MC33375ST-5.0T3G [ONSEMI]
300 mA, Low Dropout Voltage Regulator with On/Off Control; 300毫安，低压差稳压器具有开/关控制
| 型号： | MC33375ST-5.0T3G |
| 厂家： | 
ONSEMI |
| 描述： | 300 mA, Low Dropout Voltage Regulator with On/Off Control |
| 文件： | 总14页 (文件大小：249K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MC33375, NCV33375 Series
300 mA, Low Dropout
Voltage Regulator with
On/Off Control
The MC33375 series are micropower low dropout voltage
regulators available in a wide variety of output voltages as well as
packages, SOT−223 and SOP−8. These devices feature a very low
quiescent current and are capable of supplying output currents up to
300 mA. Internal current and thermal limiting protection are provided
by the presence of a short circuit at the output and an internal thermal
shutdown circuit.
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LOW DROPOUT
MICROPOWER VOLTAGE
REGULATOR
The MC33375 has a control pin that allows a logic level signal to
turn−off or turn−on the regulator output.
MARKING
DIAGRAMS
Due to the low input−to−output voltage differential and bias current
specifications, these devices are ideally suited for battery powered
computer, consumer, and industrial equipment where an extension of
useful battery life is desirable.
4
SOT−223
ST SUFFIX
CASE 318E
AYM
375xx G
G
1
Features:
• Low Quiescent Current (0.3 ꢀ A in OFF mode; 125 ꢀ A in ON mode)
1
8
• Low Input−to−Output Voltage Differential of 25 mV at I = 10 mA,
O
and 260 mV at I = 300 mA
O
• Extremely Tight Line and Load Regulation
375xx
ALYW
G
• Stable with Output Capacitance of only 0.33 ꢀ F for 2.5 V Output
SOIC−8
D SUFFIX
CASE 751
8
Voltage
1
• Internal Current and Thermal Limiting
• Logic Level ON/OFF Control
1
• Pb−Free Packages are Available
A
Y
= Assembly Location
= Year
• NCV Prefix for Automotive and Other Applications Requiring Site
M = Date Code
= Wafer Lot
and Control Changes
L
W = Work Week
xx = Voltage Version
V
in
V
out
G
= Pb−Free Package
(Note: Microdot may be in either location)
Thermal &
Anti−sat
Protection
ORDERING INFORMATION
On/Off
See detailed ordering and shipping information in the
package dimensions section on page 11 of this data sheet.
Rint
On/Off
Block
1.23 V
V. Ref.
54 K
GND
This device contains 41 active transistors
Figure 1. Simplified Block Diagram
© Semiconductor Components Industries, LLC, 2009
1
Publication Order Number:
May, 2009 − Rev. 12
MC33375/D
MC33375, NCV33375 Series
PIN CONNECTIONS
Gnd
1
2
3
4
8
7
6
5
4
Input
Gnd
Output
Gnd
Gnd
Gnd
ON/OFF
N/C
1
2
3
V
in
ON/ V
out
OFF
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Input Voltage
V
CC
13
Vdc
Power Dissipation and Thermal Characteristics
T = 25°C
A
P
Internally Limited
W
Maximum Power Dissipation
D
Case 751 (SOP−8) D Suffix
R
R
160
25
°C/W
°C/W
Thermal Resistance, Junction−to−Ambient
Thermal Resistance, Junction−to−Case
Case 318E (SOT−223) ST Suffix
Thermal Resistance, Junction−to−Air
Thermal Resistance, Junction−to−Case
ꢁ
JA
JC
ꢁ
245
15
°C/W
°C/W
R
R
ꢁ
JA
JC
ꢁ
Output Current
I
300
mA
°C
°C
°C
O
Maximum Junction Temperature
Operating Ambient Temperature Range
Storage Temperature Range
T
150
J
T
− 40 to +125
− 65 to +150
A
T
stg
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
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2
MC33375, NCV33375 Series
ELECTRICAL CHARACTERISTICS (C = 1.0 ꢀ F, T = 25°C, for min/max values T = −40°C to +125°C, Note 1)
L
A
J
Characteristic
Symbol
Min
Typ
Max
Unit
Output Voltage
1.8 V Suffix
2.5 V Suffix
3.0 V Suffix
3.3 V Suffix
5.0 V Suffix
I
= 0 mA to 250 mA
V
O
Vdc
O
T = 25°C, V = [V + 1] V
1.782
2.475
2.970
3.267
4.950
1.80
2.50
3.00
3.30
5.00
1.818
2.525
3.030
3.333
5.05
A
in
O
1.8 V Suffix
2.5 V Suffix
3.0 V Suffix
3.3 V Suffix
5.0 V Suffix
V
= [V + 1] V, 0 < I < 100 mA
1.764
2.450
2.940
3.234
4.900
−
−
−
−
−
1.836
2.550
3.060
3.366
5.100
in
O
O
2% Tolerance from T = −40 to +125°C
J
Line Regulation
V
= [V + 1] V to 12 V, I = 250 mA,
Reg
−
2.0
10
mV
mV
mV
in
O
O
line
All Suffixes T = 25°C
A
Load Regulation
V
in
= [V + 1] V, I = 0 mA to 250 mA,
Reg
load
−
5.0
25
O
O
All Suffixes T = 25°C
A
Dropout Voltage (Note 3)
V − V
in O
I
O
I
O
I
O
I
O
= 10 mA
T = −40°C to +125°C
J
−
−
−
−
25
100
200
400
500
= 100 mA
= 250 mA
= 300 mA
115
220
260
Ripple Rejection (120 Hz)
Output Noise Voltage
V
= [V + 1.5] V to [V + 5.5] V
−
65
75
−
dB
in(peak−peak)
O
O
V
n
ꢀ
V
r
m
s
C = 1.0 ꢀ F
C = 200 ꢀ F
L
I
O
= 50 mA (10 Hz to 100 kHz)
−
−
160
46
−
−
L
CURRENT PARAMETERS
Quiescent Current ON Mode
Quiescent Current OFF Mode
V
V
= [V + 1] V, I = 0 mA
I
I
−
−
125
0.3
200
4.0
ꢀ A
ꢀ A
ꢀ A
in
O
O
QOn
QOff
Quiescent Current ON Mode SAT
1.8 V Suffix
2.5 V Suffix
3.0 V Suffix
3.3 V Suffix
= [V − 0.5] V, I = 0 mA (Note 2)
I
QSAT
in
O
O
−
−
−
−
−
1100
1100
1500
1500
1500
1500
1500
2000
2000
2000
5.0 V Suffix
Current Limit
V
in
= [V + 1] V, V Shorted
I
LIMIT
−
450
−
mA
V
O
O
ON/OFF INPUTS
On/Off Input Voltage
V
CTRL
Logic “1” (Regulator On) V = V
Logic “0” (Regulator Off) V < 0.03 V
2%
2.4
−
−
−
−
−
−
0.5
0.3
out
out
O
Logic “0” (Regulator Off) V < 0.05 V (1.8 V Option)
out
THERMAL SHUTDOWN
Thermal Shutdown
−
−
150
−
°C
1. Low duty pulse techniques are used during test to maintain junction temperature as close to ambient as possible.
2. Quiescent Current is measured where the PNP pass transistor is in saturation. V = [V − 0.5] V guarantees this condition.
in
O
3. For 1.8 V version V is constrained by the minimum input voltage of 2.5 V.
DO
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3
MC33375, NCV33375 Series
DEFINITIONS
Load Regulation − The change in output voltage for a
difference between the input power (V X I ) and the
CC CC
change in load current at constant chip temperature.
Dropout Voltage − The input/output differential at which
the regulator output no longer maintains regulation against
further reductions in input voltage. Measured when the
output drops 100 mV below its nominal value (which is
measured at 1.0 V differential), dropout voltage is affected
by junction temperature, load current and minimum input
supply requirements.
output power (V X I ) is increasing.
out out
Depending on ambient temperature, it is possible to
calculate the maximum power dissipation and so the
maximum current as following:
T – T
J
A
Pd +
R
ꢁJA
The maximum operating junction temperature T is
J
specified at 150°C, if T = 25°C, then P can be found. By
Output Noise Voltage − The RMS AC voltage at the
output with a constant load and no input ripple, measured
over a specified frequency range.
A
D
neglecting the quiescent current, the maximum power
dissipation can be expressed as:
Maximum Power Dissipation − The maximum total
dissipation for which the regulator will operate within
specifications.
Quiescent Current − Current which is used to operate the
regulator chip and is not delivered to the load.
Line Regulation − The change in output voltage for a
change in the input voltage. The measurement is made under
conditions of low dissipation or by using pulse techniques
such that the average chip temperature is not significantly
affected.
Maximum Package Power Dissipation − The maximum
package power dissipation is the power dissipation level at
which the junction temperature reaches its maximum value
i.e. 150°C. The junction temperature is rising while the
P
D
I
+
out
V
– V
out
CC
The thermal resistance of the whole circuit can be
evaluated by deliberately activating the thermal shutdown
of the circuit (by increasing the output current or raising the
input voltage for example).
Then you can calculate the power dissipation by
subtracting the output power from the input power. All
variables are then well known: power dissipation, thermal
shutdown temperature (150°C for MC33375) and ambient
temperature.
T – T
J
A
R
+
ꢁJA
P
D
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4
MC33375, NCV33375 Series
200
150
100
50
70
60
7
6
5
4
3
2
7
6
5
4
3
2
T = 25° C
A
C = 0.47 ꢀ F
L
I = 10 mA
V
in
L
50
40
V
out
= 3.3 V
30
20
0
10
V
out
0
-50
-100
1
0
1
0
-10
-20
200
0
20
40
60
80 100 120 140 160 180 200
0
50
100
150
TIME (ꢀ S)
TIME (ꢀ S)
Figure 2. Line Transient Response
Figure 3. Line Transient Response
1.0
0.8
0.6
0.4
0.2
350
250
300
200
100
0
0.14
0.09
LOAD
CURRENT
150
LOAD CURRENT
50
-50
0.04
-100
-200
-300
-150
-250
-350
-450
-550
0
-0.01
-0.06
-0.11
-0.16
-0.2
-0.4
-0.6
-0.8
-1.0
V
out
C = 33.0 ꢀF
L
C = 1.0 ꢀ F
L
V
out
CHANGE
V
out
= 3.3 V
-400
-500
-600
-700
V
out
= 3.3 V
CHANGE
T = 25° C
A
V = 4.3 V
T = 25° C
A
V = 4.3 V
in
in
-650
-750
0
50
100
150
200
250
300
350 400
0
50
100
150
200
250
300
TIME (ꢀ S)
TIME (ꢀ S)
Figure 5. Load Transient Response
Figure 4. Load Transient Response
300
250
200
150
100
3.5
3.0
2.5
2.0
1.5
1.0
I = 1 mA
L
I = 250 mA
L
50
0
0.5
0
1
10
100
1000
0
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
I , OUTPUT CURRENT (mA)
O
INPUT VOLTAGE (V)
Figure 6. Output Voltage versus Input Voltage
Figure 7. Dropout Voltage versus Output Current
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5
MC33375, NCV33375 Series
12
10
8
300
250
200
150
100
I = 300 mA
L
I = 300 mA
L
I = 250 mA
L
6
I = 100 mA
L
4
I = 100 mA
L
2
50
0
I = 10 mA
L
I = 50 mA
L
0
-40
0
25
85
0
1
2
3
4
5
6
7
8
TEMPERATURE (°C)
V
in
(VOLTS)
Figure 9. Ground Pin Current versus
Input Voltage
Figure 8. Dropout Voltage versus Temperature
2.5
8
7
6
5
4
3
2
I
O
= 0
2.495
2.49
I = 250 mA
L
I
O
= 250 mA
2.485
2.48
I = 100 mA
L
I = 50 mA
L
2.475
2.47
1
0
-40
0
25
85
-40 -20
0
20
40
60
80
100 120 140
TEMPERATURE (°C)
T (°C)
A
Figure 10. Ground Pin Current versus
Ambient Temperature
Figure 11. Output Voltage versus Ambient
Temperature (Vin = Vout + 1V)
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6
MC33375, NCV33375 Series
2.5
2.495
2.49
I
O
= 0
I
O
= 250 mA
2.485
2.48
2.475
2.47
2.465
-40
0
25
85
TEMPERATURE (°C)
Figure 12. Output Voltage versus Ambient
Temperature (Vin = 12 V)
70
60
70
60
50
40
30
20
I = 100 mA
L
I = 10 mA
L
50
40
30
20
I = 250 mA
L
I = 1 mA
L
10
0
10
0
0.1
1
10
100
0.1
1
10
100
FREQUENCY (kHz)
FREQUENCY (kHz)
Figure 13. Ripple Rejection
Figure 14. Ripple Rejection
5
4.5
4
ENABLE
3.5
C = 1.0 ꢀ F
L
3
2.5
2
C = 33 ꢀ F
L
1.5
1
0.5
0
0
100
200
300
400
500
TIME (ꢀ S)
Figure 15. Enable Transient
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7
MC33375, NCV33375 Series
1.8 V Option
2.0
1.85
1.84
1.83
1.82
1.81
1.80
1.79
1.78
1.77
I
= 100 mA
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
LOAD
T = 25° C
A
I
= 0 mA
0.2
0
LOAD
1.76
1.75
-40
-20
0
20
40
60
80
100
120
0
1
2
3
4
5
6
T , AMBIENT TEMPERATURE (°C)
A
V
CC
, (V)
Figure 16. Output Voltage versus Temperature
Figure 17. Output Voltage versus Input Voltage
12
10
8
140
120
100
80
T = 25° C
A
V
CC
= 3 V
6
60
4
40
T = 25° C
A
2
0
20
0
I
= 0 mA
LOAD
0
50
100
150
200
250
300
350
0
1
2
3
4
5
6
I , (mA)
LOAD
V
CC
, (V)
Figure 19. Quiescent Current versus Input Voltage
Figure 18. Ground Current versus Load Current
80
70
60
50
40
30
20
V
= 3 V
= 1 mA
CC
I
LOAD
T = 25°C
A
C
= 1 ꢀ F
OUT
ENABLE
2 V
V
OUT
0 V
10
0
0
5
10
15
20
25
30
35
40
45
50
0.1
1
10
100
1000
t, TIME (ꢀ s)
f, FREQUENCY (kHz)
Figure 20. PSRR versus Frequency
Figure 21. Enable Response
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8
MC33375, NCV33375 Series
V
CC
= 3 V
I
= 1 mA to 100 mA
LOAD
T = 25°C
A
1.82 V
1.80 V
1.78 V
100 mA
1 mA
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
t, TIME (ms)
Figure 22. Load Transient Response
APPLICATIONS INFORMATION
ON/OFF
V
out
V
in
MC33375−xx
C
C
LOAD
in
out
GND
Figure 23. Typical Application Circuit
The MC33375 regulators are designed with internal
current limiting and thermal shutdown making them
user−friendly. Figure 15 is a typical application circuit. The
output capability of the regulator is in excess of 300 mA,
with a typical dropout voltage of less than 260 mV. Internal
protective features include current and thermal limiting.
frequencies. A 0.33 ꢀ F or larger tantalum, mylar, ceramic,
or other capacitor having low internal impedance at high
frequencies should be chosen. The bypass capacitor should
be mounted with shortest possible lead or track length
directly across the regulator’s input terminals. Figure 16
shows the ESR that allows the LDO to remain stable for
various load currents.
EXTERNAL CAPACITORS
These regulators require only a 0.33 ꢀ F (or greater)
capacitance between the output and ground for stability for
1.8 V, 2.5 V, 3.0 V, and 3.3 V output voltage options. Output
voltage options of 5.0 V require only 0.22 ꢀ F for stability.
The output capacitor must be mounted as close as possible
to the MC33375. If the output capacitor must be mounted
further than two centimeters away from the MC33375, then
a larger value of output capacitor may be required for
stability. A value of 0.68 ꢀ F or larger is recommended. Most
type of aluminum, tantalum, or multilayer ceramic will
perform adequately. Solid tantalums or appropriate
multilayer ceramic capacitors are recommended for
operation below 25°C. An input bypass capacitor is
recommended to improve transient response or if the
regulator is connected to the supply input filter with long
wire lengths, more than 4 inches. This will reduce the
circuit’s sensitivity to the input line impedance at high
100
V
C
C
= 3.0 V
= 1.0 ꢀ F
= 1.0 ꢀ F
out
out
in
10
Stable Region
1.0
0.1
0
50
100
150
200
250
300
LOAD CURRENT (mA)
Figure 24. ESR for Vout = 3.0V
Applications should be tested over all operating
conditions to insure stability.
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9
MC33375, NCV33375 Series
THERMAL PROTECTION
The internal current limit will typically limit current to
450 mA. If during current limit the junction exceeds 150°C,
the thermal protection will protect the device also. Current
limit is not a substitute for proper heatsinking.
Internal thermal limiting circuitry is provided to protect
the integrated circuit in the event that the maximum junction
temperature is exceeded. When activated, typically at
150°C, the output is disabled. There is no hysteresis built
into the thermal protection. As a result the output will appear
to be oscillating during thermal limit. The output will turn
off until the temperature drops below the 150°C then the
output turns on again. The process will repeat if the junction
increases above the threshold. This will continue until the
existing conditions allow the junction to operate below the
temperature threshold.
OUTPUT NOISE
In many applications it is desirable to reduce the noise
present at the output. Reducing the regulator bandwidth by
increasing the size of the output capacitor will reduce the
noise on the MC33375.
ON/OFF PIN
When this pin is pulled low, the MC33375 is off. This pin
should not be left floating. The pin should be pulled high for
the MC33375 to operate.
Thermal limit is not a substitute for proper
heatsinking.
180
160
1.6
1.4
P
for T = 50°C
D(max)
A
140
120
100
80
1.2
1.0
0.8
0.6
0.4
2.0 oz. Copper
L
Minimum
Size Pad
L
R
ꢁ
JA
60
0
5.0
10
15
20
25
30
L, LENGTH OF COPPER (mm)
Figure 25. SOT−223 Thermal Resistance and Maximum
Power Dissipation versus P.C.B. Copper Length
170
150
130
110
90
3.2
2.8
2.4
2.0
1.6
1.2
P
for T = 50°C
A
D(max)
Graph Represents Symmetrical Layout
2.0 oz.
L
Copper
70
3.0
mm
L
R
ꢁ
JA
50
30
0.8
0.4
0
10
20
30
40
50
L, LENGTH OF COPPER (mm)
Figure 26. SOP−8 Thermal Resistance and Maximum
Power Dissipation versus P.C.B. Copper Length
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10
MC33375, NCV33375 Series
ORDERING INFORMATION
Operating
Temperature Range,
†
Tolerance
Device
MC33375ST−1.8T3
MC33375ST−1.8T3G
NCV33375ST1.8T3G
MC33375D−2.5
Type
Package
Shipping
SOT−223
1.8 V
(Fixed Voltage)
SOT−223
(Pb−Free)
4000 / Tape & Reel
98 Units / Rail
SOIC−8
MC33375D−2.5G
SOIC−8
(Pb−Free)
MC33375D−2.5R2
MC33375D−2.5R2G
NCV33375D−2.5R2G
MC33375ST−2.5T3
MC33375ST−2.5T3G
SOIC−8
2.5 V
(Fixed Voltage)
SOIC−8
(Pb−Free)
2500 / Tape & Reel
SOT−223
4000 / Tape & Reel
98 Units / Rail
SOT−223
(Pb−Free)
MC33375D−3.0
SOIC−8
MC33375D−3.0G
SOIC−8
(Pb−Free)
MC33375D−3.0R2
MC33375D−3.0R2G
SOIC−8
3.0 V
(Fixed Voltage)
2500 / Tape & Reel
4000 / Tape & Reel
98 Units / Rail
1% Tolerance
SOIC−8
(Pb−Free)
at T = 25°C
A
MC33375ST−3.0T3
MC33375ST−3.0T3G
SOT−223
2% Tolerance at
T from −40 to +125°C
SOT−223
(Pb−Free)
J
MC33375D−3.3
SOIC−8
MC33375D−3.3G
SOIC−8
(Pb−Free)
MC33375D−3.3R2
MC33375D−3.3R2G
SOIC−8
3.3 V
(Fixed Voltage)
2500 / Tape & Reel
4000 / Tape & Reel
98 Units / Rail
SOIC−8
(Pb−Free)
MC33375ST−3.3T3
MC33375ST−3.3T3G
SOT−223
SOT−223
(Pb−Free)
MC33375D−5.0
SOIC−8
MC33375D−5.0G
SOIC−8
(Pb−Free)
MC33375D−5.0R2
MC33375D−5.0R2G
SOIC−8
5.0 V
(Fixed Voltage)
2500 / Tape & Reel
4000 / Tape & Reel
SOIC−8
(Pb−Free)
MC33375ST−5.0T3
MC33375ST−5.0T3G
SOT−223
SOT−223
(Pb−Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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11
MC33375, NCV33375 Series
DEVICE MARKING
Device
Version
1.8 V
2.5 V
3.0 V
3.3 V
5.0 V
Marking (1st line)
37518
MC33375, NCV33375
MC33375, NCV33375
MC33375
37525
37530
MC33375
37533
MC33375
37550
TAPE AND REEL SPECIFICATIONS†
Device
Reel Size
Tape Width
Quantity
2500 Units
4000 Units
MC33375D, NCV33375D
MC33375ST, NCV33375ST
13″
13″
12 mm Embossed Tape
8 mm Embossed Tape
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
http://onsemi.com
12
MC33375, NCV33375 Series
PACKAGE DIMENSIONS
SOT−223 (TO−261)
CASE 318E−04
ISSUE M
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
D
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
b1
MILLIMETERS
INCHES
NOM
0.064
0.002
0.030
0.121
0.012
0.256
0.138
0.091
0.037
0.069
0.276
−
4
2
DIM
A
A1
b
b1
c
D
E
e
e1
L1
MIN
1.50
0.02
0.60
2.90
0.24
6.30
3.30
2.20
0.85
1.50
6.70
0°
NOM
1.63
0.06
0.75
3.06
0.29
6.50
3.50
2.30
0.94
1.75
7.00
−
MAX
1.75
0.10
0.89
3.20
0.35
6.70
3.70
2.40
1.05
2.00
7.30
10°
MIN
0.060
0.001
0.024
0.115
0.009
0.249
0.130
0.087
0.033
0.060
0.264
0°
MAX
0.068
0.004
0.035
0.126
0.014
0.263
0.145
0.094
0.041
0.078
0.287
10°
H
E
E
1
3
b
e1
e
H
E
C
q
q
A
0.08 (0003)
A1
L1
SOLDERING FOOTPRINT*
3.8
0.15
2.0
0.079
6.3
0.248
2.3
0.091
2.3
0.091
2.0
0.079
mm
inches
1.5
0.059
ǒ
Ǔ
SCALE 6:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
13
MC33375, NCV33375 Series
PACKAGE DIMENSIONS
SOIC−8 NB
CASE 751−07
ISSUE AJ
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
−X−
A
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
8
5
4
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. 751−01 THRU 751−06 ARE OBSOLETE. NEW
STANDARD IS 751−07.
S
M
M
B
0.25 (0.010)
Y
1
K
−Y−
G
MILLIMETERS
DIM MIN MAX
INCHES
MIN
MAX
0.197
0.157
0.069
0.020
A
B
C
D
G
H
J
K
M
N
S
4.80
3.80
1.35
0.33
5.00 0.189
4.00 0.150
1.75 0.053
0.51 0.013
C
N X 45
_
SEATING
PLANE
−Z−
1.27 BSC
0.050 BSC
0.10 (0.004)
0.10
0.19
0.40
0
0.25 0.004
0.25 0.007
1.27 0.016
0.010
0.010
0.050
8
0.020
0.244
M
J
H
D
8
0
_
_
_
_
0.25
5.80
0.50 0.010
6.20 0.228
M
S
S
X
0.25 (0.010)
Z
Y
SOLDERING FOOTPRINT*
1.52
0.060
7.0
4.0
0.275
0.155
0.6
0.024
1.270
0.050
mm
inches
ǒ
Ǔ
SCALE 6:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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MC33375/D
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