NC7SZ08FHX-L22175 概述
TinyLogic UHS 2 输入 AND 门极
NC7SZ08FHX-L22175 数据手册
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PDF下载DATA SHEET
www.onsemi.com
MARKING
DIAGRAMS
TinyLogic UHS Two-Input
AND Gate
GGKK
XYZ
SIP6
CASE 127EB
NC7SZ08
Pin 1
Description
The NC7SZ08 is a single two−input AND gate from onsemi’s
Ultra−High Speed (UHS) series of TinyLogic. The device is fabricated
with advanced CMOS technology to achieve ultra−high speed with
high output drive while maintaining low static power dissipation over
GGKK
XYZ
UDFN6
CASE 517DP
Pin 1
a broad V operating range. The device is specified to operate over
CC
the 1.65 V to 5.5 V V operating range. The inputs and output are
CC
high impedance when V is 0 V. Inputs tolerate voltages up to 5.5 V,
CC
SC−74A
CASE 318BQ
7Z08 M•
independent of V operating voltage.
CC
•
Features
• Ultra−High Speed: t = 2.7 ns (Typical) into 50 pF at 5 V V
PD
CC
• High Output Drive: 24 mA at 3 V V
CC
SOT23−5
CASE 527AH
7Z08 M
• Broad V Operating Range: 1.65 V to 5.5 V
CC
• Matches Performance of LCX Operated at 3.3 V V
CC
• Power Down High Impedance Inputs / Outputs
• Over−Voltage Tolerance Inputs Facilitate 5 V to 3 V Translation
• Proprietary Noise / EMI Reduction Circuitry
SC−88A
CASE 419A−02
Z08 M•
•
• Ultra−Small MicroPak™ Packages
• Space−Saving SOT23−5, SC−74A and SC−88A Packages
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
GG, 7Z08, Z08 = Specific Device Code
Compliant
KK
XY
Z
M
•
= 2−Digit Lot Run Traceability Code
= 2−Digit Date Code Format
= Assembly Plant Code
= Date Code
IEEE / IEC
A
B
&
Y
= Pb−Free Package
(Microdot may be in either location)
Figure 1. Logic Symbol
ORDERING INFORMATION
See detailed ordering, marking and shipping information in the
package dimensions section on page 6 of this data sheet.
© Semiconductor Components Industries, LLC, 1996
1
Publication Order Number:
June, 2022 − Rev. 7
NC7SZ08/D
NC7SZ08
Pin Configurations
A 1
B 2
6 V
CC
A
B
1
2
3
5
4
V
Y
CC
5 NC
4 Y
GND
GND 3
Figure 2. SOT23−5, SC−88A and SC−74A (Top View)
Figure 3. MicroPak (Top Through View)
PIN DEFINITIONS
FUNCTION TABLE (Y = AB)
Pin #
Inputs
Output
SOT23−5 /
SC−88A /
SC74A
A
L
B
L
Y
L
Pin # MicroPak
Name
A
Description
Input
1
2
3
4
5
1
2
3
4
6
5
L
H
L
L
B
Input
H
H
L
GND
Y
Ground
H
H
Output
H = HIGH Logic Level
L = LOW Logic Level
V
CC
Supply Voltage
No Connect
NC
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2
NC7SZ08
ABSOLUTE MAXIMUM RATINGS
Symbol
Parameter
Min
−0.5
−0.5
−0.5
−
Max
6.5
Unit
V
V
CC
Supply Voltage
V
IN
DC Input Voltage
6.5
V
V
DC Output Voltage
DC Input Diode Current
DC Output Diode Current
DC Output Current
6.5
V
OUT
I
V
V
< 0 V
−50
−50
50
mA
mA
mA
mA
°C
IK
IN
I
< 0 V
−
OK
OUT
I
−
OUT
I
or I
DC V or Ground Current
−
50
CC
GND
CC
T
STG
Storage Temperature Range
−65
−
+150
+150
+260
390
332
812
812
4000
2000
T
J
Junction Temperature Under Bias
°C
T
L
Junction Lead Temperature (Soldering, 10 Seconds)
−
°C
P
D
Power Dissipation in Still Air
SC−74A / SOT23−5
−
mW
SC−88A
−
MicroPak−6
MicroPak2ꢀ−6
−
−
ESD
Human Body Model, JESD22−A114
Charge Device Model, JESD22−C101
−
V
−
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Supply Voltage Operating
Supply Voltage Data Retention
Input Voltage
Conditions
Min
1.65
1.50
0
Max
5.50
5.50
5.5
Unit
V
CC
V
V
IN
V
V
V
OUT
Output Voltage
0
V
CC
T
Operating Temperature
Input Rise and Fall Times
−40
0
+85
20
°C
A
t , t
r
V
CC
V
CC
V
CC
at 1.8 V, 2.5 V 0.2 V
at 3.3 V 0.3 V
ns/V
f
0
10
at 5.0 V 0.5 V
0
5
q
Thermal Resistance
SC−74A / SOT23−5
SC−88A
−
320
377
154
154
°C/W
JA
−
MicroPak−6
−
MicroPak2−6
−
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
1. Unused inputs must be held HIGH or LOW. They may not float.
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3
NC7SZ08
DC ELECTICAL CHARACTERISTICS
T
A
= +25°C
T = −40 to +85°C
A
Min
0.65 V
0.70 V
−
Typ
−
Max
−
Min
Max
Symbol
Parameter
V
(V)
Conditions
Unit
CC
V
IH
HIGH Level Input Voltage
1.65 to 1.95
2.30 to 5.50
1.65 to 1.95
2.30 to 5.50
1.65
0.65 V
−
−
V
CC
CC
CC
CC
−
−
0.70 V
V
IL
LOW Level Input Voltage
HIGH Level Output Voltage
−
0.35 V
−
−
0.35 V
CC
V
V
CC
−
−
0.30 V
0.30 V
CC
CC
V
OH
V
OH
= V or V ,
1.55
1.70
2.20
2.90
4.40
1.29
1.90
2.50
2.40
3.90
−
1.65
1.80
2.30
3.00
4.50
1.52
2.15
2.80
2.68
4.20
0.00
0.00
0.00
0.00
0.00
0.80
0.10
0.15
0.22
0.22
−
−
−
−
−
−
−
−
−
−
−
1.55
1.70
2.20
2.90
4.40
1.29
1.90
2.40
2.30
3.80
−
−
−
−
−
−
−
−
−
−
−
IN
IH
IL
I
= −100 mA
1.80
2.30
3.00
4.50
1.65
I
I
I
I
I
= −4 mA
= −8 mA
= −16 mA
= −24 mA
= −32 mA
OH
OH
OH
OH
OH
2.30
3.00
3.00
4.50
V
OL
LOW Level Output Voltage
1.65
V
OL
= V or V ,
0.10
0.10
0.10
0.10
0.10
0.24
0.30
0.40
0.55
0.55
1
0.10
0.10
0.10
0.10
0.10
0.24
0.30
0.40
0.55
0.55
10
V
IN
IH
IL
I
= 100 mA
1.80
−
−
2.30
−
−
3.00
−
−
4.50
−
−
1.65
I
OL
I
OL
I
OL
I
OL
I
OL
= 4 mA
−
−
2.30
= 8 mA
−
−
3.00
= 16 mA
= 24 mA
= 32 mA
−
−
3.00
−
−
4.50
−
−
I
IN
Input Leakage Current
1.65 to 5.50
0
V
IN
V
IN
V
IN
= 5.5 V, GND
−
−
mA
mA
mA
I
Power Off Leakage Current
Quiescent Supply Current
or V
= 5.5 V
−
−
1
−
10
OFF
OUT
I
1.65 to 5.50
= 5.5 V, GND
−
−
2
−
20
CC
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4
NC7SZ08
AC ELECTRICAL CHARACTERISTICS
T
A
= +25°C
Typ
6.3
T = −40 to +85°C
A
Min
−
Max
12.0
10.0
7.0
4.7
4.1
5.2
4.5
−
Min
Max
12.7
10.5
7.5
5.0
4.4
5.5
4.8
−
Symbol
, t
Parameter
V
(V)
Conditions
Unit
CC
t
Propagation Delay
(Figure 4, 5)
1.65
1.80
C = 15 pF,
−
−
−
−
−
−
−
−
−
−
ns
PLH PHL
L
R = 1 MW
L
−
5.2
2.50 0.20
3.30 0.30
5.00 0.50
3.30 0.30
5.00 0.50
0.00
−
3.4
−
2.6
−
2.2
C = 50 pF,
L
−
3.3
L
R = 500 W
−
2.7
C
Input Capacitance
−
4
pF
pF
IN
C
Power Dissipation Capacitance
(Note 2) (Figure 6)
3.30
−
20
25
−
−
PD
5.00
−
−
−
2. C is defined as the value of the internal equivalent capacitance which is derived from dynamic operating current consumption (I
) at
PD
CCD
no output loading and operating at 50% duty cycle. C is related to I
dynamic operating current by the expression:
PD
CCD
I
= (C ) (V ) (f ) + (I static).
CCD
PD CC IN CC
V
CC
OUTPUT
INPUT
C *
L
R
L
NOTE:
3. CL includes load and stray capacitance.
4. Input PRR = 10 MHz t = 500 ns.
w
Figure 4. AC Test Circuit
Figure 5. AC Waveforms
V
CC
A
INPUT
NOTE:
5. Input = AC Waveform; t = t = 1.8 ns;
r
f
PRR = 10 MHz; Duty Cycle = 50%.
Figure 6. ICCD Test Circuit
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5
NC7SZ08
ORDERING INFORMATION
Part Number
†
Top Mark
7Z08
7Z08
Z08
Packages
SC−74A
Shipping
NC7SZ08M5X
3000 / Tape & Reel
3000 / Tape & Reel
3000 / Tape & Reel
3000 / Tape & Reel
5000 / Tape & Reel
5000 / Tape & Reel
5000 / Tape & Reel
5000 / Tape & Reel
NC7SZ08M5X−L22090
NC7SZ08P5X
SOT23−5
SC−88A
NC7SZ08P5X−F22057
NC7SZ08L6X
Z08
SC−88A
GG
SIP6, MicroPak
SIP6, MicroPak
NC7SZ08L6X−L22175
NC7SZ08FHX
GG
GG
UDFN6, MicroPak2
UDFN6, MicroPak2
NC7SZ08FHX−L22175
GG
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
MicroPak and MicroPak2 are trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other
countries.
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6
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SIP6 1.45X1.0
CASE 127EB
ISSUE O
DATE 31 AUG 2016
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98AON13590G
SIP6 1.45X1.0
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SC−74A
CASE 318BQ
ISSUE B
5
1
DATE 18 JAN 2018
SCALE 2:1
5X b
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
0.20 C A B
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT
EXCEED 0.15 PER SIDE.
M
5
4
E1
E
1
2
3
0.05
A1
L
B
e
DETAIL A
A
D
MILLIMETERS
DIM
A
A1
b
c
D
E
E1
e
MIN
0.90
0.01
0.25
0.10
2.85
2.50
1.35
MAX
1.10
0.10
0.50
0.26
3.15
3.00
1.65
TOP VIEW
SIDE VIEW
A
DETAIL A
c
0.95 BSC
SEATING
PLANE
END VIEW
C
L
M
0.20
0
0.60
10
_
_
RECOMMENDED
GENERIC
SOLDERING FOOTPRINT*
MARKING DIAGRAM*
0.95
PITCH
XXX MG
G
XXX
M
= Specific Device Code
= Date Code
2.40
G
= Pb−Free Package
(Note: Microdot may be in either location)
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present. Some products
may not follow the Generic Marking.
5X
1.00
5X
0.70
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98AON66279G
SC−74A
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2018
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SC−88A (SC−70−5/SOT−353)
CASE 419A−02
ISSUE M
SCALE 2:1
DATE 11 APR 2023
GENERIC MARKING
DIAGRAM*
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “G”, may
or may not be present. Some products may
not follow the Generic Marking.
XXXMG
G
XXX = Specific Device Code
M
= Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
STYLE 1:
STYLE 2:
STYLE 3:
PIN 1. ANODE 1
2. N/C
STYLE 4:
STYLE 5:
PIN 1. BASE
PIN 1. ANODE
2. EMITTER
3. BASE
PIN 1. SOURCE 1
2. DRAIN 1/2
3. SOURCE 1
4. GATE 1
PIN 1. CATHODE
2. COMMON ANODE
3. CATHODE 2
2. EMITTER
3. BASE
4. COLLECTOR
5. COLLECTOR
3. ANODE 2
4. CATHODE 2
5. CATHODE 1
4. COLLECTOR
5. CATHODE
4. CATHODE 3
5. CATHODE 4
5. GATE 2
STYLE 9:
STYLE 6:
PIN 1. EMITTER 2
2. BASE 2
STYLE 7:
STYLE 8:
Note: Please refer to datasheet for
style callout. If style type is not called
out in the datasheet refer to the device
datasheet pinout or pin assignment.
PIN 1. ANODE
2. CATHODE
3. ANODE
4. ANODE
5. ANODE
PIN 1. BASE
2. EMITTER
3. BASE
PIN 1. CATHODE
2. COLLECTOR
3. N/C
3. EMITTER 1
4. COLLECTOR
5. COLLECTOR 2/BASE 1
4. COLLECTOR
5. COLLECTOR
4. BASE
5. EMITTER
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98ASB42984B
SC−88A (SC−70−5/SOT−353)
PAGE 1 OF 1
onsemi and
are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves
the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular
purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation
special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others.
© Semiconductor Components Industries, LLC, 2018
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SC−88A (SC−70 5 Lead), 1.25x2
CASE 419AC−01
ISSUE A
DATE 29 JUN 2010
SYMBOL
MIN
NOM
MAX
D
0.80
A
1.10
e
e
A1
A2
0.00
0.80
0.10
1.00
b
c
0.15
0.10
1.80
1.80
1.15
0.30
0.18
2.20
2.40
1.35
D
2.00
2.10
E1
E
E
E1
e
1.25
0.65 BSC
0.36
L
0.26
0.46
L1
L2
0.42 REF
0.15 BSC
TOP VIEW
0º
4º
8º
θ
10º
θ1
q1
A2
A1
A
q
L
b
L1
q1
c
L2
SIDE VIEW
END VIEW
Notes:
(1) All dimensions are in millimeters. Angles in degrees.
(2) Complies with JEDEC MO-203.
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98AON34260E
SC−88A (SC−70 5 LEAD), 1.25X2
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
UDFN6 1.0X1.0, 0.35P
CASE 517DP
ISSUE O
DATE 31 AUG 2016
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98AON13593G
UDFN6 1.0X1.0, 0.35P
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SOT−23, 5 Lead
CASE 527AH
ISSUE A
DATE 09 JUN 2021
q
q
q
q
q
q1
q2
GENERIC
MARKING DIAGRAM*
XXXM
XXX = Specific Device Code
M
= Date Code
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “G”, may
or may not be present. Some products may
not follow the Generic Marking.
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98AON34320E
SOT−23, 5 LEAD
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
onsemi,
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates
and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.
A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any
products or information herein, without notice. The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the
information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use
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vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license
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