Figure 12.  
Under Voltage Monitor  
The output voltage is monitored at the output of the differential amplifier for UVLO. If the output falls more than 300mV  
below the DAC−DROOP voltage the UVLO comparator will trip sending the VR_RDY signal low.  
Over Voltage Protection  
The output voltage is also monitored at the output of the differential amplifier for OVP. During normal operation, if the output  
voltage exceeds the DAC voltage by 400 mV, the VR_RDY flag goes low, and the DAC will be ramped down to 0 V. At the  
same time, the high side gate drivers are all turned off and the low side gate drivers are all turned on until the voltage falls to  
new DAC voltage 0.2 V. The part will stay in this mode until the V voltage or EN is toggled.  
CC  
OVP Threshold Behavior  
VCC  
UVLO RISING  
OVP Threshold  
DAC + ~400 mV  
2.9 V  
DAC  
DRON  
Figure 13. OVP Threshold Behavior  
www.onsemi.com  
18  
NCP81142  
OVP Behavior at Startup  
OVP Threshold  
2.9 V  
Vout  
DAC  
DRON  
PWM  
Figure 14. OVP Behavior at Startup  
OVP Threshold  
DAC  
VSP_VSN  
OVP  
Triggered  
PWM  
Latch Off  
Figure 15. OVP During Normal Operation Mode  
During start up, the OVP threshold is set to 2.9 V. This allows the controller to start up without false triggering the OVP.  
ORDERING INFORMATION  
Device  
NCP81142MNTXG  
Package  
Shipping  
QFN32  
4000 / Tape & Reel  
(Pb−Free)  
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging  
Specifications Brochure, BRD8011/D.  
Intel is a registered trademark of Intel Corporation in the U.S. and/or other countries.  
www.onsemi.com  
19  
MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
QFN32 4x4, 0.4P  
CASE 485CD  
ISSUE A  
1
DATE 09 OCT 2012  
SCALE 2:1  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ASME  
Y14.5M, 1994.  
2. CONTROLLING DIMENSION: MILLIMETERS.  
3. DIMENSION b APPLIES TO PLATED TERMINAL  
AND IS MEASURED BETWEEN 0.15 AND 0.30 MM  
FROM TERMINAL TIP.  
B
E
A
D
L
L
PIN ONE  
REFERENCE  
L1  
4. COPLANARITY APPLIES TO THE EXPOSED PAD  
AS WELL AS THE TERMINALS.  
DETAIL A  
MILLIMETERS  
ALTERNATE TERMINAL  
CONSTRUCTIONS  
DIM MIN  
MAX  
1.00  
0.05  
A
A1  
A3  
b
0.80  
0.00  
0.20 REF  
0.15  
0.25  
D
D2  
E
E2  
e
K
K2  
L
L1  
4.00 BSC  
0.10  
0.10  
C
EXPOSED Cu  
MOLD CMPD  
2.60  
2.80  
4.00 BSC  
C
2.60  
2.80  
TOP VIEW  
0.40 BSC  
0.30 REF  
0.45 REF  
A
DETAIL B  
0.05  
C
ALTERNATE  
A3  
0.25  
−−−  
0.45  
0.15  
CONSTRUCTION  
GENERIC  
MARKING DIAGRAM*  
0.05  
C
DETAIL B  
NOTE 4  
A1  
SEATING  
PLANE  
C
SIDE VIEW  
XXXXXX  
XXXXXX  
ALYWG  
G
C
A
B
0.10  
DETAIL A  
D2  
K
9
4X  
K2  
XXXXX = Specific Device Code  
A
L
Y
W
G
17  
= Assembly Location  
= Wafer Lot  
= Year  
= Work Week  
= PbFree Package  
32X L  
DETAIL C  
CORNER LEAD  
CONSTRUCTION  
E2  
(Note: Microdot may be in either location)  
1
*This information is generic. Please refer  
to device data sheet for actual part  
marking. PbFree indicator, “G”, may  
or not be present.  
C
B
A
B
0.10  
25  
32X  
DETAIL C  
b
0.07  
e
M
M
C
A
RECOMMENDED  
MOUNTING FOOTPRINT  
C
0.05  
NOTE 3  
BOTTOM VIEW  
4.30  
2.80  
32X  
0.58  
PACKAGE  
OUTLINE  
1
2.80  
4.30  
8X  
C0.08  
32X  
0.25  
0.40  
PITCH  
DIMENSIONS: MILLIMETERS  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98AON66248E  
QFN32 4X4, 0.4P  
PAGE 1 OF 1  
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are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
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