MM74HC08MX [ONSEMI]
四路 2 输入 AND 门极;
| 型号： | MM74HC08MX |
| 厂家： | 
ONSEMI |
| 描述： | 四路 2 输入 AND 门极 栅 光电二极管 逻辑集成电路 触发器 |
| 文件： | 总9页 (文件大小：333K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DATA SHEET
www.onsemi.com
Quad 2-Input AND Gate
MM74HC08
14
1
SOIC−14 NB
CASE 751A−03
General Description
The MM74HC08 AND gates utilize advanced silicon−gate CMOS
technology to achieve operating speeds similar to LS−TTL gates with
the low power consumption of standard CMOS integrated circuits.
The HC08 has buffered outputs, providing high noise immunity
and the ability to drive 10 LS−TTL loads. The 74HC logic family
is functionally as well as pin−out compatible with the standard
74LS logic family. All inputs are protected from damage due to static
14
1
SOIC14
CASE 751EF
discharge by internal diode clamps to V and ground.
CC
Features
14
• Typical Propagation Delay: 12 ns (t ), 7 ns (t
)
PHL
PLH
1
• Fan−out of 10 LS−TTL Loads
TSSOP−14 WB
CASE 948G−01
• Quiescent Power Consumption: 2 mA Maximum at Room
Temperature
• Low Input Current: 1 mA Maximum
• This Device is Pb−Free and Halide Free
MARKING DIAGRAMS
SOIC−14
Connection Diagram
14
V
B4
13
B3
10
A3
9
A4
12
Y4
11
Y3
8
HC08A
AWLYWW
CC
14
1
TSSOP−14
14
HC
08A
ALYWG
G
1
1
A1
2
3
4
5
6
7
A2
Top View
B2
Y2
GND
B1
Y1
HC08A
A
WL, L
Y
= Specific Device Code
= Assembly Location
= Wafer Lot Number
= Year
WW, YW = Work Week
ORDERING INFORMATION
See detailed ordering and shipping information on page 4
of this data sheet.
© Semiconductor Components Industries, LLC, 1983
1
Publication Order Number:
December, 2022 − Rev. 2
MM74HC08/D
MM74HC08
ABSOLUTE MAXIMUM RATINGS (Note 1)
Symbol
Rating
Min
−0.5
−0.5
−0.5
Max
Unit
V
V
CC
Supply Voltage
+7.0
V
IN
DC Input Voltage
V
V
+ 0.5
V
CC
CC
V
OUT
DC Output Voltage
Clamp Diode Current
DC Output Current, per pin
+ 0.5
20
V
I , I
IK OK
mA
mA
mA
°C
I
25
OUT
I
DC V or GND Current, per pin
50
CC
CC
T
STG
Storage Temperature Range
Power Dissipation
−65
+150
P
D
SOIC Package only
500
260
mW
°C
T
L
Lead Temperature (Soldering 10 second)
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Unless otherwise specified all voltages are referenced to ground.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
2
Max
Unit
V
V
CC
Supply Voltage
6
V
IN
, V
DC Input or Output Voltage
Operating Temperature Range
Input Rise or Fall Times
0
V
CC
V
OUT
T
A
−55
−
+125
1000
500
°C
ns
ns
ns
t , t
r
V
CC
V
CC
V
CC
= 2.0 V
= 4.5 V
= 6.0 V
f
−
−
400
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
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2
MM74HC08
DC ELECTRICAL CHARACTERISTICS (Note 2)
T
= −40°C
T = −55°C
A
to 125°C
A
to 85°C
T
A
= 25°C
Typ
Guaranteed Limits
Symbol
Parameter
V
CC
(V)
Conditions
Unit
V
Minimum HIGH Level
Input Voltage
2.0
1.5
1.5
3.15
4.2
1.5
3.15
4.2
0.5
1.35
1.8
1.9
4.4
5.9
3.7
V
IH
4.5
6.0
2.0
4.5
6.0
2.0
4.5
6.0
4.5
3.15
4.2
V
Maximum LOW Level
Input Voltage
0.5
0.5
V
V
IL
1.35
1.8
1.35
1.8
V
OH
Minimum HIGH Level
Output Voltage
V
OUT
= V or V
2.0
4.5
6.0
4.2
1.9
1.9
IN
IH
IL
⎪I
⎪ ≤20 mA
4.4
4.4
5.9
5.9
V
OUT
= V or V
3.98
3.84
IN
IH
IL
⎪I
⎪ ≤4.0 mA
6.0
V
OUT
= V or V
IL
5.7
5.48
5.34
5.2
IN
IH
⎪I
⎪ ≤5.2 mA
V
OL
Maximum LOW Level
Output Voltage
2.0
4.5
6.0
4.5
V
OUT
= V or V
0
0
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.4
V
IN
IH
IL
⎪I
⎪ ≤20 mA
0
0.1
0.1
V
OUT
= V or V
0.2
0.26
0.33
IN
IH
IL
⎪I
⎪ ≤4.0 mA
6.0
V
OUT
= V or V
IL
0.2
0.26
0.33
0.4
IN
IH
⎪I
⎪ ≤5.2 mA
I
Maximum Input Current
6.0
6.0
V
V
= V or GND
0.1
2.0
1.0
20
1.0
40
mA
mA
IN
IN
CC
I
Maximum Quiescent
Supply Current
= V or GND,
CC
= 0 mA
CC
IN
I
OUT
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
2. For a power supply of 5 V 10% the worst case output voltages (V and V ) occur for HC at 4.5 V. Thus the 4.5 V values should be used
OH
OL
when designing with this supply. Worst case V and V occur at V = 5.5 V and 4.5 V respectively. (The V value at 5.5 V is 3.85 V.) The
IH
IL
CC
IH
worst case leakage current (I , I , and I ) occur for CMOS at the higher voltage and so the 6.0 V values should be used.
IN CC
OZ
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3
MM74HC08
AC ELECTRICAL CHARACTERISTICS (V = 5.0 V, T = 25°C, C = 15 pF, t = t = 6 ns)
CC
A
L
r
f
Symbol
Parameter
Conditions
Typ
Guaranteed Limit Unit
t
t
Maximum Propagation Delay, Output HIGH−to−LOW
Maximum Propagation Delay, Output LOW−to−HIGH
12
20
15
ns
ns
PHL
7
PLH
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
AC ELECTRICAL CHARACTERISTICS (V = 2.0 V to 6.0 V, C = 50 pF t = t = 6 ns, (unless otherwise specified))
CC
L
r
f
T
A
= 25°C
T = −40°C to 125°C
A
Typ
77
15
13
30
10
8
Guaranteed Limits
Symbol
Parameter
V
CC
(V)
Conditions
Unit
t
Maximum Propagation Delay,
Output HIGH−to−LOW
2.0
121
175
35
ns
PHL
4.5
6.0
2.0
4.5
6.0
2.0
4.5
6.0
24
20
90
18
15
75
15
13
30
t
Maximum Propagation Delay,
Output LOW−to−HIGH
134
27
ns
ns
PLH
23
t
t
Maximum Output Rise and Fall Time
30
8
110
22
TLH, THL
7
19
C
Power Dissipation Capacitance
(Note 3)
(per gate)
38
pF
pF
PD
C
Maximum Input Capacitance
4
10
10
IN
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
2
3. C determines the no load dynamic power consumption, P = C
V
f + I V , and the no load dynamic current consumption,
PD
D
PD CC
CC CC
I
= C
V
f + I
.
S
PD CC
CC
ORDERING INFORMATION
Device
†
Package
Shipping
MM74HC08M
SOIC−14 NB, Case 751A−03
(Pb−Free and Halide Free)
55 Units / Tube
MM74HC08MX
SOIC 14, Case 751EF
(Pb−Free and Halide Free)
2500 Units / Tape & Reel
MM74HC08MTC
MM74HC08MTCX
TSSOP−14 WB, Case 948G−01
(Pb−Free and Halide Free)
96 Units / Tube
2500 Units / Tape & Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
NOTE: All packages are lead free per JEDEC: J−STD−020B standard.
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4
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SOIC−14 NB
CASE 751A−03
ISSUE L
14
1
DATE 03 FEB 2016
SCALE 1:1
NOTES:
D
A
B
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION
SHALL BE 0.13 TOTAL IN EXCESS OF AT
MAXIMUM MATERIAL CONDITION.
4. DIMENSIONS D AND E DO NOT INCLUDE
MOLD PROTRUSIONS.
14
8
7
A3
E
H
5. MAXIMUM MOLD PROTRUSION 0.15 PER
SIDE.
L
DETAIL A
1
MILLIMETERS
DIM MIN MAX
INCHES
MIN MAX
13X b
M
M
B
0.25
A
A1
A3
b
D
E
1.35
0.10
0.19
0.35
8.55
3.80
1.75 0.054 0.068
0.25 0.004 0.010
0.25 0.008 0.010
0.49 0.014 0.019
8.75 0.337 0.344
4.00 0.150 0.157
M
S
S
B
0.25
C A
DETAIL A
h
A
X 45
_
e
H
h
L
1.27 BSC
0.050 BSC
6.20 0.228 0.244
0.50 0.010 0.019
1.25 0.016 0.049
5.80
0.25
0.40
0
0.10
M
A1
e
M
7
0
7
_
_
_
_
SEATING
PLANE
C
GENERIC
MARKING DIAGRAM*
SOLDERING FOOTPRINT*
6.50
14
14X
1.18
XXXXXXXXXG
AWLYWW
1
1
XXXXX = Specific Device Code
A
WL
Y
= Assembly Location
= Wafer Lot
= Year
1.27
PITCH
WW
G
= Work Week
= Pb−Free Package
14X
0.58
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “G”, may
or may not be present. Some products may
not follow the Generic Marking.
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
STYLES ON PAGE 2
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98ASB42565B
SOIC−14 NB
PAGE 1 OF 2
onsemi and
are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves
the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular
purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation
special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
SOIC−14
CASE 751A−03
ISSUE L
DATE 03 FEB 2016
STYLE 1:
STYLE 2:
CANCELLED
STYLE 3:
STYLE 4:
PIN 1. NO CONNECTION
2. CATHODE
PIN 1. COMMON CATHODE
2. ANODE/CATHODE
3. ANODE/CATHODE
4. NO CONNECTION
5. ANODE/CATHODE
6. NO CONNECTION
7. ANODE/CATHODE
8. ANODE/CATHODE
9. ANODE/CATHODE
10. NO CONNECTION
11. ANODE/CATHODE
12. ANODE/CATHODE
13. NO CONNECTION
14. COMMON ANODE
PIN 1. NO CONNECTION
2. ANODE
3. ANODE
4. NO CONNECTION
5. ANODE
6. NO CONNECTION
7. ANODE
8. ANODE
9. ANODE
10. NO CONNECTION
11. ANODE
12. ANODE
13. NO CONNECTION
14. COMMON CATHODE
3. CATHODE
4. NO CONNECTION
5. CATHODE
6. NO CONNECTION
7. CATHODE
8. CATHODE
9. CATHODE
10. NO CONNECTION
11. CATHODE
12. CATHODE
13. NO CONNECTION
14. COMMON ANODE
STYLE 5:
STYLE 6:
STYLE 7:
STYLE 8:
PIN 1. COMMON CATHODE
2. ANODE/CATHODE
3. ANODE/CATHODE
4. ANODE/CATHODE
5. ANODE/CATHODE
6. NO CONNECTION
7. COMMON ANODE
8. COMMON CATHODE
9. ANODE/CATHODE
10. ANODE/CATHODE
11. ANODE/CATHODE
12. ANODE/CATHODE
13. NO CONNECTION
14. COMMON ANODE
PIN 1. CATHODE
2. CATHODE
3. CATHODE
4. CATHODE
5. CATHODE
6. CATHODE
7. CATHODE
8. ANODE
PIN 1. ANODE/CATHODE
2. COMMON ANODE
3. COMMON CATHODE
4. ANODE/CATHODE
5. ANODE/CATHODE
6. ANODE/CATHODE
7. ANODE/CATHODE
8. ANODE/CATHODE
9. ANODE/CATHODE
10. ANODE/CATHODE
11. COMMON CATHODE
12. COMMON ANODE
13. ANODE/CATHODE
14. ANODE/CATHODE
PIN 1. COMMON CATHODE
2. ANODE/CATHODE
3. ANODE/CATHODE
4. NO CONNECTION
5. ANODE/CATHODE
6. ANODE/CATHODE
7. COMMON ANODE
8. COMMON ANODE
9. ANODE/CATHODE
10. ANODE/CATHODE
11. NO CONNECTION
12. ANODE/CATHODE
13. ANODE/CATHODE
14. COMMON CATHODE
9. ANODE
10. ANODE
11. ANODE
12. ANODE
13. ANODE
14. ANODE
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98ASB42565B
SOIC−14 NB
PAGE 2 OF 2
onsemi and
are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves
the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular
purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation
special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SOIC14
CASE 751EF
ISSUE O
DATE 30 SEP 2016
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98AON13739G
SOIC14
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
TSSOP−14 WB
CASE 948G
ISSUE C
14
DATE 17 FEB 2016
1
SCALE 2:1
NOTES:
14X K REF
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
M
S
S
V
0.10 (0.004)
T U
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL
IN EXCESS OF THE K DIMENSION AT
MAXIMUM MATERIAL CONDITION.
S
0.15 (0.006) T U
N
0.25 (0.010)
14
8
2X L/2
M
B
L
N
−U−
PIN 1
IDENT.
F
7
1
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
DETAIL E
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
S
K
0.15 (0.006) T U
A
−V−
MILLIMETERS
DIM MIN MAX
INCHES
MIN MAX
K1
A
B
C
D
F
G
H
J
4.90
4.30
−−−
0.05
0.50
5.10 0.193 0.200
4.50 0.169 0.177
J J1
1.20
−−− 0.047
0.15 0.002 0.006
0.75 0.020 0.030
SECTION N−N
0.65 BSC
0.026 BSC
0.60 0.020 0.024
0.20 0.004 0.008
0.16 0.004 0.006
0.30 0.007 0.012
0.25 0.007 0.010
0.50
0.09
0.09
0.19
J1
K
−W−
C
K1 0.19
L
M
6.40 BSC
0.252 BSC
0.10 (0.004)
0
8
0
8
_
_
_
_
SEATING
PLANE
−T−
H
G
DETAIL E
D
GENERIC
MARKING DIAGRAM*
14
SOLDERING FOOTPRINT
XXXX
XXXX
ALYWG
G
7.06
1
1
A
L
= Assembly Location
= Wafer Lot
Y
W
G
= Year
= Work Week
= Pb−Free Package
0.65
PITCH
(Note: Microdot may be in either location)
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “G”, may
or may not be present. Some products may
not follow the Generic Marking.
01.34X6
14X
1.26
DIMENSIONS: MILLIMETERS
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98ASH70246A
TSSOP−14 WB
PAGE 1 OF 1
onsemi and
are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves
the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular
purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation
special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
onsemi,
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates
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