MC74LCX244AMN2TWG_技术文档

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Is Now

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onsemi andꢀꢀꢀꢀꢀꢀꢀand other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or

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notice. The information herein is provided “as-is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality,

or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all

liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using onsemi products, including compliance with all laws,

regulations and safety requirements or standards, regardless of any support or applications information provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/

or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application

by customer’s technical experts. onsemi does not convey any license under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized

for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for

implantation in the human body. Should Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and holdonsemi and its officers, employees,

subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death

associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal Opportunity/Affirmative

Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. Other names and brands may be claimed as the property of others.

Low-Voltage CMOS Octal

Buffer

With 5 V−Tolerant Inputs and Outputs

(3−State, Non−Inverting)

MC74LCX244A

www.onsemi.com

The MC74LCX244A is a high performance, non−inverting octal

buffer operating from a 1.65 to 3.6 V supply. High impedance TTL

compatible inputs significantly reduce current loading to input drivers

while TTL compatible outputs offer improved switching noise

performance. A V specification of 5.5 V allows MC74LCX244A

I

inputs to be safely driven from 5 V devices. The MC74LCX244A is

suitable for memory address driving and all TTL level bus oriented

transceiver applications.

TSSOP−20

DT SUFFIX

CASE 948E

QFN20

MN SUFFIX

CASE 485CB

Current drive capability is 24 mA at the outputs. The Output Enable

(OE) input, when HIGH, disables the output by placing them in

a HIGH Z condition.

MARKING DIAGRAMS

20

Features

• Designed for 1.65 to 3.6 V V Operation

CC

LCX

244

• 5 V Tolerant − Interface Capability With 5 V TTL Logic

• Supports Live Insertion and Withdrawal

ALYW G

G

1

• I

Specification Guarantees High Impedance When V = 0 V

CC

• LVTTL Compatible

OFF

TSSOP−20

• LVCMOS Compatible

1

• 24 mA Balanced Output Sink and Source Capability

• Near Zero Static Supply Current in All Three Logic States (10 mA)

Substantially Reduces System Power Requirements

• Latchup Performance Exceeds 100 mA

244

ALYWG

G

• ESD Performance:

QFN20 − 485CB

♦ Human Body Model >2000 V

A

L, WL

Y, YY

=

Assembly Location

Wafer Lot

Year

• NLV Prefix for Automotive and Other Applications Requiring

Unique Site and Control Change Requirements; AEC−Q100

Qualified and PPAP Capable

W, WW = Work Week

G or G

= Pb−Free Package

• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS

Compliant

(Note: Microdot may be in either location)

ORDERING INFORMATION

See detailed ordering and shipping information on page 6 of

this data sheet.

1

Publication Order Number:

June, 2021 − Rev. 0

MC74LCX244A/D

MC74LCX244A

1

V

2OE 1O0 2D0 1O1 2D1 1O2 2D2 1O3 2D3

19 18 17 16 15 14 12

CC

1OE

1D0

1D1

1D2

1D3

20

13

11

2

4

6

8

18

16

14

12

1O0

1O1

1O2

1O3

1

2

3

4

5

6

7

9

8

10

1OE 1D0 2O0 1D1 2O1 1D2 2O2 1D3 2O3 GND

19

12

19

11

10

20

2OE

2D0

2D1

2D2

2D3

QFN

PIN #1

17

3

5

7

9

2O0

2O1

2O2

2O3

2

9

15

13

11

Figure 1. Pinouts: 20−Lead (Top View)

PIN NAMES

PINS

nOE

FUNCTION

Output Enable Inputs

Data Inputs

Figure 2. Logic Diagram

1Dn, 2Dn

1On, 2On

3−State Outputs

TRUTH TABLE

INPUTS

OUTPUTS

1On, 2On

1OE

2OE

1Dn

2Dn

L

H

X

L

H

Z

H

H = High Voltage Level

L = Low Voltage Level

Z = High Impedance State

X = High or Low Voltage Level and Transitions are Acceptable

For I reasons, DO NOT FLOAT Inputs

CC

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2

MC74LCX244A

MAXIMUM RATINGS

Symbol

Parameter

Value

Unit

V

I

DC Input Voltage (Note 1)

DC Output Voltage (Note 1)

−0.5 to +6.5

V

O

Active−Mode (High or Low State)

Tri−State Mode

−0.5 to V + 0.5

V

CC

−0.5 to +6.5

Power−Down Mode (V = 0 V)

−0.5 to +6.5

CC

I

DC Input Diode Current

V

< GND

OUT

−50

mA

°C

IK

IN

I

DC Output Diode Current

DC Output Source/Sink Current

DC Supply Current Per Supply Pin

DC Supply Current Per Ground Pin

Storage Temperature Range

Moisture Sensitivity

V

−50

OK

I

50

100

O

I

CC

I

100

GND

T

−65 to +150

Level 1

STG

MSL

F

R

Flammability Rating

Oxygen Index: 28 to 34

UL 94 V−0 @ 0.125 in

V

ESD

ESD Withstand Voltage (Note 2)

Human Body Model

Charged Device Model

> 2000

N/A

V

I

Latchup Performance (Note 3)

100

mA

LATCHUP

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality

should not be assumed, damage may occur and reliability may be affected.

1. I absolute maximum rating must be observed.

O

2. HBM tested to EIA / JESD22−A114−A. CDM tested to JESD22−C101−A. JEDEC recommends that ESD qualification to EIA/JESD22−A115A

(Machine Model) be discontinued.

3. Tested to EIA/JESD78 Class II.

RECOMMENDED OPERATING CONDITIONS

Symbol

Parameter

Min

1.65

1.5

0

Typ

3.3

−

Max

3.6

5.5

Unit

V

CC

Supply Voltage

Operating

V

Data Retention Only

V

I

Digital Input Voltage

Output Voltage

V

O

Active Mode (High or Low State)

0

−

V

CC

Tri−State Mode

0

−

5.5

Power Down Mode (V = 0 V)

0

−

CC

T

Operating Free−Air Temperature

−40

0

−

+125

10

°C

A

t , t

r

Input Transition Rise or Fall Rate V = from 0.8 V to 2.0 V, V = 3.0 V

−

ns/V

f

I

CC

Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond

the Recommended Operating Ranges limits may affect device reliability.

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3

MC74LCX244A

DC ELECTRICAL CHARACTERISTICS

T

A

= −405C to +855C

T

A

= −405C to +1255C

Min

Max

Min

Max

Symbol

Parameter

Conditions

V

CC

(V)

Unit

V

IH

High−Level Input Voltage

1.65 to 1.95 0.65 x V

−

0.65 x V

CC

−

V

CC

2.3 to 2.7

2.7 to 3.6

1.65 to 1.95

2.3 to 2.7

2.7 to 3.6

1.7

2.0

−

1.7

2.0

−

V

Low−Level Input Voltage

0.35 x V

0.7

0.35 x V

0.7

V

IL

CC

−

0.8

−

0.8

V

OH

High−Level

V = V or V

I

IH

IL

Output Voltage

I

= −100 mA

1.65 to 3.6

1.65

2.3

V

CC

– 0.2

−

V – 0.2

CC

−

OH

I

= −4 mA

= −8 mA

1.2

OH

1.8

2.2

2.4

2.2

1.8

2.2

2.4

2.2

I

= −12 mA

= −16 mA

= −24 mA

2.7

OH

I

3.0

V

OL

Low−Level

V = V or V

V

I

IH

IL

Output Voltage

I

= 100 mA

1.65 to 3.6

1.65

2.3

−

0.2

0.45

0.6

−

0.2

0.45

0.6

0.4

0.6

5.0

OL

I

= 4 mA

= 8 mA

OL

I

= 12 mA

= 16 mA

= 24 mA

2.7

0.4

OL

I

3.0

0.4

3.0

0.55

5.0

I

Input Leakage Current

V = 0 to 5.5 V

3.6

mA

I

3−State Output Leakage Current

V = V or V ,

I

3.6

5.0

OZ

IH

IL

V

O

= 0 V to 5.5 V

I

Power Off Leakage Current

Quiescent Supply Current

V = 5.5 V or

0

−

10

−

20

mA

OFF

I

V

O

= 5.5 V

I

V = 5.5 V or GND

3.6

−

10

−

10

mA

CC

I

ΔI

Increase in I per Input

V

= V – 0.6 V 2.3 to 3.6

500

CC

IH

CC

Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product

performance may not be indicated by the Electrical Characteristics if operated under different conditions.

www.onsemi.com

4

MC74LCX244A

AC ELECTRICAL CHARACTERISTICS

T

A

= −405C to +855C

T

A

= −405C to +1255C

Min

Max

Min

Max

Symbol

Parameter

Propagation Delay,

D to O

Conditions

V

(V)

Unit

CC

t

,

See Figures 3

and 4

1.65 to

1.95

−

10.3

−

10.3

ns

PLH

t

PHL

2.3 to 2.7

2.7

−

7.8

7.5

−

7.8

7.5

3.0 to 3.6

6.5

t

,

Output Enable Time,

OE to O

See Figures 3

and 4

1.65 to

1.95

13.0

ns

PZH

PZL

2.3 to 2.7

2.7

−

10.0

9.0

−

10.0

9.0

3.0 to 3.6

8.0

t

,

Output Disable Time, OE to O

See Figures 3

and 4

1.65 to

1.95

11.0

PHZ

t

PLZ

2.3 to 2.7

2.7

−

8.4

8.0

7.0

−

8.4

8.0

7.0

−

3.0 to 3.6

t

,

Output to Output Skew

1.65 to

1.95

OSHL

t

OSLH

2.3 to 2.7

2.7

−

3.0 to 3.6

1.0

DYNAMIC SWITCHING CHARACTERISTICS

T

A

= +25°C

Min

Typ

0.8

Max

−

Symbol

Parameter

Test Condition

C = 50 pF, V = 3.3 V, V = 0 V

V

CC

(V)

Unit

V

OLP

Dynamic LOW

Peak Voltage

(Note 4)

3.3

−

V

L

IH

IL

C = 30 pF, V = 2.5 V, V = 0 V

2.5

3.3

2.5

0.6

−

L

IH

IL

V

OLV

Dynamic LOW

Valley Voltage

(Note 4)

C = 50 pF, V = 3.3 V, V = 0 V

−0.8

−

V

L

IH

IL

C = 30 pF, V = 2.5 V, V = 0 V

−0.6

−

L

IH

IL

4. Number of outputs defined as “n”. Measured with “n−1” outputs switching from HIGH−to−LOW or LOW−to−HIGH. The remaining output is

measured in the LOW state.

CAPACITIVE CHARACTERISTICS

Symbol

Parameter

Input Capacitance

Test Condition

= 3.3 V, V = 0 V or V

Typical (T = 25°C)

Unit

pF

A

C

V

7

8

IN

CC

I

CC

C

Output Capacitance

= 3.3 V, V = 0 V or V

pF

OUT

CC

I

C

Power Dissipation Capacitance

(Note 5)

10 MHz, V = 3.3 V, V = 0 V or V

CC

25

pF

PD

CC

I

5. C is defined as the value of the internal equivalent capacitance which is calculated from the dynamic operating current consumption without

PD

load. Average operating current can be obtained by the equation I

= C • V • f + I . C is used to determine the no−load

CC(OPR)

PD CC in CC PD

2

dynamic power consumption: P = C • V

• f + I • V

.

D

PD

CC

in

CC

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5

MC74LCX244A

OPEN

V_LOAD

GND

R_L

Test

Switch Position

Open

DUT

OUTPUT

t_PLH/ t_PHL

t_PLZ/ t_PZL

t_PHZ/ t_PZH

V_LOAD

GND

*

R_T

R_L

C_L

C includes probe and jig capacitance

L

R is Z

of pulse generator (typically 50 W)

T

OUT

f = 1 MHz

Figure 3. Test Circuits

V_CC

t_r= 2.5 ns

INPUT

t_f= 2.5 ns

V_CC

90%

V_mi

INPUT

V_mi

GND

10%

GND

V_OH

t_PZL

t_PLZ

t_PHL

t_PLH

~ V_CC

V_mo

OUTPUT

V_mo

OUTPUT

V_OL+ V_Y

V_OL

t_PZH

t_PHZ

t_PLH

t_PHL

V_OH

V_OH- V_Y

V_mo

OUTPUT

V_OL

~0 V

V

CC

, V

R , W

L

C , pF

L

V

LOAD

V

mi

, V

V , V

mo

V , V

Y

1.65 to 1.95

2.3 to 2.7

2.7

500

30

50

2 x V

V

/2

V

/2

0.15

CC

2 x V

V

0.15

0.3

6 V

1.5

3.0 to 3.6

0.3

Figure 4. Switching Waveforms

ORDERING INFORMATION

Device

†

Package

Shipping

MC74LCX244ADTR2G

TSSOP−20

(Pb−Free)

2500 / Tape & Reel

3000 / Tape & Reel

MC74LCX244AMN2TWG

(Contact ON Semiconductor)

QFN20, 2.5x3.5

(Pb−Free)

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging

Specifications Brochure, BRD8011/D.

*NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP

Capable

www.onsemi.com

6

MC74LCX244A

PACKAGE DIMENSIONS

TSSOP−20

CASE 948E

ISSUE D

NOTES:

20X K REF

1. DIMENSIONING AND TOLERANCING PER

K

K1

ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION:

MILLIMETER.

M

S

V

0.10 (0.004)

T U

S

0.15 (0.006) T U

3. DIMENSION A DOES NOT INCLUDE

MOLD FLASH, PROTRUSIONS OR GATE

BURRS. MOLD FLASH OR GATE BURRS

SHALL NOT EXCEED 0.15 (0.006) PER SIDE.

4. DIMENSION B DOES NOT INCLUDE

INTERLEAD FLASH OR PROTRUSION.

INTERLEAD FLASH OR PROTRUSION

SHALL NOT EXCEED 0.25 (0.010) PER SIDE.

5. DIMENSION K DOES NOT INCLUDE

DAMBAR PROTRUSION. ALLOWABLE

DAMBAR PROTRUSION SHALL BE 0.08

(0.003) TOTAL IN EXCESS OF THE K

DIMENSION AT MAXIMUM MATERIAL

CONDITION.

J J1

20

11

^2XL/2

B

SECTION N−N

L

−U−

PIN 1

IDENT

0.25 (0.010)

N

1

10

M

6. TERMINAL NUMBERS ARE SHOWN FOR

REFERENCE ONLY.

7. DIMENSION A AND B ARE TO BE

DETERMINED AT DATUM PLANE −W−.

S

0.15 (0.006) T U

A

−V−

N

MILLIMETERS

INCHES

DIM MIN

MAX

6.60

4.50

1.20

0.15

0.75

MIN

MAX

0.260

0.177

0.047

0.006

0.030

F

A

B

6.40

4.30

---

0.252

0.169

---

DETAIL E

C

D

0.05

0.50

0.002

0.020

F

G

H

0.65 BSC

0.026 BSC

−W−

0.27

0.09

0.19

0.37

0.20

0.16

0.30

0.25

0.011

0.004

0.007

0.015

0.008

0.006

0.012

0.010

C

J

J1

K

G

D

H

K1

L

DETAIL E

6.40 BSC

0.252 BSC

0

0.100 (0.004)

−T− ^SEATING

M

0

8

_

PLANE

SOLDERING FOOTPRINT*

7.06

1

0.65

PITCH

0¹.3^6X6

16X

1.26

DIMENSIONS: MILLIMETERS

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

www.onsemi.com

7

MC74LCX244A

PACKAGE DIMENSIONS

QFN20, 2.5x3.5, 0.4P

CASE 485CB

ISSUE O

NOTES:

A

B

D

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

L

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSIONS b APPLIES TO PLATED

TERMINAL AND IS MEASURED BETWEEN

0.15 AND 0.30 MM FROM TERMINAL TIP.

4. COPLANARITY APPLIES TO THE EXPOSED

PAD AS WELL AS THE TERMINALS.

PIN ONE

REFERENCE

L1

DETAIL A

ALTERNATE TERMINAL

CONSTRUCTIONS

MILLIMETERS

DIM MIN

MAX

1.00

0.05

E

A

A1

A3

b

0.80

0.00

0.20 REF

EXPOSED Cu

MOLD CMPD

0.15

0.25

1.10

0.15

C

2X

D

2.50 BSC

D2

E

0.90

3.50 BSC

2X

0.15

C

E2

e

2.00

2.20

TOP VIEW

DETAIL B

0.40 BSC

ALTERNATE

L

0.35

---

0.45

0.15

CONSTRUCTIONS

L1

DETAIL B

(A3)

A1

0.10

0.08

C

NOTE 4

SEATING

PLANE

C

SIDE VIEW

D2

SOLDERING FOOTPRINT*

3.80

2.24

0.10 C A B

PACKAGE

OUTLINE

20X

L

9

12

0.10 C A B

DETAIL A

20X

0.63

2.80 1.14

E2

1

20X

b

20X

0.25

0.40

PITCH

0.10 C A B

2

19

1

0.05

C

NOTE 3

DIMENSIONS: MILLIMETERS

e

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

e/2

BOTTOM VIEW

ON Semiconductor and

are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.

ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent

coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.

ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability

arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.

Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,

regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or

specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer

application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not

designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification

in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized

application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and

expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such

claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This

literature is subject to all applicable copyright laws and is not for resale in any manner.

PUBLICATION ORDERING INFORMATION

LITERATURE FULFILLMENT:

Email Requests to: orderlit@onsemi.com

TECHNICAL SUPPORT

North American Technical Support:

Voice Mail: 1 800−282−9855 Toll Free USA/Canada

Phone: 011 421 33 790 2910

Europe, Middle East and Africa Technical Support:

Phone: 00421 33 790 2910

For additional information, please contact your local Sales Representative

ON Semiconductor Website: www.onsemi.com

◊

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8


型号：	MC74LCX244AMN2TWG
厂家：	ONSEMI
描述：	Low-Voltage CMOS Octal Buffer With 5 VâTolerant Inputs and Outputs (3âState, NonâInverting)
文件：	总9页 (文件大小：314K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

MC74LCX244AMN2TWG [ONSEMI]

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