MID400SV [ONSEMI]
8 引脚 DIP 交流线路监视器逻辑输出光耦合器;型号: | MID400SV |
厂家: | ONSEMI |
描述: | 8 引脚 DIP 交流线路监视器逻辑输出光耦合器 监视器 输出元件 光电 |
文件: | 总12页 (文件大小:351K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
DATA SHEET
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AC Line Monitor Logic-Out
Device
PDIP8 6.6x3.81, 2.54P
CASE 646BW
8
1
MID400
PDIP8 9.655x6.6, 2.54P
CASE 646CQ
8
8
Description
1
1
The MID400 is an optically isolated AC line−to−logic interface
device. It is packaged in an 8−lead plastic DIP. The AC line voltage is
monitored by two back−to−back GaAs LED diodes in series with an
external resistor. A high gain detector circuit senses the LED current
and drives the output gate to a logic low condition.
The MID400 has been designed solely for the use as an AC line
monitor. It is recommended for use in any AC−to−DC control
application where excellent optical isolation, solid state reliability,
TTL compatibility, small size, low power, and low frequency
operations are required.
PDIP8 GW
CASE 709AC
MARKING DIAGRAM
ON
MID400
VXXYYT1
Features
MID400 = Specific Device Code
• Direct Operation from any Line Voltage with the Use of an External
V
= DIN EN/IEC60747−5−5 Option (only
appears on component ordered with
this option)
Resistor
• Externally Adjustable Time Delay
XX
YY
= Two−Digit Year Code, e.g., “06”
= Digit Work Week, Ranging from “01”
to “53”
• Externally Adjustable AC Voltage Sensing Level
• Logic Level Compatibility
T1
= Assembly Package Code
• Safety and Regulatory Approvals:
♦ UL1577, 2,500 VAC
for 1 Minute
RMS
FUNCTIONAL SCHEMATIC
♦ DIN−EN/IEC60747−5−5, 630 V Peak Working Insulation Voltage
Applications
• Monitoring of the AC/DC “Line−down” Condition
1
2
3
4
8
7
6
5
VCC
AUX
VO
• “Closed−loop” Interface between Electromechanical Elements such
as Solenoids, Relay Contacts, Small Motors, and Microprocessors
• Time Delay Isolation Switch
N/C
N/C
GND
ORDERING INFORMATION
See detailed ordering and shipping information on page 8 of
this data sheet.
© Semiconductor Components Industries, LLC, 2005
1
Publication Order Number:
October, 2022 − Rev. 3
MID400/D
MID400
SAFETY AND INSULATION RATINGS (As per DIN EN/IEC 60747−5−5, this optocoupler is suitable for “safe electrical insulation”
only within the safety limit data. Compliance with the safety ratings shall be ensured by means of protective circuits.)
Parameter
Characteristics
Installation Classifications per DIN VDE 0110/1.89 Table 1, For Rated Mains Voltage <150 V
I–IV
I–IV
RMS
<300 V
RMS
Climatic Classification
55/100/21
2
Pollution Degree (DIN VDE 0110/1.89)
Comparative Tracking Index
175
Symbol
Parameter
Value
Unit
V
PR
Input−to−Output Test Voltage, Method A, V
x 1.6 = V , Type and Sample Test
1008
V
peak
IORM
PR
with t = 10 s, Partial Discharge < 5 pC
m
Input−to−Output Test Voltage, Method B, V
x 1.875 = V , 100% Production Test
1182
V
peak
IORM
PR
with t = 1 s, Partial Discharge < 5 pC
m
V
Maximum Working Insulation Voltage
Highest Allowable Over−Voltage
External Creepage
630
6000
≥7
V
V
IORM
peak
V
IOTM
peak
mm
mm
mm
°C
External Clearance
≥7
DTI
Distance Through Insulation (Insulation Thickness)
Case Temperature (Note 1)
≥0.4
150
60
T
S
I
Input Current (Note 1)
mA
mW
W
S,INPUT
P
Output Power (Note 1)
150
S,OUTPUT
9
R
Insulation Resistance at T , V = 500 V (Note 1)
>10
IO
S
IO
1. Safety limit values – maximum values allowed in the event of a failure.
ABSOLUTE MAXIMUM RATINGS
Symbol
Parameter
Value
−55 to +125
Unit
°C
T
Storage Temperature
Operating Temperature
Junction Temperature
STG
OPR
T
−40 to +85
°C
T
J
−55 to +100
°C
T
SOL
Lead Solder Temperature (Wave soldering only. See recommended reflow profile
graph for SMD mounting)
260 for 10 seconds
°C
P
D
Total Device Power Dissipation @ T = 25°C
115
4
mW
A
Derate Above 70°C
mW/°C
EMITTER
RMS Current
DC Current
25
30
45
2
mA
mA
P
LED Power Dissipation @ T = 25°C
mW
D(EMITTER)
A
Derate Above 70°C
mW/°C
DETECTOR
I
Low Level Output Current
High Level Output Voltage
Supply Voltage
20
7
mA
V
OL
V
OH
CC
V
7
V
P
Detector Power Dissipation @ T = 25°C
70
2
mW
mW/°C
D(DETECTOR)
A
Derate Above 70°C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
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2
MID400
ELECTRICAL CHARACTERISTICS (0°C to 70°C Free Air Temperature unless otherwise specified)
Symbol
Parameter
Test Conditions
Min
Typ
Max
Unit
INDIVIDUAL COMPONENT CHARACTERISTICS
EMITTER
V
Input Forward Voltage
I
=
30 mA
−
−
−
−
1.5
3.0
V
F
IN(DC)
DETECTOR
I
Logic Low Output Supply Current
I
= 4.0 mA,
mA
CCL
IN(RMS)
V
= Open, V = 5.5V,
O
CC
24 V ≤ V
≤ 240 V
IN(ON_RMS)
I
Logic High Output Supply Current
I
V
V
= 0.15 mA,
−
−
0.8
mA
CCH
IN(RMS)
CC
= 5.5 V,
≥ 5.5 V
IN(OFF_RMS)
TRANSFER CHARACTERISTICS
DC CHARACTERISTICS
V
Logic Low Output Current
Logic High Output Current
On−state RMS Input Voltage
Off−state RMS Input Voltage
On−state RMS Input Current
Off−state RMS Input Current
I
= I
CC
, I = 16 mA,
−
−
0.18
0.02
−
0.40
100
−
V
mA
V
OL
IN
IN(ON_RMS)
O
V
= 4.5 V,
24 V ≤ V
≤ 240 V
IN(ON_RMS)
I
I
= 0.15 mA,
OH
IN(RMS)
V
= V = 5.5 V,
IN(OFF_RMS)
O
CC
V
≥ 5.5 V
V
I
= 16 mA,
90
−
IN(ON_RMS)
O
V
= 0.4 V, V = 4.5 V,
O
CC
R
= 22 kW
IN
V
I
I
≤ 100 mA,
−
5.5
−
V
IN(OFF_RMS)
IN(ON_RMS)
IN(OFF_RMS)
O
V
= V = 5.5 V,
O
CC
R
= 22 kW
IN
I
= 16 mA,
= 0.4 V, V = 4.5 V,
4.0
−
−
mA
mA
O
V
O
CC
IN(ON_RMS)
24 V ≤ V
≤ 240 V
I
I
≤ 100 mA,
= V = 5.5 V,
IN(OFF_RMS)
−
0.15
O
V
O
CC
V
≥ 5.5 V
AC CHARACTERISTICS
t
Turn−On Time
Turn−Off Time
I
= 4.0 mA, I = 16 mA,
−
−
1.0
1.0
−
−
ms
ms
ON
IN(RMS)
CC
O
V
= 4.5 V, R = 22 kW
IN
t
(See figure 3)
OFF
ISOLATION CHARACTERISTICS
V
ISO
Steady State Isolation Voltage
Relative Humidity ≤ 50%,
I−O
2,500
−
−
VAC
RMS
I
≤ 10 mA, 1 Minute, 60 Hz
C
R
Isolation Capacitance
Isolation Resistance
f = 1 MHz
= 500 VDC
−
−
−
2
pF
ISO
ISO
11
V
10
−
W
I−O
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
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3
MID400
APPLICATION INFORMATION
GLOSSARY
Voltages
The input of the MID400 consists of two back−to−back
LED diodes which will accept and convert alternating
currents into light energy. An integrated photo
diode−detector amplifier forms the output network. Optical
V
IN (ON_RMS)
On−State RMS Input Voltage
coupling between input and output provides 2500 VAC
The RMS voltage at an input terminal for a specified input
current with output conditions applied according to the
product specification will cause the output switching
element to be sustained in the on−state within one full cycle.
RMS
voltage isolation. A very high current transfer ratio (defined
as the ratio of the DC output current and the DC input
current) is achieved through the use of high gain amplifier.
The detector amplifier circuitry operates from a 5 V DC
supply and drives an open collector transistor output. The
switching times are intentionally designed to be slow in
order to enable the MID400, when used as an AC line
monitor, to respond only to changes in input voltage
exceeding many milliseconds. The short period of time
during zero−crossing which occurs once every half cycle of
the power line is completely ignored. To operate the
V
IN (OFF_RMS)
Off−State RMS Input Voltage
The RMS voltage at an input terminal for a specified input
current with output conditions applied according to the
product specification will cause the output switching
element to be sustained in the off−state within one full cycle.
V
OL
Low−Level Output Voltage
The voltage at an output terminal for a specific output
MID400, always add a resistor, R , in series with the input
IN
(as shown in figure 2) to limit the current to the required
value. The value of the resistor can be determined by the
following equation:
current I , with input conditions applied according to the
OL
product specification will establish a low−level at the output.
VIN * VF
V
OH
RIN
+
(eq. 1)
High−Level Output Voltage
IIN
The voltage at an output terminal for a specific output
Where,
(RMS) is the input voltage.
current I , with input conditions applied according to the
OH
V
IN
product specification will establish a high−level at the
output.
V is the forward voltage drop across the LED.
F
I
(RMS) is the desired input current required to sustain a
V
F
IN
logic “O” on the output.
LED Forward Voltage
The voltage developed across the LED when input current
I is applied to the anode of the LED.
F
PIN DESCRIPTION
Pin
Number
Pin
Name
Currents
Description
I
IN (ON_RMS)
1, 3
2, 4
8
V
, V
Input terminals
No Connect
IN1
IN2
On−State RMS Input Current
N/C
The RMS current flowing into an input with output
conditions applied according to the product specification
will cause the output switching element to be sustained in the
on−state within one full cycle.
V
CC
Supply voltage, output circuit.
7
AUX
Auxiliary terminal.
Programmable capacitor input to adjust
AC voltage sensing level and time delay.
I
IN (OFF_RMS)
6
5
V
O
Output terminal; open collector.
Circuit ground potential.
Off−state RMS Input Current
The RMS current flowing into an input with output
conditions applied according to the product specification
will cause the output switching element to be sustained in the
off−state within one full cycle.
GND
SCHEMATIC DIAGRAM
I
OH
VIN1
N/C
VIN2
N/C
1
2
3
4
8
7
6
5
VCC
AUX.
VO
High−Level Output Current
The current flowing into an output with input conditions
applied according to the product specification will establish
high−level at the output.
GND
Figure 1. Schematic Diagram
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4
MID400
I
OL
Dynamic Characteristics
Low−Level Output Current
t
ON
The current flowing into an output with input conditions
applied according to the product specification will establish
low−level at the output.
Turn−On Time
The time between the specified reference points on the
input and the output voltage waveforms with the output
changing from the defined high−level to the defined
low−level.
I
CCL
Supply Current, Output LOW
The current flowing into the V supply terminal of a
circuit when the output is at a low−level voltage.
CC
t
OFF
Turn−Off Time
I
The time between the specified reference points on the
input and the output voltage waveforms with the output
changing from the defined low−level to the defined
high−level.
CCH
Supply Current, Output HIGH
The current flowing into the V supply terminal of a
CC
circuit when the output is at a high−level voltage.
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5
MID400
TEST CIRCUITS
V
CC
R
= 22 kW
IN
1
2
3
4
8
V
IN
7
6
5
R = 300 W
AC INPUT
L
C
AUX
V
O
INPUT CURRENT VS. CAPACITANCE, C
CIRCUIT
AUX
Figure 2. Typical Application Circuit
A−C
INPUT
OV
t
t
OFF
ON
V
OH
OUTPUT 50%
50%
V
OL
*INPUT TURNS ON AND OFF AT ZERO CROSSING
+4.5 V
V
CC
1
8
1 INPUT
N/C
V
CC
2
3
4
7
6
5
A−C
INPUT
AUX.
R
300 W
L
R
IN
2 INPUT
N/C
V
OUT
22 kW
OUTPUT
GND
TEST CIRCUIT
Figure 3. MID400 Switching Time
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6
MID400
TYPICAL PERFORMANCE CURVES
250
200
150
100
50
30
T = 25°C
CC
T = 25°C
A
CC
A
V
= 5.0 V
V
= 5.0 V
25
20
15
10
5
TURN OFF
TURN ON
I
≤ mA
OH
I
OL
= 16 mA
50
0
0
0
10
20
30
40
60
0
10
20
R , INPUT RESISTANCE (kW)
IN
30
40
50
60
R
, INPUT RESISTANCE (kW)
IN
Figure 4. Input Voltage vs. Input Resistance
Figure 8. Input Voltage vs. Input Resistance
2.8
120
V
CC
= 5.0 V
I
I
R
= 16 mA
≤ mA
= 22 kW
OL
2.4
2.0
1.6
1.2
OH
110
100
IN
T = 25°C
A
I
IN (ON)
I
CCL
0.8
0.4
0
90
80
I
IN (OFF)
I
CCH
4.5 4.6 4.7 4.8 4.9 5.0 5.1 5.2 5.3 5.4 5.5
10
20
50
100
200
500
1000
CAPACITANCE (pF) (AUX. TO GND)
V
CC
, SUPPLY VOLTAGE (V)
Figure 5. Supply Current vs. Supply Voltage
Figure 7. Input Current vs. Capacitance
0.30
0.20
4.5 V
5.0 V
I
= 4.0 mA
IN (ON_RMS)
0.15
0.10
0.05
0
0
5.0
10.0
15.0
20.0
25.0
I
OL
, OUTPUT CURRENT (mA)
Figure 6. Output Voltage vs. Output Current
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7
MID400
REFLOW PROFILE
300
250
200
150
100
50
215C, 10–30 s
225C peak
Time above 183C, 60–150 s
Ramp up = 3C/s
0
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
Time (Minute)
• Peak reflow temperature: 225C (package surface temperature)
• Time of temperature higher than 183C for 60–150 seconds
• One time soldering reflow is recommended
Figure 9. Reflow Profile
ORDERING INFORMATION
Part Number
†
Package
Shipping
MID400
DIP 8−Pin
(Pb−Free)
50 / Tube
50 / Tube
MID400S
SMT 8−Pin (Lead Bend)
(Pb−Free)
MID400SD
MID400V
SMT 8−Pin (Lead Bend)
(Pb−Free)
1,000 / Tape and Reel
50 / Tube
DIP 8−Pin, DIN EN/IEC 60747−5−5 Option
(Pb−Free)
MID400SV
MID400SDV
MID400WV
SMT 8−Pin (Lead Bend), DIN EN/IEC 60747−5−5 Option
(Pb−Free)
50 / Tube
SMT 8−Pin (Lead Bend), DIN EN/IEC 60747−5−5 Option
(Pb−Free)
1,000 / Tape and Reel
50 / Tube
DIP 8−Pin, 0.4” Lead Spacing, DIN EN/IEC 60747−5−5 Option
(Pb−Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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8
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
PDIP8 6.6x3.81, 2.54P
CASE 646BW
ISSUE O
DATE 31 JUL 2016
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98AON13445G
PDIP8 6.6X3.81, 2.54P
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
PDIP8 9.655x6.6, 2.54P
CASE 646CQ
ISSUE O
DATE 18 SEP 2017
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98AON13446G
PDIP8 9.655X6.6, 2.54P
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
PDIP8 GW
CASE 709AC
ISSUE O
DATE 31 JUL 2016
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98AON13447G
PDIP8 GW
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
onsemi,
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates
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