MM5ZXXXST1G [ONSEMI]

Zener Voltage Regulators 200 mW SOD-523 Surface Mount; 齐纳稳压器为200 ​​mW SOD- 523表面贴装
MM5ZXXXST1G
型号: MM5ZXXXST1G
厂家: ONSEMI    ONSEMI
描述:

Zener Voltage Regulators 200 mW SOD-523 Surface Mount
齐纳稳压器为200 ​​mW SOD- 523表面贴装

稳压器
文件: 总4页 (文件大小:49K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
MM5Z2V4ST1 SERIES  
Zener Voltage Regulators  
200 mW SOD−523 Surface Mount  
This series of Zener diodes is packaged in a SOD−523 surface  
mount package. They are designed to provide voltage regulation  
protection and are especially attractive in situations where space is at a  
premium. They are well suited for applications such as cellular  
phones, hand held portables, and high density PC boards.  
http://onsemi.com  
Specification Features  
1
2
Standard Zener Breakdown Voltage Range −2.4 V to 18 V  
Steady State Power Rating of 200 mW  
Cathode  
Anode  
Small Body Outline Dimensions:  
0.047x 0.032(1.20 mm x 0.80 mm)  
2
Low Body Height: 0.028(0.7 mm)  
1
ESD Rating of Class 3 (>16 kV) per Human Body Model  
Tight Tolerance V  
Z
SOD−523  
CASE 502  
PLASTIC  
These are Pb−Free Devices  
Mechanical Characteristics  
CASE: Void-free, transfer-molded, thermosetting plastic  
Epoxy Meets UL 94, V−0  
LEAD FINISH: 100% Matte Sn (Tin)  
MOUNTING POSITION: Any  
MARKING DIAGRAM  
XX MG  
G
2
1
QUALIFIED MAX REFLOW TEMPERATURE: 260°C  
Device Meets MSL 1 Requirements  
XX = Specific Device Code  
M
Date Code*  
G
= Pb−Free Package  
MAXIMUM RATINGS  
(Note: Microdot may be in either location)  
Rating  
Symbol  
Max  
Unit  
*Date Code orientation may vary depending  
upon manufacturing location.  
Total Device Dissipation FR−5 Board,  
P
D
(Note 1) @ T = 25°C  
200  
1.5  
mW  
mW/°C  
A
Derate above 25°C  
ORDERING INFORMATION  
Thermal Resistance from  
Junction−to−Ambient  
R
q
JA  
635  
°C/W  
Device  
Package  
Shipping  
Junction and Storage Temperature Range  
T , T  
−65 to  
+150  
°C  
J
stg  
MM5ZxxxST1  
MM5ZxxxST1G  
SOD−523* 3000/Tape & Reel  
SOD−523* 3000/Tape & Reel  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
1. FR−4 Minimum Pad.  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
*This package is inherently Pb−Free.  
DEVICE MARKING INFORMATION  
See specific marking information in the device marking  
column of the Electrical Characteristics table on page 2 of  
this data sheet.  
©
Semiconductor Components Industries, LLC, 2006  
1
Publication Order Number:  
April, 2006 − Rev. 6  
MM5Z2V4ST1/D  
 
MM5Z2V4ST1 SERIES  
ELECTRICAL CHARACTERISTICS  
(T = 25°C unless otherwise noted,  
A
I
V
= 0.9 V Max. @ I = 10 mA for all types)  
F
F
I
F
Symbol  
Parameter  
Reverse Zener Voltage @ I  
V
Z
ZT  
I
Reverse Current  
ZT  
Z
Maximum Zener Impedance @ I  
Reverse Current  
ZT  
ZK  
ZT  
ZK  
V
V
R
Z
V
I
V
R
ZT  
F
I
ZK  
I
Z
Maximum Zener Impedance @ I  
I
Reverse Leakage Current @ V  
Reverse Voltage  
R
R
V
R
I
Forward Current  
F
V
Forward Voltage @ I  
F
F
Figure 1. Zener Voltage Regulator  
QV  
Maximum Temperature Coefficient of V  
Z
Z
C
Max. Capacitance @V = 0 and f = 1 MHz  
R
ELECTRICAL CHARACTERISTICS (VF = 0.9 Max @ IF = 10 mA for all types)  
Z
= IZT  
@ 10%  
Mod W  
Max  
ZT  
Zener Voltage  
VZ  
Max  
IR @ VR  
d
@ I  
/dt (mV/k)  
VZ  
I
Z
I
Z
Z
ZK  
= 5 mA  
ZT1  
Test  
C pF Max @  
= 1.0  
mA W  
Max  
Device  
Marking  
Current  
Izt mA  
V = 0  
R
f = 1 MHz  
Min  
Max  
mA  
V
Min  
Max  
Device*  
MM5Z2V4ST1  
MM5Z2V7ST1  
MM5Z3V3ST1  
MM5Z3V6ST1  
MM5Z3V9ST1  
T2  
T3  
T5  
T6  
T7  
5.0  
5.0  
5.0  
5.0  
5.0  
2.43  
2.67  
3.32  
3.60  
3.89  
2.63  
2.91  
3.53  
3.85  
4.16  
1000  
1000  
1000  
1000  
1000  
100  
100  
95  
120  
100  
5.0  
5.0  
3.0  
1.0  
1.0  
1.0  
1.0  
1.0  
−3.5  
−3.5  
−3.5  
−3.5  
−3.5  
0
0
450  
450  
450  
450  
450  
0
90  
0
90  
−2.5  
MM5Z4V3ST1  
MM5Z4V7ST1  
MM5Z5V1ST1  
MM5Z5V6ST1  
MM5Z6V2ST1  
MM5Z6V8ST1  
MM5Z7V5ST1  
MM5Z8V2ST1  
MM5Z9V1ST1  
MM5Z12VST1  
T8  
T9  
TA  
TC  
TE  
TF  
TG  
TH  
TK  
TN  
5.0  
5.0  
5.0  
5.0  
5.0  
5.0  
5.0  
5.0  
5.0  
5.0  
4.17  
4.55  
4.98  
5.49  
6.06  
6.65  
7.28  
8.02  
8.85  
11.74  
4.43  
4.75  
5.2  
1000  
800  
500  
200  
100  
160  
160  
160  
160  
80  
90  
80  
60  
40  
10  
15  
15  
15  
15  
25  
3.0  
3.0  
2.0  
1.0  
3.0  
2.0  
1.0  
0.7  
0.5  
0.1  
1.0  
2.0  
2.0  
2.0  
4.0  
4.0  
5.0  
5.0  
6.0  
8.0  
−3.5  
−3.5  
−2.7  
−2.0  
0.4  
0
450  
260  
225  
200  
185  
155  
140  
135  
130  
130  
0.2  
1.2  
2.5  
3.7  
4.5  
5.3  
6.2  
7.0  
10  
5.73  
6.33  
6.93  
7.6  
1.2  
2.5  
8.36  
9.23  
12.24  
3.2  
3.8  
6.0  
MM5Z16VST1  
MM5Z18VST1  
TU  
5.0  
5.0  
15.85  
17.56  
16.51  
18.35  
80  
80  
40  
45  
0.05  
0.05  
11.2  
12.6  
10.4  
12.4  
14  
16  
105  
100  
TW  
*The “G’’ suffix indicates Pb−Free package available.  
http://onsemi.com  
2
MM5Z2V4ST1 SERIES  
100  
80  
60  
40  
20  
0
0
25  
50  
75  
100  
125  
150  
TEMPERATURE (°C)  
Figure 2. Steady State Power Derating  
http://onsemi.com  
3
MM5Z2V4ST1 SERIES  
PACKAGE DIMENSIONS  
SOD−523  
CASE 502−01  
ISSUE B  
−X−  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: MILLIMETER.  
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD  
FINISH THICKNESS. MINIMUM LEAD THICKNESS  
IS THE MINIMUM THICKNESS OF BASE  
MATERIAL.  
A
−Y−  
B
1
2
MILLIMETERS  
NOM  
INCHES  
NOM  
D 2 PL  
DIM MIN  
MAX  
1.30  
0.90  
0.70  
0.35  
MIN  
MAX  
0.051  
0.035  
0.028  
0.014  
A
B
C
D
J
1.10  
1.20  
0.80  
0.60  
0.30  
0.14  
0.20  
1.60  
0.043  
0.028  
0.020  
0.010  
0.047  
0.032  
0.024  
0.012  
M
0.08 (0.003)  
T
X
Y
0.70  
0.50  
0.25  
0.07  
0.15  
1.50  
0.20 0.0028 0.0055 0.0079  
K
S
0.25  
1.70  
0.006  
0.059  
0.008  
0.063  
0.010  
0.067  
C
−T−  
SEATING  
PLANE  
K
J
S
SOLDERING FOOTPRINT*  
1.40  
0.0547  
0.40  
0.0157  
0.40  
0.0157  
mm  
inches  
ǒ
Ǔ
SCALE 10:1  
*For additional information on our Pb−Free strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
ON Semiconductor and  
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice  
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All  
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights  
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications  
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should  
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,  
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death  
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal  
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.  
PUBLICATION ORDERING INFORMATION  
LITERATURE FULFILLMENT:  
N. American Technical Support: 800−282−9855 Toll Free  
USA/Canada  
ON Semiconductor Website: http://onsemi.com  
Order Literature: http://www.onsemi.com/litorder  
Literature Distribution Center for ON Semiconductor  
P.O. Box 61312, Phoenix, Arizona 85082−1312 USA  
Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada  
Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada  
Email: orderlit@onsemi.com  
Japan: ON Semiconductor, Japan Customer Focus Center  
2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051  
Phone: 81−3−5773−3850  
For additional information, please contact your  
local Sales Representative.  
MM5Z2V4ST1/D  

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