NC7SVL32FHX [ONSEMI]
Tiny Logic Low-ICCT Two-Input OR Gate;
| 型号： | NC7SVL32FHX |
| 厂家： | 
ONSEMI |
| 描述： | Tiny Logic Low-ICCT Two-Input OR Gate 栅 |
| 文件： | 总12页 (文件大小：666K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON
Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s
technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA
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is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
December 2010
NC7SVL32
TinyLogic® Low-ICCT Two-Input OR Gate
Features
Description
The NC7SVL32 is a single two-input OR gate with a
Low-ICCT input design from Fairchild’s Ultra-Low Power
(ULP-A) series of TinyLogic®. The NC7SVL32 features
very low quiescent current, even when the input voltage
is lower than the VCC supply. This feature services
mobile handset applications very well, allowing for direct
interface with baseband processor general-purpose
I/Os. Since mobile devices rely on a battery supply, the
NC7SVL32 facilitates lower power consumption in
mixed-voltage rail environments.
0.9V to 3.6V VCC Supply Operation
3.6V Over-Voltage Tolerant I/Os at VCC from
0.9V to 3.6V
Power-Off High-Impedance Inputs and Outputs
Proprietary Quiet Series™ Noise / EMI Reduction
Circuitry
Ultra-Small MicroPak™ Packages
Ultra-Low Dynamic Power
This product is designed on an advanced CMOS
technology for a wide low-voltage operating range (0.9V
to 3.6V VCC), high drive needs (up to 24mA), and speed
(maximum propagation delay of 3.5ns, VCC=3.3V). It
achieves this performance while maintaining low CMOS
power dissipation.
Ordering Information
Part Number
NC7SVL32P5X
NC7SVL32L6X
NC7SVL32FHX
Top Mark
Package
Packing Method
L32
CF
CF
5-Lead SC70, EIAJ SC-88a, 1.25mm Wide
6-Lead MicroPak™, 1.00mm Wide
3000 Units on Tape & Reel
5000 Units on Tape & Reel
5000 Units on Tape & Reel
6-Lead, MicroPak2™, 1x1mm Body, .35mm Pitch
© 2008 Fairchild Semiconductor Corporation
NC7SVL32 • Rev. 1.0.4
www.fairchildsemi.com
Connection Diagram
IEEE/IEC
A
B
Y
≥1
Figure 1.
Logic Symbol
Pin Configurations
1
5
4
A
VCC
1
2
3
6
5
4
A
B
VCC
NC
Y
2
B
GND
Figure 3.
3
GND
Y
Figure 2.
SC70 (Top View)
MicroPak™ (Top Through View)
Pin Definitions
Pin # SC70
Pin # MicroPak™
Name
A
Description
Input
1
2
3
4
1
2
3
4
5
6
B
Input
GND
Y
Ground
Output
NC
VCC
No Connect
Supply Voltage
5
Function Table
Y = A+B
Inputs
Output
A
L
B
L
Y
L
L
H
L
H
H
H
H
H
H
H = HIGH Logic Level
L = LOW Logic Level
© 2008 Fairchild Semiconductor Corporation
NC7SVL32 • Rev. 1.0.4
www.fairchildsemi.com
2
Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device
reliability. The absolute maximum ratings are stress ratings only.
Symbol
VCC
Parameter
Min.
-0.5
-0.5
-0.5
-0.5
Max.
4.6
Unit
V
Supply Voltage
VIN
DC Input Voltage
4.6
V
HIGH or LOW State(1)
VCC + 0.5
4.6
VOUT
IIK
DC Output Voltage
V
VCC = 0V
VIN < 0V
DC Input Diode Current
DC Output Diode Current
DC Output Source/Sink Current
-50
mA
mA
VOUT < 0V
VOUT > VCC
-50
IOK
+50
IOH / IOL
ICC or IGND
TSTG
±50
mA
mA
°C
DC VCC or Ground Current per Supply Pin
Storage Temperature Range
±50
-65
+150
+150
+260
150
TJ
Junction Temperature Under Bias
Junction Lead Temperature, Soldering 10 Seconds
SC70-5
°C
TL
°C
PD
Power Dissipation at +85°C
MicroPak™-6
MicroPak2™-6
130
mW
V
120
Human Body Model, JEDEC:JESD22-A114
Charge Device Model, JEDEC:JESD22-C101
4000
2000
ESD
Note:
1. IO absolute maximum ratings must be observed.
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not
recommend exceeding them or designing to Absolute Maximum Ratings.
Symbol
VCC
Parameter
Supply Voltage
Conditions
Min.
0.9
0
Max.
3.6
Unit
V
VIN
Input Voltage
3.6
V
VCC=0V
HIGH or LOW State
CC=3.0V to 3.6V
0
3.6
VOUT
Output Voltage
V
0
VCC
V
±24.0
±18.0
±6.0
±4.0
±2.0
±0.1
VCC=2.3V to 2.7V
VCC=1.65V to 1.95V
VCC=1.4V to 1.6V
VCC=1.1V to 1.3V
VCC=0.9V
IOH/IOL
Output Current in IOH/IOL
mA
TA
Operating Temperature, Free Air
Minimum Input Edge Rate
-40
+85
°C
VIN=0.8V to 2.0, VCC=3.0V
SC70-5
10
ns/V
Δt/ΔV
425
500
560
Thermal Resistance
MicroPak™-6
°C/W
θJA
MicroPak2™-6
Note:
2. Unused inputs must be held HIGH or LOW. They may not float.
© 2008 Fairchild Semiconductor Corporation
www.fairchildsemi.com
NC7SVL32 • Rev. 1.0.4
3
DC Electrical Characteristics
TA=25°C
Min.
TA=-40 to +85°C
Symbol
Parameter
VCC
Conditions
Units
Max.
Min.
.65 x VCC
.65 x VCC
.65 x VCC
0.90
Max.
0.90
.65 x VCC
.65 x VCC
.65 x VCC
0.90
1.10 ≤ VCC ≤ 1.30
1.40 ≤ VCC ≤ 1.60
1.65 ≤ VCC ≤ 1.95
2.30 ≤ VCC ≤ 2.70
2.70 ≤ VCC ≤ 3.60
0.90
HIGH Level Input
Voltage
VIH
V
1.50
1.50
1.50
1.50
.25 x VCC
.25 x VCC
.25 x VCC
.25 x VCC
0.70
.25 x VCC
.25 x VCC
.25 x VCC
.25 x VCC
0.70
1.10 ≤ VCC ≤ 1.30
1.40 ≤ VCC ≤ 1.60
1.65 ≤ VCC ≤ 1.95
2.30 ≤ VCC ≤ 2.70
2.70 ≤ VCC ≤ 3.60
0.90
LOW Level Input
Voltage
VIL
V
0.80
0.80
VCC-0.10
VCC-0.10
VCC-0.10
VCC-0.10
VCC-0.20
VCC-0.20
VCC-0.20
VCC-0.20
.75 x VCC
.75 x VCC
1.25
1.10 ≤ VCC ≤ 1.30
1.40 ≤ VCC ≤ 1.60
1.65 ≤ VCC ≤ 1.95
2.30 ≤ VCC ≤ 2.70
2.70 ≤ VCC ≤ 3.60
1.10 ≤ VCC ≤ 1.30
1.40 ≤ VCC ≤ 1.60
1.65 ≤ VCC ≤ 1.95
2.30 ≤ VCC ≤ 2.70
2.30 ≤ VCC ≤ 2.70
2.70 ≤ VCC ≤ 3.60
2.30 ≤ VCC ≤ 2.70
2.70 ≤ VCC ≤ 3.60
2.70 ≤ VCC ≤ 3.60
V
V
V
V
CC-0.20
CC-0.20
CC-0.20
CC-0.20
I
OH=-100µA
I
I
OH=-2mA
OH=-4mA
.75 x VCC
.75 x VCC
1.25
HIGH Level Output
Voltage
VOH
V
I
I
OH=-6mA
2.00
2.00
1.80
1.80
OH=-12mA
2.20
2.20
1.70
1.70
I
I
OH=-18mA
OH=-24mA
2.40
2.40
2.20
2.20
Continued on the following page…
© 2008 Fairchild Semiconductor Corporation
NC7SVL32 • Rev. 1.0.4
www.fairchildsemi.com
4
DC Electrical Characteristics (Continued)
TA=25°C
TA=-40 to +85°C
Symbol
Parameter
VCC
Conditions
Units
Min.
Max.
0.1
Min.
Max.
0.1
0.90
0.1
0.1
1.10 ≤ VCC ≤ 1.30
1.40 ≤ VCC ≤ 1.60
1.65 ≤ VCC ≤ 1.95
2.30 ≤ VCC ≤ 2.70
2.70 ≤ VCC ≤ 3.60
1.10 ≤ VCC ≤ 1.30
1.40 ≤ VCC ≤ 1.60
1.65 ≤ VCC ≤ 1.95
2.30 ≤ VCC ≤ 2.70
2.70 ≤ VCC ≤ 3.60
2.30 ≤ VCC ≤ 2.70
2.70 ≤ VCC ≤ 3.60
2.70 ≤ VCC ≤ 3.60
0.2
0.2
I
I
OL=100µA
0.2
0.2
0.2
0.2
0.2
0.2
OL=2mA
0.25 x VCC
0.25 x VCC
0.30
0.25 x VCC
0.25 x VCC
0.3
LOW Level
Output Voltage
VOL
V
IOL=4mA
IOL=6mA
0.40
0.40
IOL=12mA
IOL=18mA
0.40
0.40
0.60
0.60
0.40
0.40
IOL=24mA
0.55
0.55
Input Leakage
Current
IIN
0.90 to 3.60
±0.1
±0.5
0.5
µA
µA
0 ≤ VIN ≤ 3.60V
Power Off
Leakage
Current
IOFF
0
0.5
0.9
0 ≤ (VIN, VO) ≤ 3.60V
VIN=VCC, or GND
VCC ≤ VIN ≤ 3.60V
VIN=0.9V
0.9
±0.9
8
Quiescent
Supply Current
ICC
0.90 to 3.60
µA
µA
1.95
3.60
6
6
Increase in ICC
per Input
ICCT
VIN=1.5V
8
AC Electrical Characteristics
TA=25°C
TA=-40 to 85°C
Symbol Parameter
VCC
Conditions
CL=15pF, RL=1MΩ
CL=15pF, RL=2kΩ
Units Figure
Min. Typ. Max. Min.
Max.
0.90
42.0
3.5
1.5
1.1
0.6
0.5
8.2
4.0
3.2
2.3
1.9
17.0
7.0
5.5
4.0
3.5
3.0
1.5
1.0
0.6
0.5
30.5
7.5
6.0
4.5
4.0
1.10 ≤ VCC ≤ 1.30
1.40 ≤ VCC ≤ 1.60
1.65 ≤ VCC ≤ 1.95
Propagation
tPHL, tPLH
Figure 4
ns
Delay
Figure 5
2.30 ≤ VCC ≤ 2.70 CL=30pF, RL=500Ω
2.70 ≤ VCC ≤ 3.60
Input
CIN
0
3
5
pF
pF
Capacitance
Power
VIN=0V or VCC
f=10MHz
,
CPD
Dissipation
0.90 to 3.60
Capacitance
© 2008 Fairchild Semiconductor Corporation
NC7SVL32 • Rev. 1.0.4
www.fairchildsemi.com
5
AC Loadings and Waveforms
Figure 4. AC Test Circuit
Figure 5.
AC Waveforms
VCC
2.5V ± 0.2V 1.8V ± 0.15V 1.5V ± 0.1V
Symbol
3.3V ± 0.3V
1.5V
1.2V ± 0.1V
VCC/2
0.9V
VCC/2
VCC/2
Vmi
VCC/2
VCC/2
VCC/2
VCC/2
VCC/2
VCC/2
Vmo
1.5V
VCC/2
© 2008 Fairchild Semiconductor Corporation
NC7SVL32 • Rev. 1.0.4
www.fairchildsemi.com
6
Physical Dimensions
Figure 6.
5-Lead, SC70, EIAJ SC-88a, 1.25mm Wide
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify
or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically
the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
Tape and Reel Specifications
Please visit Fairchild Semiconductor’s online packaging area for the most recent tape and reel specifications:
http://www.fairchildsemi.com/products/analog/pdf/sc70-5_tr.pdf.
Package Designator
Tape Section
Leader (Start End)
Carrier
Cavity Number
125 (Typical)
3000
Cavity Status Cover Type Status
Empty
Filled
Sealed
Sealed
Sealed
P5X
Trailer (Hub End)
75 (Typical)
Empty
© 2008 Fairchild Semiconductor Corporation
NC7SVL32 • Rev. 1.0.4
www.fairchildsemi.com
7
Physical Dimensions
2X
0.05 C
1.45
B
(1)
2X
0.05 C
(0.49)
5X
(0.254)
1.00
(0.75)
(0.52)
1X
TOP VIEW
A
PIN 1 IDENTIFIER
5
0.55MAX
(0.30)
6X
PIN 1
0.05 C
0.05
0.00
RECOMMENED
LAND PATTERN
0.05 C
C
0.45
0.35
0.10
6X
0.00
0.25
6X
0.15
1.0
DETAIL A
0.10
C B A
0.40
0.30
0.05
C
0.35
0.25
5X
5X
0.40
0.30
DETAIL A
PIN 1 TERMINAL
0.075 X 45
CHAMFER
0.5
BOTTOM VIEW
(0.05)
6X
(0.13)
4X
Notes:
1. CONFORMS TO JEDEC STANDARD M0-252 VARIATION UAAD
2. DIMENSIONS ARE IN MILLIMETERS
3. DRAWING CONFORMS TO ASME Y14.5M-1994
4. FILENAME AND REVISION: MAC06AREV4
5. PIN ONE IDENTIFIER IS 2X LENGTH OF ANY
OTHER LINE IN THE MARK CODE LAYOUT.
Figure 7.
6-Lead, MicroPak™, 1.0mm Wide
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify
or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically
the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
Tape and Reel Specifications
Please visit Fairchild Semiconductor’s online packaging area for the most recent tape and reel specifications:
http://www.fairchildsemi.com/products/logic/pdf/micropak_tr.pdf.
Package Designator
Tape Section
Leader (Start End)
Carrier
Cavity Number
125 (Typical)
5000
Cavity Status Cover Type Status
Empty
Filled
Sealed
Sealed
Sealed
L6X
Trailer (Hub End)
75 (Typical)
Empty
© 2008 Fairchild Semiconductor Corporation
NC7SVL32 • Rev. 1.0.4
www.fairchildsemi.com
8
Physical Dimensions
0.89
0.35
0.05 C
2X
1.00
B
A
5X 0.40
1X 0.45
PIN 1
0.66
MIN 250uM
1.00
6X 0.19
0.05 C
TOP VIEW
RECOMMENDED LAND PATTERN
FOR SPACE CONSTRAINED PCB
2X
0.90
0.35
0.05 C
0.55MAX
C
5X 0.52
SIDE VIEW
0.73
0.57
1X
(0.08) 4X
DETAIL A
0.09
0.19
6X
1
2
3
0.20 6X
ALTERNATIVE LAND PATTERN
FOR UNIVERSAL APPLICATION
(0.05) 6X
0.35
0.25
5X
0.60
6
5
4
0.10
.05 C
C B A
0.40
0.30
0.35
(0.08)
4X
BOTTOM VIEW
NOTES:
A. COMPLIES TO JEDEC MO-252 STANDARD
B. DIMENSIONS ARE IN MILLIMETERS.
0.075X45°
CHAMFER
C. DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994
D. LANDPATTERN RECOMMENDATION IS BASED ON FSC
DESIGN.
DETAIL A
PIN 1 LEAD SCALE: 2X
E. DRAWING FILENAME AND REVISION: MGF06AREV3
Figure 8.
6-Lead, MicroPak2™, 1x1mm Body, .35mm Pitch
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify
or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically
the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
Tape and Reel Specifications
Please visit Fairchild Semiconductor’s online packaging area for the most recent tape and reel specifications:
http://www.fairchildsemi.com/packaging/MicroPAK2_6L_tr.pdf.
Package Designator
Tape Section
Leader (Start End)
Carrier
Cavity Number
125 (Typical)
5000
Cavity Status Cover Type Status
Empty
Filled
Sealed
Sealed
Sealed
FHX
Trailer (Hub End)
75 (Typical)
Empty
© 2008 Fairchild Semiconductor Corporation
NC7SVL32 • Rev. 1.0.4
www.fairchildsemi.com
9
© 2008 Fairchild Semiconductor Corporation
NC7SVL32 • Rev. 1.0.4
www.fairchildsemi.com
10
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent
coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This
literature is subject to all applicable copyright laws and is not for resale in any manner.
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