MC14017BCP [ONSEMI]

Decade Counter; 十进制计数器
MC14017BCP
型号: MC14017BCP
厂家: ONSEMI    ONSEMI
描述:

Decade Counter
十进制计数器

计数器
文件: 总8页 (文件大小:234K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
The MC14017B is a five–stage Johnson decade counter with  
built–in code converter. High speed operation and spike–free outputs  
are obtained by use of a Johnson decade counter design. The ten  
decoded outputs are normally low, and go high only at their  
appropriate decimal time period. The output changes occur on the  
positive–going edge of the clock pulse. This part can be used in  
frequency division applications as well as decade counter or decimal  
decode display applications.  
http://onsemi.com  
MARKING  
DIAGRAMS  
Fully Static Operation  
16  
DC Clock Input Circuit Allows Slow Rise Times  
Carry Out Output for Cascading  
Divide–by–N Counting  
PDIP–16  
P SUFFIX  
CASE 648  
MC14017BCP  
AWLYYWW  
1
Supply Voltage Range = 3.0 Vdc to 18 Vdc  
Capable of Driving Two Low–power TTL Loads or One Low–power  
Schottky TTL Load Over the Rated Temperature Range  
Pin–for–Pin Replacement for CD4017B  
16  
SOIC–16  
D SUFFIX  
CASE 751B  
14017B  
AWLYWW  
Triple Diode Protection on All Inputs  
1
16  
SOEIAJ–16  
F SUFFIX  
CASE 966  
MAXIMUM RATINGS (Voltages Referenced to V ) (Note 2.)  
SS  
MC14017B  
AWLYWW  
Symbol  
Parameter  
Value  
Unit  
V
V
DD  
DC Supply Voltage Range  
0.5 to +18.0  
1
V , V  
Input or Output Voltage Range  
(DC or Transient)  
0.5 to V + 0.5  
V
in out  
DD  
A
= Assembly Location  
WL or L = Wafer Lot  
YY or Y = Year  
WW or W = Work Week  
I , I  
in out  
Input or Output Current  
(DC or Transient) per Pin  
±10  
mA  
P
D
Power Dissipation,  
500  
mW  
per Package (Note 3.)  
ORDERING INFORMATION  
T
Ambient Temperature Range  
Storage Temperature Range  
55 to +125  
65 to +150  
260  
°C  
°C  
°C  
A
Device  
Package  
PDIP–16  
SOIC–16  
Shipping  
T
stg  
T
Lead Temperature  
(8–Second Soldering)  
MC14017BCP  
MC14017BD  
2000/Box  
48/Rail  
L
2. Maximum Ratings are those values beyond which damage to the device  
may occur.  
3. Temperature Derating:  
MC14017BDR2  
SOIC–16 2500/Tape & Reel  
Plastic “P and D/DW” Packages: – 7.0 mW/ C From 65 C To 125 C  
MC14017BF  
SOEIAJ–16  
SOEIAJ–16  
See Note 1.  
See Note 1.  
This device contains protection circuitry to guard against damage due to high  
static voltages or electric fields. However, precautions must be taken to avoid  
applications of any voltage higher than maximum rated voltages to this  
MC14017BFEL  
1. For ordering information on the EIAJ version of the  
SOIC packages, please contact your local ON  
Semiconductor representative.  
high–impedancecircuit. For proper operation, V and V should be constrained  
in  
out  
to the range V  
(V or V  
)
V
DD  
.
SS  
in  
out  
Unused inputs must always be tied to an appropriate logic voltage level (e.g.,  
either V or V ). Unused outputs must be left open.  
SS  
DD  
Semiconductor Components Industries, LLC, 2000  
1
Publication Order Number:  
March, 2000 – Rev. 3  
MC14017B/D  
MC14017B  
PIN ASSIGNMENT  
Q5  
Q1  
Q0  
Q2  
Q6  
Q7  
Q3  
1
2
3
4
5
6
7
8
16  
V
DD  
15 RESET  
14 CLOCK  
13  
12  
CE  
C
out  
11 Q9  
10 Q4  
V
SS  
9
Q8  
FUNCTIONAL TRUTH TABLE  
(Positive Logic)  
BLOCK DIAGRAM  
CLOCK 14  
Q0  
Q1  
Q2  
Q3  
Q4  
Q5  
Q6  
Q7  
Q8  
Q9  
3
2
4
7
10  
1
5
6
Clock  
Decode  
Clock Enable Reset Output=n  
0
X
X
X
1
X
0
0
0
1
0
0
0
0
n
n
Q0  
n+1  
n
CLOCK  
ENABLE  
13  
X
X
1
n
n+1  
9
11  
RESET 15  
C
out  
12  
X = Don’t Care. If n < 5 Carry = “1”,  
Otherwise = “0”.  
V
V
= PIN 16  
= PIN 8  
DD  
SS  
LOGIC DIAGRAM  
Q5  
Q1  
Q7  
Q3  
7
Q9  
11  
1
2
6
14  
CLOCK  
CLOCK  
12  
C
C
D
R
Q
C
C
D
Q
C
C
D
R
Q
C
C
D
R
Q
Q
C
C
D
R
Q
Q
ENABLE  
CARRY  
13  
Q
R
Q
R
Q
R
R
R
R
15  
RESET  
3
5
4
9
10  
Q0  
Q6  
Q2  
Q3  
Q4  
http://onsemi.com  
2
MC14017B  
ELECTRICAL CHARACTERISTICS (Voltages Referenced to V  
)
SS  
– 55 C  
25 C  
125 C  
V
Vdc  
DD  
(4.)  
Characteristic  
Output Voltage  
Symbol  
Unit  
Min  
Max  
Min  
Typ  
Max  
Min  
Max  
“0” Level  
“1” Level  
“0” Level  
V
OL  
5.0  
10  
15  
0.05  
0.05  
0.05  
0
0
0
0.05  
0.05  
0.05  
0.05  
0.05  
0.05  
Vdc  
V
in  
= V or 0  
DD  
V
OH  
5.0  
10  
15  
4.95  
9.95  
14.95  
4.95  
9.95  
14.95  
5.0  
10  
15  
4.95  
9.95  
14.95  
Vdc  
Vdc  
V
in  
= 0 or V  
DD  
Input Voltage  
(V = 4.5 or 0.5 Vdc)  
V
IL  
5.0  
10  
15  
1.5  
3.0  
4.0  
2.25  
4.50  
6.75  
1.5  
3.0  
4.0  
1.5  
3.0  
4.0  
O
(V = 9.0 or 1.0 Vdc)  
O
(V = 13.5 or 1.5 Vdc)  
O
“1” Level  
V
IH  
Vdc  
(V = 0.5 or 4.5 Vdc)  
5.0  
10  
15  
3.5  
7.0  
11  
3.5  
7.0  
11  
2.75  
5.50  
8.25  
3.5  
7.0  
11  
O
(V = 1.0 or 9.0 Vdc)  
O
(V = 1.5 or 13.5 Vdc)  
O
Output Drive Current  
I
mAdc  
OH  
(V = 2.5 Vdc)  
Source  
Sink  
5.0  
5.0  
10  
– 3.0  
– 0.64  
– 1.6  
– 4.2  
– 2.4  
– 0.51  
– 1.3  
– 3.4  
– 4.2  
– 0.88  
– 2.25  
– 8.8  
– 1.7  
– 0.36  
– 0.9  
– 2.4  
OH  
(V = 4.6 Vdc)  
OH  
(V = 9.5 Vdc)  
OH  
(V = 13.5 Vdc)  
OH  
15  
(V = 0.4 Vdc)  
I
OL  
5.0  
10  
15  
0.64  
1.6  
4.2  
0.51  
1.3  
3.4  
0.88  
2.25  
8.8  
0.36  
0.9  
2.4  
mAdc  
OL  
(V = 0.5 Vdc)  
OL  
(V = 1.5 Vdc)  
OL  
Input Current  
Input Capacitance  
I
15  
± 0.1  
±0.00001  
± 0.1  
± 1.0  
µAdc  
in  
C
5.0  
7.5  
pF  
in  
(V = 0)  
in  
Quiescent Current  
(Per Package)  
I
5.0  
10  
15  
5.0  
10  
20  
0.005  
0.010  
0.015  
5.0  
10  
20  
150  
300  
600  
µAdc  
µAdc  
DD  
(5.) (6.)  
Total Supply Current  
I
T
5.0  
10  
15  
I = (0.27 µA/kHz) f + I  
T
I = (0.55 µA/kHz) f + I  
T
I = (0.83 µA/kHz) f + I  
T
DD  
DD  
DD  
(Dynamic plus Quiescent,  
Per Package)  
(C = 50 pF on all outputs, all  
L
buffers switching)  
4. Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.  
5. The formulas given are for the typical characteristics only at 25 C.  
6. To calculate total supply current at loads other than 50 pF:  
I (C ) = I (50 pF) + (C – 50) Vfk  
T
L
T
L
where: I is in µA (per package), C in pF, V = (V – V ) in volts, f in kHz is input frequency, and k = 0.0011.  
T
L
DD  
SS  
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3
MC14017B  
SWITCHING CHARACTERISTICS (7.) (C = 50 pF, T = 25 C)  
L
A
V
Vdc  
DD  
(8.)  
Characteristic  
Output Rise and Fall Time  
Symbol  
Min  
Typ  
Max  
Unit  
t
,
ns  
TLH  
t
t
t
, t  
= (1.5 ns/pF) C + 25 ns  
t
THL  
5.0  
10  
15  
100  
50  
40  
200  
100  
80  
TLH THL  
L
, t  
= (0.75 ns/pF) C + 12.5 ns  
TLH THL  
L
, t  
= (0.55 ns/pF) C + 9.5 ns  
L
TLH THL  
Propagation Delay Time  
Reset to Decode Output  
t
t
t
,
ns  
ns  
ns  
ns  
PLH  
t
PHL  
t
t
t
, t  
= (1.7 ns/pF) C + 415 ns  
= (0.66 ns/PF) C + 197 ns  
L
= (0.5 ns/pF) C + 150 ns  
5.0  
10  
15  
500  
230  
175  
1000  
460  
350  
PLH PHL  
L
, t  
PLH PHL  
, t  
PLH PHL  
L
Propagation Delay Time  
Clock to C  
,
PLH  
t
out  
PHL  
t
t
t
, t  
= (1.7 ns/pF) C + 315 ns  
= (0.66 ns/pF) C + 142 ns  
L
= (0.5 ns/pF) C + 100 ns  
L
5.0  
10  
15  
400  
175  
125  
800  
350  
250  
PLH PHL  
L
, t  
PLH PHL  
, t  
PLH PHL  
Propagation Delay Time  
Clock to Decode Output  
,
PLH  
t
PHL  
t
t
t
, t  
= (1.7 ns/pF) C + 415 ns  
= (0.66 ns/pF) C + 197 ns  
L
= (0.5 ns/pF) C + 150 ns  
5.0  
10  
15  
500  
230  
175  
1000  
460  
350  
PLH PHL  
L
, t  
PLH PHL  
, t  
PLH PHL  
L
Turn–Off Delay Time  
Reset to C  
t
PLH  
out  
t
t
t
= (1.7 ns/pF) C + 315 ns  
5.0  
10  
15  
400  
175  
125  
800  
350  
250  
PLH  
PLH  
PLH  
L
= (0.66 ns/pF) C + 142 ns  
L
= (0.5 ns/pF) C + 100 ns  
L
Clock Pulse Width  
t
5.0  
10  
15  
250  
100  
75  
125  
50  
35  
ns  
MHz  
ns  
w(H)  
Clock Frequency  
f
cl  
5.0  
10  
15  
5.0  
12  
16  
2.0  
5.0  
6.7  
Reset Pulse Width  
t
5.0  
10  
15  
500  
250  
190  
250  
125  
95  
w(H)  
Reset Removal Time  
Clock Input Rise and Fall Time  
Clock Enable Setup Time  
Clock Enable Removal Time  
t
5.0  
10  
15  
750  
275  
210  
375  
135  
105  
ns  
rem  
t
,
5.0  
10  
15  
TLH  
t
No Limit  
THL  
t
5.0  
10  
15  
350  
150  
115  
175  
75  
52  
ns  
su  
t
5.0  
10  
15  
420  
200  
140  
260  
100  
70  
ns  
rem  
7. The formulas given are for the typical characteristics only at 25 C.  
8. Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.  
http://onsemi.com  
4
MC14017B  
V
DD  
V
out  
Output  
Sink Drive Source Drive  
Output  
CLOCK  
ENABLE  
V
SS  
Q0  
Q1  
Q2  
Q3  
Q4  
Q5  
Q6  
Q7  
Q8  
Q9  
Clock to  
desired  
outputs  
(S1 to B)  
Decode  
Outputs  
(S1 to A)  
A
B
V
S1  
S1  
DD  
I
D
RESET  
CLOCK  
Clock to 5  
thru 9  
(S1 to B)  
V
SS  
Carry  
S1 to A  
V
V
=
=
V
DD  
– V  
GS  
DD  
EXTERNAL  
POWER  
V
out  
V
– V  
out DD  
DS  
C
out  
SUPPLY  
V
SS  
Figure 1. Typical Output Source and Output Sink Characteristics Test Circuit  
V
DD  
0.01 µF  
CERAMIC  
I
D
500 µF  
Q0  
Q1  
Q2  
Q3  
Q4  
Q5  
Q6  
Q7  
Q8  
Q9  
CLOCK  
ENABLE  
RESET  
CLOCK  
f
c
PULSE  
GENERATOR  
C
out  
V
SS  
C
L
C
L
C
L
C
L
C
L
C
L
C
L
C
L
C
L
C
L
C
L
Figure 2. Typical Power Dissipation Test Circuit  
http://onsemi.com  
5
MC14017B  
APPLICATIONS INFORMATION  
Figure 3 shows a technique for extending the number of decoded output states for the MC14017B. Decoded outputs are  
sequential within each stage and from stage to stage, with no dead time (except propagation delay).  
RESET  
RESET  
RESET  
CLOCK  
CLOCK  
CLOCK  
MC14017B  
MC14017B  
MC14017B  
• • •  
Q8 Q9  
CE  
CE  
CE  
Q1  
• • •  
• • •  
Q0 Q1  
Q8 Q9  
Q0Q1  
Q8 Q9  
8 DECODED  
OUTPUTS  
9 DECODED  
OUTPUTS  
8 DECODED  
OUTPUTS  
CLOCK  
FIRST STAGE  
INTERMEDIATE STAGES  
LAST STAGE  
Figure 3. Counter Expansion  
Pcp  
Ncp  
90%  
10%  
V
DD  
CLOCK  
50%  
V
SS  
20 ns  
t
t
su  
20 ns  
rem  
V
DD  
CLOCK  
ENABLE  
V
SS  
t
rem  
20 ns  
20 ns  
20 ns  
V
DD  
RESET  
20 ns  
V
SS  
t
t
PLH  
PLH  
t
PHL  
Q0  
V
OH  
V
OL  
t
TLH  
t
t
PHL  
PLH  
V
90%  
10%  
OH  
50%  
Q1  
Q2  
Q3  
Q4  
Q5  
Q6  
Q7  
Q8  
V
OL  
t
t
t
t
THL  
PLH  
PHL  
TLH  
V
OH  
V
OL  
t
t
PHL  
t
t
THL  
PLH  
TLH  
V
OH  
50%  
V
OL  
t
t
t
t
THL  
PLH  
PHL  
TLH  
V
OH  
t
V
OL  
THL  
t
t
t
TLH  
PLH  
PHL  
t
PHL  
V
OH  
V
OL  
t
t
THL  
TLH  
t
t
PHL  
90%  
PLH  
V
OH  
10%  
V
OL  
t
t
THL  
t
THL  
t
PHL  
PLH  
V
OH  
V
OL  
t
THL  
V
OH  
t
PLH  
V
OL  
t
t
THL  
PLH  
TLH  
t
PHL  
t
V
OH  
Q9  
C
V
OL  
t
t
t
PHL  
t
TLH  
THL  
PHL  
t
PLH  
V
OH  
out  
V
OL  
t
THL  
t
TLH  
Figure 4. AC Measurement Definition and Functional Waveforms  
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6
MC14017B  
PACKAGE DIMENSIONS  
PDIP–16  
P SUFFIX  
PLASTIC DIP PACKAGE  
CASE 648–08  
ISSUE R  
NOTES:  
–A–  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: INCH.  
3. DIMENSION L TO CENTER OF LEADS WHEN  
FORMED PARALLEL.  
16  
1
9
8
B
S
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.  
5. ROUNDED CORNERS OPTIONAL.  
INCHES  
DIM MIN MAX  
0.740 0.770 18.80 19.55  
MILLIMETERS  
MIN MAX  
F
A
B
C
D
F
G
H
J
K
L
M
S
C
L
0.250 0.270  
0.145 0.175  
0.015 0.021  
6.35  
3.69  
0.39  
1.02  
6.85  
4.44  
0.53  
1.77  
0.040  
0.70  
SEATING  
PLANE  
–T–  
0.100 BSC  
0.050 BSC  
0.008 0.015  
2.54 BSC  
1.27 BSC  
K
M
0.21  
0.38  
3.30  
7.74  
10  
H
J
0.110  
0.295 0.305  
10  
0.020 0.040  
0.130  
2.80  
7.50  
0
G
D 16 PL  
0
0.51  
1.01  
M
M
0.25 (0.010)  
T A  
SOIC–16  
D SUFFIX  
PLASTIC SOIC PACKAGE  
CASE 751B–05  
ISSUE J  
–A–  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DIMENSIONS A AND B DO NOT INCLUDE  
MOLD PROTRUSION.  
16  
1
9
–B–  
P 8 PL  
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)  
PER SIDE.  
M
S
0.25 (0.010)  
B
8
5. DIMENSION D DOES NOT INCLUDE DAMBAR  
PROTRUSION. ALLOWABLE DAMBAR  
PROTRUSION SHALL BE 0.127 (0.005) TOTAL  
IN EXCESS OF THE D DIMENSION AT  
MAXIMUM MATERIAL CONDITION.  
G
MILLIMETERS  
DIM MIN MAX  
INCHES  
MIN  
MAX  
0.393  
0.157  
0.068  
0.019  
0.049  
F
A
B
C
D
F
9.80  
3.80  
1.35  
0.35  
0.40  
10.00 0.386  
4.00 0.150  
1.75 0.054  
0.49 0.014  
1.25 0.016  
R X 45  
K
C
G
J
K
M
P
1.27 BSC  
0.050 BSC  
–T–  
SEATING  
PLANE  
0.19  
0.10  
0
0.25 0.008  
0.25 0.004  
0.009  
0.009  
7
J
M
D
16 PL  
7
0
5.80  
0.25  
6.20 0.229  
0.50 0.010  
0.244  
0.019  
M
S
S
0.25 (0.010)  
T B  
A
R
http://onsemi.com  
7
MC14017B  
PACKAGE DIMENSIONS  
SOEIAJ–16  
F SUFFIX  
PLASTIC EIAJ SOIC PACKAGE  
CASE 966–01  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
ISSUE O  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DIMENSIONS D AND E DO NOT INCLUDE  
MOLD FLASH OR PROTRUSIONS AND ARE  
MEASURED AT THE PARTING LINE. MOLD FLASH  
OR PROTRUSIONS SHALL NOT EXCEED 0.15  
(0.006) PER SIDE.  
L
E
16  
9
8
Q
1
H
E
M
4. TERMINAL NUMBERS ARE SHOWN FOR  
REFERENCE ONLY.  
E
5. THE LEAD WIDTH DIMENSION (b) DOES NOT  
INCLUDE DAMBAR PROTRUSION. ALLOWABLE  
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)  
TOTAL IN EXCESS OF THE LEAD WIDTH  
DIMENSION AT MAXIMUM MATERIAL CONDITION.  
DAMBAR CANNOT BE LOCATED ON THE LOWER  
RADIUS OR THE FOOT. MINIMUM SPACE  
BETWEEN PROTRUSIONS AND ADJACENT LEAD  
TO BE 0.46 ( 0.018).  
1
L
DETAIL P  
Z
D
VIEW P  
e
MILLIMETERS  
INCHES  
A
DIM MIN  
MAX  
MIN  
–––  
MAX  
0.081  
0.008  
0.020  
0.011  
0.413  
0.215  
c
A
1
–––  
0.05  
0.35  
0.18  
9.90  
5.10  
2.05  
A
0.20 0.002  
0.50 0.014  
0.27 0.007  
10.50 0.390  
5.45 0.201  
b
c
D
E
A
1
b
0.13 (0.005)  
e
1.27 BSC  
0.050 BSC  
0.10 (0.004)  
M
H
7.40  
0.50  
1.10  
0
0.70  
–––  
8.20 0.291  
0.85 0.020  
1.50 0.043  
10  
0.90 0.028  
0.78 –––  
0.323  
0.033  
0.059  
10  
0.035  
0.031  
E
L
L
E
M
Q
0
1
Z
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MC14017B/D  

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