LC898130DP1XHTBG [ONSEMI]

OIS/CL-AF and Zoom Control LSI;
LC898130DP1XHTBG
型号: LC898130DP1XHTBG
厂家: ONSEMI    ONSEMI
描述:

OIS/CL-AF and Zoom Control LSI

文件: 总10页 (文件大小:213K)
中文:  中文翻译
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DATA SHEET  
www.onsemi.com  
OIS/CL-AF & Zoom  
Control LSI  
Advance Information  
WLCSP36  
CASE 567ZU  
LC898130DP  
MARKING DIAGRAM  
Overview  
This is a system LSI integrating an onchip 32bit DSP, a FLASH  
ROM and peripherals including analog circuits for OIS (Optical  
Image Stabilization) / Closed LoopAF (Auto Focus) and Zoom  
control, constant current drivers and PIEZO drivers.  
898130XH  
AWLYYWW  
A
WL  
YY  
= Assembly Location  
= Wafer Lot  
= Year  
Features  
Onchip 32bit DSP  
WW  
= Work Week  
Builtin Software for Digital Servo Filter  
Builtin Software for Gyro Filter  
Memory  
ORDERING INFORMATION  
Flash Memory  
Program ROM  
Program SRAM  
Data SRAM  
Device  
Package  
Shipping  
LC898130DP1XHTBG WLCSP36  
4,000 /  
(PbFree) Tape & Reel  
LC898130DPNXHTBG WLCSP36  
4,000 /  
Peripherals  
(PbFree) Tape & Reel  
AD Converter  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specification  
Brochure, BRD8011/D.  
DA Converter  
2wire Serial I/F Circuit  
2
(The Communication Protocol is Compatible with I C)  
Hall/MR Bias Circuit  
VGA (Hall/MR Amp)  
OSC (Oscillator)  
LDO (Low DropOut Regulator)  
Digital Gyro I/F (SPI)  
Interrupt I/F  
This document contains information on a new product.  
Specifications and information herein are subject to change  
without notice.  
PLL  
Temperature Sensor  
Driver  
OIS/CLAF and Zoom/PIEZO (Bidirection)  
Constant Current Linear Driver (x2ch, I = 200 mA)  
full  
PIEZO (Didirection)  
PWM Driver (x2ch, Exclusive Use with Constant Current Linear  
Driver)  
Package  
WLCSP36 (3 x 12 Pin) Thickness Max. 0.35 mm, with Back Coat  
LeadFree  
Halogen Free  
Power Supply Voltage  
AD/DA/VGA/LDO/OSC/Flash/PLL/Temp. Sensor:  
AVDD = 2.7 V to 3.6 V  
Driver: V = 2.7 V to 3.6 V  
M
1.8 V I/O: I  
= 1.7 V to 3.6 V  
OVDD  
Core Logic: Generated by Onchip LDO  
Connect 1 mF Capacitor to LDPO Pin  
© Semiconductor Components Industries, LLC, 2021  
1
Publication Order Number:  
September, 2021 Rev. P0  
LC898130DP/D  
LC898130DP  
BLOCK DIAGRAM  
DSP  
RAM  
ROM  
RAM  
FLASH  
IOVDD  
2wire  
Serial I/F  
Slave  
SCL  
SDA  
Hall  
VGA  
ADC  
SSB0  
SSB1  
SCLK  
MOSI  
MISO  
SPI  
INT  
Hall Offset  
/ Bias  
Port  
EIRQ  
AVDD  
LDPO  
2wire  
Serial I/F  
Master/Slave  
SCL2  
SDA2  
LDO  
POR  
OSC  
PLL  
1 mF  
MCLK  
DVSS  
AVSS  
OUT 1  
OUT 2  
OUT 3  
OUT 4  
HBridge  
Driver  
VM  
PGND  
Figure 1. Block Diagram  
www.onsemi.com  
2
LC898130DP  
DSP  
RAM  
ROM  
RAM  
FLASH  
IOVDD  
2wire  
Serial I/F  
Slave  
SCL  
SDA  
MR  
VGA  
ADC  
SSB0  
SSB1  
SCLK  
MOSI  
MISO  
SPI  
INT  
Hall Offset  
/ Bias  
Port  
EIRQ  
AVDD  
LDPO  
2wire  
Serial I/F  
Master/Slave  
SCL2  
SDA2  
LDO  
POR  
OSC  
PLL  
1 mF  
MCLK  
DVSS  
AVSS  
OUT1  
OUT2  
OUT3  
OUT4  
HBridge  
Driver  
VM  
PGND  
Figure 2. Block Diagram  
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3
LC898130DP  
PIN LAYOUT  
C
B
A
OUT2  
VM  
OUT1  
OPINP1 OPINP2 OPINP3 OPINP4 HLBO1 HLBO2  
DVSS  
SSB1  
IOVDD  
SSB0  
SDA2  
SCL2  
SDA  
SCL  
PGND OPINM1 OPINM2 OPINM3 OPINM4 PCNT1 PCNT2  
OUT4  
1
OUT3  
2
MON1  
3
MON2  
4
AVSS  
5
AVDD  
6
LDPO  
7
MCLK  
8
EIRQ  
9
MISO  
10  
MOSI  
11  
SCLK  
12  
Driver  
VDD/VSS  
Internal VDD Output  
1.8 V I/O  
Figure 3. Pin Layout (Bottom View)  
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4
LC898130DP  
PIN DESCRIPTION  
PIN DESCRIPTION  
No.  
1
Pin  
I/O  
B
I/O Pwr  
Function  
Servo Monitor Analog In/Out  
Init  
Z
MON1  
MON2  
SCL  
AVDD  
AVDD  
2
B
Servo Monitor Analog In/Out  
Z
3
B
IOVDD  
IOVDD  
IOVDD  
IOVDD  
IOVDD  
2wire serial HOST I/F Clock Slave  
Z
4
SDA  
B
2wire serial HOST I/F Data Slave  
Z
5
SSB0  
SCLK  
MOSI  
B
Digital Gyro Data I/F Chip Select 0 Out (3/4wire Master)  
Digital Gyro Data I/F Clock Out (3/4wire Master)  
Z
6
B
Z
7
B
Digital Gyro Data I/F Data InOut (3wire Master)  
Digital Gyro Data I/F Data Out (4wire Master)  
Z
8
MISO  
B
IOVDD  
Digital Gyro Data I/F Data In (4wire Master)  
U
SSB2  
SELADR  
9
EIRQ  
MCLK  
B
B
B
B
B
O
O
O
O
I
IOVDD  
IOVDD  
IOVDD  
IOVDD  
IOVDD  
AVDD  
AVDD  
AVDD  
AVDD  
AVDD  
AVDD  
AVDD  
AVDD  
AVDD  
AVDD  
AVDD  
AVDD  
VM  
Interrupt Input  
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
29  
30  
31  
32  
33  
34  
35  
36  
Master Clock  
SSB1  
Digital Gyro Data I/F Chip Select 1 Out (3/4wire Master)  
2wire serial I/F Clock Master/Slave  
2wire serial I/F Data Master/Slave  
Hall/MR Bias Output 1  
SCL2  
SDA2  
HLBO1  
HLBO2  
PCNT1  
PCNT2  
OPINM1  
OPINP1  
OPINM2  
OPINP2  
OPINM3  
OPINP3  
OPINM4  
OPINP4  
OUT1  
Hall/MR Bias Output 2  
External Driver Power Control 1  
External Driver Power Control 2  
VGA (Hall/MR Amp) Input Minus 1  
VGA (Hall/MR Amp) Input Plus 1  
VGA (Hall/MR Amp) Input Minus 2  
VGA (Hall/MR Amp) Input Plus 2  
VGA Input Minus 3  
I
I
I
I
I
VGA (MR Amp) Input Plus 3  
VGA Input Minus 4  
I
I
VGA (MR Amp) Input Plus 4  
OIS Driver Output 1  
O
O
O
O
P
P
P
P
P
P
P
OUT2  
VM  
OIS Driver Output 2  
OUT3  
VM  
OIS Driver Output 3  
OUT4  
VM  
OIS Driver Output 4  
AVDD  
Analog Power (2.7 V to 3.6 V)  
Analog GND  
AVSS  
VM  
Driver Power (2.7 V to 3.6 V)  
Driver GND  
PGND  
IOVDD  
DVSS  
I/O Power (1.7 V to 3.6 V)  
Digital GND  
LDPO  
Internal 1.38 V LDO Power Output  
NOTE: Z: HiZ  
U: Internal PullUp Register On  
D: Internal PullDown Register On  
*Process when pins are not used  
PIN TYPE “O” – Ensure that it is set to OPEN.  
PIN TYPE “I” – OPEN is inhibited. Ensure that it is connected to the V or V even when it is unused.  
DD  
SS  
(Please contact onsemi for more information about selection of V or V .)  
DD  
SS  
PIN TYPE “B” – If you are unsure about processing method on the pin description of pin layout table, please contact us.  
Note that incorrect processing of unused pins may result in defects.  
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5
LC898130DP  
ELECTRICAL CHARACTERISTICS  
ABSOLUTE MAXIMUM RATINGS (AVSS = 0 V, PGND = 0 V, DVSS = 0 V)  
Parameter Symbol Conditions  
Power Supply Voltage  
25°C  
Ratings  
0.3 to 4.6  
0.3 to 4.6  
0.3 to 4.6  
Unit  
V
V
AD  
max  
max  
max  
T
A
V
T
25°C  
25°C  
25°C  
25°C  
25°C  
V
M
A
V
IO  
T
A
V
Input/Output Voltage  
V , V  
AI AO  
T
A
0.3 to V + 0.3  
V
AD  
V
MI  
, V  
T
A
0.3 to V + 0.3  
V
MO  
M
V , V  
II  
T
A
0.3 to V + 0.3  
V
IOO  
IO  
Storage Temperature  
T
stg  
55 to 125  
°C  
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality  
should not be assumed, damage may occur and reliability may be affected.  
ALLOWABLE OPERATING RATINGS (T = 40 to 85°C, AVSS = 0 V, PGND = 0 V, DVSS = 0 V)  
A
Parameter  
3.0 V POWER SUPPLY (AVDD)  
Power Supply Voltage  
Symbol  
Min  
Typ  
Max  
Unit  
V
AD  
2.7  
0
2.8  
3.6  
V
V
Input Voltage Range  
V
INA  
V
AD  
3.0 V POWER SUPPLY (VM)  
Power Supply Voltage  
V
2.7  
0
2.8  
3.6  
V
V
M
Input Voltage Range  
V
INM  
V
M
1.8 V POWER SUPPLY (IOVDD)  
Power Supply Voltage  
V
1.7  
0
1.8  
3.6  
V
V
IO  
Input Voltage Range  
V
INI  
V
IO  
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond  
the Recommended Operating Ranges limits may affect device reliability.  
DC CHARACTERISTICS: INPUT/OUTPUT  
(T = 40 to 85°C, AVSS = 0 V, PGND = 0 V, DVSS = 0 V, AVDD = 2.7 to 3.6 V, IOVDD = 1.7 to 3.6 V)  
A
Parameter  
Symbol  
Conditions  
Min  
Typ  
Max  
Unit  
Applicable Pins  
Highlevel Input Voltage  
V
CMOS  
Schmitt  
0.7 IOVDD  
V
SCL, SDA, SCL2,  
SDA2, SSB0, SSB1,  
SCLK, MOSI, MISO,  
EIRQ, MCLK  
IH  
Lowlevel Input Voltage  
V
0.3 IOVDD  
V
IL  
Highlevel Input Voltage  
Lowlevel Input Voltage  
Highlevel Output Voltage  
V
CMOS  
0.7 AVDD  
0.3 AVDD  
V
V
V
MON1, MON2  
IH  
Schmitt  
V
IL  
V
OH  
I
= 3 mA  
IOVDD −  
SDA, SCL2, SDA2,  
SSB0, SSB1, SCLK,  
MOSI, MISO, EIRQ,  
MCLK  
OH  
0.2  
Lowlevel Output Voltage  
Highlevel Output Voltage  
V
V
I
= 3 mA  
0.2  
V
V
SCL, SDA, SCL2,  
SDA2, SSB0, SSB1,  
SCLK, MOSI, MISO,  
EIRQ, MCLK  
OL  
OL  
I
I
= 2 mA  
AVDD −  
0.2  
MON1, MON2  
OH  
OH  
Lowlevel Output Voltage  
V
OL  
= 2 mA  
0.2  
V
V
OL  
Analog Input Voltage  
V
AVSS  
AVDD  
MON1, MON2,  
OPINP1, OPINM1,  
OPINP2, OPINM2,  
OPINP3, OPINM3,  
OPINP4, OPINM4  
AI  
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6
LC898130DP  
DC CHARACTERISTICS: INPUT/OUTPUT (continued)  
(T = 40 to 85°C, AVSS = 0 V, PGND = 0 V, DVSS = 0 V, AVDD = 2.7 to 3.6 V, IOVDD = 1.7 to 3.6 V)  
A
Parameter  
Pull Up Resistor  
Symbol  
Conditions  
Min  
Typ  
Max  
Unit  
Applicable Pins  
R
20  
250  
kW  
SCL2, SDA2, SSB0,  
SSB1, SCLK, MOSI,  
MISO, EIRQ, MCLK,  
MON1, MON2  
up  
Pull Down Resistor  
R
20  
250  
kW  
dn  
DRIVER OUTPUT  
(T = 25°C, AVSS = 0 V, PGND = 0 V, DVSS = 0 V, AVDD = VM = 2.8 V)  
A
Parameter  
Symbol  
Conditions  
Min  
190  
Typ  
Max  
Unit  
Output Current, OUT1OUT4  
I
full  
Full code  
200  
210  
mA  
NONVOLATILE MEMORY CHARACTERISTICS  
(T = 40 to 85°C, AVSS = 0 V, PGND = 0 V, DVSS = 0 V, AVDD = 2.7 to 3.6 V, IOVDD = 1.7 to 3.6 V)  
A
Parameter  
Symbol  
Conditions  
Read for FLASH  
Program & Erase for FLASH  
Value  
40 to 85  
Unit  
°C  
Operating Temperature  
T
opr1  
T
opr2  
10 to 65 (Note 1)  
°C  
1. All drivers must be in the standby state.  
Item  
Symbol  
EN  
Conditions  
Min  
Typ  
Max  
1000  
Unit  
Cycles  
Years  
ms  
Applicable Circuit  
Endurance  
Flash Memory  
Data Retention  
Write Time  
RT  
10  
t
3
WT  
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
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7
 
LC898130DP  
AC CHARACTERISTICS  
Power Supply Timing  
t
R
t
W
AVDD  
Min V  
VM  
IOVDD  
10%  
V
bot  
Figure 4. VDD Supply Timing  
Table 1.  
Item  
Symbol  
Min  
Typ  
Max  
Unit  
Rise Time  
t
100  
3
ms  
ms  
V
R
Wait Time  
t
W
Bottom Voltage  
V
bot  
0.2  
Injection order between AVDD, VM and IOVDD is below.  
1.7 V  
1.7 V  
IOVDD  
t
t
AVIO  
IOAV  
2.7 V  
2.7 V  
AVDD  
VM  
0.2 V  
0.2 V  
t
t
AVVM  
VMAV  
0.2 V  
0.2 V  
Figure 5. Injection Order between AVDD, VM and IOVDD  
Table 2.  
Item  
Symbol  
Min  
Typ  
Max  
Unit  
IOVDD On to AVDD ON  
AVDD ON to VM ON  
t
0
0
0
0
*
ms  
ms  
ms  
ms  
IOAV  
t
AVVM  
VMAV  
VM OFF to AVDD OFF  
AVDD OFF to IOVDD OFF  
t
t
AVIO  
*Please make IOPRSTB (D0_0064h, bit0) = 0 before turning OFF AVDD when AVDD is turned off with keeping IOVDD on.  
SDA, SCL, SSB0, SSB1, SCLK, MOSI, MISO, EIRQ, MCLK, SCL2 and SDA2 tolerate 3 V input at the time of IOVDD power  
off.  
The data in the Flash memory may be rewritten unintentionally if you do not keep specifications.  
And it is forbidden to power off during Flash memory access. The data in the Flash memory may be rewritten unintentionally.  
Drivers are recommended to set standby before VM power off.  
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8
LC898130DP  
2wire Serial Interface Timing  
The 2wire serial interface timing definition and electric characteristics are shown below. The communication protocol is  
2
compatible with I C. This circuit has clock stretch function.  
Static Address: 7’b0100100  
t
f
t
r
t
BUF  
V
IHmin  
SDA  
SCL  
V
ILmin  
t
t
t
t
t
t
SU;STO  
HD;STA  
HD;DAT SU;DAT  
SU;STA HD;STA  
t
f
t
r
V
IHmin  
V
ILmin  
t
t
1/f  
SCL  
LOW  
HIGH  
Start Condition  
Repeated Start Condition  
Stop Condition Start Condition  
Figure 6. 2wire Serial Interface Timing  
Table 3.  
Standardmode  
Fastmode  
Fastmode Plus  
Min  
Max  
Min  
Max  
Min  
Max  
Item  
SCL Clock Frequency  
Symbol  
Units  
kHz  
ms  
f
100  
400  
1000  
SCL  
START Condition Hold Time  
SCL Clock Low Period  
SCL Clock High Period  
t
t
4.0  
4.7  
4.0  
4.7  
0.6  
1.3  
0.6  
0.6  
0.26  
0.5  
HD;STA  
t
ms  
LOW  
t
0.26  
0.26  
ms  
HIGH  
Setup Time for Repetition  
START Condition  
ms  
SU;STA  
Data Hold Time  
t
0 (Note 2)  
3.45  
0 (Note 2)  
0.9  
0 (Note 2)  
0.45  
ms  
ns  
ns  
ns  
ms  
ms  
HD;DAT  
Data Setup Time  
t
250  
100  
50  
SU;DAT  
SDA, SCL Rising Time  
SDA, SCL Falling Time  
STOP Condition Setup Time  
t
r
1000  
300  
300  
300  
120  
120  
t
f
t
4.0  
4.7  
0.6  
1.3  
0.26  
0.5  
SU;STO  
Bus Free Time between  
STOP and START  
t
BUF  
2. Although the I C specification defines a condition that 300 ns of hold time is required internally, this LSI is designed for a condition with typ.  
2
33 ns of hold time. If SDA signal is unstable around falling point of SCL signal, please implement an appropriate treatment on board, such  
as inserting a resister.  
www.onsemi.com  
9
 
LC898130DP  
PACKAGE DIMENSIONS  
WLCSP36 1.295x4.74x0.33  
CASE 567ZU  
ISSUE O  
onsemi,  
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates  
and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.  
A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/PatentMarking.pdf. onsemi reserves the right to make changes at any time to any  
products or information herein, without notice. The information herein is provided “asis” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the  
information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use  
of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products  
and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information  
provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may  
vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license  
under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems  
or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should  
Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates,  
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death  
associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal  
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.  
PUBLICATION ORDERING INFORMATION  
LITERATURE FULFILLMENT:  
Email Requests to: orderlit@onsemi.com  
TECHNICAL SUPPORT  
North American Technical Support:  
Voice Mail: 1 8002829855 Toll Free USA/Canada  
Phone: 011 421 33 790 2910  
Europe, Middle East and Africa Technical Support:  
Phone: 00421 33 790 2910  
For additional information, please contact your local Sales Representative  
onsemi Website: www.onsemi.com  
www.onsemi.com  

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