MC10H644FN [ONSEMI]

68030/040 PECL to TTL Clock Driver; 68030/040 PECL到TTL时钟驱动器
MC10H644FN
型号: MC10H644FN
厂家: ONSEMI    ONSEMI
描述:

68030/040 PECL to TTL Clock Driver
68030/040 PECL到TTL时钟驱动器

时钟驱动器
文件: 总6页 (文件大小:167K)
中文:  中文翻译
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MC10H644, MC100H644  
68030/040 PECL to TTL  
Clock Driver  
The MC10H/100H644 generates the necessary clocks for the  
68030, 68040 and similar microprocessors. The device is functionally  
equivalent to the H640, but with fewer outputs in a smaller outline  
20lead PLCC package. It is guaranteed to meet the clock  
specifications required by the 68030 and 68040 in terms of  
parttopartskew, withinpart skew and also duty cycle skew.  
The user has a choice of using either TTL or PECL (ECL referenced  
to +5.0 V) for the input clock. TTL clocks are typically used in present  
MPU systems. However, as clock speeds increase to 50 MHz and  
beyond, the inherent superiority of ECL (particularly differential  
ECL) as a means of clock signal distribution becomes increasingly  
evident. The H644 also uses differential ECL internally to achieve its  
superior skew characteristic.  
The H644 includes dividebytwo and dividebyfour stages, both  
to achieve the necessary duty cycle and skew to generate MPU clocks  
as required. A typical 50 MHz processor application would use an  
input clock running at 100 MHz, thus obtaining output clocks at  
50 MHz and 25 MHz (see Logic Symbol).  
The 10H version is compatible with MECL10H ECL logic levels,  
while the 100H version is compatible with 100K levels (referenced  
to +5.0 V).  
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MARKING  
DIAGRAM  
1
10H644  
PLCC20  
FN SUFFIX  
CASE 775  
AWLYYWW  
A
= Assembly Location  
= Wafer Lot  
= Year  
WL  
YY  
WW  
= Work Week  
Generates Clocks for 68030/040  
Meets 68030/040 Skew Requirements  
TTL or PECL Input Clock  
Extra TTL and ECL Power/Ground Pins  
Within Device Skew on Similar Paths is 0.5 ns  
Asynchronous Reset  
ORDERING INFORMATION  
Device  
Package  
Shipping  
MC10H644FN  
MC100H644FN  
PLCC20  
37 Units/Rail  
37 Units/Rail  
PLCC20  
Single +5.0 V Supply  
Function  
Reset (R): LOW on RESET forces all Q outputs LOW and all Q  
outputs HIGH.  
Synchronized Outputs: The device is designed to have the POS  
edges of the ÷2 and ÷4 outputs synchronized.  
Select (SEL): LOW selects the PECL input source (DE/DE). HIGH  
selects the TTL input source (DT).  
The H644 also contains circuitry to force a stable state of the PECL  
input differential pair, should both sides be left open. In this case, the  
DE side of the input is pulled LOW, and DE goes HIGH.  
©
Semiconductor Components Industries, LLC, 2006  
1
Publication Order Number:  
June, 2006 Rev. 6  
MC10H644/D  
MC10H644, MC100H644  
Q4 VT  
18 17  
Q5 GT  
16 15  
R
Table 1. PIN DESCRIPTION  
14  
PIN  
FUNCTION  
19  
20  
1
13  
12  
11  
10  
9
GT  
Q3  
GT  
Q2  
GT  
VE  
DE  
V
GT  
VT  
VE  
GE  
TTL Ground (0 V)  
TTL V (+5.0 V)  
CC  
ECL V (+5.0 V)  
CC  
ECL Ground (0 V)  
DE, DE  
ECL Signal Input (positive ECL)  
BB  
V
V
Reference Output  
BB  
BB  
DT  
TTL Signal Input  
Signal Outputs (TTL)  
Input Select (TTL)  
Reset (TTL)  
2
DE  
GE  
Qn, Qn  
SEL  
R
3
4
5
6
7
8
*Skews are specified for Identical Edges  
Q1 VT  
Q0 SEL DT  
Figure 1. Pinout: PLCC20 (Top View)  
TTL OUTPUTS  
Q0  
VBB  
DE  
(ECL)  
DE  
(ECL)  
Q1  
Q2  
÷2  
2:1 MUX  
DT  
(TTL)  
Q3  
Q4  
Q5  
SEL  
(TTL)  
÷4  
R
(TTL)  
Figure 2. Logic Diagram  
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2
MC10H644, MC100H644  
Table 2. 10H PECL DC CHARACTERISTICS (V = V = 5.0 V ±5%)  
T
E
0°C  
25°C  
85°C  
Min  
Max  
Min  
Max  
Min  
Max  
Symbol  
Characteristic  
Condition  
Unit  
I
I
Input HIGH Current  
Input LOW Current  
255  
175  
175  
mA  
INH  
INL  
0.5  
0.5  
0.5  
V
*
Input HIGH Voltage  
Input LOW Voltage  
V
V
= 5.0 V  
= 5.0 V  
3.83  
3.05  
4.16  
3.52  
3.87  
3.05  
4.19  
3.52  
3.94  
3.05  
4.28  
3.55  
V
IH  
IL  
E
E
V *  
V
*
BB  
Output Reference Voltage  
3.62  
3.73  
3.65  
3.75  
3.69  
3.81  
V
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit  
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared  
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit  
values are applied individually under normal operating conditions and not valid simultaneously.  
Table 3. 100H PECL DC CHARACTERISTICS (V = V = 5.0 V ±5%)  
T
E
0°C  
25°C  
85°C  
Min  
Max  
Min  
Max  
Min  
Max  
Symbol  
Characteristic  
Condition  
Unit  
I
I
Input HIGH Current  
Input LOW Current  
255  
175  
175  
mA  
INH  
INL  
0.5  
0.5  
0.5  
V
*
Input HIGH Voltage  
Input LOW Voltage  
V
V
= 5.0 V  
= 5.0 V  
3.835  
3.19  
4.12  
3.835  
3.19  
4.12  
3.835  
3.19  
4.12  
V
IH  
IL  
E
E
V *  
3.525  
3.525  
3.525  
V
*
BB  
Output Reference Voltage  
3.62  
3.74  
3.62  
3.74  
3.62  
3.74  
V
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit  
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared  
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit  
values are applied individually under normal operating conditions and not valid simultaneously.  
*PECL levels are referenced to V and will vary 1:1 with the power supply. The values shown are for V = 5.0 V.  
CC  
CC  
Only corresponds to ECL Clock Inputs.  
Table 4. DC CHARACTERISTICS (V = V = 5.0 V ±5%)  
T
E
0°C  
25°C  
85°C  
Min Max  
Min  
Max  
65  
Min  
Max  
Symbol  
Characteristic  
Power Supply Current  
Condition  
Pin  
Unit  
mA  
mA  
I
I
ECL  
TTL  
V
65  
85  
65  
85  
EE  
CC  
E
Total all V pins  
85  
T
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit  
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared  
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit  
values are applied individually under normal operating conditions and not valid simultaneously.  
Table 5. TTL DC CHARACTERISTICS (V = V = 5.0 V ±5%)  
T
E
0°C  
25°C  
85°C  
Min  
Max  
Min  
Max  
Min  
Max  
Symbol  
Characteristic  
Input HIGH Voltage  
Condition  
Unit  
V
V
2.0  
2.0  
2.0  
V
IH  
IL  
Input LOW Voltage  
0.8  
0.8  
0.8  
I
Input HIGH Current  
V
V
= 2.7 V  
= 7.0 V  
20  
100  
20  
100  
20  
100  
mA  
IH  
IN  
IN  
I
Input LOW Current  
V
= 0.5 V  
0.6  
0.6  
0.6  
mA  
V
IL  
IN  
V
Output HIGH Voltage  
I
= 3.0 mA  
= 24 mA  
2.5  
2.0  
2.5  
2.0  
2.5  
2.0  
OH  
OH  
OH  
I
V
V
Output LOW Voltage  
I
= 24 mA  
OL  
0.5  
0.5  
0.5  
V
V
OL  
IK  
Input Clamp Voltage  
I
= 18 mA  
1.2  
1.2  
1.2  
IN  
I
Output Short Circuit Current  
V
= 0 V  
OUT  
100 225 100 225 100 225  
mA  
OS  
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit  
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared  
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit  
values are applied individually under normal operating conditions and not valid simultaneously.  
http://onsemi.com  
3
MC10H644, MC100H644  
Table 6. AC CHARACTERISTICS (V = V = 5.0 V ±5%)  
T
E
0°C  
Min Max  
25°C  
85°C  
Min  
Max  
Min  
Max  
Symbol  
Characteristic  
Condition  
Unit  
t
Propagation Delay ECL  
D to Output  
All Outputs  
CL = 50 pF  
5.8  
6.8  
5.7  
6.7  
6.1  
7.1  
ns  
PLH  
t
Propagation Delay TTL  
D to Output  
CL = 50 pF  
5.7  
6.7  
5.7  
6.7  
6.0  
7.0  
ns  
PLH  
t
t
t
t
t
*
*
*
WithinDevice Skew  
WithinDevice Skew  
WithinDevice Skew  
ParttoPart Skew  
Q0, 1, 4, 5  
Q2, Q3  
CL = 50 pF  
CL = 50 pF  
CL = 50 pF  
CL = 50 pF  
CL = 50 pF  
0.5  
0.5  
1.5  
1.0  
7.3  
0.5  
0.5  
1.5  
1.0  
7.3  
0.5  
0.5  
1.5  
1.0  
7.5  
ns  
ns  
ns  
ns  
ns  
skwd  
skwd  
skwd  
All Outputs  
Q0, 1, 4, 5  
All Outputs  
*
skpp  
Propagation Delay  
R to Output  
4.3  
4.3  
4.5  
PD  
t
t
Output Rise/Fall Time  
All Outputs  
CL = 50 pF  
CL = 50 pF  
1.6  
1.6  
1.6  
ns  
R
F
0.8 V 2.0 V  
f
Maximum Input Frequency  
Minimum Pulse Width Reset  
Reset Recovery Time  
135  
1.5  
135  
1.5  
135  
1.5  
MHz  
ns  
max  
TW  
t
1.25  
9.5  
1.25  
9.5  
1.25  
9.5  
ns  
rr  
T
Pulse Width Out High or Low @ f  
= 100 MHz and CL = 50 pF  
Q0, 1  
CL = 50 pF  
Relative 1.5 V  
10.5  
10.5  
10.5  
ns  
PW  
in  
T
Setup Time  
ns  
ns  
S
SEL to DE, DT  
2.0  
2.0  
2.0  
2.0  
2.0  
2.0  
TH  
Hold Time  
SEL to DE, DT  
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit  
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared  
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit  
values are applied individually under normal operating conditions and not valid simultaneously.  
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4
MC10H644, MC100H644  
PACKAGE DIMENSIONS  
PLCC20  
FN SUFFIX  
PLASTIC PLCC PACKAGE  
CASE 77502  
ISSUE D  
S
S
0.007 (0.180) M  
T
L−M  
N
B
Y BRK  
N−  
M
S
S
N
0.007 (0.180)  
T
L−M  
U
D
D
L−  
M−  
Z
W
20  
1
S
S
S
N
0.010 (0.250)  
T
L−M  
G1  
X
V
VIEW DD  
S
S
S
S
0.007 (0.180) M  
0.007 (0.180) M  
T
L−M  
L−M  
N
N
A
R
Z
T
S
S
N
0.007 (0.180) M  
T
L−M  
H
C
K1  
E
K
0.004 (0.100)  
G
TSEATING  
PLANE  
J
M
S
S
N
0.007 (0.180)  
T
L−M  
F
VIEW S  
G1  
VIEW S  
S
S
S
0.010 (0.250)  
T
L−M  
N
NOTES:  
1. DATUMS −L−, −M−, AND −N− DETERMINED  
INCHES  
MILLIMETERS  
DIM MIN  
MAX  
0.395  
0.395  
0.180  
0.110  
0.019  
MIN  
9.78  
9.78  
4.20  
2.29  
0.33  
MAX  
10.03  
10.03  
4.57  
WHERE TOP OF LEAD SHOULDER EXITS PLASTIC  
BODY AT MOLD PARTING LINE.  
A
B
C
E
F
0.385  
0.385  
0.165  
0.090  
0.013  
2. DIMENSION G1, TRUE POSITION TO BE  
MEASURED AT DATUM −T−, SEATING PLANE.  
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD  
FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250)  
PER SIDE.  
4. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
5. CONTROLLING DIMENSION: INCH.  
6. THE PACKAGE TOP MAY BE SMALLER THAN THE  
PACKAGE BOTTOM BY UP TO 0.012 (0.300).  
DIMENSIONS R AND U ARE DETERMINED AT THE  
OUTERMOST EXTREMES OF THE PLASTIC BODY  
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,  
GATE BURRS AND INTERLEAD FLASH, BUT  
INCLUDING ANY MISMATCH BETWEEN THE TOP  
AND BOTTOM OF THE PLASTIC BODY.  
7. DIMENSION H DOES NOT INCLUDE DAMBAR  
PROTRUSION OR INTRUSION. THE DAMBAR  
PROTRUSION(S) SHALL NOT CAUSE THE H  
DIMENSION TO BE GREATER THAN 0.037 (0.940).  
THE DAMBAR INTRUSION(S) SHALL NOT CAUSE  
THE H DIMENSION TO BE SMALLER THAN 0.025  
(0.635).  
2.79  
0.48  
G
H
J
0.050 BSC  
1.27 BSC  
0.026  
0.020  
0.025  
0.350  
0.350  
0.042  
0.042  
0.042  
0.032  
−−−  
−−−  
0.66  
0.51  
0.64  
8.89  
8.89  
1.07  
1.07  
1.07  
−−−  
2
0.81  
−−−  
−−−  
9.04  
9.04  
1.21  
1.21  
1.42  
0.50  
10  
K
R
U
V
W
X
Y
Z
0.356  
0.356  
0.048  
0.048  
0.056  
−−− 0.020  
10  
2
_
_
_
_
G1 0.310  
K1 0.040  
0.330  
−−−  
7.88  
1.02  
8.38  
−−−  
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5
MC10H644, MC100H644  
MECL is a trademark of Semiconductor Components Industries, LLC (SCILLC).  
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are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice  
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All  
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights  
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications  
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should  
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and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death  
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal  
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.  
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MC10H644/D  

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