ISL9R860PF2 [ONSEMI]

8A,600V,STEALTH™ 二极管;
ISL9R860PF2
型号: ISL9R860PF2
厂家: ONSEMI    ONSEMI
描述:

8A,600V,STEALTH™ 二极管

局域网 功效 二极管
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ISL9R860PF2  
8 A, 600 V, STEALTH]  
Diode  
Description  
The ISL9R860PF2 is a STEALTH diode optimized for low loss  
performance in high frequency hard switched applications. The  
www.onsemi.com  
STEALTH family exhibits low reverse recovery current (I ) and  
rr  
exceptionally soft recovery under typical operating conditions. This  
device is intended for use as a free wheeling or boost diode in power  
supplies and other power switching applications. The low I and short  
rr  
ta phase reduce loss in switching transistors. The soft recovery  
minimizes ringing, expanding the range of conditions under which the  
diode may be operated without the use of additional snubber circuitry.  
Consider using the STEALTH diode with an SMPS IGBT to provide  
the most efficient and highest power density design at lower cost.  
1
2
1. Cathode  
2. Anode  
Features  
Stealth Recovery t = 28 ns (@ I = 8 A)  
rr  
F
Max Forward Voltage, V = 2.4 V (@ T = 25°C)  
F
C
600 V Reverse Voltage and High Reliability  
Avalanche Energy Rated  
1
2
This Device is PbFree and is RoHS Compliant  
TO220, 2Lead  
CASE 221AS  
Applications  
Switch Mode Power Supplies  
Hard Switched PFC Boost Diode  
UPS Free Wheeling Diode  
Motor Drive FWD  
MARKING DIAGRAM  
SMPS FWD  
Snubber Diode  
$Y&Z&3&K  
R860PF2  
$Y  
&Z&3  
&K  
= ON Semiconductor Logo  
= Data Code (Year & Week)  
= Lot  
R860PF2  
= Specific Device Code  
ORDERING INFORMATION  
See detailed ordering and shipping information on page 3 of  
this data sheet.  
© Semiconductor Components Industries, LLC, 2009  
1
Publication Order Number:  
March, 2019 Rev. 4  
ISL9R860PF2/D  
ISL9R860PF2  
MAXIMUM RATINGS T = 25°C unless otherwise noted  
C
Symbol  
Parameter  
Rating  
600  
Units  
V
V
Peak Repetitive Reverse Voltage  
Working Peak Reverse Voltage  
DC Blocking Voltage  
RRM  
RWM  
V
600  
V
V
R
600  
V
I
Average Rectified Forward Current (T = 75°C)  
8
A
F(AV)  
C
I
Repetitive Peak Surge Current (20 kHz Square Wave)  
Nonrepetitive Peak Surge Current (Halfwave 1 Phase 60 Hz)  
Power Dissipation  
16  
A
FRM  
I
100  
A
FSM  
P
D
26  
W
mJ  
°C  
°C  
E
Avalanche Energy (1 A, 40 mH)  
20  
AVL  
T , T  
J
Operating and Storage Temperature Range  
55 to 175  
300  
STG  
T
L
Maximum Temperature for Soldering  
Leads at 0.063 in (1.6 mm) from Case for 10 s  
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality  
should not be assumed, damage may occur and reliability may be affected.  
ELECTRICAL CHARACTERISTICS T = 25°C unless otherwise noted  
C
Symbol  
OFF STATE CHARACTERISTICS  
Instantaneous Reverse Current  
Parameter  
Test Condition  
Min  
Typ  
Max  
Unit  
I
R
V
R
= 600 V  
T
= 25°C  
100  
1.0  
mA  
C
T
= 125°C  
mA  
C
ON STATE CHARACTERISTICS  
Instantaneous Forward Voltage  
V
F
I = 8 A  
F
T
T
= 25°C  
2.0  
1.6  
2.4  
2.0  
V
V
C
= 125°C  
C
DYNAMIC CHARACTERISTICS  
Junction Capacitance  
SWITCHING CHARACTERISTICS  
C
V
R
= 10 V , I = 0 A  
30  
pF  
J
F
Reverse Recovery Time  
18  
21  
25  
30  
ns  
ns  
ns  
A
t
I = 1 A, di /dt = 100 A/ms, V = 30 V  
F F R  
rr  
I = 8 A, di /dt = 100 A/ms, V = 30 V  
F
F
R
I = 8 A, di /dt = 200 A/μs, V = 390 V,  
Reverse Recovery Time  
28  
t
I
F
C
F
R
rr  
T
= 25°C  
Maximum Reverse Recovery Current  
Reverse Recovery Charge  
Reverse Recovery Time  
3.2  
50  
rr  
nC  
ns  
Q
t
rr  
I = 8 A, di /dt = 200 A/μs, V = 390 V,  
77  
F
C
F
R
rr  
T
= 125°C  
S
Softness Factor (t /t )  
3.7  
3.4  
150  
53  
b
a
Maximum Reverse Recovery Current  
Reverse Recovery Charge  
A
I
rr  
nC  
ns  
Q
rr  
I = 8 A, di /dt = 600 A/μs, V = 390 V,  
Reverse Recovery Time  
t
rr  
F
C
F
R
T
= 125°C  
S
Softness Factor (t /t )  
2.5  
6.5  
195  
500  
b
a
Maximum Reverse Recovery Current  
Reverse Recovery Charge  
A
I
rr  
nC  
Q
rr  
dI /dt  
M
Maximum di/dt during t  
A/ms  
b
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
www.onsemi.com  
2
ISL9R860PF2  
THERMAL CHARACTERISTICS T = 25°C unless otherwise noted  
C
Symbol  
Parameter  
Test Condition  
Min  
Typ  
Max  
Unit  
°C/W  
°C/W  
4.8  
R
Thermal Resistance, Junction to Case  
Thermal Resistance, Junction to Ambient  
θ
JC  
JA  
TO220F  
70  
R
θ
PACKAGE MARKING AND ORDERING INFORMATION  
Part Number  
Top Mark  
Package  
Packing Method  
Tube  
Reel Size  
Tape Width  
Quantity  
50  
ISL9R860PF2  
R860PF2  
TO220F2L  
N/A  
N/A  
TYPICAL CHARACTERISTICS  
16  
14  
12  
10  
8
100  
175°C  
150°C  
175°C  
150°C  
125°C  
25°C  
10  
1
125°C  
100°C  
100°C  
6
4
25°C  
2
0.1  
0
100  
200  
300  
400  
500  
600  
0
0.25 0.5 0.75  
1
1.25 1.5 1.75  
2
2.25 2.5 2.75  
V , Forward Voltage [V]  
F
V , Reverse Voltage [V]  
R
Figure 1. Forward Current vs. Forward Voltage  
Figure 2. Reverse Current vs. Reverse Voltage  
90  
80  
V
= 390 V, T = 125°C  
J
V
= 390 V, T = 125°C  
J
R
R
80  
70  
60  
50  
40  
30  
20  
10  
0
70  
60  
50  
40  
30  
20  
10  
0
t
at di /dt = 200 A/ms, 500 A/ms, 800 A/ms  
F
b
t
at I = 16 A, 8 A, 4 A  
F
b
t
a
at I = 16 A, 8 A, 4 A  
F
t
a
at di /dt = 200 A/ms, 500 A/ms, 800 A/ms  
F
0
2
4
6
8
10  
12  
14  
16  
100  
200  
300 400  
500  
600  
700 800  
900  
1000  
I , Forward Current [A]  
F
di /dt, Current Rate of Change [A/ms]  
F
Figure 3. ta and tb Curves vs. Forward Current  
Figure 4. ta and tb Curves vs. diF/dt  
www.onsemi.com  
3
ISL9R860PF2  
TYPICAL CHARACTERISTICS (continued)  
14  
11  
10  
9
V
= 390 V, T = 125°C  
J
R
di /dt = 800 A/ms  
V
= 390 V, T = 125°C  
J
F
R
12  
10  
8
I
F
= 16 A  
8
I
F
= 8 A  
di /dt = 500 A/ms  
F
7
I
F
= 4 A  
6
6
5
4
di /dt = 200 A/ms  
F
4
2
3
2
0
0
2
4
6
8
10  
12  
14  
16  
100  
200  
300  
400  
500  
600  
700 800  
900  
1000  
IF, Forward Current [A]  
di /dt, Current Rate of Change [A/ms]  
F
Figure 5. Maximum Reverse Recovery Current  
vs. Forward Current  
Figure 6. Maximum Reverse Recovery Current  
vs. diF/dt  
350  
6
V
= 390 V, T = 125°C  
J
R
V
= 390 V, T = 125°C  
J
R
300  
250  
200  
150  
100  
50  
I
= 16 A  
F
5
4
3
2
1
I
= 16 A  
F
I
= 8 A  
F
F
I
= 8 A  
F
I
= 4 A  
400  
F
I
= 4 A  
500  
100  
200  
300  
500  
600  
700 800  
900  
1000  
100  
200  
300  
400  
600  
700 800  
900 1000  
di /dt, Current Rate of Change [A/ms]  
F
diF/dt, Current Rate of Change [A/ms]  
Figure 7. Reverse Recovery Softness Factor  
Figure 8. Reverse Recovery Charge  
vs. diF/dt  
vs. diF/dt  
1200  
10  
1000  
800  
600  
400  
200  
0
8
6
4
2
0
0.1  
1
10  
100  
50  
75  
100  
125  
150  
175  
V , Reverse Voltage [V]  
R
T , Case Temperature [°C]  
C
Figure 9. Junction Capacitance  
vs. Reverse Voltage  
Figure 10. DC Current Derating Curve  
www.onsemi.com  
4
ISL9R860PF2  
TYPICAL CHARACTERISTICS (continued)  
2.0  
1.0  
DUTY CYCLE DESCENDING ORDER  
0.5  
0.2  
0.1  
0.05  
0.02  
0.01  
0.1  
P
DM  
t
1
t
2
0.01  
NOTES:  
DUTY FACTOR: D = t / t  
1
2
PEAK T = P  
x Z  
J
x R + T  
q
JA A  
SINGLE PULSE  
q
A
J
DM  
0.001  
5  
4  
3  
2  
1  
0
1
10  
10  
10  
10  
10  
10  
10  
t, Rectangular Pulse Duration (s)  
Figure 11. Normalized Maximum Transient Thermal Impedance  
TEST CIRCUIT AND WAVEFORMS  
V
AMPLITUDE AND  
GE  
R
CONTROL di /dt t  
G
F
1
L
AND t CONTROL I  
2
F
di  
F
t
rr  
I
F
dt  
t
t
b
a
DUT  
CURRENT  
SENSE  
0
R
G
+
0.25 I  
V
RM  
V
DD  
GE  
MOSFET  
t
I
RM  
1
t
2
Figure 12. trr Test Circuit  
Figure 13. trr Waveforms and Definitions  
I = 1 A  
L = 40 Mh  
R < 0.1 W  
V
E
Q
= 50 V  
DD  
2
= 1 / 2LI [V  
/ (V  
> DUT V  
V )]  
)
AVL  
R(AVL)  
R(AVL)  
DD  
V
I
AVL  
= IGBT (BV  
LR  
1
CES  
R(AVL)  
+
CURRENT  
SENSE  
I
L
L
Q1  
V
DD  
IV  
DUT  
t
t
t
2
t
0
1
Figure 14. Avalanche Energy Test Circuit  
Figure 15. Avalanche Current and Voltage Waveforms  
STEALTH is trademark of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries.  
www.onsemi.com  
5
MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
TO220 Fullpack, 2Lead / TO220F2FS  
CASE 221AS  
ISSUE O  
DATE 29 FEB 2012  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98AON67438E  
TO220 FULLPACK, 2LEAD / TO220F2FS  
PAGE 1 OF 1  
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding  
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically  
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the  
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© Semiconductor Components Industries, LLC, 2019  
www.onsemi.com  
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