NB4N507ADR2G [ONSEMI]

3.3V/5V, 50 MHz to 200 MHz PECL Clock Synthesizer; 3.3V / 5V , 50 MHz至200 MHz的PECL时钟合成器
NB4N507ADR2G
型号: NB4N507ADR2G
厂家: ONSEMI    ONSEMI
描述:

3.3V/5V, 50 MHz to 200 MHz PECL Clock Synthesizer
3.3V / 5V , 50 MHz至200 MHz的PECL时钟合成器

时钟
文件: 总7页 (文件大小:124K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
NB4N507A  
3.3V/5V, 50 MHz to 200 MHz  
PECL Clock Synthesizer  
Description  
The NB4N507A is a precision clock synthesizer which generates a  
very low jitter differential PECL output clock. It produces a clock  
output based on an integer multiple of an input reference frequency.  
The NB4N507A accepts a standard fundamental mode crystal,  
using PhaseLockedLoop (PLL) techniques, will produce output  
clocks up to 200 MHz. In addition, the PLL circuitry will produce a  
50% duty cycle squarewave clock output.  
http://onsemi.com  
The NB4N507A can be programmed to generate a selection of input  
reference frequency multiples. An exact 155.52 MHz output clock can  
be generated from a 19.44 MHz crystal and the x8 multiplier selection.  
The NB4N507A is intended for low output jitter clock generation.  
SOIC16  
D SUFFIX  
CASE 751B  
Features  
Input Crystal Frequency of 10 27 MHz  
Enable Usage of Common LowCost Crystal  
Differential PECL Output Clock Frequencies up to 200 MHz  
Duty Cycle of 48%/52%  
MARKING DIAGRAM  
Operating Range: V = 3.0 V to 5.5 V  
CC  
Ideal for SONET Applications and Oscillator Manufacturers  
Available in Die Form  
Packaged in 16Pin Narrow SOIC  
PbFree Packages are Available*  
NB4N507AG  
AWLYWW  
Osc  
A
WL  
Y
WW  
G
= Assembly Location  
= Wafer Lot  
= Year  
= Work Week  
= PbFree Package  
CLKOUT  
CLKOUT  
CP  
PD  
PECL  
VCO  
OE  
Mult  
S0 S1  
Figure 1. Simplified Logic Block  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 5 of this data sheet.  
*For additional information on our PbFree strategy and soldering details, please  
download the ON Semiconductor Soldering and Mounting Techniques  
Reference Manual, SOLDERRM/D.  
©
Semiconductor Components Industries, LLC, 2006  
1
Publication Order Number:  
November, 2006 Rev. 2  
NB4N507A/D  
 
NB4N507A  
V
DD  
X1/CLK  
Crystal  
CLKOUT  
CLKOUT  
OE  
Oscillator  
Buffer  
Phase  
Detector  
Charge  
Pump  
PECL  
Output  
VCO  
X2  
Feedback  
Multiplier  
Select  
S0 S1  
GND  
Figure 2. NB4N507A Logic Diagram  
Table 1. CLOCK MULTIPLIER SELECT TABLE  
X1/CLK  
1
2
16  
15  
X2  
S1  
L
S0  
L
Multiplier  
9.72X*  
10X  
V
V
NC  
DD  
DD  
L
M
H
L
3
4
5
14  
13  
12  
S0  
L
12X  
M
M
M
H
H
H
6.25X  
8X  
S1  
OE  
NC  
M
H
L
5X  
GND  
NA  
GND  
NC  
6
7
8
11  
10  
9
NC  
M
H
3X  
4X  
NC  
CLKOUT  
CLKOUT  
Table 2. OE, OUTPUT ENABLE FUNCTION  
OE  
0
Function  
Disable  
Enable  
Figure 3. 16Pin SOIC (Top View)  
1
*Crystal = 16 MHz, f  
L = GND  
= 155.52 MHz  
CLKOUT  
H = V  
DD  
M = OPEN  
http://onsemi.com  
2
NB4N507A  
Table 3. PIN DESCRIPTION  
Pin #  
SOIC16  
Name  
I/O  
Description  
1
X1/CLK  
Crystal Input  
Power Supply  
TriLevel Input  
Power Supply  
No Connect  
Crystal or Clock Input  
2,3  
4
V
Positive Supply Voltage (3.0 V to 5.5 V)  
DD  
S1  
Multiplier Select Pin; When Left Open, Defaults to V B 2  
DD  
5,6  
GND  
NC  
Negative Supply Voltage  
7,10,11,12,  
15  
8
9
CLKOUT  
CLKOUT  
OE  
PECL Output  
PECL Output  
Noninverted differential PECL clock output.  
Inverted differential PECL clock output.  
13  
(LV)CMOS/(LV)TTL  
Input  
Output Enable for the CLKOUT/CLKOUT Outputs. Outputs are  
enabled when HIGH or when left open; OE pin has internal pullup resistor. Disables  
both outputs when LOW. CLKOUT goes LOW, CLKOUT goes HIGH.  
14  
16  
S0  
X2  
TriLevel Input  
Multiplier Select Pin; When Left Open, Defaults to V B 2  
DD  
Crystal Input  
Crystal Input  
Table 4. ATTRIBUTES  
Characteristics  
Value  
ESD Protection  
Human Body Model  
Machine Model  
Charged Device Model  
> 1 kV  
> 150 V  
> 1 kV  
Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1)  
Level 1  
Flammability Rating  
Transistor Count  
Oxygen Index: 28 to 34  
UL 94 V0 @ 0.125 in  
1145 Devices  
Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test  
1. For additional information, see Application Note AND8003/D.  
Table 5. MAXIMUM RATINGS  
Symbol  
Parameter  
Condition 1  
Condition 2  
Rating  
Unit  
V
V
V
Positive Power Supply  
GND = 0 V  
6
CC  
I
Input Voltage  
GND 0.5 V V + 0.5  
V
I
DD  
T
Operating Temperature Range  
Storage Temperature Range  
Thermal Resistance (JunctiontoAmbient)  
40 to +85  
°C  
°C  
A
T
65 to +150  
stg  
JA  
q
0 lfpm  
500 lfpm  
SOIC16  
SOIC16  
100  
60  
°C/W  
°C/W  
q
Thermal Resistance (JunctiontoCase)  
(Note 2)  
33 to 36  
°C/W  
°C  
JC  
T
sol  
Wave Solder  
Pb < 3 sec @ 248°C  
PbFree < 3 sec @ 260°C  
265  
265  
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the  
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect  
device reliability.  
2. JEDEC standard multilayer board 2S2P (2 signal, 2 power).  
http://onsemi.com  
3
 
NB4N507A  
Table 6. DC CHARACTERISTICS (V = 3.0 V to 5.5 V, GND = 0 V, T = 40°C to +85°C (Note 3))  
DD  
A
Symbol  
Characteristic  
Min  
Typ  
Max  
Unit  
I
Power Supply Current  
V
DD  
= 5 V  
DD  
15  
10  
27  
23  
35  
30  
mA  
mA  
DD  
(does not include output load resistor current)  
V
V
V
= 3.3 V  
V
V
V
V
Output HIGH Voltage (Notes 5 & 6)  
V
DD  
= 5 V  
DD  
= 3.3 V  
3.95  
2.57  
4.05  
2.67  
4.15  
2.77  
V
V
V
V
OH  
OL  
IH  
Output LOW Voltage (Notes 5 & 6)  
Input HIGH Voltage (Note 4)  
Input LOW Voltage,(Note 4)  
V
DD  
= 5 V  
3.12  
1.90  
3.20  
2.00  
3.30  
2.10  
DD  
= 3.3 V  
S0, S1, X1  
OE  
V
– 0.5  
V
DD  
DD  
2.0  
S0, S1, X1  
OE  
0
0.5  
0.8  
IL  
C
C
Internal Crystal Capacitance, X1 & X2  
Input Capacitance, S0, S1, OE  
0
pF  
pF  
x
5.0  
in  
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit  
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared  
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit  
values are applied individually under normal operating conditions and not valid simultaneously.  
3. PECL output parameters vary 1:1 with V  
.
DD  
4. S0 and S1 default to V B 2 when left open.  
DD  
Table 7. AC CHARACTERISTICS (V = 3.0 V to 5.5 V, GND = 0 V, T = 40°C to +85°C (Note 5))  
DD  
A
Symbol  
Characteristic  
Min  
10  
5
Typ  
Max  
27  
Unit  
MHz  
MHz  
MHz  
mV  
%
f
f
f
Crystal Input Frequency  
Xtal  
Input Clock Frequency (Note 8)  
Output Frequency Range  
52  
CLK  
OUT  
50  
550  
48  
10  
200  
V
Output Amplitude  
680  
out pkpk  
DC  
Clock Output Duty Cycle (Note 8)  
PLL Bandwidth (Note 8)  
52  
PLL  
kHz  
ps  
BW  
jitter (pd)  
jitter (pd)  
t
t
Period Jitter (RMS, 1s, 10,000 Cycles)  
Period Jitter (PeaktoPeak, 10,000 Cycles)  
Output Rise and Fall Times (Note 8)  
10  
$20  
500  
ps  
tr/tf  
50  
270  
ps  
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit  
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared  
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit  
values are applied individually under normal operating conditions and not valid simultaneously.  
5. PECL outputs loaded with external resistors for proper operation (see Figure 4).  
6. V  
and V can be set by the external resistors, which can be modified.  
OH  
OL  
7. The crystal should be fundamental mode, parallel resonant. Do not use third overtone. For exact tuning when using a crystal, capacitors  
should be connected from pins X1 to ground and X2 to ground. The value of these capacitors is given by the following equation, where CL  
is the specified crystal load capacitance: Crystal caps (pF) = (CL5) x 2. So, for a crystal with 16 pF load capacitance, use two 22 pF caps.  
8. Guaranteed by design and characterization.  
http://onsemi.com  
4
 
NB4N507A  
V
DD  
GND  
V
DD  
NB4N507  
z = 50 W  
z = 50 W  
62 W  
D
PECL  
Driver  
PECL  
Receiver  
V
DD  
62 W  
D
z = 50 W  
z = 50 W  
270 W  
GND  
GND  
GND  
Figure 4. Recommended PECL Output Loading for the NB4N507A  
APPLICATIONS INFORMATION  
High Frequency Differential PECL Oscillators: The  
NB4N507A. Since the output of the chip is phaselocked to  
the input, the NB4N507A has no temperature dependence,  
and the temperature coefficient of the combined system is  
the same as that of the low frequency TCXO.  
NB4N507A, along with a low frequency fundamental mode  
crystal, can build a high frequency differential PECL output  
oscillator. For example, a 10 MHz crystal connected to the  
NB4N507A with the 12X output selected (S1 = 0, S0 = 1)  
produces a 120 MHz PECL output clock.  
High Frequency VCXO: The bandwidth of the PLL is  
guaranteed to be greater than 10 kHz. This means that the  
PLL will track any modulation on the input with a frequency  
of less than 10 kHz. By using this property, a low frequency  
VCXO can be built. The output can then be multiplied by the  
NB4N507A, thereby producing a high frequency VCXO.  
High Frequency TCXO: Extending the previous  
application, an inexpensive, low frequency TCXO can be  
built and the output frequency can be multiplied using the  
Decoupling and External Components  
The NB4N507A requires a 0.01 mF decoupling capacitor  
to be connected between V and GND on pins 2 and 5. It  
DD  
must be connected close to the NB4N507A. Other V and  
DD  
GND connections should be connected to those pins, or to the  
V
DD  
and GND planes on the board. Another four resistors are  
needed for the PECL outputs as shown on the block diagram  
in Figure 1. Suggested values of these resistors are shown in  
the Block Diagram, but they can be varied to change the  
differential pair output swing, and the DC level.  
ORDERING INFORMATION  
Device  
NB4N507AD  
Package  
Shipping  
SOIC16  
48 Units / Rail  
48 Units / Rail  
NB4N507ADG  
SOIC16  
(PbFree)  
NB4N507ADR2  
SOIC16  
2500 / Tape & Reel  
2500 / Tape & Reel  
NB4N507ADR2G  
SOIC16  
(PbFree)  
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging  
Specifications Brochure, BRD8011/D.  
http://onsemi.com  
5
NB4N507A  
Resource Reference of Application Notes  
AN1405/D  
AN1406/D  
AN1503/D  
AN1504/D  
AN1568/D  
AN1672/D  
AND8001/D  
AND8002/D  
AND8020/D  
AND8066/D  
AND8090/D  
ECL Clock Distribution Techniques  
Designing with PECL (ECL at +5.0 V)  
ECLinPSt I/O SPiCE Modeling Kit  
Metastability and the ECLinPS Family  
Interfacing Between LVDS and ECL  
The ECL Translator Guide  
Odd Number Counters Design  
Marking and Date Codes  
Termination of ECL Logic Devices  
Interfacing with ECLinPS  
AC Characteristics of ECL Devices  
http://onsemi.com  
6
NB4N507A  
PACKAGE DIMENSIONS  
SOIC16  
D SUFFIX  
CASE 751B05  
ISSUE J  
A−  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
16  
9
8
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DIMENSIONS A AND B DO NOT INCLUDE  
MOLD PROTRUSION.  
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)  
PER SIDE.  
5. DIMENSION D DOES NOT INCLUDE DAMBAR  
PROTRUSION. ALLOWABLE DAMBAR  
PROTRUSION SHALL BE 0.127 (0.005) TOTAL  
IN EXCESS OF THE D DIMENSION AT  
MAXIMUM MATERIAL CONDITION.  
B−  
P 8 PL  
M
S
B
0.25 (0.010)  
1
G
MILLIMETERS  
INCHES  
MIN  
DIM MIN  
MAX  
10.00  
4.00  
1.75  
0.49  
1.25  
MAX  
0.393  
0.157  
0.068  
0.019  
0.049  
F
A
B
C
D
F
9.80  
3.80  
1.35  
0.35  
0.40  
0.386  
0.150  
0.054  
0.014  
0.016  
R X 45  
K
_
C
G
J
1.27 BSC  
0.050 BSC  
T−  
SEATING  
PLANE  
0.19  
0.10  
0
0.25  
0.25  
7
0.008  
0.004  
0
0.009  
0.009  
7
J
M
K
M
P
R
D
16 PL  
_
_
_
_
5.80  
0.25  
6.20  
0.50  
0.229  
0.010  
0.244  
0.019  
M
S
S
0.25 (0.010)  
T B  
A
ECLinPS is a trademark of Semiconductor Components INdustries, LLC (SCILLC).  
ON Semiconductor and  
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice  
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All  
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights  
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications  
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should  
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,  
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death  
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal  
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.  
PUBLICATION ORDERING INFORMATION  
LITERATURE FULFILLMENT:  
N. American Technical Support: 8002829855 Toll Free  
USA/Canada  
Europe, Middle East and Africa Technical Support:  
Phone: 421 33 790 2910  
Japan Customer Focus Center  
Phone: 81357733850  
ON Semiconductor Website: www.onsemi.com  
Order Literature: http://www.onsemi.com/orderlit  
Literature Distribution Center for ON Semiconductor  
P.O. Box 5163, Denver, Colorado 80217 USA  
Phone: 3036752175 or 8003443860 Toll Free USA/Canada  
Fax: 3036752176 or 8003443867 Toll Free USA/Canada  
Email: orderlit@onsemi.com  
For additional information, please contact your local  
Sales Representative  
NB4N507A/D  

相关型号:

NB4N507A_06

3.3V/5V, 50 MHz to 200 MHz PECL Clock Synthesizer
ONSEMI

NB4N527S

3.3V, 2.5Gb/s Dual AnyLevel⑩ to LVDS Receiver/Driver/Buffer/Translator with Internal Input Termination
ONSEMI

NB4N527SMN

3.3V, 2.5Gb/s Dual AnyLevel⑩ to LVDS Receiver/Driver/Buffer/Translator with Internal Input Termination
ONSEMI

NB4N527SMNEVB

Evaluation Board Manual for NB4N527S
ONSEMI

NB4N527SMNG

3.3V, 2.5Gb/s Dual AnyLevel⑩ to LVDS Receiver/Driver/Buffer/Translator with Internal Input Termination
ONSEMI

NB4N527SMNR2

3.3V, 2.5Gb/s Dual AnyLevel⑩ to LVDS Receiver/Driver/Buffer/Translator with Internal Input Termination
ONSEMI

NB4N527SMNR2G

3.3V, 2.5Gb/s Dual AnyLevel⑩ to LVDS Receiver/Driver/Buffer/Translator with Internal Input Termination
ONSEMI

NB4N7132

Link Replicator for Fibre Channel, Gigabit Ethernet, HDTV and SATA
ONSEMI

NB4N7132DTG

Link Replicator for Fibre Channel, Gigabit Ethernet, HDTV and SATA
ONSEMI

NB4N7132DTR2G

Link Replicator for Fibre Channel, Gigabit Ethernet, HDTV and SATA
ONSEMI

NB4N840M

3.3V 3.2Gb/s Dual Differential Clock/Data 2 x 2 Crosspoint Switch with CML Output and Internal Termination
ONSEMI

NB4N840MMNEVB

3.3V 3.2Gb/s Dual Differential Clock/Data 2 x 2 Crosspoint Switch with CML Output and Internal Termination
ONSEMI