MC10H642FNR2 [ONSEMI]

68030/040 PECL to TTL Clock Driver; 68030/040 PECL到TTL时钟驱动器
MC10H642FNR2
型号: MC10H642FNR2
厂家: ONSEMI    ONSEMI
描述:

68030/040 PECL to TTL Clock Driver
68030/040 PECL到TTL时钟驱动器

时钟驱动器 逻辑集成电路 输入元件
文件: 总10页 (文件大小:173K)
中文:  中文翻译
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MC10H642, MC100H642  
68030/040 PECL to TTL  
Clock Driver  
Description  
The MC10H/100H642 generates the necessary clocks for the  
68030, 68040 and similar microprocessors. It is guaranteed to meet the  
clock specifications required by the 68030 and 68040 in terms of  
parttopartskew, withinpart skew and also duty cycle skew.  
The user has a choice of using either TTL or PECL (ECL referenced  
to +5.0 V) for the input clock. TTL clocks are typically used in present  
MPU systems. However, as clock speeds increase to 50 MHz and  
beyond, the inherent superiority of ECL (particularly differential  
ECL) as a means of clock signal distribution becomes increasingly  
evident. The H642 also uses differential PECL internally to achieve its  
superior skew characteristic.  
The H642 includes dividebytwo and dividebyfour stages, both  
to achieve the necessary duty cycle skew and to generate MPU clocks  
as required. A typical 50 MHz processor application would use an  
input clock running at 100 MHz, thus obtaining output clocks at  
50 MHz and 25 MHz (see Logic Diagram).  
http://onsemi.com  
PLCC28  
FN SUFFIX  
CASE 776  
MARKING DIAGRAM*  
The 10H version is compatible with MECL 10HECL logic levels,  
while the 100H version is compatible with 100K levels (referenced to  
+5.0 V).  
1
MCxxxH642G  
AWLYYWW  
Features  
Generates Clocks for 68030/040  
Meets 030/040 Skew Requirements  
TTL or PECL Input Clock  
Extra TTL and PECL Power/Ground Pins  
Asynchronous Reset  
xxx  
A
WL  
YY  
WW  
G
= 10 or 100  
= Assembly Location  
= Wafer Lot  
= Year  
= Work Week  
= PbFree Package  
Single +5.0 V Supply  
PbFree Packages are Available*  
Function  
Reset(R): LOW on RESET forces all Q outputs LOW.  
Select(SEL): LOW selects the ECL input source (DE/DE). HIGH  
selects the TTL input source (DT).  
*For additional marking information, refer to  
Application Note AND8002/D.  
The H642 also contains circuitry to force a stable input state of the  
ECL differential input pair, should both sides be left open. In this Case,  
the DE side of the input is pulled LOW, and DE goes HIGH.  
Power Up: The device is designed to have positive edges of the ÷2  
and ÷4 outputs synchronized at Power Up.  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 8 of this data sheet.  
*For additional information on our PbFree strategy and soldering details, please  
download the ON Semiconductor Soldering and Mounting Techniques  
Reference Manual, SOLDERRM/D.  
©
Semiconductor Components Industries, LLC, 2006  
1
Publication Order Number:  
November, 2006 Rev. 8  
MC10H642/D  
MC10H642, MC100H642  
VT VT Q1  
GT GT  
22 21  
Q0  
20  
VT  
19  
TTL Outputs  
25  
24  
23  
Q7  
Q6  
18  
17  
16  
15  
14  
13  
12  
Q2 26  
GT 27  
GT 28  
V
BB  
DE  
DE  
VE  
R
TTL/ECL Clock Inputs  
V
Q5  
Q4  
Q3  
BB  
DE  
DE  
Q3  
1
÷4  
MUX  
VT  
VT  
2
3
4
DT  
GE  
DT  
SEL  
Q2  
Q4  
5
6
7
8
9
10  
11  
TTL Control Inputs  
Q1  
Q0  
÷2  
Q5  
GT GT  
Q6 Q7  
VT  
SEL  
Figure 1. Pinout: PLCC28  
R
(Top View)  
Figure 2. Logic Diagram  
Table 1. PIN DESCRIPTION  
Pin  
Symbol  
Description  
Pin  
Symbol  
Description  
81  
82  
83  
84  
85  
86  
87  
88  
89  
10  
11  
12  
13  
14  
Q3  
VT  
VT  
Q4  
Q5  
GT  
GT  
Q6  
Q7  
VT  
SEL  
DT  
GE  
R
Signal Output (TTL)**  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
VE  
DE  
DE  
BB  
VT  
Q0  
GT  
GT  
Q1  
VT  
VT  
Q2  
GT  
GT  
ECL V (+5.0 V)  
CC  
TTL V (+5.0 V)  
ECL Signal Input (NonInverting)  
CC  
TTL V (+5.0 V)  
ECL Signal Input (Inverting)  
CC  
Signal Output (TTL)**  
Signal Output (TTL)**  
TTL Ground (0 V)  
V
V
Reference Output  
CC  
BB  
TTL V (+5.0 V)  
Signal Output (TTL)*  
TTL Ground (0 V)  
TTL Ground (0 V)  
Signal Output (TTL)*  
TTL Ground (0 V)  
Signal Output (TTL)**  
Signal Output (TTL)**  
TTL V (+5.0 V)  
TTL V (+5.0 V)  
CC  
CC  
Input Select (TTL)  
TTL Signal Input  
ECL Ground (0 V)  
Reset (TTL)  
TTL V (+5.0 V)  
CC  
Signal Output (TTL)**  
TTL Ground (0 V)  
TTL Ground (0 V)  
* Divide by 2  
**Divide by 4  
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2
MC10H642, MC100H642  
Table 2. 10H PECL CHARACTERISTICS (V = V = 5.0 V ± 5%)  
T
E
T
A
= 0°C  
T
A
= 25°C  
T = 85°C  
A
Min  
Max  
Min  
Max  
Min  
Max  
Symbol  
Characteristic  
Condition  
Unit  
I
I
Input HIGH Current  
Input LOW Current  
255  
175  
175  
mA  
INH  
INL  
0.5  
0.5  
0.5  
V
V
Input HIGH Voltage (Note 1)  
Input LOW Voltage (Note 1)  
V
= 5.0 V  
3.83  
3.05  
4.16  
3.52  
3.87  
3.05  
4.19  
3.52  
3.94  
3.05  
4.28  
V
V
IH  
IL  
EE  
3.555  
V
Output Reference Voltage (Note 1)  
3.62  
3.73  
3.65  
3.75  
3.69  
3.81  
BB  
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit  
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared  
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit  
values are applied individually under normal operating conditions and not valid simultaneously.  
1. PECL LEVELS are referenced to V and will vary 1:1 with the power supply. The VALUES shown are for V = 5.0 V.  
CC  
CC  
Table 3. 100H PECL CHARACTERISTICS (V = V = 5.0 V ± 5%)  
T
E
T
A
= 0°C  
T
A
= 25°C  
T = 85°C  
A
Min  
Max  
Min  
Max  
Min  
Max  
Symbol  
Characteristic  
Condition  
Unit  
I
I
Input HIGH Current  
Input LOW Current  
255  
175  
175  
mA  
INH  
INL  
0.5  
0.5  
0.5  
V
V
Input HIGH Voltage (Note 2)  
Input LOW Voltage (Note 2)  
V
= 5.0 V  
EE  
3.835  
3.190  
4.120  
3.525  
3.835  
3.190  
4.120  
3.525  
3.835  
3.190  
4.120  
3.525  
V
V
IH  
IL  
V
Output Reference Voltage (Note 2)  
3.620  
3.740  
3.620  
3.740  
3.620  
3.740  
BB  
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit  
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared  
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit  
values are applied individually under normal operating conditions and not valid simultaneously.  
2. PECL LEVELS are referenced to V and will vary 1:1 with the power supply. The VALUES shown are for V = 5.0 V.  
CC  
CC  
Table 4. 10H/100H DC CHARACTERISTICS (V = V = 5.0 V ± 5%)  
T
E
T
A
= 0°C  
T
A
= 25°C  
T = 85°C  
A
Symbol  
Characteristic  
Power Supply Current  
Condition  
Min  
Max  
Min  
Max  
Min  
Max  
Unit  
mA  
mA  
mA  
I
PECL  
TTL  
VE Pin  
57  
30  
30  
57  
30  
30  
57  
30  
30  
EE  
I
I
Total All VT Pins  
CCH  
CCL  
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit  
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared  
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit  
values are applied individually under normal operating conditions and not valid simultaneously.  
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3
 
MC10H642, MC100H642  
Table 5. 10H/100H TTL DC CHARACTERISTICS (V = V = 5.0 V ± 5%)  
T
E
T
A
= 0°C  
T
A
= 25°C  
T = 85°C  
A
Min  
Max  
Min  
Max  
Min  
Max  
Symbol  
Characteristic  
Input HIGH Voltage  
Condition  
Unit  
V
2.0  
2.0  
2.0  
V
IH  
IL  
V
Input LOW Voltage  
0.8  
0.8  
0.8  
I
Input HIGH Current  
V
V
= 2.7 V  
= 7.0 V  
20  
100  
20  
100  
20  
100  
mA  
IH  
IN  
IN  
I
Input LOW Current  
V
= 0.5 V  
0.6  
0.6  
0.6  
mA  
V
IL  
IN  
V
Output HIGH Voltage  
I
I
= 3.0 mA  
= 15 mA  
2.5  
2.0  
2.5  
2.0  
2.5  
2.0  
OH  
OH  
OH  
V
V
Output LOW Voltage  
I
I
= 24 mA  
0.5  
0.5  
0.5  
V
V
OL  
IK  
OL  
Input Clamp Voltage  
= 18 mA  
1.2  
225  
1.2  
225  
1.2  
225  
IN  
I
Output Short Circuit Current  
V
= 0 V  
OUT  
100  
100  
100  
mA  
OS  
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit  
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared  
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit  
values are applied individually under normal operating conditions and not valid simultaneously.  
Table 6. AC CHARACTERISTICS (V = V = 5.0 V ± 5%)  
T
E
T
A
= 0°C  
T = 25°C  
A
T = 85°C  
A
Symbol  
Characteristic  
Condition  
CL = 25 pF  
Min  
Max  
Min  
Max  
Min  
Max  
Unit  
t
Propagation Delay  
Q2Q7  
C ECL  
C TTL  
ns  
PLH  
D to Output  
4.70  
4.70  
5.70  
5.70  
4.75  
4.75  
5.75  
5.75  
4.60  
4.50  
5.60  
5.50  
tskpp  
ParttoPart Skew  
WithinDevice Skew  
1.0  
0.5  
1.0  
0.5  
1.0  
0.5  
ns  
ns  
ns  
tskwd*  
t
Propagation Delay  
D to Output  
Q0, Q1  
C ECL  
C TTL  
CL = 25 pF  
CL = 25 pF  
PLH  
4.30  
4.30  
5.30  
5.30  
4.50  
4.50  
5.50  
5.50  
4.25  
4.25  
5.25  
5.25  
tskpp  
tskwd  
ParttoPart Skew  
All  
Outputs  
2.0  
2.0  
2.0  
ns  
WithinDevice Skew  
CL = 25 pF  
CL = 25 pF  
1.0  
6.3  
1.0  
6.0  
1.0  
6.5  
ns  
ns  
t
Propagation Delay  
R to Output  
All  
Outputs  
4.3  
4.0  
4.5  
PD  
t
t
Output Rise/Fall Time  
0.8 V to 2.0 V  
All  
Outputs  
CL = 25 pF  
CL = 25 pF  
2.5  
2.5  
2.5  
2.5  
2.5  
2.5  
ns  
R
F
f
**  
Maximum Input Frequency  
Reset Pulse Width  
100  
1.5  
100  
1.5  
100  
1.5  
MHz  
ns  
MAX  
RPW  
RRT  
Reset Recovery Time  
1.25  
1.25  
1.25  
ns  
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit  
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared  
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit  
values are applied individually under normal operating conditions and not valid simultaneously.  
* WithinDevice Skew defined as identical transactions on similar paths through a device.  
**MAX Frequency is 135 MHz.  
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4
MC10H642, MC100H642  
10/100H642 DUTY CYCLE CONTROL  
To maintain a duty cycle of ±5% at 50 MHz, limit the load capacitance and/or power supply variation as shown in Figures  
1 and 2. For a ±2.5% duty cycle limit, see Figures 3 and 4. Figures 5 and 6 show duty cycle variation with temperature.  
Figure 7 shows typical TPD versus load. Figure 8 shows reset recovery time. Figure 9 shows output states after power up.  
Best duty cycle control is obtained with a single mP load and minimum line length.  
11  
11  
4.75  
10  
4.75  
10  
5.00  
5.25  
5.00  
5.25  
9
0
10  
20  
30  
40  
50  
60  
9
0
10  
20  
30  
40  
50  
60  
CAPACITIVE LOAD (pF)  
CAPACITIVE LOAD (pF)  
Figure 3. MC10H642 Positive PW versus Load  
Figure 4. MC10H642 Negative PW versus Load  
@ ±5% VCC, TA = 25°C  
@ ±5% VCC, TA = 25°C  
10.8  
10.6  
10.4  
10.2  
10.0  
9.8  
10.6  
10.4  
10.2  
10.0  
9.8  
4.875  
5.00  
4.875  
5.00  
5.125  
5.125  
9.6  
9.6  
9.4  
9.4  
9.2  
0
10  
20  
30  
40  
50  
60  
0
10  
20 30  
CAPACITIVE LOAD (pF)  
40  
50  
60  
CAPACITIVE LOAD (pF)  
Figure 6. MC10H642 Negative PW versus Load  
Figure 5. MC10H642 Positive PW versus Load  
@ ±2.5% VCC, TA = 25°C  
@ ±2.5% VCC, TA = 25°C  
10.5  
10.4  
10.2  
10.0  
9.8  
10.3  
10.1  
9.9  
0 pF  
0 pF  
25 pF  
50 pF  
25 pF  
50 pF  
9.7  
9.6  
9.5  
9.4  
0
20  
40  
60  
80  
100  
0
20  
40  
60  
80  
100  
TEMPERATURE (°C)  
TEMPERATURE (°C)  
Figure 7. MC10H642 Positive PW versus Temperature,  
CC = 5.0 V  
Figure 8. MC10H642 Negative PW versus  
Temperature, VCC = 5.0 V  
V
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5
MC10H642, MC100H642  
6.2  
6.0  
5.8  
5.6  
5.4  
5.2  
4.75  
5.00  
5.25  
0
10  
20  
30  
40  
50  
60  
CAPACITIVE (pF)  
Figure 9. MC10H642 + Tpd versus Load, VCC ±5%, TA = 25°C  
(Overshoot at 50 MHz with no load makes graph non linear)  
DT  
RESET, R  
R
t
rec  
R
t
pw  
Q0  
Q2  
Q1  
Q7  
MC10/100H642  
Figure 10. Clock Phase and Reset Recovery Time After Reset Pulse  
MC10/100H642  
D
in  
Q0.Q1  
Q4 & Q5  
Q2  
Q7  
After Power Up  
Figure 11.  
Outputs  
Q2  
Q7 will Synchronize with Pos Edges of Din & Q0  
Q1  
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6
MC10H642, MC100H642  
Switching Circuit PECL:  
PECL  
USE 0.1 mF CAPACITORS  
V
EE  
V
& V  
CCO  
CC  
TTL  
FOR DECOUPLING.  
+7 V  
OPEN  
50 W COAX  
DEVICE  
UNDER  
TEST  
IN  
OUT  
ALL  
OTHERS  
PULSE  
GENERATOR  
450 W  
t , t  
PZL PLZ  
R1  
500 W  
DEVICE  
UNDER  
TEST  
R2  
500 W  
50 pF  
CH A  
CH B  
USE OSCILLOSCOPE  
INTERNAL 50 W LOAD  
FOR TERMINATION.  
OSCILLOSCOPE  
Figure 12. Switching Circuit and Waveforms  
PECL/TTL  
PECL/TTL  
50%/1.5 V  
V
in  
80%/2.0 V  
20%/0.8 V  
V
out  
T
T
pd−−  
pd++  
50%/1.5 V  
T
rise  
T
fall  
V
out  
Figure 14. Waveforms: Rise and Fall Times  
Figure 13. Propagation Delay — SingleEnded  
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7
MC10H642, MC100H642  
ORDERING INFORMATION  
Device  
Package  
Shipping  
MC10H642FN  
PLCC28  
37 Units / Rail  
37 Units / Rail  
MC10H642FNG  
PLCC28  
(PbFree)  
MC10H642FNR2  
PLCC28  
500 / Tape & Reel  
500 / Tape & Reel  
MC10H642FNR2G  
PLCC28  
(PbFree)  
MC100H642FN  
PLCC28  
37 Units / Rail  
37 Units / Rail  
MC100H642FNG  
PLCC28  
(PbFree)  
MC100H642FNR2  
MC100H642FNR2G  
PLCC28  
500 / Tape & Reel  
500 / Tape & Reel  
PLCC28  
(PbFree)  
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging  
Specifications Brochure, BRD8011/D.  
Resource Reference of Application Notes  
AN1405/D  
AN1406/D  
AN1503/D  
AN1504/D  
AN1568/D  
AN1672/D  
AND8001/D  
AND8002/D  
AND8020/D  
AND8066/D  
AND8090/D  
ECL Clock Distribution Techniques  
Designing with PECL (ECL at +5.0 V)  
ECLinPSt I/O SPiCE Modeling Kit  
Metastability and the ECLinPS Family  
Interfacing Between LVDS and ECL  
The ECL Translator Guide  
Odd Number Counters Design  
Marking and Date Codes  
Termination of ECL Logic Devices  
Interfacing with ECLinPS  
AC Characteristics of ECL Devices  
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8
MC10H642, MC100H642  
PACKAGE DIMENSIONS  
PLCC28  
FN SUFFIX  
PLASTIC PLCC PACKAGE  
CASE 77602  
ISSUE E  
M
S
S
0.007 (0.180)  
T
L−M  
N
B
Y BRK  
D
N−  
M
S
S
N
0.007 (0.180)  
T
L−M  
U
Z
M−  
L−  
W
D
S
S
S
N
0.010 (0.250)  
T
L−M  
X
G1  
V
28  
1
VIEW DD  
M
S
S
S
A
0.007 (0.180)  
0.007 (0.180)  
T
L−M  
L−M  
N
M
S
S
N
0.007 (0.180)  
T
L−M  
H
Z
M
S
T
N
R
K1  
C
E
0.004 (0.100)  
G
K
SEATING  
PLANE  
T−  
J
M
S
S
N
0.007 (0.180)  
T
L−M  
F
VIEW S  
G1  
S
S
S
N
0.010 (0.250)  
T
L−M  
VIEW S  
NOTES:  
INCHES  
MILLIMETERS  
1. DATUMS −L−, −M−, AND −N− DETERMINED  
WHERE TOP OF LEAD SHOULDER EXITS  
PLASTIC BODY AT MOLD PARTING LINE.  
2. DIMENSION G1, TRUE POSITION TO BE  
MEASURED AT DATUM −T−, SEATING PLANE.  
3. DIMENSIONS R AND U DO NOT INCLUDE  
MOLD FLASH. ALLOWABLE MOLD FLASH IS  
0.010 (0.250) PER SIDE.  
4. DIMENSIONING AND TOLERANCING PER  
ANSI Y14.5M, 1982.  
5. CONTROLLING DIMENSION: INCH.  
6. THE PACKAGE TOP MAY BE SMALLER THAN  
THE PACKAGE BOTTOM BY UP TO 0.012  
(0.300). DIMENSIONS R AND U ARE  
DETERMINED AT THE OUTERMOST  
EXTREMES OF THE PLASTIC BODY  
EXCLUSIVE OF MOLD FLASH, TIE BAR  
BURRS, GATE BURRS AND INTERLEAD  
FLASH, BUT INCLUDING ANY MISMATCH  
BETWEEN THE TOP AND BOTTOM OF THE  
PLASTIC BODY.  
DIM MIN  
MAX  
0.495  
0.495  
0.180  
0.110  
0.019  
MIN  
12.32  
12.32  
4.20  
MAX  
12.57  
12.57  
4.57  
A
B
C
E
F
0.485  
0.485  
0.165  
0.090  
0.013  
2.29  
0.33  
2.79  
0.48  
G
H
J
0.050 BSC  
1.27 BSC  
0.026  
0.020  
0.025  
0.450  
0.450  
0.042  
0.042  
0.042  
0.032  
−−−  
−−−  
0.66  
0.51  
0.64  
11.43  
11.43  
1.07  
1.07  
1.07  
−−−  
0.81  
−−−  
K
R
U
V
W
X
Y
Z
−−−  
0.456  
0.456  
0.048  
0.048  
0.056  
11.58  
11.58  
1.21  
1.21  
1.42  
0.50  
10  
−−− 0.020  
10  
2
2
_
_
_
_
G1 0.410  
K1 0.040  
0.430  
−−−  
10.42  
1.02  
10.92  
−−−  
7. DIMENSION H DOES NOT INCLUDE DAMBAR  
PROTRUSION OR INTRUSION. THE DAMBAR  
PROTRUSION(S) SHALL NOT CAUSE THE H  
DIMENSION TO BE GREATER THAN 0.037  
(0.940). THE DAMBAR INTRUSION(S) SHALL  
NOT CAUSE THE H DIMENSION TO BE  
SMALLER THAN 0.025 (0.635).  
http://onsemi.com  
9
MC10H642, MC100H642  
ECLinPS is a trademark of Semiconductor Components Industries, LLC (SCILLC).  
MECL 10H is a trademark of Motorola, Inc.  
ON Semiconductor and  
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice  
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All  
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights  
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications  
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should  
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,  
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death  
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal  
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.  
PUBLICATION ORDERING INFORMATION  
LITERATURE FULFILLMENT:  
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USA/Canada  
Europe, Middle East and Africa Technical Support:  
Phone: 421 33 790 2910  
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Phone: 81357733850  
ON Semiconductor Website: www.onsemi.com  
Order Literature: http://www.onsemi.com/orderlit  
Literature Distribution Center for ON Semiconductor  
P.O. Box 5163, Denver, Colorado 80217 USA  
Phone: 3036752175 or 8003443860 Toll Free USA/Canada  
Fax: 3036752176 or 8003443867 Toll Free USA/Canada  
Email: orderlit@onsemi.com  
For additional information, please contact your local  
Sales Representative  
MC10H642/D  

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