MC74AC245NG [ONSEMI]
Octal Bidirectional Transceiver with 3−State Inputs/Outputs; 八路双向收发器具有三态输入/输出
| 型号： | MC74AC245NG |
| 厂家： | 
ONSEMI |
| 描述： | Octal Bidirectional Transceiver with 3−State Inputs/Outputs |
| 文件： | 总10页 (文件大小：112K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MC74AC245, MC74ACT245
Octal Bidirectional
Transceiver with 3−State
Inputs/Outputs
The MC74AC245/74ACT245 contains eight non−inverting
bidirectional buffers with 3−state outputs and is intended for
bus−oriented applications. Current sinking capability is 24 mA at both
the A and B ports. The Transmit/Receive (T/R) input determines the
direction of data flow through the bidirectional transceiver. Transmit
(active−HIGH) enables data from A ports to B ports; Receive
(active−LOW) enables data from B ports to A ports. The Output
Enable input, when HIGH, disables both A and B ports by placing
them in a High Z condition.
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PDIP−20
N SUFFIX
CASE 738
1
Features
• Noninverting Buffers
SOIC−20W
DW SUFFIX
CASE 751D
• Bidirectional Data Path
• A and B Outputs Source/Sink 24 mA
• ′ACT245 has TTL Compatible Inputs
• Pb−Free Packages are Available
1
PIN ASSIGNMENT
TSSOP−20
DT SUFFIX
CASE 948E
PIN
OE
T/R
FUNCTION
Output Enable Input
1
Transmit/Receive Input
A −A
Side A 3−State Inputs or 3−State Outputs
Side B 3−State Inputs or 3−State Outputs
0
7
B −B
SOEIAJ−20
M SUFFIX
CASE 967
0
7
TRUTH TABLES
Inputs
1
Outputs
OE T/R
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 6 of this data sheet.
L
L
H
L
H
X
Bus B Data to Bus A
Bus A Data to Bus B
High Z State
DEVICE MARKING INFORMATION
See general marking information in the device marking
section on page 7 of this data sheet.
H = HIGH Voltage Level
L = LOW Voltage Level
X = Immaterial
V
OE
19
B
B
B
B
B
B
B
B
7
CC
0
1
2
3
4
5
6
20
18
17
16
15
14
12
13
11
1
2
3
4
5
6
7
9
8
10
T/R
A
A
A
A
A
A
A
A
7
GND
0
1
2
3
4
5
6
Figure 1.
©
Semiconductor Components Industries, LLC, 2006
1
Publication Order Number:
November, 2006 − Rev. 7
MC74AC245/D
MC74AC245, MC74ACT245
MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
V
V
DC Supply Voltage (Referenced to GND)
−0.5 to +7.0
CC
V
DC Input Voltage (Referenced to GND)
DC Output Voltage (Referenced to GND)
DC Input Current, per Pin
−0.5 to V +0.5
V
IN
CC
V
−0.5 to V +0.5
V
OUT
CC
I
20
50
mA
mA
mA
°C
IN
I
DC Output Sink/Source Current, per Pin
OUT
I
DC V or GND Current per Output Pin
50
CC
CC
T
stg
Storage Temperature
−65 to +150
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
2.0
4.5
0
Typ
5.0
5.0
−
Max
6.0
Unit
′AC
V
Supply Voltage
V
V
CC
′ACT
5.5
V
, V
IN
DC Input Voltage, Output Voltage (Ref. to GND)
V
CC
OUT
V
V
V
V
V
@ 3.0 V
@ 4.5 V
@ 5.5 V
@ 4.5 V
@ 5.5 V
−
150
40
25
10
8.0
−
−
CC
CC
CC
CC
CC
Input Rise and Fall Time (Note 1)
−
−
−
−
−
ns/V
t , t
r
f
′AC Devices except Schmitt Inputs
−
−
Input Rise and Fall Time (Note 2)
t , t
r
ns/V
f
′ACT Devices except Schmitt Inputs
−
T
Junction Temperature (PDIP)
Operating Ambient Temperature Range
Output Current − High
−
140
85
°C
°C
J
T
A
−40
−
25
−
I
−24
24
mA
mA
OH
I
Output Current − Low
−
−
OL
1. V from 30% to 70% V ; see individual Data Sheets for devices that differ from the typical input rise and fall times.
IN
CC
2. V from 0.8 V to 2.0 V; see individual Data Sheets for devices that differ from the typical input rise and fall times.
IN
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2
MC74AC245, MC74ACT245
DC CHARACTERISTICS
Symbol
74AC
74AC
T
A
=
V
CC
T
A
= +25°C
Parameter
Unit
Conditions
−40°C to
+85°C
(V)
Typ
Guaranteed Limits
V
3.0
4.5
5.5
1.5
2.25
2.75
2.1
3.15
3.85
2.1
3.15
3.85
V
= 0.1 V
OUT
Minimum High Level
IH
V
V
V
or V − 0.1 V
CC
Input Voltage
V
3.0
4.5
5.5
1.5
2.25
2.75
0.9
1.35
1.65
0.9
1.35
1.65
V
= 0.1 V
OUT
Maximum Low Level
Input Voltage
IL
or V − 0.1 V
CC
V
3.0
4.5
5.5
2.99
4.49
5.49
2.9
4.4
5.4
2.9
4.4
5.4
I
= −50 mA
OUT
Minimum High Level
Output Voltage
OH
*V = V or V
IN
IL
IH
3.0
4.5
5.5
−
−
−
2.56
3.86
4.86
2.46
3.76
4.76
−12 mA
−24 mA
−24 mA
V
V
I
I
OH
V
3.0
4.5
5.5
0.002
0.001
0.001
0.1
0.1
0.1
0.1
0.1
0.1
= 50 mA
OUT
Maximum Low Level
Output Voltage
OL
*V = V or V
IN
IL
IH
3.0
4.5
5.5
−
−
−
0.36
0.36
0.36
0.44
0.44
0.44
12 mA
24 mA
24 mA
V
I
OL
I
Maximum Input
Leakage Current
IN
5.5
5.5
−
−
0.1
0.6
1.0
6.0
mA
mA
V = V , GND
I CC
I
I
V (OE) = V , V
I IL IH
Maximum
3-State
OZT
V = V , GND
I
CC
V
V
V
= V , GND
Current
O
CC
5.5
5.5
−
−
−
−
75
mA
mA
= 1.65 V Max
†Minimum Dynamic
Output Current
OLD
OHD
OLD
OHD
I
−75
= 3.85 V Min
I
Maximum Quiescent
Supply Current
CC
5.5
−
8.0
80.0
mA
V
= V or GND
IN CC
*All outputs loaded; thresholds on input associated with output under test.
†Maximum test duration 2.0 ms, one output loaded at a time.
NOTE:
I
and I @ 3.0 V are guaranteed to be less than or equal to the respective limit @ 5.5 V V
.
IN
CC
CC
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3
MC74AC245, MC74ACT245
AC CHARACTERISTICS (For Figures and Waveforms − See AND8277/D at www.onsemi.com)
74AC
74AC
T
= −40°C
A
T
= +25°C
= 50 pF
V
*
Fig.
No.
A
CC
to +85°C
C
Symbol
Parameter
Unit
C
(V)
L
= 50 pF
L
Min
Typ
Max
Min
Max
Propagation Delay
A to B or B to A
3.3
5.0
1.5
1.5
5.0
3.5
8.5
6.5
1.0
1.0
9.0
7.0
t
t
t
ns
ns
ns
ns
ns
ns
3−5
3−5
3−7
3−8
3−7
3−8
PLH
PHL
PZH
n
n
n
n
n
Propagation Delay
A to B or B to A
3.3
5.0
1.5
1.5
5.0
3.5
8.5
6.0
1.0
1.0
9.0
7.0
n
n
n
3.3
5.0
2.5
1.5
7.0
5.0
11.5
8.5
2.0
1.0
12.5
9.0
Output Enable Time
Output Enable Time
Output Disable Time
Output Disable Time
3.3
5.0
2.5
1.5
7.5
5.5
12.0
9.0
2.0
1.0
13.5
9.5
t
PZL
PHZ
3.3
5.0
2.0
1.5
6.5
5.5
12.0
9.0
1.0
1.0
12.5
10.0
t
3.3
5.0
2.0
1.5
7.0
5.5
11.5
9.0
1.5
1.0
13.0
10.0
t
PLZ
*Voltage Range 3.3 V is 3.3 V 0.3 V.
Voltage Range 5.0 V is 5.0 V 0.5 V.
DC CHARACTERISTICS
74ACT
74ACT
T
=
A
V
CC
T
A
= +25°C
Symbol
Parameter
Unit
Conditions
−40°C to
+85°C
(V)
Typ
Guaranteed Limits
V
4.5
5.5
1.5
1.5
2.0
2.0
2.0
2.0
V
= 0.1 V
OUT
Minimum High Level
Input Voltage
IH
V
V
V
or V − 0.1 V
CC
V
4.5
5.5
1.5
1.5
0.8
0.8
0.8
0.8
V
= 0.1 V
OUT
Maximum Low Level
Input Voltage
IL
or V − 0.1 V
CC
V
4.5
5.5
4.49
5.49
4.4
5.4
4.4
5.4
I
= −50 mA
OUT
Minimum High Level
Output Voltage
OH
*V = V or V
IN
IL
IH
IH
4.5
5.5
−
−
3.86
4.86
3.76
4.76
V
V
V
−24 mA
I
OH
−24 mA
V
4.5
5.5
0.001
0.001
0.1
0.1
0.1
0.1
I
= 50 mA
OUT
Maximum Low Level
Output Voltage
OL
*V = V or V
IN
IL
4.5
5.5
−
−
0.36
0.36
0.44
0.44
24 mA
24 mA
I
OL
I
Maximum Input
Leakage Current
IN
5.5
5.5
−
0.1
−
1.0
1.5
mA
V = V , GND
I CC
DI
Additional Max. I /Input
0.6
mA
V = V − 2.1 V
I CC
CCT
CC
I
V (OE) = V , V
I IL IH
Maximum
3−State
Current
OZT
5.5
−
0.6
6.0
mA
V = V , GND
I
CC
V
V
V
= V , GND
O
CC
I
5.5
5.5
−
−
−
−
75
mA
mA
= 1.65 V Max
†Minimum Dynamic
Output Current
OLD
OLD
OHD
I
−75
= 3.85 V Min
OHD
I
Maximum Quiescent
Supply Current
CC
5.5
−
8.0
80.0
mA
V
= V or GND
IN CC
*All outputs loaded; thresholds on input associated with output under test.
†Maximum test duration 2.0 ms, one output loaded at a time.
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4
MC74AC245, MC74ACT245
AC CHARACTERISTICS (For Figures and Waveforms − See AND8277/D at www.onsemi.com)
74ACT
74ACT
T
= −40°C
A
T
= +25°C
= 50 pF
V
*
CC
Fig.
No.
A
to +85°C
C
Symbol
Parameter
Unit
C
(V)
L
= 50 pF
Max
8.0
L
Min
1.5
1.5
1.5
1.5
1.5
2.0
Typ
4.0
4.0
5.0
5.5
5.5
5.0
Max
7.5
8.0
10
Min
1.5
1.0
1.5
1.5
1.0
1.5
t
t
t
Propagation Delay, A to B or B to A
5.0
5.0
5.0
5.0
5.0
5.0
ns
ns
ns
ns
ns
ns
3−5
3−5
3−7
3−8
3−7
3−8
PLH
PHL
PZH
n
n
n
n
n
Propagation Delay, A to B or B to A
9.0
n
n
n
Output Enable Time
Output Enable Time
Output Disable Time
Output Disable Time
11.0
12.0
11.0
11.0
t
10
PZL
PHZ
t
10
t
10
PLZ
*Voltage Range 5.0 V is 5.0 V 0.5 V.
CAPACITANCE
Symbol
Value
Typ
Parameter
Unit
Test Conditions
C
Input Capacitance
4.5
15
45
pF
pF
pF
V
V
V
= 5.0 V
= 5.0 V
= 5.0 V
IN
I/O
PD
CC
CC
CC
C
C
Input/Output Capacitance
Power Dissipation Capacitance
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5
MC74AC245, MC74ACT245
ORDERING INFORMATION
Device
†
Package
Shipping
MC74AC245N
PDIP−20
MC74AC245NG
PDIP−20
(Pb−Free)
18 Units / Rail
MC74ACT245N
PDIP−20
MC74ACT245NG
PDIP−20
(Pb−Free)
MC74AC245DW
SOIC−20
38 Units / Rail
1000 / Tape & Reel
38 Units / Rail
MC74AC245DWG
SOIC−20
(Pb−Free)
MC74AC245DWR2
MC74AC245DWR2G
SOIC−20
SOIC−20
(Pb−Free)
MC74ACT245DW
MC74ACT245DWG
SOIC−20
SOIC−20
(Pb−Free)
MC74ACT245DWR2
MC74ACT245DWR2G
SOIC−20
1000 / Tape & Reel
SOIC−20
(Pb−Free)
MC74AC245DT
TSSOP−20*
TSSOP−20*
TSSOP−20*
TSSOP−20*
TSSOP−20*
TSSOP−20*
TSSOP−20*
TSSOP−20*
SOEIAJ−20
75 Units / Rail
2500 / Tape & Reel
75 Units / Rail
MC74AC245DTG
MC74AC245DTR2
MC74AC245DTR2G
MC74ACT245DT
MC74ACT245DTG
MC74ACT245DTR2
MC74ACT245DTR2G
MC74AC245M
2500 / Tape & Reel
40 Units / Rail
2000 / Tape & Reel
40 Units / Rail
MC74AC245MG
SOEIAJ−20
(Pb−Free)
MC74AC245MEL
MC74AC245MELG
SOEIAJ−20
SOEIAJ−20
(Pb−Free)
MC74ACT245M
SOEIAJ−20
MC74ACT245MG
SOEIAJ−20
(Pb−Free)
MC74ACT245MEL
MC74ACT245MELG
SOEIAJ−20
2000 / Tape & Reel
SOEIAJ−20
(Pb−Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*These packages are inherently Pb−Free.
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6
MC74AC245, MC74ACT245
MARKING DIAGRAMS
PDIP−20
SOIC−20W
TSSOP−20
SOEIAJ−20
20
20
20
1
20
1
AC
245
AC245
AWLYYWWG
MC74AC245N
AWLYYWWG
74AC245
AWLYWWG
ALYWG
G
1
1
20
20
20
1
20
1
ACT
245
ACT245
AWLYYWWG
74ACT245
AWLYWWG
MC74ACT245N
AWLYYWWG
ALYWG
G
1
1
A
WL, L
YY, Y
= Assembly Location
= Wafer Lot
= Year
WW, W = Work Week
G or G
= Pb−Free Package
(Note: Microdot may be in either location)
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7
MC74AC245, MC74ACT245
PACKAGE DIMENSIONS
PDIP−20
N SUFFIX
PLASTIC DIP PACKAGE
CASE 738−03
ISSUE E
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
−A−
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
20
1
11
10
B
INCHES
DIM MIN MAX
MILLIMETERS
L
C
MIN
25.66
6.10
3.81
0.39
MAX
27.17
6.60
4.57
0.55
A
B
C
D
E
F
1.010
0.240
0.150
0.015
1.070
0.260
0.180
0.022
0.050 BSC
1.27 BSC
−T−
SEATING
PLANE
K
0.050
0.070
1.27
1.77
G
J
0.100 BSC
2.54 BSC
M
0.008
0.110
0.015
0.140
0.21
2.80
0.38
3.55
N
E
K
L
0.300 BSC
7.62 BSC
G
F
M
N
0
0.020
15
0.040
0
_
0.51
15
1.01
J 20 PL
_
_
_
D 20 PL
M
M
B
0.25 (0.010)
T
M
M
A
0.25 (0.010)
T
SOIC−20W
DW SUFFIX
CASE 751D−05
ISSUE G
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
D
A
q
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
PROTRUSION.
20
11
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION
SHALL BE 0.13 TOTAL IN EXCESS OF B
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
E
B
MILLIMETERS
1
10
DIM MIN
MAX
2.65
0.25
0.49
0.32
12.95
7.60
A
A1
B
C
D
E
2.35
0.10
0.35
0.23
12.65
7.40
20X B
M
S
S
B
0.25
T A
e
1.27 BSC
H
h
10.05
0.25
0.50
0
10.55
0.75
0.90
7
A
L
q
_
_
SEATING
PLANE
18X e
A1
C
T
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8
MC74AC245, MC74ACT245
PACKAGE DIMENSIONS
TSSOP−20
DT SUFFIX
CASE 948E−02
ISSUE C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION:
MILLIMETER.
20X K REF
K
M
S
S
V
0.10 (0.004)
T
U
S
U
K1
0.15 (0.006) T
3. DIMENSION A DOES NOT INCLUDE
MOLD FLASH, PROTRUSIONS OR GATE
BURRS. MOLD FLASH OR GATE BURRS
SHALL NOT EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION
SHALL NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
J J1
20
11
2X L/2
B
SECTION N−N
L
−U−
PIN 1
IDENT
0.25 (0.010)
N
1
10
M
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
S
0.15 (0.006) T
U
A
−V−
N
MILLIMETERS
INCHES
DIM MIN
MAX
6.60
4.50
1.20
0.15
0.75
MIN
MAX
0.260
0.177
F
A
B
6.40
4.30
−−−
0.252
0.169
DETAIL E
C
−−− 0.047
0.006
0.030
D
0.05
0.50
0.002
0.020
F
G
H
0.65 BSC
0.026 BSC
−W−
0.27
0.09
0.09
0.19
0.19
0.37
0.20
0.16
0.30
0.25
0.011
0.004
0.004
0.007
0.007
0.015
0.008
0.006
0.012
0.010
C
J
J1
K
G
D
H
K1
L
DETAIL E
6.40 BSC
0.252 BSC
0
0.100 (0.004)
−T− SEATING
M
0
8
8
_
_
_
_
PLANE
SOLDERING FOOTPRINT*
7.06
1
0.65
PITCH
16X
0.36
16X
1.26
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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9
MC74AC245, MC74ACT245
PACKAGE DIMENSIONS
SOEIAJ−20
M SUFFIX
CASE 967−01
ISSUE A
NOTES:
ꢀꢁ1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
L
20
11
E
Q
ꢀꢁ2. CONTROLLING DIMENSION: MILLIMETER.
ꢀꢁ3. DIMENSIONS D AND E DO NOT INCLUDE
MOLD FLASH OR PROTRUSIONS AND ARE
MEASURED AT THE PARTING LINE. MOLD FLASH
OR PROTRUSIONS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
1
H
E
E
_
M
ꢀꢁ4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
L
1
10
ꢀꢁ5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
DETAIL P
Z
D
VIEW P
e
A
c
MILLIMETERS
INCHES
MIN MAX
−−− 0.081
DIM MIN
MAX
2.05
0.20
0.50
0.25
12.80
5.45
A
−−−
0.05
A
1
A
b
1
0.002
0.008
0.020
0.010
0.504
0.215
b
c
0.35
0.15
0.014
0.006
0.486
0.201
M
0.10 (0.004)
0.13 (0.005)
D
E
e
12.35
5.10
1.27 BSC
0.050 BSC
H
7.40
0.50
1.10
8.20
0.85
1.50
0.291
0.020
0.043
0.323
0.033
0.059
E
L
L
E
M
Q
0
10
10
0.035
0
0.028
_
_
_
_
0.70
−−−
0.90
0.81
1
Z
−−− 0.032
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to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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