MBRS1540T3G [ONSEMI]
Surface Mount Schottky Power Rectifier SMB Power Surface Mount Package; 表面贴装肖特基功率整流器SMB功率表面贴装封装
| 型号： | MBRS1540T3G |
| 厂家： | 
ONSEMI |
| 描述： | Surface Mount Schottky Power Rectifier SMB Power Surface Mount Package |
| 文件： | 总5页 (文件大小：66K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MBRS1540T3
Surface Mount
Schottky Power Rectifier
SMB Power Surface Mount Package
These devices employ the Schottky Barrier principle in a
metal−to−silicon power rectifier. Features epitaxial construction with
oxide passivation and metal overlay contact. Ideally suited for low
voltage, high frequency switching power supplies; free wheeling
diodes and polarity protection diodes.
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SCHOTTKY BARRIER
RECTIFIER
1.5 AMPERES, 40 VOLTS
Features
• Compact Package with J−Bend Leads Ideal for Automated Handling
• Highly Stable Oxide Passivated Junction
• Guard−Ring for Over−Voltage Protection
• Low Forward Voltage Drop
• Pb−Free Package is Available
SMB
CASE 403A
PLASTIC
Mechanical Characteristics
• Case: Molded Epoxy
• Epoxy Meets UL 94 V−0 @ 0.125 in
• Weight: 95 mg (Approximately)
• Cathode Polarity Band
MARKING DIAGRAM
• Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
• Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
AYWW
BGJG
G
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
BGJ
A
Y
= Specific Device Code
= Assembly Location
= Year
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
V
V
V
40
V
RRM
RWM
R
WW
G
= Work Week
= Pb−Free Package
(Note: Microdot may be in either location)
Average Rectified Forward Current
I
1.5
3.0
A
A
O
(At Rated V , T = 100°C)
R
C
Peak Repetitive Forward Current
I
FRM
(At Rated V , Square Wave,
R
ORDERING INFORMATION
100 kHz, T = 105°C)
C
†
Non−Repetitive Peak Surge Current
(Surge Applied at Rated Load Conditions
Halfwave, Single Phase, 60 Hz)
I
40
A
FSM
Device
Package
Shipping
MBRS1540T3
SMB
2500/Tape & Reel
MBRS1540T3G
SMB
(Pb−Free)
2500/Tape & Reel
Storage/Operating Case Temperature
Operating Junction Temperature
T
, T
−55 to +150
−55 to +125
10,000
°C
°C
stg
C
T
J
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Voltage Rate of Change
dv/dt
V/ms
(Rated V , T = 25°C)
R
J
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
©
Semiconductor Components Industries, LLC, 2005
1
Publication Order Number:
August, 2005 − Rev. 3
MBRS1540T3/D
MBRS1540T3
THERMAL CHARACTERISTICS
Characteristic
Symbol
Value
Unit
Thermal Resistance,
°C/W
Junction−to−Lead (Note 1)
Thermal Resistance,
Junction−to−Ambient (Note 2)
R
R
24
80
q
JL
q
JA
ELECTRICAL CHARACTERISTICS
v
T = 25°C
T = 125°C
V
F
J
J
Maximum Instantaneous Forward Voltage (Note 3)
see Figure 2
0.46
0.54
0.39
0.54
(i = 1.5 A)
(i = 3.0 A)
F
F
I
T = 25°C
T = 100°C
mA
R
J
J
Maximum Instantaneous Reverse Current (Note 3)
see Figure 4
0.8
0.1
5.7
1.6
(V = 40 V)
(V = 20 V)
R
R
1. Mounted with minimum recommended pad size, PC Board FR4.
2. 1 inch square pad size (1 x 0.5 inch for each lead) on FR4 board.
3. Pulse Test: Pulse Width ≤ 250 ms, Duty Cycle ≤ 2.0%.
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2
MBRS1540T3
100
10
100
10
T = 125°C
J
T = 125°C
J
25°C
1.0
0.1
1.0
0.1
100°C
100°C
−ꢀ40°C
25°C
0.1
0.3
0.5
0.7
0.9
0.1
0.3
0.5
0.7
0.9
v , INSTANTANEOUS FORWARD VOLTAGE (VOLTS)
F
V , MAXIMUM INSTANTANEOUS FORWARD VOLTAGE (VOLTS)
F
Figure 1. Typical Forward Voltage
Figure 2. Maximum Forward Voltage
100E−3
10E−3
1.0E−3
100E−6
10E−6
1.0E−6
100E−3
10E−3
1.0E−3
100E−6
10E−6
1.0E−6
T = 125°C
J
T = 125°C
J
100°C
25°C
100°C
25°C
0
10
20
30
40
0
10
20
30
40
V , REVERSE VOLTAGE (VOLTS)
R
V , REVERSE VOLTAGE (VOLTS)
R
Figure 3. Typical Reverse Current
Figure 4. Maximum Reverse Current
2.5
2.0
1.5
1.0
1.2
1.0
0.8
0.6
0.4
FREQ = 20 kHz
dc
SQUARE WAVE
dc
Ipk/Io = p
SQUARE WAVE
Ipk/Io = 5.0
Ipk/Io = 10
Ipk/Io = p
Ipk/Io = 5.0
Ipk/Io = 20
Ipk/Io = 10
Ipk/Io = 20
0.5
0
0.2
0
25
45
65
85
105
125
0
0.5
1.0
1.5
2.0
2.5
T , LEAD TEMPERATURE (°C)
L
I , AVERAGE FORWARD CURRENT (AMPS)
O
Figure 5. Current Derating
Figure 6. Forward Power Dissipation
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3
MBRS1540T3
1000
125
115
105
95
R
= 24°C/W
tja
T = 25°C
J
43°C/W
63°C/W
100
80°C/W
85
93°C/W
75
65
10
0
5.0
10
15
20
25
30
35
40
0
5.0
10
15
20
25
30
35
40
V , REVERSE VOLTAGE (VOLTS)
R
V , DC REVERSE VOLTAGE (VOLTS)
R
Figure 7. Capacitance
Figure 8. Typical Operating Temperature Derating*
* Reverse power dissipation and the possibility of thermal runaway must be considered when operating this device under any re-
verse voltage conditions. Calculations of T therefore must include forward and reverse power effects. The allowable operating
J
T may be calculated from the equation:
J
T = T
J
− r(t)(Pf + Pr) where
Jmax
r(t) = thermal impedance under given conditions,
Pf = forward power dissipation, and
Pr = reverse power dissipation
This graph displays the derated allowable T due to reverse bias under DC conditions only and is calculated as T = T
− r(t)Pr,
J
J
Jmax
where r(t) = Rthja. For other power applications further calculations must be performed.
1.0E+00
1.0E−01
1.0E−02
50%
20%
10%
5.0%
2.0%
1.0%
1.0E−03
1.0E−04
R
= R
tjl*r(t)
tjl(t)
0.00001
0.0001
0.001
0.01
0.1
t, TIME (s)
1.0
10
100
1000
Figure 9. Thermal Response — Junction to Case
1.0E+00
1.0E−01
1.0E−02
50%
20%
10%
5.0%
2.0%
1.0%
1.0E−03
1.0E−04
R
= R
tjl*r(t)
tjl(t)
0.00001
0.0001
0.001
0.01
0.1
t, TIME (s)
1.0
10
100
1000
Figure 10. Thermal Response — Junction to Ambient
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4
MBRS1540T3
PACKAGE DIMENSIONS
SMB
PLASTIC PACKAGE
CASE 403A−03
ISSUE E
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
H
E
2. CONTROLLING DIMENSION: INCH.
3. D DIMENSION SHALL BE MEASURED WITHIN DIMENSION P.
E
MILLIMETERS
INCHES
DIM
A
A1
b
c
D
MIN
1.90
0.05
1.96
0.15
3.30
4.06
5.21
0.76
NOM
2.13
0.10
2.03
0.23
3.56
4.32
5.44
1.02
MAX
MIN
NOM
0.084
0.004
0.080
0.009
0.140
0.170
0.214
0.040
MAX
0.095
0.006
0.083
0.012
0.150
0.180
0.220
0.050
2.41
0.15
2.11
0.30
3.81
4.57
5.59
1.27
0.075
0.002
0.077
0.006
0.130
0.160
0.205
0.030
b
D
E
H
E
L
0.51 REF
L1
0.020 REF
A
A1
c
L
L1
SOLDERING FOOTPRINT*
2.261
0.089
2.743
0.108
2.159
0.085
mm
inches
ǒ
Ǔ
SCALE 8:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
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MBRS1540T3/D
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