MC74LCX04DTG [ONSEMI]
Low-Voltage CMOS Hex Inverter; 低电压CMOS六反相器
| 型号： | MC74LCX04DTG |
| 厂家： | 
ONSEMI |
| 描述： | Low-Voltage CMOS Hex Inverter |
| 文件： | 总7页 (文件大小：138K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MC74LCX04
Low-Voltage CMOS Hex
Inverter
With 5 V−Tolerant Inputs
The MC74LCX04 is a high performance hex inverter operating
from a 2.0 to 5.5 V supply. High impedance TTL compatible inputs
significantly reduce current loading to input drivers while TTL
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MARKING
compatible outputs offer improved switching noise performance. A V
I
DIAGRAMS
specification of 5.5 V allows MC74LCX04 inputs to be safely driven
from 5 V devices if V is less than 5.0 V.
Current drive capability is 24 mA at the outputs.
CC
14
SOIC−14
D SUFFIX
CASE 751A
LCX04G
AWLYWW
14
Features
1
Designed for 2.0 V to 5.5 V V Operation
CC
1
5 V Tolerant Inputs − Interface Capability With 5 V TTL Logic
LVTTL Compatible
14
LVCMOS Compatible
24 mA Balanced Output Sink and Source Capability
LCX
04
TSSOP−14
DT SUFFIX
CASE 948G
14
ALYWG
Near Zero Static Supply Current (10 mA) Substantially Reduces
G
1
System Power Requirements
Latchup Performance Exceeds 500 mA
1
ESD Performance: Human Body Model >2000 V;
A
= Assembly Location
WL, L = Wafer Lot
YY, Y = Year
Machine Model >200 V
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
WW, W = Work Week
G or G = Pb−Free Package
Compliant
(Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
Semiconductor Components Industries, LLC, 2012
1
Publication Order Number:
October, 2012 − Rev. 8
MC74LCX04/D
MC74LCX04
1
2
A0
A1
A2
A3
A4
A5
O0
O1
O2
O3
O4
O5
V
CC
A3
O3
A4
O4
A5
O5
3
4
14
13
12
11
10
9
8
5
6
13
11
9
12
10
8
1
2
3
4
5
6
7
A0
O0
A1
O1
A2
O2 GND
Figure 1. Pinout: 14−Lead (Top View)
Figure 2. Logic Diagram
TRUTH TABLE
An
PIN NAMES
On
Pins
Function
An
On
Data Inputs
Outputs
L
H
H
L
MAXIMUM RATINGS
Symbol
Parameter
Value
Condition
Unit
V
V
V
V
DC Supply Voltage
−0.5 to +7.0
CC
I
DC Input Voltage
−0.5 V +7.0
V
I
DC Output Voltage
−0.5 V V +0.5
Output in HIGH or LOW State (Note 1)
V < GND
V
O
O
CC
I
I
DC Input Diode Current
DC Output Diode Current
−50
mA
mA
mA
mA
mA
mA
C
IK
I
−50
+50
V
O
V
O
< GND
OK
> V
CC
I
I
I
DC Output Source/Sink Current
DC Supply Current Per Supply Pin
DC Ground Current Per Ground Pin
Storage Temperature Range
Moisture Sensitivity
50
O
100
100
CC
GND
T
−65 to +150
STG
MSL
Level 1
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. I absolute maximum rating must be observed.
O
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2
MC74LCX04
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
Typ
Max
Unit
V
CC
Supply Voltage
Operating
Data Retention Only
2.0
1.5
2.5, 3.3
2.5, 3.3
5.5
5.5
V
V
V
Input Voltage
0
0
5.5
V
V
I
Output Voltage
(HIGH or LOW State) (3−State)
V
CC
O
I
HIGH Level Output Current
V
CC
V
CC
V
CC
= 3.0 V − 3.6 V
= 2.7 V − 3.0 V
= 2.3 V − 2.7 V
−24
−12
−8
mA
OH
I
OL
LOW Level Output Current
V
CC
V
CC
V
CC
= 3.0 V − 3.6 V
= 2.7 V − 3.0 V
= 2.3 V − 2.7 V
+24
+12
+8
mA
T
Operating Free−Air Temperature
−55
+125
10
C
A
Dt/DV
Input Transition Rise or Fall Rate, V from 0.8 V to 2.0 V, V = 3.0 V
0
ns/V
IN
CC
DC ELECTRICAL CHARACTERISTICS
T
A
= −55C to +125C
Symbol
Characteristic
Condition
Min
Max
Unit
V
V
V
HIGH Level Input Voltage (Note 2)
2.3 V V 2.7 V
1.7
2.0
V
IH
CC
2.7 V V 3.6 V
CC
LOW Level Input Voltage (Note 2)
HIGH Level Output Voltage
2.3 V V 2.7 V
0.7
0.8
V
V
IL
CC
2.7 V V 3.6 V
CC
2.3 V V 3.6 V; I = −100 mA
V
− 0.2
OH
CC
OH
CC
V
CC
V
CC
V
CC
V
CC
= 2.3 V; I = −8 mA
1.8
2.2
2.4
2.2
OH
= 2.7 V; I = −12 mA
OH
= 3.0 V; I = −18 mA
OH
= 3.0 V; I = −24 mA
OH
V
LOW Level Output Voltage
2.3 V V 3.6 V; I = 100 mA
0.2
0.6
0.4
0.4
0.55
10
V
OL
CC
OL
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
= 2.3 V; I = 8 mA
OL
= 2.7 V; I = 12 mA
OL
= 3.0 V; I = 16 mA
OL
= 3.0 V; I = 24 mA
OL
I
I
I
Power Off Leakage Current
Input Leakage Current
= 0, V = 5.5 V or V = 5.5 V
OUT
mA
mA
mA
mA
OFF
IN
= 3.6 V, V = 5.5 V or GND
5
IN
IN
Quiescent Supply Current
= 3.6 V, V = 5.5 V or GND
10
CC
IN
DI
Increase in I per Input
2.3 V 3.6 V; V = V − 0.6 V
500
CC
CC
CC
IH
CC
2. These values of V are used to test DC electrical characteristics only.
I
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3
MC74LCX04
AC CHARACTERISTICS (t = t = 2.5 ns; R = 500 W)
R
F
L
Limits
T
A
= −55C to +125C
V
CC
= 3.3 V 0.3 V
V
CC
= 2.7 V
V
CC
= 2.5 V 0.2 V
C = 50 pF
L
C = 50 pF
L
C = 30 pF
L
Symbol
Parameter
Waveform
Min
1.5
1.5
Max
5.2
5.2
1.0
1.0
Min
Max
6.0
Min
1.5
1.5
Max
6.2
Unit
t
Propagation Delay Time
Input to Output
1
1.5
1.5
ns
PLH
t
t
t
6.0
6.2
PHL
Output−to−Output Skew
(Note 3)
ns
OSHL
OSLH
3. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device.
The specification applies to any outputs switching in the same direction, either HIGH−to−LOW (t
) or LOW−to−HIGH (t
); parameter
OSHL
OSLH
guaranteed by design.
DYNAMIC SWITCHING CHARACTERISTICS
T
A
= +25C
Typ
Symbol
Characteristic
Dynamic LOW Peak Voltage
(Note 4)
Condition
= 3.3 V, C = 50 pF, V = 3.3 V, V = 0 V
Min
Max
Unit
V
V
OLP
V
CC
V
CC
V
CC
V
CC
0.8
L
IH
IL
= 2.5 V, C = 30 pF, V = 2.5 V, V = 0 V
0.6
V
L
IH
IL
V
OLV
Dynamic LOW Valley Voltage
(Note 4)
= 3.3 V, C = 50 pF, V = 3.3 V, V = 0 V
−0.8
−0.6
V
L
IH
IL
= 2.5 V, C = 30 pF, V = 2.5 V, V = 0 V
V
L
IH
IL
4. Number of outputs defined as “n”. Measured with “n−1” outputs switching from HIGH−to−LOW or LOW−to−HIGH. The remaining output is
measured in the LOW state.
CAPACITIVE CHARACTERISTICS
Symbol
Parameter
Input Capacitance
Condition
= 3.3 V, V = 0 V or V
Typical
Unit
pF
C
C
C
V
V
7
8
IN
CC
I
CC
CC
Output Capacitance
= 3.3 V, V = 0 V or V
pF
OUT
PD
CC
I
Power Dissipation Capacitance
10 MHz, V = 3.3 V, V = 0 V or V
CC
25
pF
CC
I
ORDERING INFORMATION
Device
†
Package
Shipping
MC74LCX04DG
SOIC−14
(Pb−Free)
55 Units / Rail
2500 Tape & Reel
96 Units / Rail
MC74LCX04DR2G
MC74LCX04DTG
MC74LCX04DTR2G
SOIC−14
(Pb−Free)
TSSOP−14
(Pb−Free)
TSSOP−14
(Pb−Free)
2500 Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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4
MC74LCX04
V
CC
Vmi
Vmi
An
On
0 V
t
t
PLH
PHL
V
OH
OL
Vmo
Vmo
V
WAVEFORM 1 − PROPAGATION DELAYS
t
R
= t = 2.5 ns, 10% to 90%; f = 1 MHz; t = 500 ns
F
W
V
CC
3.3 V $ 0.3 V
1.5 V
2.7 V
1.5 V
1.5 V
2.5 V $ 0.2 V
Symbol
Vmi
V
CC
/2
Vmo
1.5 V
V
CC
/2
Figure 3. AC Waveforms
V
CC
PULSE
GENERATOR
DUT
R
T
C
R
L
L
C = 50 pF at V = 3.3 ꢀ0.3 V or equivalent (includes jig and probe capacitance)
L
CC
C = 30 pF at V = 2.5 ꢀ0.2 V or equivalent (includes jig and probe capacitance)
L
CC
R = R = 500 W or equivalent
L
1
R = Z
of pulse generator (typically 50 W)
T
OUT
Figure 4. Test Circuit
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5
MC74LCX04
PACKAGE DIMENSIONS
TSSOP−14
DT SUFFIX
CASE 948G
ISSUE B
NOTES:
14X K REF
1. DIMENSIONING AND TOLERANCING PER
M
S
S
V
ANSI Y14.5M, 1982.
0.10 (0.004)
T
U
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
S
0.15 (0.006) T
U
N
0.25 (0.010)
14
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
8
2X L/2
M
B
L
N
−U−
PIN 1
IDENT.
F
7
1
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
DETAIL E
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
S
K
0.15 (0.006) T
U
A
−V−
MILLIMETERS
DIM MIN MAX
INCHES
MIN MAX
K1
A
B
C
D
F
G
H
J
4.90
4.30
−−−
0.05
0.50
5.10 0.193 0.200
4.50 0.169 0.177
J J1
1.20
−−− 0.047
0.15 0.002 0.006
0.75 0.020 0.030
SECTION N−N
0.65 BSC
0.026 BSC
0.60 0.020 0.024
0.20 0.004 0.008
0.16 0.004 0.006
0.30 0.007 0.012
0.25 0.007 0.010
0.50
0.09
0.09
0.19
J1
K
−W−
C
K1 0.19
L
M
6.40 BSC
0.252 BSC
0.10 (0.004)
0
8
0
8
_
_
_
_
SEATING
PLANE
−T−
H
G
DETAIL E
D
SOLDERING FOOTPRINT*
7.06
1
0.65
PITCH
01.34X6
14X
1.26
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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6
MC74LCX04
PACKAGE DIMENSIONS
SOIC−14 NB
CASE 751A−03
ISSUE K
NOTES:
D
A
B
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION
SHALL BE 0.13 TOTAL IN EXCESS OF AT
MAXIMUM MATERIAL CONDITION.
4. DIMENSIONS D AND E DO NOT INCLUDE
MOLD PROTRUSIONS.
14
8
7
A3
E
H
5. MAXIMUM MOLD PROTRUSION 0.15 PER
SIDE.
L
DETAIL A
1
MILLIMETERS
DIM MIN MAX
INCHES
MIN MAX
13X b
M
M
B
0.25
A
A1
A3
b
D
E
1.35
0.10
0.19
0.35
8.55
3.80
1.75 0.054 0.068
0.25 0.004 0.010
0.25 0.008 0.010
0.49 0.014 0.019
8.75 0.337 0.344
4.00 0.150 0.157
M
S
S
0.25
C
A
B
DETAIL A
h
A
X 45
_
e
H
h
L
1.27 BSC
0.050 BSC
6.20 0.228 0.244
0.50 0.010 0.019
1.25 0.016 0.049
5.80
0.25
0.40
0
M
A1
e
M
7
0
7
_
_
_
_
SEATING
PLANE
C
SOLDERING FOOTPRINT*
6.50
14X
1.18
1
1.27
PITCH
14X
0.58
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks,
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MC74LCX04/D
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