MC74LCX16543DTR2 [ONSEMI]
LVC/LCX/Z SERIES, DUAL 8-BIT REGISTERED TRANSCEIVER, TRUE OUTPUT, PDSO56, PLASTIC, TSSOP-56;
| 型号： | MC74LCX16543DTR2 |
| 厂家： | 
ONSEMI |
| 描述： | LVC/LCX/Z SERIES, DUAL 8-BIT REGISTERED TRANSCEIVER, TRUE OUTPUT, PDSO56, PLASTIC, TSSOP-56 光电二极管 输出元件 逻辑集成电路 |
| 文件： | 总19页 (文件大小：526K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SEMICONDUCTOR TECHNICAL DATA
The MC74LCX16543 is a high performance, non–inverting 16–bit
latching transceiver operating from a 2.7 to 3.6V supply. The device is
byte controlled. Each byte has separate control inputs which can be tied
together for full 16–bit operation. High impedance TTL compatible inputs
significantly reduce current loading to input drivers while TTL compatible
LOW–VOLTAGE CMOS
16–BIT LATCHING
TRANSCEIVER
outputs offer improved switching noise performance. A V specification of
I
5.5V allows MC74LCX16543 inputs to be safely driven from 5V devices.
The MC74LCX16543 is suitable for memory address driving and all TTL
level bus oriented transceiver applications.
For data flow from A to B with the EAB LOW, the A–to–B Output
Enable (OEAB) must be LOW in order to enable data to the B bus, as
indicated in the Function Table. With EAB LOW, a LOW signal on the
A–to–B Latch Enable (LEAB) input makes the A–to–B latches
transparent; a subsequent LOW–to–HIGH transition of the LEAB signal
will latch the A latches, and the outputs no longer change with the A
inputs. With EAB and OEAB both LOW, the 3–State B output buffers are
active and reflect the data present at the output of the A latches. Control
of data flow from B to A is symetric to that above, but uses the EBA,
LEBA, and OEBA inputs.
DT SUFFIX
PLASTIC TSSOP PACKAGE
CASE 1202–01
• Designed for 2.7 to 3.6V V
CC
Operation
• 5.2ns Maximum t
pd
• 5V Tolerant — Interface Capability With 5V TTL Logic
• Supports Live Insertion and Withdrawal
• I
OFF
Specification Guarantees High Impedance When V
= 0V
CC
PIN NAMES
• LVTTL Compatible
• LVCMOS Compatible
Pins
Function
• 24mA Balanced Output Sink and Source Capability
OExxn
Exxn
LExxn
A0–A15
B0–B15
Output Enable Inputs
Enable Inputs
Latch Enable Inputs
3–State Inputs/Outputs
3–State Inputs/Outputs
• Near Zero Static Supply Current in All Three Logic States (20µA)
Substantially Reduces System Power Requirements
• Latchup Performance Exceeds 500mA
• ESD Performance: Human Body Model >2000V; Machine Model >200V
This document contains information on a new product. Specifications and information herein are subject to
change without notice.
11/96
REV 0.2
199
Motorola, Inc. 1996
MC74LCX16543
LOGIC DIAGRAM
Pinout: 56-Lead TSSOP
(Top View)
DETAIL A
D
D
52
B0
Q
OEAB1
LEAB1
EAB1
GND
A0
OEBA1
LEBA1
EBA1
GND
B0
1
2
3
4
5
56
55
54
53
52
LE
5
A0
Q
LE
A1 6
51 B1
DETAIL A x 7
V
V
CC
7
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
CC
A2
A3
B2
8
B3
9
A4
B4
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
56
1
OEBA1
OEAB1
EAB1
GND
A5
GND
B5
EBA1
54
3
2
LEAB1
LEBA1
55
A6
B6
A7
B7
A8
B8
DETAIL B
D
A9
B9
D
42
B8
A10
GND
A11
A12
A13
B10
GND
B11
B12
B13
Q
LE
15
A8
Q
LE
V
CC
V
CC
A14
A15
B14
B15
GND
DETAIL Bx 7
GND
EAB2 26
31 EBA2
29
28
LEAB2
OEAB2
LEBA2
OEBA2
27
28
30
29
OEBA2
EBA2
OEAB2
EAB2
31
26
27
LEAB2
LEBA2
30
MOTOROLA
200
LCX DATA
BR1339 — REV 3
MC74LCX16543
FUNCTION TABLE
Inputs
EABn
Data Ports
Operating Mode
OEABn
OEBAn
EBAn
LEABn
LEBAn
An
Bn
Input
X
H
H
Input
X
L
X
L
X
L
X
L
X
X
Disable Outputs
X
Transparent Data; Outputs Disabled
Latch and Outputs Disabled
H
H
l
l
h
h
L
H
Input
Output
H
L
X*
X*
L
X
l
h
Z
Z
Load and B Outputs Disabled
H
L
X
X
X
Z
Hold; B Outputs Disabled
Transparent A to B
L
L
H
H
H
X
X
L
l
h
L
H
Latch and Display B Outputs
Load and A Outputs Disabled
H
L
Output
Input
X*
X*
H
L
Z
Z
l
h
X
X
H
L
Z
X
Hold; A Outputs DIsabled
Transparent B to A
L
L
H
H
X
H
L
l
Latch and Display A Outputs
H
h
H = High Voltage Level; h = High Voltage Level One Setup Time Prior to the Latch Enable or Enable Low–to–High Transition; L = Low VoltageLevel;
l = Low Voltage Level One Setup Time Prior to the Latch Enable or Enable Low–to–High Transition; X = Don’t Care; * = The latches are not internally
gated with the Output Enables. Therefore, data at the A or B ports may enter the latches at any time, provided that the LExx and Exx pins are set
accordingly. For I
reasons, Do Not Float Inputs.
CC
ABSOLUTE MAXIMUM RATINGS*
Symbol
CC
Parameter
Value
Condition
Unit
V
V
V
V
DC Supply Voltage
DC Input Voltage
DC Output Voltage
–0.5 to +7.0
–0.5 ≤ V ≤ +7.0
V
I
I
–0.5 ≤ V ≤ +7.0
Output in 3–State
Note 1.
V
O
O
–0.5 ≤ V ≤ V
+ 0.5
V
O
CC
I
I
DC Input Diode Current
DC Output Diode Current
–50
–50
V < GND
mA
mA
mA
mA
mA
mA
°C
IK
I
V
O
< GND
OK
+50
V > V
O CC
I
I
I
DC Output Source/Sink Current
DC Supply Current Per Supply Pin
DC Ground Current Per Ground Pin
Storage Temperature Range
±50
O
±100
±100
CC
GND
T
–65 to +150
STG
*
Absolutemaximumcontinuousratingsarethosevaluesbeyondwhichdamagetothedevicemayoccur. Exposuretotheseconditionsorconditions
beyond those indicated may adversely affect device reliability. Functional operation under absolute–maximum–rated conditions is not implied.
1. Output in HIGH or LOW State. I absolute maximum rating must be observed.
O
LCX DATA
201
MOTOROLA
BR1339 — REV 3
MC74LCX16543
RECOMMENDED OPERATING CONDITIONS
Symbol
CC
Parameter
Min
Typ
Max
Unit
V
Supply Voltage
Operating
Data Retention Only
2.0
1.5
3.3
3.3
3.6
3.6
V
V
V
Input Voltage
0
5.5
V
V
I
Output Voltage
(HIGH or LOW State)
(3–State)
0
0
V
CC
O
5.5
–24
24
I
I
I
I
HIGH Level Output Current, V
= 3.0V – 3.6V
mA
mA
mA
mA
°C
OH
OL
OH
OL
CC
LOW Level Output Current, V
= 3.0V – 3.6V
= 2.7V – 3.0V
= 2.7V – 3.0V
CC
HIGH Level Output Current, V
–12
12
CC
LOW Level Output Current, V
CC
T
A
Operating Free–Air Temperature
Input Transition Rise or Fall Rate, V from 0.8V to 2.0V,
–40
0
+85
10
∆t/∆V
ns/V
IN
V
CC
= 3.0V
DC ELECTRICAL CHARACTERISTICS
T
A
= –40°C to +85°C
Symbol
Characteristic
HIGH Level Input Voltage (Note 2.)
LOW Level Input Voltage (Note 2.)
HIGH Level Output Voltage
Condition
Min
2.0
Max
Unit
V
V
V
V
2.7V ≤ V
≤ 3.6V
IH
CC
2.7V ≤ V
2.7V ≤ V
≤ 3.6V
= –100µA
0.8
V
IL
CC
≤ 3.6V; I
V
– 0.2
V
OH
CC
OH
CC
V
CC
V
CC
V
CC
= 2.7V; I
= 3.0V; I
= 3.0V; I
= –12mA
= –18mA
= –24mA
2.2
OH
OH
OH
2.4
2.2
V
LOW Level Output Voltage
2.7V ≤ V
CC
≤ 3.6V; I
= 100µA
OL
0.2
0.4
V
OL
V
= 2.7V; I = 12mA
OL
CC
CC
CC
V
V
= 3.0V; I
= 3.0V; I
= 16mA
= 24mA
0.4
OL
OL
0.55
±5.0
±5.0
I
I
Input Leakage Current
3–State Output Current
2.7V ≤ V
CC
≤ 3.6V; 0V ≤ V ≤ 5.5V
µA
µA
I
I
2.7 ≤ V
CC
≤ 3.6V; 0V ≤ V ≤ 5.5V;
O
I
OZ
V = V or V
IH
IL
I
I
Power–Off Leakage Current
Quiescent Supply Current
V
= 0V; V or V = 5.5V
10
20
µA
µA
µA
µA
OFF
CC
I
O
2.7 ≤ V
≤ 3.6V; V = GND or V
CC
CC
I
CC
2.7 ≤ V
CC
≤ 3.6V; 3.6 ≤ V or V ≤ 5.5V
±20
500
I
O
∆I
Increase in I
per Input
2.7 ≤ V
CC
≤ 3.6V; V = V
IH
– 0.6V
CC
CC
CC
2. These values of V are used to test DC electrical characteristics only.
I
MOTOROLA
202
LCX DATA
BR1339 — REV 3
MC74LCX16543
AC CHARACTERISTICS (Note 3.; t = t = 2.5ns; C = 50pF; R = 500Ω)
R
F
L
L
Limits
T
A
= –40°C to +85°C
V
= 3.0V to 3.6V
Max
V
= 2.7V
CC
CC
Symbol
Parameter
Waveform
Min
Min
Max
Unit
t
t
Propagation Delay
An to Bn or Bn to An
1
1.5
1.5
5.2
5.2
1.5
1.5
6.0
6.0
ns
PLH
PHL
t
t
Propagation Delay
LEBAn to An or LEABn to Bn
4
2
2
2
2
1.5
1.5
6.5
6.5
1.5
1.5
7.5
7.5
ns
ns
ns
ns
ns
PLH
PHL
t
t
Output Enable Time
OEBAn to An or OEABn to Bn
1.5
1.5
6.5
6.5
1.5
1.5
7.0
7.0
PZH
PZL
t
t
Output Disable Time
OEBAn to An or OEABn to Bn
1.5
1.5
6.5
6.5
1.5
1.5
7.0
7.0
PHZ
PLZ
t
t
Output Enable Time
EBAn to An or EABn to Bn
1.5
1.5
6.5
6.5
1.5
1.5
7.0
7.0
PZH
PZL
t
t
Output Disable Time
EBAn to An or EABn to Bn
1.5
1.5
6.5
6.5
1.5
1.5
7.0
7.0
PHZ
PLZ
t
t
t
t
t
Setup Time, HIGH to LOW Data to LExxn
Hold Time, HIGH to LOW Data to LExxn
Setup Time, HIGH to LOW Data to Exxn
Hold Time, HIGH to LOW Data to Exxn
Latch Enable or Enable Pulse Width, LOW
4
4
4
4
4
2.5
1.5
2.5
1.5
3.0
2.5
1.5
2.5
1.5
3.0
ns
ns
ns
ns
ns
ns
s
h
s
h
w
t
t
Output–to–Output Skew
(Note 4.)
1.0
1.0
OSHL
OSLH
3. These AC parameters are preliminary and may be modified prior to release. The maximum AC limits are design targets. Actual performance
will be specified upon completion of characterization.
4. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device.
The specification applies to any outputs switching in the same direction, either HIGH–to–LOW (t
guaranteed by design.
) or LOW–to–HIGH (t
OSHL
); parameter
OSLH
DYNAMIC SWITCHING CHARACTERISTICS
T
A
= +25°C
Symbol
Characteristic
Condition
Min
Typ
0.8
0.8
Max
Unit
V
V
V
Dynamic LOW Peak Voltage (Note 5.)
Dynamic LOW Valley Voltage (Note 5.)
V
V
= 3.3V, C = 50pF, V = 3.3V, V = 0V
L IH IL
OLP
CC
= 3.3V, C = 50pF, V = 3.3V, V = 0V
IH IL
V
OLV
CC
L
5. Number of outputs defined as “n”. Measured with “n–1” outputs switching from HIGH–to–LOW or LOW–to–HIGH. The remaining output is
measured in the LOW state.
CAPACITIVE CHARACTERISTICS
Symbol
Parameter
Input Capacitance
Condition
= 3.3V, V = 0V or V
Typical
Unit
pF
C
C
C
V
V
7
8
IN
CC
I
CC
CC
Input/Output Capacitance
= 3.3V, V = 0V or V
pF
I/O
PD
CC
I
Power Dissipation Capacitance
10MHz, V
CC
= 3.3V, V = 0V or V
CC
20
pF
I
LCX DATA
BR1339 — REV 3
203
MOTOROLA
MC74LCX16543
2.7V
0V
An
or Bn
1.5V
t
, t
PLH PHL
V
OH
Bn
or An
1.5V
V
OL
WAVEFORM 1 – A/B to B/A PROPAGATION DELAYS
t
R
= t = 2.5ns, 10% to 90%; f = 1MHz; t = 500ns
F
W
2.7V
OExxn
or Exxn
1.5V
1.5V
0V
t
t
PHZ
PZH
V
OH
– 0.3V
An
or Bn
1.5V
1.5V
≈ 0V
t
t
PLZ
PZL
≈ 3.0V
An
or Bn
V
OL
+ 0.3V
WAVEFORM 2 – OExx/Exx to A or B OUTPUT ENABLE AND DISABLE TIMES
t
R
= t = 2.5ns, 10% to 90%; f = 1MHz; t = 500ns
F
W
Figure 1. AC Waveforms
MOTOROLA
204
LCX DATA
BR1339 — REV 3
MC74LCX16543
2.7V
1.5V
0V
An
or Bn
t
w
t
s
t
h
NEGATIVE
PULSE
1.5V
1.5V
1.5V
1.5V
2.7V
t
Exxn
or LExxn
1.5V
1.5V
w
0V
t
, t
PLH PHL
V
OH
POSITIVE
PULSE
An
or Bn
1.5V
t
w
V
OL
WAVEFORM 3 – INPUT PULSE DEFINITION
WAVEFORM 4 – Enable to A or B PROPAGATION DELAYS, Enable MINIMUM
PULSE WIDTH, A or B to Enable SETUP AND HOLD TIMES
t
= t = 2.5ns, 10% to 90% of 0V to 2.7V
F
R
t
= t = 2.5ns, 10% to 90%; f = 1MHz; t = 500ns except when noted
F W
R
Figure 2. AC Waveforms (continued)
V
CC
6V
OPEN
GND
R
1
PULSE
GENERATOR
DUT
R
T
C
L
R
L
TEST
SWITCH
Open
6V
t , t
PLH PHL
t , t
PZL PLZ
Open Collector/Drain t
PLH
and t
PHL
6V
t
, t
GND
PZH PHZ
C
L
R
L
R
T
= 50pF or equivalent (Includes jig and probe capacitance)
= R = 500Ω or equivalent
1
OUT
= Z
of pulse generator (typically 50Ω)
Figure 3. Test Circuit
LCX DATA
205
MOTOROLA
BR1339 — REV 3
SEMICONDUCTOR TECHNICAL DATA
Device Nomenclature
MC 74 XXXX YYYYYY ZZ
Motorola
Package Type
Circuit Identifier
• D
= Plastic Narrow JECDEC SOIC
• DW = Plastic Wide JEDEC SOIC
• M = Plastic EIAJ SOIC
• SD = Plastic SSOP
• DT = Plastic TSSOP
Temperature Range
• 74 = –40 to +85°C
Family Identifier
• LCX = 5V–Tolerant Low–Voltage CMOS
• LVX = Low–Voltage CMOS
• LVXC = Configurable Low–Voltage CMOS
Function Type
• A = Modified LCX Spec
251
MOTOROLA
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751A–03
ISSUE F
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
–A–
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
14
1
8
7
P 7 PL
–B–
M
M
0.25 (0.010)
B
MILLIMETERS
INCHES
MIN MAX
G
F
R X 45°
DIM MIN
MAX
8.75
4.00
1.75
0.49
1.25
C
A
B
C
D
F
G
J
K
M
P
8.55
3.80
1.35
0.35
0.40
0.337 0.344
0.150 0.157
0.054 0.068
0.014 0.019
0.016 0.049
0.050 BSC
J
M
SEATING
PLANE
K
D 14 PL
1.27 BSC
0.19
0.10
0°
0.25
0.25
7°
0.008 0.009
0.004 0.009
M
S
S
0.25 (0.010)
T
B
A
0°
7°
5.80
0.25
6.20
0.50
0.228 0.244
0.010 0.019
R
M SUFFIX
PLASTIC SOIC EIAJ PACKAGE
CASE 965–01
ISSUE O
NOTES:
1
DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2
3
CONTROLLING DIMENSION: MILLIMETER.
DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH OR PROTRUSIONS AND ARE MEASURED
AT THE PARTING LINE. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
L
E
14
8
7
Q
1
E H
4
5
TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
E
M
THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
L
1
DETAIL P
Z
D
VIEW P
e
MILLIMETERS
INCHES
A
DIM MIN
MAX
MIN
---
MAX
0.081
c
A
---
2.05
A
0.05
0.35
0.18
0.20 0.002 0.008
0.50 0.014 0.020
0.27 0.007
1
b
c
0.011
D
E
e
9.90 10.50 0.390 0.413
b
A
1
5.10
5.45 0.201 0.215
M
1.27 BSC
0.050 BSC
8.20 0.291 0.323
0.85 0.020 0.033
1.50 0.043 0.059
0.13 (0.005)
0.10 (0.004)
H
7.40
0.50
1.10
0
0.70
---
E
L
L
E
M
Q
10
0.90 0.028 0.035
1.42 --- 0.056
0
10
1
Z
MOTOROLA
252
Case Outlines
(continued)
SD SUFFIX
PLASTIC SSOP PACKAGE
CASE 940A–03
NOTES:
ISSUE B
6
DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
14X K REF
7
8
CONTROLLING DIMENSION: MILLIMETER.
DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
M
S
S
0.12 (0.005)
T U
V
0.25 (0.010)
N
9
DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
14
8
L/2
M
N
10 DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION/INTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN
EXCESS OF K DIMENSION AT MAXIMUM
MATERIAL CONDITION. DAMBAR INTRUSION
SHALL NOT REDUCE DIMENSION K BY MORE
THAN 0.07 (0.002) AT LEAST MATERIAL
CONDITION.
B
L
F
PIN 1
IDENT
1
7
DETAIL E
–U–
11 TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
12 DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
A
–V–
K
J
J1
M
S
MILLIMETERS
DIM MIN MAX
INCHES
MIN MAX
0.20 (0.008)
T U
A
B
C
D
F
6.07
5.20
1.73
0.05
0.63
6.33 0.238 0.249
5.38 0.205 0.212
1.99 0.068 0.078
0.21 0.002 0.008
0.95 0.024 0.037
K1
SECTION N–N
G
H
J
J1
K
K1
L
0.65 BSC
0.026 BSC
1.22 0.042 0.048
0.20 0.003 0.008
0.16 0.003 0.006
0.38 0.010 0.015
0.33 0.010 0.013
1.08
0.09
0.09
0.25
0.25
7.65
0
–W–
C
0.076 (0.003)
SEATING
PLANE
–T–
7.90 0.301
0.311
8
D
G
M
8
0
DETAIL E
H
DT SUFFIX
PLASTIC TSSOP PACKAGE
CASE 948G–01
ISSUE O
NOTES:
1
14X K REF
DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
M
S
S
0.10 (0.004)
T U
V
2
3
CONTROLLING DIMENSION: MILLIMETER.
DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED
0.25 (0.010) PER SIDE.
DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
S
0.15 (0.006) T U
N
0.25 (0.010)
14
4
5
8
7
2X L/2
M
B
L
N
–U–
PIN 1
IDENT.
F
1
6
7
TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
DETAIL E
K
S
0.15 (0.006) T U
A
MILLIMETERS
DIM MIN MAX
INCHES
MIN MAX
K1
–V–
A
B
4.90
4.30
–––
5.10 0.193 0.200
4.50 0.169 0.177
J J1
C
1.20
––– 0.047
D
F
G
H
J
J1
K
K1
L
0.05
0.50
0.65 BSC
0.50
0.09
0.09
0.19
0.19
0.15 0.002 0.006
0.75 0.020 0.030
SECTION N–N
0.026 BSC
0.60 0.020 0.024
0.20 0.004 0.008
0.16 0.004 0.006
0.30 0.007 0.012
0.25 0.007 0.010
–W–
C
0.10 (0.004)
6.40 BSC
0.252 BSC
SEATING
PLANE
–T–
H
G
M
0
8
0
8
DETAIL E
D
253
MOTOROLA
Case Outlines
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751B–05
ISSUE J
–A–
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
16
1
9
8
–B–
P 8 PL
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
M
M
0.25 (0.010)
B
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
G
MILLIMETERS
INCHES
MIN MAX
DIM MIN
MAX
A
B
C
D
F
G
J
K
M
P
9.80 10.00
0.386 0.393
0.150 0.157
0.054 0.068
0.014 0.019
0.016 0.049
0.050 BSC
F
K
R X 45°
3.80
1.35
0.35
0.40
4.00
1.75
0.49
1.25
C
1.27 BSC
–T–
SEATING
0.19
0.10
0°
0.25
0.25
7°
0.008 0.009
0.004 0.009
J
M
PLANE
D 16 PL
0°
7°
5.80
0.25
6.20
0.50
0.229 0.244
0.010 0.019
M
S
S
0.25 (0.010)
T
B
A
R
M SUFFIX
PLASTIC SOIC EIAJ PACKAGE
CASE 966–01
ISSUE O
NOTES:
1
DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2
3
CONTROLLING DIMENSION: MILLIMETER.
DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH OR PROTRUSIONS AND ARE MEASURED
AT THE PARTING LINE. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
L
E
16
9
8
Q
1
E H
4
5
TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
E
M
THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
L
1
DETAIL P
Z
D
VIEW P
e
MILLIMETERS
INCHES
A
DIM MIN
MAX
MIN
---
MAX
0.081
0.008
0.020
0.011
0.413
0.215
c
A
---
2.05
A
0.05
0.35
0.18
9.90
5.10
0.20 0.002
0.50 0.014
0.27 0.007
10.50 0.390
5.45 0.201
1
b
c
D
E
e
A
1
b
0.13 (0.005)
1.27 BSC
0.050 BSC
M
0.10 (0.004)
H
7.40
0.50
1.10
0
8.20 0.291
0.85 0.020
1.50 0.043
0.323
0.033
0.059
10
E
L
L
E
M
Q
10
0
0.70
---
0.90 0.028
0.78
0.035
0.031
1
Z
---
MOTOROLA
254
Case Outlines
(continued)
SD SUFFIX
PLASTIC SSOP PACKAGE
CASE 940B–03
NOTES:
6
DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
7
8
CONTROLLING DIMENSION: MILLIMETER.
DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
ISSUE B
16X K REF
M
S
S
0.12 (0.005)
T U
V
0.25 (0.010)
9
DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
N
10 DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION/INTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN
EXCESS OF K DIMENSION AT MAXIMUM
MATERIAL CONDITION. DAMBAR INTRUSION
SHALL NOT REDUCE DIMENSION K BY MORE
THAN 0.07 (0.002) AT LEAST MATERIAL
CONDITION.
11 TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
12 DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
16
9
L/2
M
N
B
L
F
PIN 1
IDENT
1
8
DETAIL E
K
–U–
A
–V–
MILLIMETERS
DIM MIN MAX
INCHES
J
J1
MIN
MAX
0.249
0.212
0.078
0.008
0.037
A
B
6.07
5.20
1.73
0.05
0.63
6.33 0.238
5.38 0.205
1.99 0.068
0.21 0.002
0.95 0.024
M
S
0.20 (0.008)
T U
K1
C
D
F
SECTION N–N
G
H
J
J1
K
K1
L
0.65 BSC
0.026 BSC
0.73
0.09
0.09
0.25
0.25
7.65
0
0.90 0.028
0.20 0.003
0.16 0.003
0.38 0.010
0.33 0.010
7.90 0.301
0.035
0.008
0.006
0.015
0.013
0.311
8
–W–
C
0.076 (0.003)
SEATING
PLANE
–T–
D
G
M
8
0
DETAIL E
H
DT SUFFIX
PLASTIC TSSOP PACKAGE
CASE 948F–01
NOTES:
1
DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
ISSUE O
2
3
CONTROLLING DIMENSION: MILLIMETER.
DIMENSION A DOES NOT INCLUDE MOLD FLASH.
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
16X KREF
M
S
S
0.10 (0.004)
T U
V
4
5
DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED
0.25 (0.010) PER SIDE.
DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
S
0.15 (0.006) T U
K
K1
16
9
2X L/2
J1
B
–U–
SECTION N–N
6
7
L
J
PIN 1
IDENT.
N
MILLIMETERS
DIM MIN MAX
INCHES
8
1
0.25 (0.010)
MIN
MAX
0.200
0.177
0.047
0.006
0.030
A
B
C
4.90
4.30
–––
5.10 0.193
4.50 0.169
1.20
M
–––
S
0.15 (0.006) T U
D
F
0.05
0.50
0.15 0.002
0.75 0.020
A
N
–V–
G
H
J
J1
K
K1
L
0.65 BSC
0.026 BSC
0.18
0.09
0.09
0.19
0.19
0.28 0.007
0.20 0.004
0.16 0.004
0.30 0.007
0.25 0.007
0.011
0.008
0.006
0.012
0.010
F
DETAIL E
6.40 BSC
0.252 BSC
0
–W–
M
0
8
8
C
0.10 (0.004)
DETAIL E
H
SEATING
PLANE
–T–
D
G
255
MOTOROLA
Case Outlines
DW SUFFIX
PLASTIC SOIC PACKAGE
CASE 751D–04
ISSUE E
-A-
NOTES:
1. DIMENSIONING AND TOLERANCING PER
20
11
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
-B-
P 10 PL
4. MAXIMUM MOLD PROTRUSION 0.150
(0.006) PER SIDE.
M
M
0.010 (0.25)
B
5. DIMENSION D DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.13
(0.005) TOTAL IN EXCESS OF D DIMENSION
AT MAXIMUM MATERIAL CONDITION.
1
10
D 20 PL
J
MILLIMETERS
DIM MIN MAX
12.65 12.95 0.499 0.510
INCHES
M
S
S
0.010 (0.25)
T
A
B
MIN MAX
A
B
C
D
F
7.40
2.35
0.35
0.50
7.60 0.292 0.299
2.65 0.093 0.104
0.49 0.014 0.019
0.90 0.020 0.035
F
R X 45°
G
J
K
M
P
1.27 BSC
0.050 BSC
0.32 0.010 0.012
0.25 0.004 0.009
0.25
0.10
0°
C
7°
0°
7°
10.05 10.55 0.395 0.415
0.25 0.75 0.010 0.029
-T-
R
M
SEATING
PLANE
K
G 18 PL
M SUFFIX
PLASTIC SOIC EIAJ PACKAGE
CASE 967–01
NOTES:
ISSUE O
1
DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2
3
CONTROLLING DIMENSION: MILLIMETER.
DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH OR PROTRUSIONS AND ARE MEASURED
AT THE PARTING LINE. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
L
E
20
11
Q
1
4
5
TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
E H
E
M
THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
L
10
1
DETAIL P
Z
D
VIEW P
MILLIMETERS
INCHES
e
A
DIM MIN
MAX
MIN
---
MAX
0.081
0.008
0.020
0.011
0.504
0.215
c
A
---
0.05
0.35
0.18
12.35
5.10
2.05
A
0.20 0.002
0.50 0.014
0.27 0.007
12.80 0.486
5.45 0.201
1
b
c
D
E
e
A
b
1
1.27 BSC
0.050 BSC
M
0.10 (0.004)
0.13 (0.005)
H
7.40
0.50
1.10
0
8.20 0.291
0.85 0.020
1.50 0.043
0.323
0.033
0.059
10
E
L
L
E
M
Q
10
0
0.70
---
0.90 0.028
0.81
0.035
0.032
1
Z
---
MOTOROLA
256
Case Outlines
(continued)
SD SUFFIX
PLASTIC SSOP PACKAGE
CASE 940C–03
ISSUE B
20X K REF
NOTES:
6
M
S
S
DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
0.12 (0.005)
T U
V
0.25 (0.010)
7
8
CONTROLLING DIMENSION: MILLIMETER.
DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
N
20
11
10
L/2
M
9
DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
B
N
L
F
10 DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION/INTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN
EXCESS OF K DIMENSION AT MAXIMUM
MATERIAL CONDITION. DAMBAR INTRUSION
SHALL NOT REDUCE DIMENSION K BY MORE
THAN 0.07 (0.002) AT LEAST MATERIAL
CONDITION.
PIN 1
IDENT
1
DETAIL E
–U–
A
K
–V–
11 TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
12 DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
M
S
J
0.20 (0.008)
T U
J1
MILLIMETERS
DIM MIN MAX
INCHES
K1
MIN
MAX
0.288
0.212
0.078
0.008
0.037
A
B
C
D
F
7.07
5.20
1.73
0.05
0.63
7.33 0.278
5.38 0.205
1.99 0.068
0.21 0.002
0.95 0.024
SECTION N–N
–W–
C
G
H
J
J1
K
K1
L
0.65 BSC
0.026 BSC
0.076 (0.003)
0.59
0.09
0.09
0.25
0.25
7.65
0
0.75 0.023
0.20 0.003
0.16 0.003
0.38 0.010
0.33 0.010
7.90 0.301
0.030
0.008
0.006
0.015
0.013
0.311
8
SEATING
PLANE
–T–
D
G
DETAIL E
H
M
8
0
257
MOTOROLA
Case Outlines
(continued)
DT SUFFIX
PLASTIC TSSOP PACKAGE
CASE 948E–02
ISSUE A
20X K REF
NOTES:
13 DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
M
S
S
0.10 (0.004)
T U
V
S
0.15 (0.006) T U
14 CONTROLLING DIMENSION: MILLIMETER.
15 DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
16 DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.25 (0.010)
PER SIDE.
17 DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
K
K1
20
11
2X L/2
J J1
B
L
–U–
PIN 1
IDENT
SECTION N–N
1
10
0.25 (0.010)
18 TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
N
S
19 DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
0.15 (0.006) T U
M
A
–V–
MILLIMETERS
DIM MIN MAX
INCHES
MIN
MAX
0.260
0.177
0.047
0.006
0.030
A
B
C
6.40
4.30
–––
6.60 0.252
4.50 0.169
1.20
N
–––
D
F
0.05
0.50
0.15 0.002
0.75 0.020
F
G
H
J
J1
K
K1
L
0.65 BSC
0.026 BSC
DETAIL E
0.27
0.09
0.09
0.19
0.19
0.37
0.011
0.015
0.008
0.006
0.012
0.010
0.20 0.004
0.16 0.004
0.30 0.007
0.25 0.007
–W–
C
6.40 BSC
0.252 BSC
G
D
M
0
8
0
8
H
DETAIL E
0.100 (0.004)
–T– SEATING
PLANE
MOTOROLA
258
Case Outlines
DW SUFFIX
PLASTIC SOIC PACKAGE
CASE 751E–04
ISSUE E
-A-
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
24
13
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN
EXCESS OF D DIMENSION AT MAXIMUM
MATERIAL CONDITION.
-B-
P 12 PL
M
M
0.010 (0.25)
B
1
12
D 24 PL
MILLIMETERS
INCHES
MIN MAX
J
F
DIM MIN
MAX
M
S
S
0.010 (0.25)
T
A
B
A
B
C
D
F
G
J
K
M
P
15.25 15.54
0.601 0.612
0.292 0.299
0.093 0.104
0.014 0.019
0.016 0.035
0.050 BSC
7.40
2.35
0.35
0.41
7.60
2.65
0.49
0.90
R X 45°
1.27 BSC
0.23
0.13
0°
0.32
0.29
8°
0.009 0.013
0.005 0.011
C
0°
8°
10.05 10.55
0.25 0.75
0.395 0.415
0.010 0.029
-T-
SEATING
PLANE
R
M
K
G 22 PL
SD SUFFIX
PLASTIC SSOP PACKAGE
CASE 940D–03
ISSUE B
NOTES:
24X K REF
20 DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
M
S
S
0.12 (0.005)
T U
V
21 CONTROLLING DIMENSION: MILLIMETER.
22 DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
23 DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
K
J
J1
L/2
24
13
K1
B
L
24 DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION/INTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN
EXCESS OF K DIMENSION AT MAXIMUM
MATERIAL CONDITION. DAMBAR INTRUSION
SHALL NOT REDUCE DIMENSION K BY MORE
THAN 0.07 (0.002) AT LEAST MATERIAL
CONDITION.
SECTION N–N
PIN 1
IDENT
1
12
0.25 (0.010)
–U–
A
–V–
N
25 TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
26 DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
M
S
0.20 (0.008)
T U
M
N
MILLIMETERS
DIM MIN MAX
INCHES
MIN
MAX
0.328
0.212
0.078
0.008
0.037
F
A
B
8.07
5.20
1.73
0.05
0.63
8.33 0.317
5.38 0.205
1.99 0.068
0.21 0.002
0.95 0.024
DETAIL E
C
D
F
G
H
J
J1
K
K1
L
0.65 BSC
0.026 BSC
0.44
0.09
0.09
0.25
0.25
7.65
0
0.60 0.017
0.20 0.003
0.16 0.003
0.38 0.010
0.33 0.010
7.90 0.301
0.024
0.008
0.006
0.015
0.013
0.311
8
–W–
C
0.076 (0.003)
SEATING
PLANE
–T–
G
D
DETAIL E
H
M
8
0
259
MOTOROLA
Case Outlines
(continued)
DT SUFFIX
PLASTIC TSSOP PACKAGE
CASE 948H–01
ISSUE O
24X KREF
M
S
S
0.10 (0.004)
T U
V
S
0.15 (0.006) T U
NOTES:
1
DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
24
13
2X L/2
2
3
CONTROLLING DIMENSION: MILLIMETER.
DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED
0.25 (0.010) PER SIDE.
DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
B
–U–
L
4
5
PIN 1
IDENT.
12
1
S
0.15 (0.006) T U
A
–V–
6
7
TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
MILLIMETERS
DIM MIN MAX
INCHES
MIN
MAX
0.311
0.177
0.047
0.006
0.030
C
A
B
C
7.70
4.30
–––
7.90 0.303
4.50 0.169
1.20
–––
0.10 (0.004)
D
F
0.05
0.50
0.15 0.002
0.75 0.020
SEATING
PLANE
–T–
G
H
D
G
H
J
J1
K
K1
L
0.65 BSC
0.026 BSC
0.27
0.09
0.09
0.19
0.19
0.37
0.011
0.015
0.008
0.006
0.012
0.010
0.20 0.004
0.16 0.004
0.30 0.007
0.25 0.007
–W–
6.40 BSC
0.252 BSC
M
0
8
0
8
DETAIL E
N
0.25 (0.010)
K
K1
M
N
J1
F
SECTION N–N
DETAIL E
J
MOTOROLA
260
Case Outlines
DT SUFFIX
PLASTIC TSSOP PACKAGE
CASE 1201–01
ISSUE A
48X K REF
K
K1
NOTES:
M
S
S
0.12 (0.005)
T U
V
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
J
J1
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS OR GATE
BURRS. MOLD FLASH OR GATE BURRS
SHALL NOT EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
48
25
SECTION N–N
B
–U–
L
N
5. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
1
24
6. DIMENSIONS A AND B ARE TO BE
DETERMINED AT DATUM PLANE –W–.
MILLIMETERS
DIM MIN MAX
12.40 12.60 0.488 0.496
INCHES
MIN MAX
A
–V–
PIN 1
IDENT.
A
B
N
6.00
–––
6.20 0.236 0.244
1.10 ––– 0.043
C
M
F
D
F
0.05
0.50
0.15 0.002 0.006
0.75 0.020 0.030
0.25 (0.010)
DETAIL E
G
H
J
J1
K
K1
L
0.50 BSC
0.0197 BSC
0.37
0.09
0.09
0.17
0.17
7.95
0
––– 0.015 –––
0.20 0.004 0.008
0.16 0.004 0.006
0.27 0.007
0.23 0.007 0.009
8.25 0.313 0.325
D
0.011
C
–W–
0.076 (0.003)
M
8
0
8
DETAIL E
–T–
SEATING
PLANE
H
G
261
MOTOROLA
Case Outlines
DT SUFFIX
PLASTIC TSSOP PACKAGE
CASE 1202–01
ISSUE A
56X K REF
K
K1
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
M
S
S
0.12 (0.005)
T U
V
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS OR GATE
BURRS. MOLD FLASH OR GATE BURRS
SHALL NOT EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL
IN EXCESS OF THE K DIMENSION AT
MAXIMUM MATERIAL CONDITION.
5. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
J
J1
56
29
28
SECTION N–N
B
L
–U–
N
1
6. DIMENSIONS A AND B ARE TO BE
DETERMINED AT DATUM PLANE –W–.
MILLIMETERS
DIM MIN MAX
INCHES
MIN
MAX
0.555
0.244
0.043
0.006
0.030
A
–V–
PIN 1
A
B
C
13.90
6.00
–––
14.10 0.547
6.20 0.236
1.10
IDENT.
N
–––
D
F
0.05
0.50
0.15 0.002
0.75 0.020
F
M
G
H
J
J1
K
K1
L
0.50 BSC
0.0197 BSC
0.12
0.09
0.09
0.17
0.17
7.95
0
––– 0.005
0.20 0.004
0.16 0.004
0.27 0.007
0.23 0.007
8.25 0.313
–––
0.008
0.006
0.011
0.009
0.325
8
0.25 (0.010)
DETAIL E
D
C
–W–
M
8
0
0.076 (0.003)
DETAIL E
–T–
SEATING
PLANE
H
G
MOTOROLA
262
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