FSA223UMX [ONSEMI]

多媒体和 USB 2.0 高速和音频开关,带负信号能力;
FSA223UMX
型号: FSA223UMX
厂家: ONSEMI    ONSEMI
描述:

多媒体和 USB 2.0 高速和音频开关,带负信号能力

开关
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November 2012  
FSA223 — USB2.0 High-Speed (480Mbps) and  
Audio Switches with Negative Signal Capability  
Features  
Description  
The FSA223 is a Double-Pole, Double Throw (DPDT)  
multiplexer that combines a low-distortion audio and a  
USB2.0 High-Speed (HS) switch path. This  
configuration enables audio and USB data to share a  
common connector port. The architecture is designed to  
allow both audio and USB signals to swing below  
ground. This means a common USB and headphone  
jack can be used for personal media players and  
portable peripheral devices.  
.
.
.
.
.
.
.
HS-USB: 4 Typical On Resistance  
HS-USB: 4.5 pF Typical On Capacitance  
Audio: 3 Typical On Resistance  
-3 db Bandwidth: > 720 MHz  
Low Power Consumption  
Power-off Protection on Common D+/R, D-/L Ports  
Automatically Detects VCC for Switch Path Selection  
Since USB2.0 is an industry standard for shared data-  
path in portable devices, the FSA223 also incorporates  
a VCC detection capability. The FSA223 includes a  
power-off feature to minimize current consumption when  
VCC is not present. This power-off circuitry is available  
for the common D+/R, D-/L ports only. Typical  
applications involve switching in portables and  
consumer applications, such as cell phones, digital  
cameras, and notebooks with hubs or controllers.  
Applications  
.
.
Cell Phone, PDA, Digital Camera, and Notebook  
LCD Monitor, TV, and Set-Top Box  
Related Resources  
.
Please refer to tape and reel specifications on  
www.fairchildsemi.com;  
IMPORTANT NOTE:  
http://www.fairchildsemi.com/packaging.  
For additional performance information, please contact  
analogswitch@fairchildsemi.com.  
Ordering Information  
Package  
Number  
Part Number  
Top Mark  
Package Description  
FSA223L10X  
FSA223MUX  
FSA223UMX  
MAC010A  
MUA010A  
MLP010A  
GN  
FSA223  
GP  
10-Lead MicroPak™, JEDEC MO-255, 1.6 x 2.1 mm  
10-Lead MSOP, JEDEC MO-187, 3.0 mm Wide  
10-Lead Quad, Ultrathin MLP, 1.4 x 1.8 mm  
VCC  
ASel  
Switch Select  
Cont ol Circuitry  
VAudio  
r
R
pd  
D+  
R
GND  
D+/R  
D-/L  
D--  
L
Figure 1.  
FSA223 Analog Symbol  
© 2007 Fairchild Semiconductor Corporation  
FSA223 • Rev. 1.0.4  
www.fairchildsemi.com  
Pin Configuration  
VCC  
10  
1
2
3
4
9
D+  
D-  
R
ASel  
D+/R  
D-/L  
8
7
6
D+  
1
10  
9
V
CC  
R
D-  
2
1
D-  
R
2
3
A
Sel  
3
4
10 D+  
L
D+/R  
8
GND  
9
8
VCC  
ASel  
L
4
5
7
D-/L  
V
L
VAudio  
VAudio  
5
GND  
5
6
7
6
Audio  
D-/L D+/R  
Figure 4. 10-Pin UMLP  
GND  
Figure 2.  
10-Pin MicroPak™  
Figure 3.  
10-Pin MSOP  
Pin Definitions  
Name  
Description  
Vaudio  
VCC  
Power supply (audio)  
Power supply (USB) and auto USB switch-path select  
ASel  
Audio select to override auto USB detect when VAUDIO supply is present  
USB data bus input sources  
D+, D-  
R, L  
Audio right and left input sources  
D+/R, D-/L  
USB and audio common connector ports  
Truth Table  
(1)  
ASel  
Vaudio  
VCC  
L, R  
D+, D-  
(2)  
LOW  
HIGH  
HIGH  
HIGH  
OFF  
OFF  
OFF  
ON  
OFF  
ON  
LOW  
LOW  
HIGH  
HIGH  
ON  
HIGH  
OFF  
Note:  
1. ASel - Internal resistor to GND provides auto-VCC detect if there is no external connection. Forcing ASel HIGH  
when VAUDIO is present overrides the USB path.  
2. The dash (—) indicates “Don’t Care” state.  
© 2007 Fairchild Semiconductor Corporation  
FSA223 • Rev. 1.0.4  
www.fairchildsemi.com  
2
Functional Description  
The FSA223 is a combined USB and audio switch  
that enables sharing the D+/D- lines of a USB  
connector with stereo audio CODEC outputs. The  
switch is optimized for high-speed USB signals and  
includes an automatic VCC-detection circuit. The  
FSA223 detects the presence of VCC and defaults to  
USB mode. Both the USB and audio switch paths  
also handle negative signals, which eliminates the  
need for large coupling capacitors.  
The ASel pin is internally terminated by a resistor to  
GND (typical value: 3 MΩ) and results in a default  
USB connection. For optimal performance, VCC  
should be connected directly to the device battery.  
Application Diagram  
2.7V - 5.5V  
V
CC  
2.7V - 5.5V  
ASel  
Vaudio  
Switch Select  
Control Circuitry  
R
pd  
D+  
R
USB 2.0  
Source  
GND  
D+/R  
USB  
Mini-AB  
Connector  
D-  
L
ID  
D-/L  
Audio  
CODEC  
GND  
Figure 5.  
Typical Application  
© 2007 Fairchild Semiconductor Corporation  
FSA223 • Rev. 1.0.4  
www.fairchildsemi.com  
3
Absolute Maximum Ratings  
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be  
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.  
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.  
The absolute maximum ratings are stress ratings only.  
Symbol  
Parameter  
Min.  
Max.  
Unit  
VAudio  
VCC  
Supply Voltage  
Supply Voltage  
-0.5  
-0.5  
6.0  
6.0  
V
V
Vaudio  
0.3V  
+
R, L Pins  
Vaudio- 7.0V  
V
V
VSW  
Switch I/O Voltage(3,4)  
Control Input Voltage(3)  
D+, D-, D+/R, D-/L  
Pins  
VCC- 7.0V  
-0.5  
VCC + 0.3V  
ASel  
IIK  
6.0  
-50  
V
Input Clamp Diode Current  
mA  
mA  
mA  
mA  
mA  
°C  
USB  
50  
ISW  
Switch I/O Current (Continuous)  
Audio  
USB  
50  
100  
100  
+150  
+150  
+260  
Peak Switch Current (Pulsed at  
1ms Duration, <10% Duty Cycle)  
ISWPEAK  
Audio  
TSTG  
TJ  
Storage Temperature Range  
-65  
Maximum Junction Temperature  
°C  
TL  
Lead Temperature (Soldering, 10 seconds)  
I/O to GND  
°C  
7.5  
Human Body Model, JESD22-A114  
All Other Pins  
3.0  
ESD  
kV  
VAudio VCC to GND  
12.0  
Charged Device Model, JESD22-C101  
2.0  
Notes:  
3. The input and output negative ratings may be exceeded if the input and output diode current ratings are observed.  
4. VSW maximum values can be exceeded ONLY if ISW maximum values are observed. For example, VSW=VCC + 0.6 V  
is acceptable if ISW is limited externally to 50 mA.  
Recommended Operating Conditions  
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended  
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not  
recommend exceeding them or designing to Absolute Maximum Ratings.  
Symbol  
Parameter  
Min.  
Max.  
Units  
VAudio  
VCC  
Supply Voltage  
2.7  
2.7  
0
5.5  
5.5  
V
V
Supply Voltage  
ASel  
Control Input Voltage  
VCC  
V
V
Audio – 6.5 V  
VCC – 6.5 V  
-40  
VAudio – 0.3 V  
VCC  
V
VSW  
Switch I/O Voltage  
V
TA  
Operating Temperature  
+85  
°C  
330  
(estimated)  
Thermal Resistance (free air)  
MicroPak™  
ºC/W  
θJA  
© 2007 Fairchild Semiconductor Corporation  
FSA223 • Rev. 1.0.4  
www.fairchildsemi.com  
4
DC Electrical Characteristics  
VAudio supply=2.7 V and typical values are at 25ºC unless otherwise specified.  
TA=- 40°C to  
+85°C  
Symbol  
Parameter  
VCC (V)  
Condition  
Unit  
Min. Typ. Max.  
Common Pins  
VIK  
VIH  
VIL  
Clamp Diode Voltage  
3.0  
IIK=-18 mA  
-1.2  
Control Input Voltage HIGH  
Control Input Voltage LOW  
3.0 to 4.3(5)  
3.0 to 4.3(5)  
1.2  
V
0.5  
VIN=3.6 V  
VIN=0 V  
-1  
-1  
10  
1
Vaudio=4.3 V  
VCC=3.0 V  
IIN  
ASel Input HIGH Current  
µA  
µA  
Power Off Leakage Current  
(Common Port Only D+/R,  
D-/L)  
Common Port (D+/R, D-/L)  
VSW=0V, 5.5 V  
IOFF  
Vaudio=VCC=0 V  
10  
D+/R, D-/L=0.3 V,  
Off-Leakage Current of Port  
D+, D-, R, L  
VCC – 0.3 V  
D+, D-, R, L=0.3 V,  
VCC – 0.3 V or Floating  
INO(0FF)  
3.6  
3.6  
-50  
-50  
1
50  
50  
nA  
On-Leakage Current of Port  
D+/R or D-/L  
D+/R, D-/L=0.3 V, VCC – 0.3 V  
D+, D-, R, L=Floating  
INC(0N)  
RPD  
1
3
nA  
ASel Internal Pull-Down  
Resistor  
MΩ  
USB Switch Path  
USB Analog Signal Range  
0
3.6  
6
V
VD+/D-=0 V, 0.4 V,  
ION=-8 mA  
RONUSB HS Switch On Resistance(6)  
3.0  
3.0  
4
(7,8)  
RONUSB HS Delta RON  
VD+/D-=0V, ION=-8 mA  
0.4  
Audio Switch Path  
Vaudio  
– 5.5  
Audio Analog Signal Range  
Vaudio  
6
V
Audio Switch On  
RONAudio  
VL/R=-2V, 0V, 0.7V, 2.0V;  
ION=-26 mA  
3.0 to 4.3(5)  
3.0 to 4.3(5)  
3.0 to 4.3(5)  
3
Resistance(6)  
(7)  
RONAudio Audio Delta RON  
VL/R=0.7V ION=-26 mA  
0.4  
1.5  
VL/R=-2 V, 0 V, 0.7 V, 2.0 V;  
RFLAT(Audio) Audio RON Flatness(9)  
2.5  
I
ON=-26 mA  
Power Supply  
Quiescent Supply Current  
ICC(Audio)  
(Audio)  
Vaudio=5.5 V  
VCC=5.5 V  
VASel=0 and VCC, IOUT=0  
IOUT=0, Vaudio=0  
4
10  
20  
µA  
µA  
µA  
Quiescent Supply Current  
ICC(VCC)  
12  
(VCC  
)
VASel=2.6 V, VCC=Floating  
VASel=1.8 V, VCC=Floating  
10  
14  
15  
18  
Increase in ICC Current per  
Control Voltage and VCC  
V
audio=3.6 V,  
ICCT  
4.3 V(5)  
Notes:  
5. 4.3 V is guaranteed by characterization, not production tested.  
6. On resistance is determined by the voltage drop between the A and B pins at the indicated current through the switch.  
7. RON=RON max – RON min measured at identical VCC, temperature, and voltage. Worst-case signal path, audio  
or USB channel, is characterized.  
8. Guaranteed by characterization, not production tested.  
9. Flatness is defined as the difference between the maximum and minimum values of on resistance over the  
specified range of conditions.  
© 2007 Fairchild Semiconductor Corporation  
FSA223 • Rev. 1.0.4  
www.fairchildsemi.com  
5
AC Electrical Characteristics  
VAudio supply=2.7 V unless otherwise specified.  
TA=- 40°C to +85°C  
Min. Typ. Max.  
Symbol  
Parameter  
VCC (V)  
Conditions  
Unit  
VD+/R, D-/L=1.0 V; RL=50 ;  
CL=50pF, Figure 14, Figure 15  
tONAUDIO2 Turn-On Time ASel to Output  
tOFFAUDIO2 Turn-Off Time ASel to Output  
3.0 to 4.3(10)  
3.0 to 4.3(10)  
3.6  
2
2
μs  
μs  
VD+/R, D-/L=1.0 V; RL=50 ;  
CL=50pF, Figure 14, Figure 15  
RL=50 ; CL=0 pF  
Figure 17  
USB Switch Propagation  
tPDUSB  
0.25  
-110  
720  
ns  
Delay(10)  
f=20 kHz; RT=32 ; CL=0 pF  
Figure 22  
Non-Adjacent Channel  
XtalkA  
3.0 to 4.3(10)  
3.0 to 4.3(10)  
3.0 to 4.3(10)  
dB  
MHz  
%
Crosstalk - Audio  
RT=50 , CL=0 pF, Signal 0 dBm  
Figure 20  
BW  
-3db Bandwidth - USB  
f=20 Hz to 20 kHz; RL=32 ,  
VIN=2 Vpp, Figure 25  
THD  
Total Harmonic Distortion  
0.1  
Note:  
10. Guaranteed by characterization, not production tested.  
USB High-Speed-Related AC Electrical Characteristics  
VAudio supply=2.7 V unless otherwise specified.  
TA=- 40°C to +85°C  
Min. Typ. Max.  
Symbol  
Parameter  
VCC (V)  
Conditions  
Unit  
tR=tF=750 ps (10-90%) at 240 MHz  
CL=0 pF, RL=50 Ω  
tSK(o)  
Channel-to-Channel Skew(11)  
3.0 to 4.3(11)  
35  
Figure 18, Figure 19  
ps  
ps  
tR=tF=750 ps (10-90%) at 240 MHz  
CL=0 pF, RL=50 Ω  
Figure 18, Figure 19  
Skew of Opposite Transitions of  
the Same Output(11)  
tSK(P)  
3.0 to 4.3(11)  
3.0 to 4.3(11)  
35  
RL=50 , CL=50 pF, tR=tF=500 ps  
tJ  
Total Jitter(11)  
130  
(10-90%) at 480 Mbps (PRBS=215 – 1)  
Note:  
11. Guaranteed by characterization, not production tested.  
Capacitance(12)  
VAudio supply=3.0V unless otherwise specified.  
TA=- 40°C to +85°C  
Min. Typ. Max.  
2.0  
Unit  
Symbol  
Parameter  
VCC (V)  
Condition  
Control Pin Input Capacitance  
CIN (ASel)  
VCC=3.0 V, 4.3 V VBias=0.05 V  
pF  
(ASel  
)
VBias=0.2 V; f=240 MHz  
Figure 24  
VCC=3.0 V, 4.3 V  
ASel=0V (CONUSB  
4.5  
9.0  
6.0  
)
D+/R, D-/L (Source Port) On  
Capacitance  
CON(D+/R, D-/L)  
pF  
VCC=3.0 V, 4.3 V  
ASel=3.0 V  
VBias=0.2 V; f=1 MHz  
Figure 24  
(CONAudio  
)
f=1 MHz  
Figure 23  
f=1MHz  
USB Input Source Off  
Capacitance  
VCC=3.0 V, 4.3 V  
ASel=3.0 V  
COFF(D+, D-)  
COFF(R/L)  
1.5  
3.0  
pF  
pF  
Audio Input Source Off  
Capacitance  
VCC=3.0 V, 4.3 V  
ASel=0 V  
Figure 23  
Note:  
12. Guaranteed by characterization, not production tested.  
© 2007 Fairchild Semiconductor Corporation  
FSA223 • Rev. 1.0.4  
www.fairchildsemi.com  
6
Applications Information  
In applications where Vsw could exceed the absolute  
Because the deselected channel may no longer provide  
guaranteed off isolation, consider the following:  
maximum rating of  
VCC+0.3 V, the following  
recommendations help maintain low power consumption  
and protect the part.  
.
.
During USB transfer, the audio amplifier should be  
powered down.  
The addition of the series diode in the VCC supply line  
blocks any current that might leak back into VCC for  
over-voltage input cases.  
During audio transfer, the USB pull-up resistor  
supply must be removed (as specified on page 141  
of the USB 2.0 specification).  
RECOMMENDATION  
Add a low forward voltage  
VCC  
I
CC blocking diode to stop  
current flow into the VCC pin  
EXPLANATION  
Parasitic PMOS bulk diode  
provides a leakage path in an  
over-voltage condition  
EXCEPTION CONDITION  
sw > VCC+0.3V  
D+  
R
V
D+/R  
EXPLANATION  
Both common port inputs have  
power-off protection, allowing  
them to withstand voltages  
greater than 0V when VCC = 0V  
D-  
L
RECOMMENDATION  
Ensure that any voltage present  
on the un-selected ports is  
< VCC to prevent data  
D+/L  
corruption on the common port  
Figure 6.  
Application Suggestions  
© 2007 Fairchild Semiconductor Corporation  
FSA223 • Rev. 1.0.4  
www.fairchildsemi.com  
7
Typical Performance Characteristics  
5.00  
4.00  
3.00  
2.00  
1.00  
0.00  
4.00  
3.00  
2.00  
1.00  
0.00  
85°C  
25°C  
-40°C  
85°C  
25°C  
-40°C  
-2.00  
0.00  
2.00  
4.00  
6.00  
-2.00  
-1.00  
0.00  
1.00  
2.00  
3.00  
4.00  
VIN  
VIN  
VAudio = 4.3V, Vbus = Float  
VAudio = 3.0V, Vbus = Float  
Figure 7.  
RON Audio, VAudio=3.0 V  
Figure 8.  
RON Audio, VAudio=4.3 V  
0.1  
1.0  
10.0  
100.0  
1000.0  
0
-20  
-40  
-60  
-80  
-100  
-120  
-140  
Frequency (KHz)  
VAudio = 4.3V  
Figure 9.  
Crosstalk  
1
0
10  
100  
1000  
10000  
-1  
-2  
-3  
-4  
-5  
-6  
-7  
-8  
Frequency (MHz)  
CL = 0pF, VCC = 4.3V  
Figure 10. USB Bandwidth  
© 2007 Fairchild Semiconductor Corporation  
FSA223 • Rev. 1.0.4  
www.fairchildsemi.com  
8
Test Diagrams  
VON  
I(OFF)  
A
Dn or R/L  
VSW  
V
D+/R or D-/L  
sw  
D+/R or D-/L  
D+, D-  
or R/L  
GND  
ION  
GND  
VCNTRL = fn (VAudio and VCC  
GND  
VCNTRL = fn (VAudio and VCC  
)
)
RON = VON / ION  
Figure 11. On Resistance  
Figure 12. Off Leakage  
D+, D- or R, L  
D+/R or D-/L  
VOUT  
CL  
D+, D- or R/L  
RL  
RS  
V
sw  
IA(ON)  
GND  
GND  
A
D+/R or  
D-/L  
V
sw  
VCNTRL = fn (VAudio and VCC  
)
GND  
GND  
RL, RS, and CL are functions of the application  
environment (see AC tables for specific values).  
CL includes test fixture and stray capacitance.  
VCNTRL = fn (VAudio and VCC  
)
Figure 13. On Leakage  
Figure 14. AC Test Circuit Load  
tRISE= 1µs  
tFALL= 1µs  
tRISE= 2.5ns  
tFALL= 2.5ns  
VCC  
90%  
3V  
Input-V  
GND  
Vth(max)  
Vth(min)  
Input-VCNTRL  
90%  
50%  
90%  
50%  
10%  
90%  
ASel  
10%  
GND  
10%  
VOH  
Output -  
10%  
90%  
VOH  
Output -VOUT  
VOL  
90%  
tON  
90%  
Vth = VCCth or VAudioth  
VOUT  
VOL  
tOFF  
tON  
tOFF  
VCNTRL = fn (VAudio and VCC  
)
Figure 15. Turn-On / Turn-Off Waveforms (ASel  
)
Figure 16. Turn-On / Turn-Off Waveforms  
(USB/Audio)  
© 2007 Fairchild Semiconductor Corporation  
FSA223 • Rev. 1.0.4  
www.fairchildsemi.com  
9
Test Diagrams (Continued)  
tRISE = 750ps  
t
FALL= 750ps  
0.4V  
90%  
50%  
90%  
50%  
InputVD+/D-  
10%  
10%  
50%  
GND  
VOH  
Output- VOUT  
VOL  
50%  
tpLH  
tpHL  
Figure 17. USB Switch Propagation Delay Waveforms  
tRISE= 750ps  
tFALL= 750ps  
0.4V  
90%  
50%  
90%  
50%  
Input – VD+/D-  
10%  
10%  
50%  
GND  
VOH  
Output- VOUT  
VOL  
50%  
tpLH  
tpHL  
Figure 18. Pulse Skew: tSK(P)=| tPHL – tPLH  
|
tRISE= 750ps  
tFALL= 750ps  
0.4V  
Input – VD+/D  
90%  
50%  
90%  
50%  
-
10%  
10%  
GND  
VOH  
Output1- VOUT  
VOL  
50%  
50%  
tpLH1  
tpHL1  
tsk(o  
VOH  
)
Output2- VOUT  
VOL  
50%  
50%  
tpLH2 tpHL2  
Figure 19. Output Skew: tSK(O)=| tPLH1 – tPLH2 | or | tPHL1 – tPHL2  
|
© 2007 Fairchild Semiconductor Corporation  
FSA223 • Rev. 1.0.4  
www.fairchildsemi.com  
10  
Test Diagrams (Continued)  
Network Analyzer  
RS  
V
IN  
VS  
GND  
GND  
VCNTRL  
GND  
VOUT  
GND  
RT  
VCNTRL = fn (VAudio and VCC  
)
GND  
RS and RT are functions of the application  
environment (see tables for specific values).  
Figure 20. USB Bandwidth  
Network Analyzer  
RS  
VIN  
VCNTRL  
VS  
GND  
RT  
GND  
GND  
VOUT  
RT  
GND  
Off Isolation = 20 Log (VOUT / VIN)  
GND  
GND  
VCNTRL = fn (VAudio and VCC  
)
RT and RS are functions of the application  
environment (see AC tables for specific values).  
Figure 21. Channel Off Isolation  
Network Analyzer  
RS  
NC  
VCNTRL  
VIN  
VS  
GND  
GND  
GND  
RT  
GND  
VCNTRL = fn (VAudio and VCC  
)
VOUT  
GND  
RT  
RT and RS are functions of the application  
environment (see AC tables for specific values).  
GND  
Crosstalk = 20 Log (VOUT / VIN)  
Figure 22. Non-Adjacent Channel-to-Channel Crosstalk  
© 2007 Fairchild Semiconductor Corporation  
FSA223 • Rev. 1.0.4  
www.fairchildsemi.com  
11  
Test Diagrams (Continued)  
Dn or R/L or D+/R or D-/L  
Capacitance  
Meter  
VCNTRL = fn (VAudio and VCC  
)
Dn or R/L  
or D+/R  
or D-/L  
f = 1MHz  
Figure 23. Channel Off Capacitance  
Dn or R/L or  
D+/R or D-/L  
Capacitance  
Meter  
VCNTRL = fn (VAudio and VCC  
)
f = 1MHz, 240Mhz  
Dn or R/L or D+/R or D-/L  
Figure 24. Channel On Capacitance  
Audio Analyzer  
RS  
V
IN  
VCNTRL  
VS  
GND  
GND  
VOUT  
GND  
GND  
RT  
VCNTRL = fn (VAudio and VCC  
)
GND  
RT and RS are functions of the application  
environment (see AC tables for specific values).  
Figure 25. Total Harmonic Distortion  
© 2007 Fairchild Semiconductor Corporation  
FSA223 • Rev. 1.0.4  
www.fairchildsemi.com  
12  
Physical Dimensions  
0.10 C  
2.10  
A
2X  
1.62  
B
KEEPOUT ZONE, NO TRACES  
OR VIAS ALLOWED  
(0.11)  
0.56  
1.12  
1.60  
PIN1 IDENT IS  
2X LONGER THAN  
OTHER LINES  
0.10  
C
10X  
(0.35)  
(0.25)  
2X  
10X  
0.50  
TOP VIEW  
RECOMMENDED LAND PATTERN  
0.55 MAX  
0.05 C  
0.05 C  
0.05  
0.00  
(0.20)  
C
0.35  
0.25  
SIDE VIEW  
(0.15)  
D
DETAIL A  
(0.36)  
0.35  
0.25  
0.65  
0.55  
0.35  
0.25  
DETAIL A 2X SCALE  
1
4
0.56  
NOTES:  
10  
5
A. PACKAGE CONFORMS TO JEDEC  
REGISTRATION MO-255, VARIATION UABD .  
B. DIMENSIONS ARE IN MILLIMETERS.  
C. DIMENSIONS AND TOLERANCES PER  
ASME Y14.5M, 1994.  
D. PRESENCE OF CENTER PAD IS PACKAGE  
SUPPLIER DEPENDENT. IF PRESENT IT  
IS NOT INTENDED TO BE SOLDERED AND  
HAS A BLACK OXIDE FINISH.  
(0.29)  
0.35  
6
9
9X  
0.25  
0.50  
0.25  
0.15  
9X  
1.62  
0.10  
0.05  
C
C
A B  
ALL FEATURES  
E. DRAWING FILENAME: MKT-MAC10Arev5.  
BOTTOM VIEW  
Figure 26. 10-Lead MicroPak™  
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner  
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify  
or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,  
specifically the warranty therein, which covers Fairchild products.  
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:  
http://www.fairchildsemi.com/packaging/.  
For tape & reel specifications, please visit, http://www.fairchildsemi.com/products/logic/pdf/micropak_tr.pdf.  
© 2007 Fairchild Semiconductor Corporation  
FSA223 • Rev. 1.0.4  
www.fairchildsemi.com  
13  
Physical Dimensions (Continued)  
Figure 27. 10-Lead Molded Small Outline Package (MSOP)  
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner  
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify  
or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,  
specifically the warranty therein, which covers Fairchild products.  
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:  
http://www.fairchildsemi.com/packaging/.  
For tape & reel specifications, please visit http://www.fairchildsemi.com/products/analog/pdf/msop10_tr.pdf.  
© 2007 Fairchild Semiconductor Corporation  
FSA223 • Rev. 1.0.4  
www.fairchildsemi.com  
14  
Physical Dimensions (Continued)  
(9X)  
0.563  
1.70  
0.15  
C
1.40  
A
B
0.663  
2X  
1
2.10  
1.80  
PIN#1 IDENT  
0.40  
0.15  
C
0.225  
(10X)  
TOP VIEW  
2X  
RECOMMENDED  
LAND PATTERN  
0.55 MAX.  
0.152  
0.10  
0.08  
C
9X  
0.45  
1.45  
C
0.55  
0.40  
SEATING  
PLANE  
C
0.05  
SIDE VIEW  
1.85  
0.35  
(9X)  
0.45  
0.225  
(10X)  
3
OPTIONAL MINIMIAL  
TOE LAND PATTERN  
0.40  
6
DETAIL A  
1
NOTES:  
PIN#1 IDENT  
A. PACKAGE DOES NOT FULLY CONFORM TO  
JEDEC STANDARD.  
B. DIMENSIONS ARE IN MILLIMETERS.  
C. DIMENSIONS AND TOLERANCES PER  
ASME Y14.5M, 1994.  
0.15  
0.25  
10  
(10X)  
0.10  
0.05  
C A B  
C
BOTTOM VIEW  
D. LAND PATTERN RECOMMENDATION IS  
BASED ON FSC DESIGN ONLY.  
E. DRAWING FILENAME: MKT-UMLP10Arev3.  
0.55  
0.45  
0.10  
0.10  
0.10  
DETAIL A  
SCALE : 2X  
PACKAGE  
EDGE  
LEAD  
LEAD  
OPTION 2  
SCALE : 2X  
OPTION 1  
SCALE : 2X  
Figure 28. 10-Lead Quad Ultrathin MLP  
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner  
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify  
or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,  
specifically the warranty therein, which covers Fairchild products.  
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:  
http://www.fairchildsemi.com/packaging/.  
For tape & reel specifications, please visit, http://www.fairchildsemi.com/products/analog/pdf/umlp10_tr.pdf.  
© 2007 Fairchild Semiconductor Corporation  
FSA223 • Rev. 1.0.4  
www.fairchildsemi.com  
15  
© 2007 Fairchild Semiconductor Corporation  
FSA223 • Rev. 1.0.4  
www.fairchildsemi.com  
16  
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent  
coverage may be accessed at www.onsemi.com/site/pdf/PatentMarking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.  
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