FSA223UMX [ONSEMI]
多媒体和 USB 2.0 高速和音频开关,带负信号能力;![FSA223UMX](http://pdffile.icpdf.com/pdf2/p00363/img/icpdf/FSA223UMX_2222081_icpdf.jpg)
型号: | FSA223UMX |
厂家: | ![]() |
描述: | 多媒体和 USB 2.0 高速和音频开关,带负信号能力 开关 |
文件: | 总18页 (文件大小:822K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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November 2012
FSA223 — USB2.0 High-Speed (480Mbps) and
Audio Switches with Negative Signal Capability
Features
Description
The FSA223 is a Double-Pole, Double Throw (DPDT)
multiplexer that combines a low-distortion audio and a
USB2.0 High-Speed (HS) switch path. This
configuration enables audio and USB data to share a
common connector port. The architecture is designed to
allow both audio and USB signals to swing below
ground. This means a common USB and headphone
jack can be used for personal media players and
portable peripheral devices.
.
.
.
.
.
.
.
HS-USB: 4 Ω Typical On Resistance
HS-USB: 4.5 pF Typical On Capacitance
Audio: 3 Ω Typical On Resistance
-3 db Bandwidth: > 720 MHz
Low Power Consumption
Power-off Protection on Common D+/R, D-/L Ports
Automatically Detects VCC for Switch Path Selection
Since USB2.0 is an industry standard for shared data-
path in portable devices, the FSA223 also incorporates
a VCC detection capability. The FSA223 includes a
power-off feature to minimize current consumption when
VCC is not present. This power-off circuitry is available
for the common D+/R, D-/L ports only. Typical
applications involve switching in portables and
consumer applications, such as cell phones, digital
cameras, and notebooks with hubs or controllers.
Applications
.
.
Cell Phone, PDA, Digital Camera, and Notebook
LCD Monitor, TV, and Set-Top Box
Related Resources
.
Please refer to tape and reel specifications on
www.fairchildsemi.com;
IMPORTANT NOTE:
http://www.fairchildsemi.com/packaging.
For additional performance information, please contact
analogswitch@fairchildsemi.com.
Ordering Information
Package
Number
Part Number
Top Mark
Package Description
FSA223L10X
FSA223MUX
FSA223UMX
MAC010A
MUA010A
MLP010A
GN
FSA223
GP
10-Lead MicroPak™, JEDEC MO-255, 1.6 x 2.1 mm
10-Lead MSOP, JEDEC MO-187, 3.0 mm Wide
10-Lead Quad, Ultrathin MLP, 1.4 x 1.8 mm
VCC
ASel
Switch Select
Cont ol Circuitry
VAudio
r
R
pd
D+
R
GND
D+/R
D-/L
D--
L
Figure 1.
FSA223 Analog Symbol
© 2007 Fairchild Semiconductor Corporation
FSA223 • Rev. 1.0.4
www.fairchildsemi.com
Pin Configuration
VCC
10
1
2
3
4
9
D+
D-
R
ASel
D+/R
D-/L
8
7
6
D+
1
10
9
V
CC
R
D-
2
1
D-
R
2
3
A
Sel
3
4
10 D+
L
D+/R
8
GND
9
8
VCC
ASel
L
4
5
7
D-/L
V
L
VAudio
VAudio
5
GND
5
6
7
6
Audio
D-/L D+/R
Figure 4. 10-Pin UMLP
GND
Figure 2.
10-Pin MicroPak™
Figure 3.
10-Pin MSOP
Pin Definitions
Name
Description
Vaudio
VCC
Power supply (audio)
Power supply (USB) and auto USB switch-path select
ASel
Audio select to override auto USB detect when VAUDIO supply is present
USB data bus input sources
D+, D-
R, L
Audio right and left input sources
D+/R, D-/L
USB and audio common connector ports
Truth Table
(1)
ASel
Vaudio
VCC
L, R
D+, D-
(2)
—
—
LOW
HIGH
HIGH
HIGH
OFF
OFF
OFF
ON
OFF
ON
—
LOW
LOW
HIGH
HIGH
ON
HIGH
OFF
Note:
1. ASel - Internal resistor to GND provides auto-VCC detect if there is no external connection. Forcing ASel HIGH
when VAUDIO is present overrides the USB path.
2. The dash (—) indicates “Don’t Care” state.
© 2007 Fairchild Semiconductor Corporation
FSA223 • Rev. 1.0.4
www.fairchildsemi.com
2
Functional Description
The FSA223 is a combined USB and audio switch
that enables sharing the D+/D- lines of a USB
connector with stereo audio CODEC outputs. The
switch is optimized for high-speed USB signals and
includes an automatic VCC-detection circuit. The
FSA223 detects the presence of VCC and defaults to
USB mode. Both the USB and audio switch paths
also handle negative signals, which eliminates the
need for large coupling capacitors.
The ASel pin is internally terminated by a resistor to
GND (typical value: 3 MΩ) and results in a default
USB connection. For optimal performance, VCC
should be connected directly to the device battery.
Application Diagram
2.7V - 5.5V
V
CC
2.7V - 5.5V
ASel
Vaudio
Switch Select
Control Circuitry
R
pd
D+
R
USB 2.0
Source
GND
D+/R
USB
Mini-AB
Connector
D-
L
ID
D-/L
Audio
CODEC
GND
Figure 5.
Typical Application
© 2007 Fairchild Semiconductor Corporation
FSA223 • Rev. 1.0.4
www.fairchildsemi.com
3
Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.
The absolute maximum ratings are stress ratings only.
Symbol
Parameter
Min.
Max.
Unit
VAudio
VCC
Supply Voltage
Supply Voltage
-0.5
-0.5
6.0
6.0
V
V
Vaudio
0.3V
+
R, L Pins
Vaudio- 7.0V
V
V
VSW
Switch I/O Voltage(3,4)
Control Input Voltage(3)
D+, D-, D+/R, D-/L
Pins
VCC- 7.0V
-0.5
VCC + 0.3V
ASel
IIK
6.0
-50
V
Input Clamp Diode Current
mA
mA
mA
mA
mA
°C
USB
50
ISW
Switch I/O Current (Continuous)
Audio
USB
50
100
100
+150
+150
+260
Peak Switch Current (Pulsed at
1ms Duration, <10% Duty Cycle)
ISWPEAK
Audio
TSTG
TJ
Storage Temperature Range
-65
Maximum Junction Temperature
°C
TL
Lead Temperature (Soldering, 10 seconds)
I/O to GND
°C
7.5
Human Body Model, JESD22-A114
All Other Pins
3.0
ESD
kV
VAudio VCC to GND
12.0
Charged Device Model, JESD22-C101
2.0
Notes:
3. The input and output negative ratings may be exceeded if the input and output diode current ratings are observed.
4. VSW maximum values can be exceeded ONLY if ISW maximum values are observed. For example, VSW=VCC + 0.6 V
is acceptable if ISW is limited externally to ≤ 50 mA.
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not
recommend exceeding them or designing to Absolute Maximum Ratings.
Symbol
Parameter
Min.
Max.
Units
VAudio
VCC
Supply Voltage
2.7
2.7
0
5.5
5.5
V
V
Supply Voltage
ASel
Control Input Voltage
VCC
V
V
Audio – 6.5 V
VCC – 6.5 V
-40
VAudio – 0.3 V
VCC
V
VSW
Switch I/O Voltage
V
TA
Operating Temperature
+85
°C
330
(estimated)
Thermal Resistance (free air)
MicroPak™
ºC/W
θJA
© 2007 Fairchild Semiconductor Corporation
FSA223 • Rev. 1.0.4
www.fairchildsemi.com
4
DC Electrical Characteristics
VAudio supply=2.7 V and typical values are at 25ºC unless otherwise specified.
TA=- 40°C to
+85°C
Symbol
Parameter
VCC (V)
Condition
Unit
Min. Typ. Max.
Common Pins
VIK
VIH
VIL
Clamp Diode Voltage
3.0
IIK=-18 mA
-1.2
Control Input Voltage HIGH
Control Input Voltage LOW
3.0 to 4.3(5)
3.0 to 4.3(5)
1.2
V
0.5
VIN=3.6 V
VIN=0 V
-1
-1
10
1
Vaudio=4.3 V
VCC=3.0 V
IIN
ASel Input HIGH Current
µA
µA
Power Off Leakage Current
(Common Port Only D+/R,
D-/L)
Common Port (D+/R, D-/L)
VSW=0V, 5.5 V
IOFF
Vaudio=VCC=0 V
10
D+/R, D-/L=0.3 V,
Off-Leakage Current of Port
D+, D-, R, L
VCC – 0.3 V
D+, D-, R, L=0.3 V,
VCC – 0.3 V or Floating
INO(0FF)
3.6
3.6
-50
-50
1
50
50
nA
On-Leakage Current of Port
D+/R or D-/L
D+/R, D-/L=0.3 V, VCC – 0.3 V
D+, D-, R, L=Floating
INC(0N)
RPD
1
3
nA
ASel Internal Pull-Down
Resistor
MΩ
USB Switch Path
USB Analog Signal Range
0
3.6
6
V
Ω
Ω
VD+/D-=0 V, 0.4 V,
ION=-8 mA
RONUSB HS Switch On Resistance(6)
3.0
3.0
4
(7,8)
∆ RONUSB HS Delta RON
VD+/D-=0V, ION=-8 mA
0.4
Audio Switch Path
Vaudio
– 5.5
Audio Analog Signal Range
Vaudio
6
V
Audio Switch On
RONAudio
VL/R=-2V, 0V, 0.7V, 2.0V;
ION=-26 mA
3.0 to 4.3(5)
3.0 to 4.3(5)
3.0 to 4.3(5)
3
Ω
Ω
Ω
Resistance(6)
(7)
∆ RONAudio Audio Delta RON
VL/R=0.7V ION=-26 mA
0.4
1.5
VL/R=-2 V, 0 V, 0.7 V, 2.0 V;
RFLAT(Audio) Audio RON Flatness(9)
2.5
I
ON=-26 mA
Power Supply
Quiescent Supply Current
ICC(Audio)
(Audio)
Vaudio=5.5 V
VCC=5.5 V
VASel=0 and VCC, IOUT=0
IOUT=0, Vaudio=0
4
10
20
µA
µA
µA
Quiescent Supply Current
ICC(VCC)
12
(VCC
)
VASel=2.6 V, VCC=Floating
VASel=1.8 V, VCC=Floating
10
14
15
18
Increase in ICC Current per
Control Voltage and VCC
V
audio=3.6 V,
ICCT
4.3 V(5)
Notes:
5. 4.3 V is guaranteed by characterization, not production tested.
6. On resistance is determined by the voltage drop between the A and B pins at the indicated current through the switch.
7. ∆ RON=RON max – RON min measured at identical VCC, temperature, and voltage. Worst-case signal path, audio
or USB channel, is characterized.
8. Guaranteed by characterization, not production tested.
9. Flatness is defined as the difference between the maximum and minimum values of on resistance over the
specified range of conditions.
© 2007 Fairchild Semiconductor Corporation
FSA223 • Rev. 1.0.4
www.fairchildsemi.com
5
AC Electrical Characteristics
VAudio supply=2.7 V unless otherwise specified.
TA=- 40°C to +85°C
Min. Typ. Max.
Symbol
Parameter
VCC (V)
Conditions
Unit
VD+/R, D-/L=1.0 V; RL=50 Ω;
CL=50pF, Figure 14, Figure 15
tONAUDIO2 Turn-On Time ASel to Output
tOFFAUDIO2 Turn-Off Time ASel to Output
3.0 to 4.3(10)
3.0 to 4.3(10)
3.6
2
2
μs
μs
VD+/R, D-/L=1.0 V; RL=50 Ω;
CL=50pF, Figure 14, Figure 15
RL=50 Ω; CL=0 pF
Figure 17
USB Switch Propagation
tPDUSB
0.25
-110
720
ns
Delay(10)
f=20 kHz; RT=32 Ω; CL=0 pF
Figure 22
Non-Adjacent Channel
XtalkA
3.0 to 4.3(10)
3.0 to 4.3(10)
3.0 to 4.3(10)
dB
MHz
%
Crosstalk - Audio
RT=50 Ω, CL=0 pF, Signal 0 dBm
Figure 20
BW
-3db Bandwidth - USB
f=20 Hz to 20 kHz; RL=32 Ω,
VIN=2 Vpp, Figure 25
THD
Total Harmonic Distortion
0.1
Note:
10. Guaranteed by characterization, not production tested.
USB High-Speed-Related AC Electrical Characteristics
VAudio supply=2.7 V unless otherwise specified.
TA=- 40°C to +85°C
Min. Typ. Max.
Symbol
Parameter
VCC (V)
Conditions
Unit
tR=tF=750 ps (10-90%) at 240 MHz
CL=0 pF, RL=50 Ω
tSK(o)
Channel-to-Channel Skew(11)
3.0 to 4.3(11)
35
Figure 18, Figure 19
ps
ps
tR=tF=750 ps (10-90%) at 240 MHz
CL=0 pF, RL=50 Ω
Figure 18, Figure 19
Skew of Opposite Transitions of
the Same Output(11)
tSK(P)
3.0 to 4.3(11)
3.0 to 4.3(11)
35
RL=50 ꢀ, CL=50 pF, tR=tF=500 ps
tJ
Total Jitter(11)
130
(10-90%) at 480 Mbps (PRBS=215 – 1)
Note:
11. Guaranteed by characterization, not production tested.
Capacitance(12)
VAudio supply=3.0V unless otherwise specified.
TA=- 40°C to +85°C
Min. Typ. Max.
2.0
Unit
Symbol
Parameter
VCC (V)
Condition
Control Pin Input Capacitance
CIN (ASel)
VCC=3.0 V, 4.3 V VBias=0.05 V
pF
(ASel
)
VBias=0.2 V; f=240 MHz
Figure 24
VCC=3.0 V, 4.3 V
ASel=0V (CONUSB
4.5
9.0
6.0
)
D+/R, D-/L (Source Port) On
Capacitance
CON(D+/R, D-/L)
pF
VCC=3.0 V, 4.3 V
ASel=3.0 V
VBias=0.2 V; f=1 MHz
Figure 24
(CONAudio
)
f=1 MHz
Figure 23
f=1MHz
USB Input Source Off
Capacitance
VCC=3.0 V, 4.3 V
ASel=3.0 V
COFF(D+, D-)
COFF(R/L)
1.5
3.0
pF
pF
Audio Input Source Off
Capacitance
VCC=3.0 V, 4.3 V
ASel=0 V
Figure 23
Note:
12. Guaranteed by characterization, not production tested.
© 2007 Fairchild Semiconductor Corporation
FSA223 • Rev. 1.0.4
www.fairchildsemi.com
6
Applications Information
In applications where Vsw could exceed the absolute
Because the deselected channel may no longer provide
guaranteed off isolation, consider the following:
maximum rating of
VCC+0.3 V, the following
recommendations help maintain low power consumption
and protect the part.
.
.
During USB transfer, the audio amplifier should be
powered down.
The addition of the series diode in the VCC supply line
blocks any current that might leak back into VCC for
over-voltage input cases.
During audio transfer, the USB pull-up resistor
supply must be removed (as specified on page 141
of the USB 2.0 specification).
RECOMMENDATION
Add a low forward voltage
VCC
I
CC blocking diode to stop
current flow into the VCC pin
EXPLANATION
Parasitic PMOS bulk diode
provides a leakage path in an
over-voltage condition
EXCEPTION CONDITION
sw > VCC+0.3V
D+
R
V
D+/R
EXPLANATION
Both common port inputs have
power-off protection, allowing
them to withstand voltages
greater than 0V when VCC = 0V
D-
L
RECOMMENDATION
Ensure that any voltage present
on the un-selected ports is
< VCC to prevent data
D+/L
corruption on the common port
Figure 6.
Application Suggestions
© 2007 Fairchild Semiconductor Corporation
FSA223 • Rev. 1.0.4
www.fairchildsemi.com
7
Typical Performance Characteristics
5.00
4.00
3.00
2.00
1.00
0.00
4.00
3.00
2.00
1.00
0.00
85°C
25°C
-40°C
85°C
25°C
-40°C
-2.00
0.00
2.00
4.00
6.00
-2.00
-1.00
0.00
1.00
2.00
3.00
4.00
VIN
VIN
VAudio = 4.3V, Vbus = Float
VAudio = 3.0V, Vbus = Float
Figure 7.
RON Audio, VAudio=3.0 V
Figure 8.
RON Audio, VAudio=4.3 V
0.1
1.0
10.0
100.0
1000.0
0
-20
-40
-60
-80
-100
-120
-140
Frequency (KHz)
VAudio = 4.3V
Figure 9.
Crosstalk
1
0
10
100
1000
10000
-1
-2
-3
-4
-5
-6
-7
-8
Frequency (MHz)
CL = 0pF, VCC = 4.3V
Figure 10. USB Bandwidth
© 2007 Fairchild Semiconductor Corporation
FSA223 • Rev. 1.0.4
www.fairchildsemi.com
8
Test Diagrams
VON
I(OFF)
A
Dn or R/L
VSW
V
D+/R or D-/L
sw
D+/R or D-/L
D+, D-
or R/L
GND
ION
GND
VCNTRL = fn (VAudio and VCC
GND
VCNTRL = fn (VAudio and VCC
)
)
RON = VON / ION
Figure 11. On Resistance
Figure 12. Off Leakage
D+, D- or R, L
D+/R or D-/L
VOUT
CL
D+, D- or R/L
RL
RS
V
sw
IA(ON)
GND
GND
A
D+/R or
D-/L
V
sw
VCNTRL = fn (VAudio and VCC
)
GND
GND
RL, RS, and CL are functions of the application
environment (see AC tables for specific values).
CL includes test fixture and stray capacitance.
VCNTRL = fn (VAudio and VCC
)
Figure 13. On Leakage
Figure 14. AC Test Circuit Load
tRISE= 1µs
tFALL= 1µs
tRISE= 2.5ns
tFALL= 2.5ns
VCC
90%
3V
Input-V
GND
Vth(max)
Vth(min)
Input-VCNTRL
90%
50%
90%
50%
10%
90%
ASel
10%
GND
10%
VOH
Output -
10%
90%
VOH
Output -VOUT
VOL
90%
tON
90%
Vth = VCCth or VAudioth
VOUT
VOL
tOFF
tON
tOFF
VCNTRL = fn (VAudio and VCC
)
Figure 15. Turn-On / Turn-Off Waveforms (ASel
)
Figure 16. Turn-On / Turn-Off Waveforms
(USB/Audio)
© 2007 Fairchild Semiconductor Corporation
FSA223 • Rev. 1.0.4
www.fairchildsemi.com
9
Test Diagrams (Continued)
tRISE = 750ps
t
FALL= 750ps
0.4V
90%
50%
90%
50%
Input– VD+/D-
10%
10%
50%
GND
VOH
Output- VOUT
VOL
50%
tpLH
tpHL
Figure 17. USB Switch Propagation Delay Waveforms
tRISE= 750ps
tFALL= 750ps
0.4V
90%
50%
90%
50%
Input – VD+/D-
10%
10%
50%
GND
VOH
Output- VOUT
VOL
50%
tpLH
tpHL
Figure 18. Pulse Skew: tSK(P)=| tPHL – tPLH
|
tRISE= 750ps
tFALL= 750ps
0.4V
Input – VD+/D
90%
50%
90%
50%
-
10%
10%
GND
VOH
Output1- VOUT
VOL
50%
50%
tpLH1
tpHL1
tsk(o
VOH
)
Output2- VOUT
VOL
50%
50%
tpLH2 tpHL2
Figure 19. Output Skew: tSK(O)=| tPLH1 – tPLH2 | or | tPHL1 – tPHL2
|
© 2007 Fairchild Semiconductor Corporation
FSA223 • Rev. 1.0.4
www.fairchildsemi.com
10
Test Diagrams (Continued)
Network Analyzer
RS
V
IN
VS
GND
GND
VCNTRL
GND
VOUT
GND
RT
VCNTRL = fn (VAudio and VCC
)
GND
RS and RT are functions of the application
environment (see tables for specific values).
Figure 20. USB Bandwidth
Network Analyzer
RS
VIN
VCNTRL
VS
GND
RT
GND
GND
VOUT
RT
GND
Off Isolation = 20 Log (VOUT / VIN)
GND
GND
VCNTRL = fn (VAudio and VCC
)
RT and RS are functions of the application
environment (see AC tables for specific values).
Figure 21. Channel Off Isolation
Network Analyzer
RS
NC
VCNTRL
VIN
VS
GND
GND
GND
RT
GND
VCNTRL = fn (VAudio and VCC
)
VOUT
GND
RT
RT and RS are functions of the application
environment (see AC tables for specific values).
GND
Crosstalk = 20 Log (VOUT / VIN)
Figure 22. Non-Adjacent Channel-to-Channel Crosstalk
© 2007 Fairchild Semiconductor Corporation
FSA223 • Rev. 1.0.4
www.fairchildsemi.com
11
Test Diagrams (Continued)
Dn or R/L or D+/R or D-/L
Capacitance
Meter
VCNTRL = fn (VAudio and VCC
)
Dn or R/L
or D+/R
or D-/L
f = 1MHz
Figure 23. Channel Off Capacitance
Dn or R/L or
D+/R or D-/L
Capacitance
Meter
VCNTRL = fn (VAudio and VCC
)
f = 1MHz, 240Mhz
Dn or R/L or D+/R or D-/L
Figure 24. Channel On Capacitance
Audio Analyzer
RS
V
IN
VCNTRL
VS
GND
GND
VOUT
GND
GND
RT
VCNTRL = fn (VAudio and VCC
)
GND
RT and RS are functions of the application
environment (see AC tables for specific values).
Figure 25. Total Harmonic Distortion
© 2007 Fairchild Semiconductor Corporation
FSA223 • Rev. 1.0.4
www.fairchildsemi.com
12
Physical Dimensions
0.10 C
2.10
A
2X
1.62
B
KEEPOUT ZONE, NO TRACES
OR VIAS ALLOWED
(0.11)
0.56
1.12
1.60
PIN1 IDENT IS
2X LONGER THAN
OTHER LINES
0.10
C
10X
(0.35)
(0.25)
2X
10X
0.50
TOP VIEW
RECOMMENDED LAND PATTERN
0.55 MAX
0.05 C
0.05 C
0.05
0.00
(0.20)
C
0.35
0.25
SIDE VIEW
(0.15)
D
DETAIL A
(0.36)
0.35
0.25
0.65
0.55
0.35
0.25
DETAIL A 2X SCALE
1
4
0.56
NOTES:
10
5
A. PACKAGE CONFORMS TO JEDEC
REGISTRATION MO-255, VARIATION UABD .
B. DIMENSIONS ARE IN MILLIMETERS.
C. DIMENSIONS AND TOLERANCES PER
ASME Y14.5M, 1994.
D. PRESENCE OF CENTER PAD IS PACKAGE
SUPPLIER DEPENDENT. IF PRESENT IT
IS NOT INTENDED TO BE SOLDERED AND
HAS A BLACK OXIDE FINISH.
(0.29)
0.35
6
9
9X
0.25
0.50
0.25
0.15
9X
1.62
0.10
0.05
C
C
A B
ALL FEATURES
E. DRAWING FILENAME: MKT-MAC10Arev5.
BOTTOM VIEW
Figure 26. 10-Lead MicroPak™
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify
or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
For tape & reel specifications, please visit, http://www.fairchildsemi.com/products/logic/pdf/micropak_tr.pdf.
© 2007 Fairchild Semiconductor Corporation
FSA223 • Rev. 1.0.4
www.fairchildsemi.com
13
Physical Dimensions (Continued)
Figure 27. 10-Lead Molded Small Outline Package (MSOP)
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify
or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
For tape & reel specifications, please visit http://www.fairchildsemi.com/products/analog/pdf/msop10_tr.pdf.
© 2007 Fairchild Semiconductor Corporation
FSA223 • Rev. 1.0.4
www.fairchildsemi.com
14
Physical Dimensions (Continued)
(9X)
0.563
1.70
0.15
C
1.40
A
B
0.663
2X
1
2.10
1.80
PIN#1 IDENT
0.40
0.15
C
0.225
(10X)
TOP VIEW
2X
RECOMMENDED
LAND PATTERN
0.55 MAX.
0.152
0.10
0.08
C
9X
0.45
1.45
C
0.55
0.40
SEATING
PLANE
C
0.05
SIDE VIEW
1.85
0.35
(9X)
0.45
0.225
(10X)
3
OPTIONAL MINIMIAL
TOE LAND PATTERN
0.40
6
DETAIL A
1
NOTES:
PIN#1 IDENT
A. PACKAGE DOES NOT FULLY CONFORM TO
JEDEC STANDARD.
B. DIMENSIONS ARE IN MILLIMETERS.
C. DIMENSIONS AND TOLERANCES PER
ASME Y14.5M, 1994.
0.15
0.25
10
(10X)
0.10
0.05
C A B
C
BOTTOM VIEW
D. LAND PATTERN RECOMMENDATION IS
BASED ON FSC DESIGN ONLY.
E. DRAWING FILENAME: MKT-UMLP10Arev3.
0.55
0.45
0.10
0.10
0.10
DETAIL A
SCALE : 2X
PACKAGE
EDGE
LEAD
LEAD
OPTION 2
SCALE : 2X
OPTION 1
SCALE : 2X
Figure 28. 10-Lead Quad Ultrathin MLP
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify
or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
For tape & reel specifications, please visit, http://www.fairchildsemi.com/products/analog/pdf/umlp10_tr.pdf.
© 2007 Fairchild Semiconductor Corporation
FSA223 • Rev. 1.0.4
www.fairchildsemi.com
15
© 2007 Fairchild Semiconductor Corporation
FSA223 • Rev. 1.0.4
www.fairchildsemi.com
16
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