MSA1162GT1 [ONSEMI]
General Purpose Amplifier Transistors; 通用放大器晶体管
| 型号： | MSA1162GT1 |
| 厂家： | 
ONSEMI |
| 描述： | General Purpose Amplifier Transistors |
| 文件： | 总4页 (文件大小：48K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MSA1162GT1, MSA1162YT1
General Purpose
Amplifier Transistors
PNP Surface Mount
• Moisture Sensitivity Level: 1
• ESD Rating: TBD
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COLLECTOR
3
MAXIMUM RATINGS (T = 25°C)
A
Rating
Collector−Base Voltage
Collector−Emitter Voltage
Emitter−Base Voltage
Symbol
Value
60
Unit
Vdc
V
(BR)CBO
(BR)CEO
(BR)EBO
V
V
50
Vdc
7.0
Vdc
2
1
BASE
EMITTER
Collector Current − Continuous
Collector Current − Peak
THERMAL CHARACTERISTICS
Characteristic
I
100
200
mAdc
mAdc
C
I
C(P)
MARKING DIAGRAM
3
Symbol
Max
200
150
Unit
mW
°C
2
62x
M
1
Power Dissipation
P
D
SC−59
Junction Temperature
T
J
CASE 318D
STYLE 1
62 = Specific Device Code
Storage Temperature
T
stg
−55 to
+150
°C
x
= G or Y
M
= Date Code
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise
noted)
A
ORDERING INFORMATION
{
Device
Package
SC−59
Shipping
Characteristic
Symbol Min Max
Unit
Collector−Emitter Breakdown Voltage (I
V
V
V
50
60
7.0
−
−
Vdc
C
(BR)CEO
(BR)CBO
(BR)EBO
MSA1162GT1
MSA1162YT1
3000/Tape & Reel
3000/Tape & Reel
= 2.0 mAdc, I = 0)
B
SC−59
Collector−Base Breakdown Voltage (I
10 mAdc, I = 0)
=
−
Vdc
Vdc
C
E
Emitter−Base Breakdown Voltage (I
10 mAdc, I = 0)
=
−
†The “T1” suffix refers to a 7 inch reel.
E
C
Collector−Base Cutoff Current (V = 45
I
I
0.1
mAdc
CB
CBO
Vdc, I = 0)
E
Collector−Emitter Cutoff Current
CEO
(V = 10 Vdc, I = 0)
−
−
−
0.1
2.0
1.0
mAdc
mAdc
mAdc
CE
B
(V = 30 Vdc, I = 0)
CE
B
(V = 30 Vdc, I = 0, T = 80°C)
CE
B
A
DC Current Gain (Note 1)
(V = 6.0 Vdc, I = 2.0 mAdc) MSA1162
YT1
h
FE
−
120 240
200 400
CE
C
MSA1162GT1
Collector−Emitter Saturation Voltage (I
V
−
0.5
−
Vdc
C
CE(sat)
= 100 mAdc, I = 10 mAdc)
B
Current−Gain − Bandwidth Product
f
T
MHz
(I = 1 mA, V = 10.0 V, f = 10 MHz)
80
C
CE
1. Pulse Test: Pulse Width ≤ 300 ms, D.C. ≤ 2%.
1
Semiconductor Components Industries, LLC, 2003
Publication Order Number:
MSA1162GT1/D
September, 2003 − Rev. 4
MSA1162GT1, MSA1162YT1
INFORMATION FOR USING THE SC−59 SURFACE MOUNT PACKAGE
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
design. The footprint for the semiconductor packages must
be the correct size to insure proper solder connection
interface between the board and the package. With the
correct pad geometry, the packages will self align when
subjected to a solder reflow process.
0.037
0.95
0.037
0.95
0.094
2.4
0.039
1.0
0.031
0.8
inches
mm
SC−59 POWER DISSIPATION
The power dissipation of the SC−59 is a function of the
pad size. This can vary from the minimum pad size for sol-
dering to the pad size given for maximum power dissipa-
tion. Power dissipation for a surface mount device is deter-
the equation for an ambient temperature T of 25°C, one
can calculate the power dissipation of the device which in
this case is 338 milliwatts.
A
150°C − 25°C
370°C/W
mined by T
, the maximum rated junction temperature
J(max)
PD =
= 338 milliwatts
of the die, Rq , the thermal resistance from the device
JA
junction to ambient; and the operating temperature, T . Us-
A
The 370°C/W assumes the use of the recommended foot-
print on a glass epoxy printed circuit board to achieve a
power dissipation of 338 milliwatts. Another alternative
would be to use a ceramic substrate or an aluminum core
board such as Thermal Clad . Using a board material such
as Thermal Clad, the power dissipation can be doubled us-
ing the same footprint.
ing the values provided on the data sheet, P can be calcu-
D
lated as follows.
TJ(max) − TA
Rq
PD =
JA
The values for the equation are found in the maximum
ratings table on the data sheet. Substituting these values into
SOLDERING PRECAUTIONS
The melting temperature of solder is higher than the rated
temperature of the device. When the entire device is heated
to a high temperature, failure to complete soldering within
a short time could result in device failure. Therefore, the
following items should always be observed in order to
minimize the thermal stress to which the devices are sub-
jected.
• Always preheat the device.
• The delta temperature between the preheat and solder-
ing should be 100°C or less.*
• The soldering temperature and time should not exceed
260°C for more than 10 seconds.
• When shifting from preheating to soldering, the maxi-
mum temperature gradient should be 5°C or less.
• After soldering has been completed, the device should
be allowed to cool naturally for at least three minutes.
Gradual cooling should be used as the use of forced
cooling will increase the temperature gradient and re-
sult in latent failure due to mechanical stress.
• Mechanical stress or shock should not be applied dur-
• When preheating and soldering, the temperature of the
leads and the case must not exceed the maximum tem-
perature ratings as shown on the data sheet. When us-
ing infrared heating with the reflow soldering method,
the difference should be a maximum of 10°C.
ing cooling
* Soldering a device without preheating can cause exces-
sive thermal shock and stress which can result in damage
to the device.
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2
MSA1162GT1, MSA1162YT1
SOLDER STENCIL GUIDELINES
Prior to placing surface mount components onto a printed
The stencil opening size for the surface mounted package
should be the same as the pad size on the printed circuit
board, i.e., a 1:1 registration.
circuit board, solder paste must be applied to the pads. A
solder stencil is required to screen the optimum amount of
solder paste onto the footprint. The stencil is made of brass
or stainless steel with a typical thickness of 0.008 inches.
TYPICAL SOLDER HEATING PROFILE
For any given circuit board, there will be a group of con-
trol settings that will give the desired heat pattern. The op-
erator must set temperatures for several heating zones, and
a figure for belt speed. Taken together, these control set-
tings make up a heating “profile” for that particular circuit
board. On machines controlled by a computer, the comput-
er remembers these profiles from one operating session to
the next. Figure 7 shows a typical heating profile for use
when soldering a surface mount device to a printed circuit
board. This profile will vary among soldering systems but
it is a good starting point. Factors that can affect the profile
include the type of soldering system in use, density and
types of components on the board, type of solder used, and
the type of board or substrate material being used. This pro-
The line on the graph shows the actual temperature that
might be experienced on the surface of a test board at or
near a central solder joint. The two profiles are based on a
high density and a low density board. The Vitronics
SMD310 convection/infrared reflow soldering system was
used to generate this profile. The type of solder used was
62/36/2 Tin Lead Silver with a melting point between
177−189°C. When this type of furnace is used for solder re-
flow work, the circuit boards and solder joints tend to heat
first. The components on the board are then heated by con-
duction. The circuit board, because it has a large surface
area, absorbs the thermal energy more efficiently, then dis-
tributes this energy to the components. Because of this ef-
fect, the main body of a component may be up to 30 degrees
cooler than the adjacent solder joints.
file
shows
temperature
versus
time.
STEP 5
HEATING
ZONES 4 & 7
SPIKE"
STEP 6 STEP 7
VENT COOLING
STEP 1
STEP 2
VENT
STEP 3
HEATING
STEP 4
HEATING
ZONES 3 & 6
SOAK"
PREHEAT
ZONE 1
RAMP"
SOAK" ZONES 2 & 5
RAMP"
205° TO 219°C
PEAK AT
SOLDER JOINT
200°C
150°C
170°C
DESIRED CURVE FOR HIGH
MASS ASSEMBLIES
160°C
150°C
SOLDER IS LIQUID FOR
40 TO 80 SECONDS
(DEPENDING ON
140°C
100°C
MASS OF ASSEMBLY)
100°C
50°C
DESIRED CURVE FOR LOW
MASS ASSEMBLIES
TIME (3 TO 7 MINUTES TOTAL)
T
MAX
Figure 1. Typical Solder Heating Profile
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3
MSA1162GT1, MSA1162YT1
PACKAGE DIMENSIONS
SC−59
CASE 318D−04
ISSUE F
A
NOTES:
ꢀꢁ1. DIMENSIONING AND TOLERANCING PER ANSI
L
Y14.5M, 1982.
ꢀꢁ2. CONTROLLING DIMENSION: MILLIMETER.
MILLIMETERS
DIM MIN MAX
INCHES
MIN MAX
3
S
B
A
B
C
D
G
H
J
2.70
1.30
1.00
0.35
1.70
0.013
0.09
0.20
1.25
2.50
3.10 0.1063 0.1220
1.70 0.0512 0.0669
1.30 0.0394 0.0511
0.50 0.0138 0.0196
2.10 0.0670 0.0826
0.100 0.0005 0.0040
0.18 0.0034 0.0070
0.60 0.0079 0.0236
1.65 0.0493 0.0649
3.00 0.0985 0.1181
2
1
D
G
K
L
S
J
C
STYLE 1:
PIN 1. EMITTER
2. BASE
K
3. COLLECTOR
H
Thermal Clad is a trademark of the Bergquist Company.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make
changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any
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liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be
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MSA1162GT1/D
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